DISCRETE SEMICONDUCTORS DATA SHEET BGY204 UHF amplifier module Product specification File under Discrete Semiconductors, SC09 1996 May 21 Philips Semiconductors Product specification UHF amplifier module BGY204 FEATURES PINNING - SOT321B • 4.8 V nominal supply voltage PIN DESCRIPTION • 3.2 W output power 1 RF input • Easy control of output power by DC voltage. 2 VC 3 VS 4 RF output APPLICATIONS • Digital cellular radio systems with Time Division Multiple Access (TDMA) operation (GSM systems) in the 880 to 915 MHz frequency range. Flange ground DESCRIPTION The BGY204 is a four-stage UHF amplifier module in a SOT321B package. The module consists of four NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized ceramic substrate. 1 2 3 4 Top view MSA489 Fig.1 Simplified outline. QUICK REFERENCE DATA RF performance at Tmb = 25 °C. MODE OF OPERATION f (MHz) VS (V) VC (V) PL (W) Gp (dB) η (%) ZS; ZL (Ω) Pulsed; δ = 1 : 8 880 to 915 4.8 ≤3.5 3.2 ≥35 typ. 45 50 1996 May 21 2 Philips Semiconductors Product specification UHF amplifier module BGY204 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VS DC supply voltage − 8 V VC DC control voltage − 4.5 V PD input drive power − 2 mW PL = 0 PL load power − 4 W Tstg storage temperature VS ≤ 6.5 V; ZL = 50 Ω −40 +100 °C Tmb operating mounting base temperature −30 +100 °C CHARACTERISTICS ZS = ZL = 50 Ω; PD = 1 mW; VS = 4.8 V; VC ≤ 3.5 V; f = 880 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT IQ leakage current VC = 0.5 V − − 0.2 mA IC control current adjust VC for PL = 3.2 W − − 0.5 mA PL load power 3.2 − − W Gp power gain adjust VC for PL = 3.2 W 35 − − dB η efficiency adjust VC for PL = 3.2 W 40 45 − % H2 second harmonic adjust VC for PL = 3.2 W − − −40 dBc H3 third harmonic adjust VC for PL = 3.2 W − − −40 dBc VSWRin input VSWR adjust VC for PL = 3.2 W − − 2.5 : 1 stability PD = 0.5 to 2 mW; VS = 4 to 6.5 V; VC = 0 to 3.5 V; PL ≤ 3.2 W; VSWR ≤ 6 : 1 through all phases; − − −60 dBc isolation VC = 0.5 V − − −36 dBm 1 − − MHz − − −85 dBm control bandwidth Pn 1996 May 21 noise power PL = 3.2 W; bandwidth = 30 kHz; 20 MHz above transmitter band ruggedness VS = 6.5 V; adjust VC for PL = 3.2 W; VSWR ≤ 10 : 1 through all phases 3 no degradation Philips Semiconductors Product specification UHF amplifier module BGY204 MGD363 MGD364 40 PL (dBm) 40 handbook, halfpage PL (dBm) 20 20 915 MHz 880 MHz 0 915 MHz 880 MHz 0 −20 −40 1.0 1.5 2.0 2.5 3.0 −20 −45 3.5 VC (V) −35 −25 −15 −5 5 PD (dBm) ZS = ZL = 50 Ω; VS = 4.8 V; adjust VC for PL = 3.2 W; Tmb = 25 °C. Fig.2 Fig.3 output amplitude modulation (%) ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; Tmb = 25 °C. Load power as a function of control voltage; typical values. Load power as a function of drive power; typical values. MGD365 20 MGD366 50 handbook, halfpage handbook, halfpage η % 16 915 MHz 40 880 MHz 915 MHz 12 30 880 MHz 8 20 4 10 0 5 15 25 PL (dBm) 0 35 0 1 2 ZS = ZL = 50 Ω; VS = 4.8 V; Tmb = 25 °C; input amplitude modulation = 3%. ZS = ZL = 50 Ω; VS = 4.8 V; Tmb = 25 °C. Fig.4 Fig.5 Output amplitude modulation as a function of load power; typical values. 1996 May 21 4 3 P L (W) 4 Efficiency as a function of load power; typical values. Philips Semiconductors Product specification UHF amplifier module BGY204 MGD367 MGD368 5 4 handbook, halfpage handbook, halfpage PL (W) VC (V) H2, H3 (dBc) VC 4 −30 −40 3 3 H2 2 −50 H3 2 −60 1 1 0 880 890 900 910 f (MHz) 0 880 920 ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; VC = 3.5 V; Tmb = 25 °C. Fig.6 890 900 910 ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; PL = 3.2 W; Tmb = 25 °C. Load power as a function of frequency; typical values. Fig.7 Control voltage and harmonics as functions of frequency; typical values. MGD369 MGD370 3.5 8 handbook, halfpage handbook, halfpage VC (V) PL (W) VS = 6.5 V 6 f (MHz) −70 920 PL = 35 dBm 3.0 30 dBm 4.8 V 4 2.5 20 dBm 2.0 10 dBm 0 dBm 1.5 −40 0 4V 2 0 -40 0 40 80 Tmb (oC) 40 Tmb (oC) ZS = ZL = 50 Ω; PD = 0 dBm; VC = 3.5 V; f = 900 MHz. ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; f = 900 MHz. Fig.8 Fig.9 Load power as a function of the mounting base temperature; typical values. 1996 May 21 5 80 Control voltage as a function of mounting base temperature; typical values. Philips Semiconductors Product specification UHF amplifier module BGY204 MGD371 25 MGD372 25 handbook, halfpage handbook, halfpage Gv Gv 20 20 15 15 915 MHz 10 10 880 MHz 880 MHz 915 MHz 5 5 0 0 0 1 2 f (MHz) 3 0 2 f (MHz) 3 PL = 25 dBm. ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; Tmb = 25 °C. PL = 30 dBm. ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; Tmb = 25 °C. Fig.10 Control loop voltage gain as a function of the frequency on the control pin; typical values. Fig.11 Control loop voltage gain as a function of the frequency on the control pin; typical values. MGD373 25 1 MGD374 25 handbook, halfpage handbook, halfpage Gv Gv 20 20 915 MHz 15 15 915 MHz 880 MHz 880 MHz 10 10 5 5 0 0 0 1 2 f (MHz) 3 0 1 2 f (MHz) 3 PL = 20 dBm. ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; Tmb = 25 °C. PL = 15 dBm. ZS = ZL = 50 Ω; PD = 0 dBm; VS = 4.8 V; Tmb = 25 °C. Fig.12 Control loop voltage gain as a function of frequency on the control pin; typical values. Fig.13 Control loop voltage gain as a function of frequency on the control pin; typical values. 1996 May 21 6 Philips Semiconductors Product specification UHF amplifier module BGY204 handbook, full pagewidth C2 C1 Z1 R1 R2 L1 Z2 C3 C4 typ. 1.5 A RF input VC VS MGD375 RF output Fig.14 Test circuit. 90 handbook, full pagewidth 1 2 3 4 50 Ω input 50 Ω output VC VS Dimensions in mm. Fig.15 Printed-circuit board layout. 1996 May 21 7 MSA915 60 Philips Semiconductors Product specification UHF amplifier module BGY204 List of components (See Fig.14) COMPONENT DESCRIPTION VALUE CATALOGUE NO. C1, C2 multilayer ceramic chip capacitor 680 pF − C3 tantalum capacitor 2.2 µF; 35 V − C4 electrolytic capacitor 47 µF; 40 V − L1 Grade 3B Ferroxcube bead Z1, Z2 stripline; note 1 50 Ω − R1 metal film resistor 100 Ω; 0.4 W − R2 metal film resistor 5 Ω; 0.4 W − 4330 030 36300 Note 1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr = 2.2); thickness 1⁄16 inch. 1996 May 21 8 Philips Semiconductors Product specification UHF amplifier module BGY204 SOLDERING The indicated temperatures are those at the solder interfaces. MLB740 300 handbook, halfpage Advised solder types are types with a liquidus less than or equal to 210 °C. T mb ( oC) Solder dots or solder prints must be large enough to wet the contact areas. 200 Footprints for soldering should cover the module contact area +0.1 mm on all sides. Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. 100 Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. 0 0 The maximum temperature profile and soldering time is indicated as follows (see Fig.16): 100 200 300 t (s) 400 t = 350 s at 100 °C t = 300 s at 125 °C t = 200 s at 150 °C t = 100 s at 175 °C Fig.16 Maximum allowable temperature profile. t = 50 s at 200 °C t = 5 s at 250 °C (maximum temperature). Cleaning The following fluids may be used for cleaning: • Alcohol • Bio-Act (Terpene Hydrocarbon) • Triclean B/S • Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product. 1996 May 21 9 Philips Semiconductors Product specification UHF amplifier module BGY204 PACKAGE OUTLINE 25.0 24.6 handbook, full pagewidth 1.65 1.25 22.1 21.7 3.0 2.6 4.3 3.9 3.1 (4×) 2.9 13.4 13.0 5.1 4.9 2.4 2.2 1 2 3 0.55 (4×) 0.45 3.7 3.3 5.08 7.62 5.08 Dimensions in mm. Fig.17 SOT321B. 1996 May 21 1.2 min 4 10 0.25 M (4×) 0.1 MSA397 0.30 0.20 Philips Semiconductors Product specification UHF amplifier module BGY204 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 May 21 11