INTEGRATED CIRCUITS DATA SHEET TDA8771A Triple 8-bit video Digital-to-Analog Converter (DAC) Product specification File under Integrated Circuits, IC02 1996 Jan 25 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A FEATURES GENERAL DESCRIPTION • 8-bit resolution The TDA8771A is a triple 8-bit video Digital-to-Analog Converter (DAC). It converts the digital input signals into analog voltage outputs at a maximum conversion rate of 35 MHz. • Sampling rate up to 35 MHz • Internal reference voltage regulator • No deglitching circuit required The DACs are based on resistor-string architecture with integrated output buffers. The output voltage range is determined by a built-in reference source. • Large output voltage range • 1 kΩ output load • Power dissipation only 200 mW The device is fabricated in a 5 V, CMOS process that ensures high functionality with low power dissipation. • Single 5 V power supply • 44-pin QFP package. APPLICATIONS • General purpose high-speed digital-to-analog conversion • Digital TV • Graphic display • Desktop video processing. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDDA analog supply voltage 4.5 5.0 5.5 V VDDD digital supply voltage 4.5 5.0 5.5 V IDDA analog supply current RL = 1 kΩ; note 1 10 33 45 mA IDDD digital supply current fclk = 35 MHz − 7 20 mA INL integral non-linearity fclk = 35 MHz; ramp input − ±0.5 ±1 LSB DNL differential non-linearity fclk = 35 MHz; ramp input − ±0.25 ±0.5 LSB fclk(max) maximum clock frequency 35 − − MHz Ptot total power dissipation 200 360 mW RL = 1 kΩ; fclk = 35 MHz; note 1 45 Note 1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. ORDERING INFORMATION TYPE NUMBER TDA8771AH 1996 Jan 25 PACKAGE NAME DESCRIPTION QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm 2 VERSION SOT307-2 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A BLOCK DIAGRAM V DDA handbook, full pagewidth RED digital inputs (bits R0 to R3) V DDD 32,35,39,43 4 clock input 7,27 31 12 to 9 1 reference current input (I REF ) 44 RED analog output 40 GREEN analog output 36 BLUE analog output 4 LSB DECODER TDA8771A RED digital inputs (bits R4 to R7) 4 8 5 to 3 GREEN digital inputs (bits G0 to G3) 4 20 to 17 4 MSB DECODER RESISTOR STRING 4 LSB DECODER GREEN digital inputs (bits G4 to G7) 4 BLUE digital inputs (bits B0 to B3) 4 16 to 13 4 MSB DECODER RESISTOR STRING 30,29 26,25 4 LSB DECODER BLUE digital inputs (bits B4 to B7) 4 24 to 21 4 MSB DECODER RESISTOR STRING BANDGAP REFERENCE 34, 37, 38,41 not connected 33 reference voltage decoupling input (VREF ) Fig.1 Block diagram. 1996 Jan 25 3 2,42 V SSA 6,28 V SSD MBH039 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A PINNING SYMBOL PIN DESCRIPTION IREF 1 reference current input for output buffers VSSA1 2 analog supply ground 1 R7 3 RED digital input data; bit 7 (MSB) R6 4 RED digital input data; bit 6 R5 5 RED digital input data; bit 5 VSSD1 6 digital supply ground 1 VDDD1 7 digital supply voltage 1 R4 8 RED digital input data; bit 4 R3 9 RED digital input data; bit 3 R2 10 RED digital input data; bit 2 R1 11 RED digital input data; bit 1 R0 12 RED digital input data; bit 0 (LSB) G7 13 GREEN digital input data; bit 7 (MSB) G6 14 GREEN digital input data; bit 6 G5 15 GREEN digital input data; bit 5 G4 16 GREEN digital input data; bit 4 G3 17 GREEN digital input data; bit 3 G2 18 GREEN digital input data; bit 2 G1 19 GREEN digital input data; bit 1 G0 20 GREEN digital input data; bit 0 (LSB) B7 21 BLUE digital input data; bit 7 (MSB) B6 22 BLUE digital input data; bit 6 B5 23 BLUE digital input data; bit 5 B4 24 BLUE digital input data; bit 4 B3 25 BLUE digital input data; bit 3 B2 26 BLUE digital input data; bit 2 VDDD2 27 digital supply voltage 2 VSSD2 28 digital supply ground 2 B1 29 BLUE digital input data; bit 1 B0 30 BLUE digital input data; bit 0 (LSB) CLK 31 clock input VDDA1 32 analog supply voltage 1 VREF 33 decoupling input for reference voltage n.c. 34 not connected VDDA2 35 analog supply voltage 2 OUTB 36 BLUE analog output n.c. 37 not connected n.c. 38 not connected VDDA3 39 analog supply voltage 3 OUTG 40 GREEN analog output 1996 Jan 25 4 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) I REF 1 33 V REF V SSA1 2 32 V DDA1 R7 3 31 R6 4 30 B0 R5 5 29 B1 V SSD1 6 VDDD1 7 27 V DDD2 R4 8 26 B2 R3 9 25 B3 R2 10 24 B4 R1 11 23 B7 21 B6 22 G0 20 G1 19 G2 18 G4 16 G5 15 G7 13 R0 12 G3 17 5 CLK 28 VSSD2 TDA8771A Fig.2 Pin configuration. 1996 Jan 25 34 n.c. index corner 44 OUTR handbook, full pagewidth OUTB RED analog output 35 V DDA2 44 36 OUTR 37 n.c. analog supply voltage 4 38 n.c. analog supply ground 2 43 OUTG 42 43 V DDA4 VSSA2 VDDA4 V DDA3 not connected 39 41 40 n.c. 41 n.c. DESCRIPTION 42 VSSA2 PIN G6 14 SYMBOL TDA8771A B5 MBH040 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL PARAMETER MIN. MAX. UNIT VDDA analog supply voltage −0.5 +6.5 V VDDD digital supply voltage −0.5 +6.5 V ∆VDD supply voltage difference between VDDA and VDDD −1.0 +1.0 V Tstg storage temperature −55 +150 °C Tamb operating ambient temperature 0 +70 °C Tj junction temperature − +125 °C THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE UNIT 75 K/W HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. 1996 Jan 25 6 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A CHARACTERISTICS VDDA = VDDD = 4.5 to 5.5 V; VSSA and VSSD shorted together; VDDA − VDDD = −0.5 to +0.5 V; Tamb = 0 to 70 °C; typical values measured at VDDA = VDDD = 5 V and Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDDA analog supply voltage VDDD digital supply voltage 4.5 5.0 5.5 V IDDA analog supply current RL = 1 kΩ; note 1 10 33 45 mA IDDD digital supply current fclk = 35 MHz − 7 20 mA 4.5 5.0 5.5 V Inputs CLOCK INPUT (PIN 31) VIL LOW level input voltage 0 − 1.2 V VIH HIGH level input voltage 2.0 − VDDD V R, G, B DIGITAL INPUTS (PINS 12 TO 8, 5 TO 3, 20 TO 13, 30, 29 AND 26 TO 21) VIL LOW level input voltage 0 − 1.2 V VIH HIGH level input voltage 2.0 − VDDD V − 0.6 0.7 mA IREF REFERENCE CURRENT INPUT FOR OUTPUT BUFFERS (PIN II 1) input current Timing; see Fig.3 fclk(max) maximum clock frequency 35 − − MHz tCPH clock pulse width HIGH 8 − − ns tCPL clock pulse width LOW 8 − − ns tr clock rise time − − 5 ns tf clock fall time − − 6 ns tSU;DAT input data set-up time 4 − − ns tHD;DAT input data hold time 4 − − ns 1.180 1.242 1.305 V Voltage reference (pin 33, referenced to VSSA) VREF output reference voltage Outputs OUTB, OUTR, OUTG ANALOG OUTPUTS (PINS 36, 44 AND 40, REFERENCED TO VSSA) FOR 1 kΩ LOAD; see Table 1 FSR full-scale output voltage range 2.80 2.95 3.10 V Vos offset of analog voltage output − 0.25 − V VOmax maximum output voltage data inputs = logic 1; note 2 2.95 3.20 3.45 V VOmin minimum output voltage data inputs = logic 0; note 2 0.05 0.25 0.45 V THD total harmonic distortion fi = 4.43 MHz; fclk = 35 MHz − −44 − dB ZL output load impedance 0.9 1.0 1.1 kΩ 1996 Jan 25 7 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) SYMBOL PARAMETER TDA8771A CONDITIONS MIN. TYP. MAX. UNIT Transfer function (fclk = 35 MHz) integral non-linearity ramp input − DNL differential non-linearity ramp input αct crosstalk DAC to DAC DAC to DAC matching INL 0.5 ±1 LSB − 0.25 ±0.5 LSB −50 − − dB − 1.0 2.0 % Switching characteristics (for 1 kΩ output load); see Fig.4 td input to 50% output delay time full-scale change − 12 − ns ts1 settling time 10% to 90% of full-scale change − 15 − ns ts2 settling time to ±1 LSB − 50 − ns − 1 − LSB⋅ns Output transients (glitches) area for 1 LSB change Vg Notes 1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. 2. VO is directly proportional to VREF. Table 1 Input coding and DAC output voltages (typical values) BINARY INPUT DATA (SYNC = BLANK = 0) CODE DAC OUTPUT VOLTAGES (V) OUTB, OUTR, OUTG RL = 1 kΩ 0000 0000 0 0.262 0000 0001 1 0.273 .... .... . . 1000 0000 128 1.731 .... .... . . 1111 1110 254 3.188 1111 1111 255 3.200 1996 Jan 25 8 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A TIMING ,,,,, ,,,,, t SU; DAT handbook, full pagewidth ,,,,, ,,,,, t HD; DAT V IH data input stable 50 % V IL clock input MBB656 - 1 t CPL t CPH Fig.3 Input timing. handbook, full pagewidth clock input input code (example of a full-scale input data transition) 50 % code 1023 code 0 1 LSB 714 mV (code 1023) 10 % td 50 % Vo(1) 90 % 54 mV (code 0) 1 LSB t s1 t s2 Fig.4 Switching timing. 1996 Jan 25 50 % V IL 9 MBB662 - 3 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A INTERNAL CIRCUITRY 1/1 page = 296 mm (Datasheet) V DDD V DDA 27 mm DACs resistor string GND V SSA V SSD (a) (b) V DDA V DDA V DDA V DD V DD V DD 125 Ω V DD (typ.) GND V SSA MBB658 - 1 (c) (d) (a) Digital inputs; pins 3 to 5, 8 to 26 and 29 to 31. (b) VREF; pin 33. (c) IREF; pin 1. (d) OUTR, G, B; pins 44, 40 and 36. Fig.5 Internal circuitry. 1996 Jan 25 10 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A APPLICATION INFORMATION handbook, full pagewidth V SSA 5 V OUTR 10 nF 1 kΩ OUTG 1 kΩ V SSA V DDA4 V SSA2 n.c. 44 V SSA 43 V SSA 5 V V SSA 5 V 42 41 OUTB 10 nF V SSA VDDA3 n.c. 40 39 38 10 nF VSSA V DDA2 n.c. n.c. 37 1 kΩ 36 35 34 I REF V REF 100 nF 1 33 2 32 R7 3 31 CLK R6 4 30 B0 R5 5 29 B1 V SSD1 6 28 VSSD2 V SSA 6.8 kΩ V SSA1 V DDD1 V DDA1 TDA8771A 5V 10 nF V DDD2 7 27 R4 8 26 B2 R3 9 25 B3 R2 10 24 B4 R1 11 23 B5 5V 5V 10 nF 10 nF V SSD 12 13 14 15 16 17 18 19 20 21 22 MBH041 R0 G7 G6 G5 G4 G3 G2 G1 G0 Analog and digital supplies should be separated and decoupled. Supplies are not connected internally. All ground pins must be connected. One ground plane is preferred although it depends on application. See Figs 7 and 9 for example of anti-aliasing filter. Fig.6 Application diagram. 1996 Jan 25 V SSA 11 B7 B6 V SSD Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A handbook, full pagewidth 12 µH TDA8771A 125 Ω 18 pF 180 Ω 12 µH 18 pF analog video output (R,G or B) 820 Ω OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36) 56 pF 150 pF 56 pF 2.4 V (p-p) MBH042 analog ground Fig.7 Example of anti-aliasing filter for 2.4 V output swing. Characteristics of Fig.8 • Order 5; adapted CHEBYSHEV • Ripple ρ ≥ 0.7 dB MSA693 0 1/2 page (Datasheet) α (dB) • f at −3 dB = 6.2 MHz • fNOTCH = 10.8 MHz. 22 mm 40 80 120 160 0 10 20 30 f (MHz) 40 Fig.8 Frequency response for filter shown in Fig.7. 1996 Jan 25 12 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A handbook, full pagewidth 27 µH TDA8771A 125 Ω 27 µH 6.8 pF 500 Ω 6.8 pF analog video output (R,G or B) 500 Ω OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36) 27 pF 68 pF 27 pF 1.5 V (p-p) MBH043 analog ground Fig.9 Example of anti-aliasing filter for 1.5 V output swing. Characteristics of Fig.10 • Order 5; adapted CHEBYSHEV • Ripple ρ ≥ 0.25 dB MSA694 0 1/2 page (Datasheet) α (dB) • f at −3 dB = 5.6 MHz • fNOTCH = 11.7 MHz. 22 mm 40 80 120 160 0 10 20 30 40 f i (MHz) Fig.10 Frequency response for filter shown in Fig.9. 1996 Jan 25 13 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A PACKAGE OUTLINE QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 θ o 10 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT307-2 1996 Jan 25 EUROPEAN PROJECTION 14 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A SOLDERING Wave soldering Introduction Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. If wave soldering cannot be avoided, the following conditions must be observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • The footprint must be at an angle of 45° to the board direction and must incorporate solder thieves downstream and at the side corners. Reflow soldering Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). Reflow soldering techniques are suitable for all QFP packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our “Quality Reference Handbook” (order code 9397 750 00192). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1996 Jan 25 15 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jan 25 16 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A NOTES 1996 Jan 25 17 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A NOTES 1996 Jan 25 18 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDA8771A NOTES 1996 Jan 25 19 Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. 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(0181)754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601 Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-2724825 SCDS47 © Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/1100/01/pp20 Document order number: Date of release: 1996 Jan 25 9397 750 00591