PHILIPS TDA4672

INTEGRATED CIRCUITS
DATA SHEET
TDA4672
Picture Signal Improvement (PSI)
circuit with enhanced peaking
function
Product specification
Supersedes data of August 1993
File under Integrated Circuits, IC02
1996 Dec 11
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
FEATURES
• Luminance signal delay from 20 ns to 1100 ns
(minimum step 45 ns)
• Selectable luminance signal peaking with symmetrical
overshoots
• Selectable 2.6 or 5 MHz peaking centre frequency and
degree of peaking from −6 dB to +9 dB in 16 steps of
1 dB each
GENERAL DESCRIPTION
The TDA4672 delays the luminance signal. The luminance
signal can also be improved by peaking and noise
reduction (coring).
• Selectable noise reduction by coring
• Selectable 5 or 12 V sandcastle input voltage
• All controls selected via the I2C-bus
• Timing pulse generation for clamping and delay time
control synchronized by sandcastle pulse
• Automatic luminance signal delay correction using a
control loop
• Luminance input signal clamping with coupling capacitor
• 4.5 to +8.8 V supply voltage
• Minimum of external components.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
VP
supply voltage (pin 1)
4.5
5
IP(tot)
total supply current
26
td(Y)
Y signal delay time
20
Vi(Y)(p-p)
composite Y input signal (peak-to-peak value, pin 16)
GY
Tamb
MAX.
UNIT
8.8
V
37
46
mA
−
1130
ns
−
450
640
mV
voltage gain of Y channel
−
−1
−
dB
operating ambient temperature
0
−
70
°C
ORDERING INFORMATION
TYPE
NUMBER
TDA4672
1996 Dec 11
PACKAGE
NAME
DIP18
DESCRIPTION
plastic dual in-line package; 18 leads (300 mil)
2
VERSION
SOT102-1
1996 Dec 11
3
100 nF
100 nF
100 nF
−(B − Y)
−(R − Y)
Y
7
3
14
13
16
17
Vref
BK, H + V
450
ns
Vref
180
ns
BLACK LEVEL
CLAMP
BK
SANDCASTLE PULSE
DETECTOR
BLACK
LEVEL
CLAMP
180
ns
DELAY TIME
CONTROL
Vref
I2C-BUS
2
90
ns
Y delay
100 nF
8
90
ns
CTI
on/off
5
18
n.c.
BLACK
LEVEL
CLAMP
2.6 MHz
5 MHz
2.6 MHz
5 MHz
peaking
frequency
100
ns
90
ns
coring
on/off
TDA4672
+1
−0.5
−0.5
+
I2C-BUS
+
Y
100
nF
6 −(B − Y)
4 −(R − Y)
12
11
MED756
I2C-BUS
PEAKING
CORING
Vref
100 nF
15
Vref
GENERATION
CORING
degree of
peaking
1
VP = 5 to 8 V
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
Fig.1 Block diagram.
45
ns
control signal
100
ns
sandcastle
5 V/12 V
VREF
10
SCL
I2C-BUS RECEIVER
9
SDA
handbook, full pagewidth
sandcastle
pulse
Philips Semiconductors
Product specification
TDA4672
BLOCK DIAGRAM
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
PINNING
SYMBOL
PIN
DESCRIPTION
VP
1
positive supply voltage
CDL
2
capacitor of delay time control
Vi(R − Y)
3
±(R − Y) colour-difference input
signal; note 1
Vo(R − Y)
4
±(R − Y) colour-difference output
signal; note 1
n.c.
5
not connected
Vo(B − Y)
6
±(B − Y) colour-difference output
signal; note 2
Vi(B − Y)
7
±(B − Y) colour-difference input
signal; note 2
GND2
8
ground 2 (0 V)
SDA
9
I2C-bus serial data input/output
SCL
10
I2C-bus serial clock input
CCOR
11
coring capacitor
VoY
12
delayed luminance output signal
CCLP1
13
black level clamping capacitor 1
CCLP2
14
black level clamping capacitor 2
Cref
15
capacitor of reference voltage
ViY
16
luminance input signal
SAND
17
sandcastle pulse input
GND1
18
ground 1 (0 V)
handbook, halfpage
1
18 GND1
CDL
2
17 SAND
Vi(R − Y) 3
16 ViY
Vo(R − Y) 4
15 Cref
n.c.
5
TDA4672
14 CCLP2
13 CCLP1
Vo(B − Y) 6
Vi(B − Y) 7
12 VoY
GND2
8
11 CCOR
SDA
9
10 SCL
MED757
Fig.2 Pin configuration.
Notes
1. Pin 3 is connected directly to pin 4.
2. Pin 7 is connected directly to pin 6.
1996 Dec 11
VP
4
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
The peaking section uses a transversal filter circuit with
selectable centre frequencies of 2.6 and 5.0 MHz.
FUNCTIONAL DESCRIPTION
The TDA4672 contains luminance signal processing.
The luminance signal section comprises a variable,
integrated luminance delay line with luminance signal
peaking and noise reduction by coring.
It provides selectable degrees of peaking from −6 to +9 dB
and noise reduction by coring, which attenuates the
high-frequency noise introduced by peaking.
The output buffer stage ensures a low-ohmic Video
Blanking Synchronization (VBS) output signal on pin 12
(<160 Ω). The gain of the luminance signal path from
pin 16 to pin 12 is unity.
All functions and parameters are controlled via the
I2C-bus.
Y-signal path
An oscillation signal of the delay time control loop is
present on output pin 12 instead of the VBS signal. It is
present during the vertical blanking interval of the burst key
pulses in lines 16 (330) to 18 (332). This sync should not
be applied for synchronization.
The video and blanking signal is AC-coupled to the input
pin 16. Its black porch is clamped to a DC reference
voltage to ensure the correct operating range of the
luminance delay stage.
The luminance delay line consists of all-pass filter sections
with delay times of 45, 90, 100, 180 and 450 ns
(see Fig.1). The luminance signal delay is controlled via
the I2C-bus in steps of 45 ns in the range of 20 to 1100 ns,
this ensures that the maximum delay difference between
the luminance and colour-difference signals is ±22.5 ns.
Colour-difference signal paths
The colour-difference input signals (on pins 3 and 7) are
connected directly to the output pins.
This is for compatibility with other Philips Semiconductors
PSI-circuits.
An automatic luminance delay time adjustment in an
internal control loop (with the horizontal frequency as a
reference) is used to correct changes in the delay time,
due to component tolerances. The control loop is
automatically enabled between the burst key pulses of
lines 16 (330) and 17 (331) during the vertical blanking
interval. The control voltage is stored in the capacitor CDL
connected to pin 2.
1996 Dec 11
TDA4672
5
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). GND1 and GND2 are connected together.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage (pin 1)
0
8.8
V
VI
input voltage (pins 2 to 7 and pins 11 to 16)
−0.1
VP
V
V9,10
input voltage at pins 9 and 10
−0.1
+8.8
V
V17
input voltage at pin 17
−0.1
+12
V
I8-18
current between pins 8 and 18
−
±20
mA
I3-4
current between pins 3 and 4
−
±4
mA
I6-7
current between pins 6 and 7
−
±4
mA
Ptot
total power dissipation
0
0.97
W
Tstg
storage temperature
−25
+150
°C
Tamb
operating ambient temperature
0
70
°C
VESD
electrostatic handling
−
+250
V
−
−500
V
−
±500
V
note 1
for pin 17
for other pins
Note
1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
UNIT
82
K/W
thermal resistance from junction to ambient in free air
CHARACTERISTICS
VP = 5 V; nominal video amplitude VVB = 315 mV; tH = 64 µs; tBK = 4 µs (burst key); Tamb = 25 °C and measurements
taken in Fig.4; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
supply voltage (pin 1)
4.5
5
8.8
V
IP(tot)
total supply current
26
37
46
mA
Vi(Y)(p-p)
VBS input signal on pin 16
(peak-to-peak value)
−
450
640
mV
V16
black level clamping voltage
I16
input current
Y-signal path
−
3.1
−
V
during clamping
±95
−
±190
µA
outside clamping
−
−
±0.1
µA
R16
input resistance
C16
input capacitance
td(Y)(max)
maximum Y delay time
set via I2C-bus
minimum Y delay time
I2C-bus
td(Y)(min)
1996 Dec 11
outside clamping
set via
6
5
−
−
MΩ
−
3
10
pF
1070
1100
1130
ns
−
20
−
ns
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
SYMBOL
∆td(Y)
PARAMETER
TDA4672
CONDITIONS
I2C-bus
minimum delay step
set via
group delay time difference
f = 0.5 to 5 MHz;
maximum delay
MIN.
TYP.
MAX.
UNIT
40
45
50
ns
−
0
±25
ns
185
215
245
ns
td(peak)
minimum delay time for peaking
GY
VBS signal gain measured on
output pin 12 (composite signal,
peak-to-peak value)
V12/V16; f = 500 kHz;
maximum delay
−2
−1
0
dB
I12
output current (emitter-follower
with constant current source)
source current
−1
−
−
mA
sink current
0.4
−
−
mA
−
−
160
Ω
f = 0.5 to 3 MHz
−2
−1
0
dB
f = 0.5 to 5 MHz
−4
−3
−1
dB
R12
output resistance
f
frequency response for
LIN
signal linearity for
maximum delay
αmin/αmax; note 1
video contents of 315 mV (p-p)
VVBS = 450 mV (p-p)
0.85
−
−
−
video contents of 450 mV (p-p)
VVBS = 640 mV (p-p)
0.60
−
−
−
fC1; LCF-bit = 0
4.5
5
5.5
MHz
fC2; LCF-bit = 1
2.3
2.6
2.9
MHz
from
−
−6
−
dB
to
−
+9
−
dB
each step
−
1
−
dB
−
−
−
%
Luminance peaking, selected via I2C-bus
fpeak
Vpeak
peaking frequency
peaking amplitude for grade of
peaking (fC amplitude over
0.5 MHz amplitude)
Y delay = 215 ns;
peaking delay only
selectable values
no limitation of peaking
Vn(rms)
noise voltage on pin 12
(RMS value)
without peaking;
f = 0 to 5 MHz
−
−
1
mV
COR
coring of peaking
(coring part referred to 315 mV)
COR-bit = 1
−
20
−
%
1996 Dec 11
7
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
SYMBOL
PARAMETER
TDA4672
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Sandcastle pulse, input voltage selectable via I2C-bus
V17
R17
input voltage threshold for
H and V sync
SC5-bit = 0 (+12 V)
1.1
1.5
1.9
V
input voltage threshold for burst
SC5-bit = 0 (+12 V)
5.5
6.5
7.5
V
input voltage threshold for
H and V sync
SC5-bit = 1 (+5 V)
1.1
1.5
1.9
V
input voltage threshold for burst
SC5-bit = 1 (+5 V)
3.0
3.5
4.0
V
input resistance
+12 V input level
30
40
50
kΩ
+5 V input level
15
20
25
kΩ
−
4
8
pF
C17
input capacitance
tBK
burst key pulse width
3.0
4.0
4.6
µs
td
leading edge delay for clamping
pulse
referenced to tBK
−
1
−
µs
np
number of required burst key
pulses vertical blanking interval
note 2
4
−
31
−
I2C-bus control, SDA and SCL
VIH
HIGH level input voltage on
pins 9 and 10
3
−
5
V
VIL
LOW level input voltage on pins 9
and 10
0
−
1.5
V
I9,10
input current on pins 9 and 10
−
−
±10
µA
Vo(ACK)
output voltage at acknowledge on Io(ACK) = 3 mA
pin 9
−
−
0.4
V
Io(ACK)
output current at acknowledge on sink current
pin 9
3
−
−
mA
Notes
1. αmin: minimum differential voltage gain of the luminance video signal;
αmax: maximum differential voltage gain of the luminance video signal.
2. A number of more than 31 burst key pulses repeats the counter cycle of delay time control.
1996 Dec 11
8
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
I2C-BUS FORMAT
S(1)
SLAVE ADDRESS(2)
ACK(3)
SUBADDRESS(4)
ACK(3)
DATA(5)
P(6)
Notes
1. S = START condition.
2. SLAVE ADDRESS = 1000 100X.
3. ACK = acknowledge, generated by the slave.
4. SUBADDRESS = subaddress byte, see Table 1.
5. DATA = data byte, see Table 1.
6. P = STOP condition.
7. X = read/write control bit.
X = 0, order to write (the circuit is slave receiver).
X = 1, order to read (the circuit is slave transmitter).
If more than 1 byte of DATA is transmitted, then auto-increment of the subaddress is performed.
I2C-bus transmission; see Table 2
Table 1
DATA
FUNCTION
SUBADDRESS
D7
D6
D5
D4
D3
D2
D1
D0
DL3
DL2
DL1
DL0
Y delay/SC
00010000
0
SC5
0
DL4
Peaking and coring
00010001
COR
PEAK
LCF
0
Table 2
PCON3 PCON2 PCON1 PCON0
Function of the bits
DATA
LOGIC 1
LOGIC 0
45 ns
0 ns
DL1
90 ns
0 ns
DL2
180 ns
0 ns
DL3
180 ns
0 ns
DL4
450 ns
0 ns
DL0
FUNCTION
set delay in luminance channel
SC5
select sandcastle pulse voltage
+5 V
+12 V
LCF
set peaking frequency response
2.6 MHz
5.0 MHz
PEAK
set peaking delay
active (190 ns)
inactive
COR
set coring control
active
inactive
PCONx
set peaking amplification
1996 Dec 11
see Table 3
9
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
Table 3
TDA4672
Peaking amplification
PCON3
PCON2
PCON1
PCON0
GRADE OF PEAKING
(dB)
1
1
1
1
−6
1
1
1
0
−5
1
1
0
1
−4
1
1
0
0
−3
1
0
1
1
−2
1
0
1
0
−1
1
0
0
1
0
1
0
0
0
+1
0
1
1
1
+2
0
1
1
0
+3
0
1
0
1
+4
0
1
0
0
+5
0
0
1
1
+6
0
0
1
0
+7
0
0
0
1
+8
0
0
0
0
+9
Remarks to the subaddress bytes
Subaddresses 00H to 0FH are reserved for colour decoders and RGB processors.
Subaddresses 10 and 11 only are acknowledged.
General call address is not acknowledged.
Power-on reset: D7 to D1 bits of data bytes are set to logic 0, D0 bit is set to logic 1.
1996 Dec 11
10
1996 Dec 11
11
VP
GND
1
18
3
CD input
CDL
+
+
CD output
4
7
CD input
CD output
+
6
Fig.3 Internal circuit.
n.c.
5
14
15
TDA4672
CCLP2
Cref
+
GND
8
13
CCLP1
+
+
+
SDA
9
10
MED759
+
11
12
SCL
CCOR
Y output
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
2
all input and output pins
except pins 9, 10 and 17
16
+
Y input
17
handbook, full pagewidth
SC
Philips Semiconductors
Product specification
TDA4672
INTERNAL CIRCUITRY
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
SDA
I2C-bus
SCL
CCOR
0.1 µF
(VBS)
VoY
CCLP1
0.1 µF
CCLP2
SDA
10
9
11
8
12
7
13
6
GND2
Vi(B − Y)
14
TDA4672
5
Vo(B − Y)
n.c.
0.1 µF
Cref
15
4
16
3
17
2
0.1 µF
(VBS)
sandcastle
pulse input
ViY
0.1 µF
SAND
GND1
1
18
Vo(R − Y)
Vi(R − Y)
CDL
VP
0.1 µF
+5 V
47 µF
15 Ω
MED758
VB
Fig.4 Test and application circuit.
1996 Dec 11
12
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
b2
MH
10
18
pin 1 index
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
0.85
inches
0.19
0.020
0.15
0.055
0.044
0.021
0.015
0.055
0.044
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
93-10-14
95-01-23
SOT102-1
1996 Dec 11
EUROPEAN
PROJECTION
13
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
TDA4672
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Dec 11
14
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
with enhanced peaking function
NOTES
1996 Dec 11
15
TDA4672
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Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
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Tel. +45 32 88 2636, Fax. +45 31 57 1949
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Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
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Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
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Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
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Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
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Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 247 9145, Fax. +7 095 247 9144
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1996
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1200/03/pp16
Date of release: 1996 Dec 11
Document order number:
9397 750 01473