INTEGRATED CIRCUITS DATA SHEET TDA9181 Integrated multistandard comb filter Objective specification File under Integrated Circuits, IC02 2000 Nov 22 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 FEATURES GENERAL DESCRIPTION • One-chip multistandard adaptive comb filter The TDA9181 is a an adaptive PAL/NTSC comb filter with two internal delay lines, filters, clock control and input clamps. Video standards PAL B, G, H, D, I, M and N and NTSC M are supported. • Cross luminance reduction • Cross colour reduction • No chroma trap, therefore sharper vertical luminance transients Two CVBS input signals can be selected by means of an input switch. • Analog discrete-time signal processing, therefore no quantization noise The selected CVBS input signal is filtered to obtain a combed luminance output signal and a combed chrominance output signal. Switched capacitor circuit techniques are used, requiring an internal clock, locked on to the colour subcarrier frequency. • Anti-aliasing and reconstruction filters are included • Input switch selects between two Y/CVBS inputs • Output switch selects between combed CVBS and an external Y/C source The colour subcarrier frequency as well as twice the colour subcarrier frequency may be applied to the IC. • fSC as well as 2 × fSC colour subcarrier signal may be applied In addition to the comb filter the circuit contains an output switch so that a selection can be made between the combed CVBS signal and an external Y/C signal. • Alignment free • Few external components • Low power. The IC is available in a DIP16 and SO16 package. The supply voltage is 5 V. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCCA analog supply voltage 4.5 5.0 5.5 V ICCA analog supply current − 25 − mA VDDD digital supply voltage 4.5 5.0 5.5 V IDDD digital supply current − 10 − mA Vi(Y/CVBS)(p-p) luminance or CVBS input signal voltage (peak-to-peak value) 0.7 1.0 1.4 V Vi(CIN)(p-p) chrominance input signal voltage (peak-to-peak value) − 0.7 1.0 V Vi(FSC)(p-p) colour subcarrier input signal voltage (peak-to-peak value) 100 200 400 mV Vo(Y/CVBS)(p-p) luminance or CVBS output signal voltage (peak-to-peak value) 0.6 1.0 1.54 V Vo(CIN)(p-p) chrominance output signal voltage (peak-to-peak value) − 0.7 1.1 V ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA9181P DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-4 TDA9181T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 2000 Nov 22 2 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 6 INPSEL Y/CVBS1 14 12 CLAMP 3 SC ADAPTIVE COMB FILTER LPF CLAMP 16 TDA9181 3 CIN Y/CVBSOUT LPF 2H/4H DELAY LPF Y/CVBS2 5 2 Philips Semiconductors VDDD Integrated multistandard comb filter BLOCK DIAGRAM 2000 Nov 22 VCCA handbook, full pagewidth COUT 1 7 SANDCASTLE DETECTOR FILTER TUNING (LPFs) 4 × fsc CLOCK GENERATOR 9 FSC 8 FSCSEL 11 10 SYS1 SYS2 4 15 AGND DGND OUTSEL MGT518 Objective specification TDA9181 Fig.1 Block diagram. 13 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 PINNING SYMBOL PIN DESCRIPTION CIN 1 chrominance signal input INPSEL 2 input switch select input Y/CVBS2 3 luminance or CVBS signal 2 input DGND 4 digital ground VDDD 5 digital supply voltage VCCA 6 analog supply voltage SC 7 sandcastle signal input FSCSEL 8 colour subcarrier select input FSC 9 colour subcarrier input signal SYS2 10 standard select 2 input SYS1 11 standard select 1 input Y/CVBS1 12 luminance or CVBS signal 1 input AGND 13 analog ground (signal reference) Y/CVBSOUT 14 luminance or CVBS signal output OUTSEL 15 output switch select input COUT 16 chrominance signal output handbook, halfpage handbook, halfpage CIN 1 16 COUT INPSEL 2 13 AGND 14 Y/CVBSOUT DGND 4 TDA9181P 13 AGND TDA9181T VDDD 5 12 Y/CVBS1 VDDD 5 12 Y/CVBS1 VCCA 6 11 SYS1 VCCA 6 11 SYS1 SC 7 10 SYS2 SC 7 10 SYS2 FSCSEL 8 9 FSCSEL 8 FSC MGT519 9 FSC MGT520 Fig.2 Pin configuration (DIP16). 2000 Nov 22 15 OUTSEL Y/CVBS2 3 14 Y/CVBSOUT DGND 4 16 COUT INPSEL 2 15 OUTSEL Y/CVBS2 3 CIN 1 Fig.3 Pin configuration (SO16). 4 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 FUNCTIONAL DESCRIPTION Output configuration Input configuration The luminance output switch selects between the reconstructed combed luminance signal and one of the buffered and clamped input signals, Y/CVBS1 or Y/CVBS2. The chrominance output switch selects between the reconstructed combed chrominance signal and the chrominance input signal (CIN). An external coupling capacitor is needed for CIN. The selected signals are applied to the outputs Y/CVBSOUT and COUT respectively via a buffer stage. The output switch signal (OUTSEL) determines whether the output switches select the internal combed signals or the external Y/C signals. The Y/CVBS1 and Y/CVBS2 input signals are clamped by means of an internally generated clamp pulse which is derived from the sandcastle input signal (pin SC). If no sandcastle signal is available, a clamp pulse signal may be applied to pin SC. External clamp capacitors are needed. The buffered and clamped Y/CVBS1 and Y/CVBS2 signals are then applied to the input switch. The input switch select signal (INPSEL) determines whether Y/CVBS1 or Y/CVBS2 is passed through to the anti-alias low-pass filter. This 3rd-order low-pass filter is optimized for best performance with respect to step response and clock suppression. The filtered signal is sampled at a clock frequency of four times the colour subcarrier frequency (fSC). Clock generation and filter tuning The clock generator is driven by a Phase-Locked Loop (PLL) circuit which generates a reference frequency of four times the colour subcarrier frequency. This PLL circuit is phase-locked to the colour subcarrier input signal (FSC). Several internal clock signals are derived from the 4 × fSC reference. A colour subcarrier frequency signal is applied to pin FSC. The colour subcarrier select input signal (FSCSEL) indicates whether the colour subcarrier frequency (fSC) or twice the colour subcarrier frequency (2 × fSC) is being applied at the FSC input. An external coupling capacitor is needed for the colour subcarrier input signal. The filter tuning ensures the automatic alignment of the anti-alias and the reconstruction low-pass filters. A 4 × fSC clock signal is used as a reference for the alignment. The tuning takes place each line during the line blanking and is initiated by means of an internally generated signal which is derived from the sandcastle input signal. Comb filter The sampled CVBS signal is applied to two delay lines. Depending on the applied standard, one delay line delays the signal over 1 or 2H for NTSC and PAL respectively (1H = one line-time). The standard select inputs SYS1 and SYS2 indicate which standard, PAL B, G, H, D, I, M, N or NTSC M, is being applied. If the output switches select external Y/C signals the oscillator of the PLL circuit is stopped regardless of the FSC input and no internal clock signals are generated. The filter tuning is also stopped. The direct and delayed signals are applied to an adaptive comb filter. The adaptive comb filter performs band-pass filtering around the colour subcarrier frequency and compares the contents of adjacent lines. In this way the combing of signals with different information is prevented and artifacts such as hanging dots are avoided. Both the combed chrominance and the combed luminance signals are passed through a reconstruction low-pass filter to obtain continuous-time signals. These low-pass filters are 3rd-order, optimized for best performance with respect to step response and clock suppression. The reconstructed signals are applied to the output switches. 2000 Nov 22 5 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 Table 5 Mode definitions Table 1 General mode definitions; note 1 PIN OUTSEL PIN FSCSEL MODE LOW COMB HIGH YC YC Y/CVBS1 or Y/CVBS2 signal COUT output signal definitions comb filtered chrominance signal YC CIN signal INPUT SWITCH MODE LOW Y/CVBS1 input selected HIGH Y/CVBS2 input selected Note 1. If the INPSEL pin is left open-circuit, the pin is pulled LOW by means of an internal pull-down resistor to analog ground (AGND). Thus the Y/CVBS1 input can also be selected by not connecting the INPSEL pin. 2000 Nov 22 Video standard mode definitions; note 1 PIN SYS2 VIDEO STANDARD LOW LOW PAL M LOW HIGH PAL B, G, H, D or I HIGH LOW NTSC M HIGH HIGH PAL N 1. If the SYS1 and SYS2 pins are left open-circuit, the SYS1 pin is pulled HIGH by means of an internal pull-up resistor to analog supply (VCCA) and the SYS2 pin is pulled LOW by means of an internal pull-down resistor to analog ground (AGND). Thus the NTSC M video standard can also be selected by not connecting pins SYS1 and SYS2. Input switch mode definitions; note 1 PIN INPSEL 2 × fSC Note COUT OUTPUT SIGNAL COMB Table 4 HIGH PIN SYS1 Y/CVBSOUT OUTPUT SIGNAL comb filtered luminance signal MODE fSC Table 6 Y/CVBSOUT output signal definitions COMB Table 3 LOW 1. If the FSCSEL pin is left open-circuit, the pin is pulled LOW by means of an internal pull-down resistor to analog ground (AGND). Thus the fSC mode can also be selected by not connecting the FSCSEL pin. 1. If the OUTSEL pin is left open-circuit, the pin is pulled LOW by means of an internal pull-down resistor to analog ground (AGND). Thus the COMB mode can also be selected by not connecting the OUTSEL pin. MODE FSC INPUT SIGNAL FREQUENCY Note Note Table 2 FSC mode definitions; note 1 6 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDDD digital supply voltage − 5.5 V VCCA analog supply voltage − 5.5 V Vi(prot)(th) input voltage protection threshold −0.3 VDD + 0.3 V Tstg storage temperature −25 +150 °C Tamb ambient temperature −25 +70 °C Tsol soldering temperature − 260 °C Tj junction temperature Ves electrostatic handling voltage for 5 s − 150 °C HBM; all pins, except pins 5 and 6; notes 1, 2 and 3 −3000 +3000 V MM; all pins, except pins 5 and 6; notes 1, 4 and 5 −300 +300 V Notes 1. All pins are protected against ESD by means of internal clamping diodes. 2. Human Body Model (HBM): R = 1.5 kΩ; C = 100 pF. 3. Pin 5 (VDDD) and pin 6 (VCCA): HBM: −1500 V < Ves < +1500 V. 4. Machine Model (MM): R = 0 Ω; C = 200 pF. 5. Pin 5 (VDDD) and pin 6 (VCCA): MM: −150 V < Ves < +150 V. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE UNIT TDA9181P 75 K/W TDA9181T 95 K/W thermal resistance from junction to ambient in free air QUALITY SPECIFICATION In accordance with “SNW-FQ-611E”. Latch-up At an ambient temperature of 70 °C all pins meet the following specification: • Itrigger ≥ 100 mA or ≥ 1.5 VDD(max) • Itrigger ≤ −100 mA or ≤ −0.5 VDD(max). 2000 Nov 22 7 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 CHARACTERISTICS VCCA = VDDD = 5 V; Tamb = 25 °C; input signal Y/CVBS1 = 1 V (p-p); input signal Y/CVBS2 = 1 V (p-p); input signal CIN = 0.7 V (p-p); input signal FSC = 200 mV (p-p) sine wave at fSC; input signal SC = 5 V (p-p) sandcastle signal; test signal: 100/0/75/0 EBU colour bar for PAL B, G, H, D, I and N, 100% white 75% amplitude FCC colour bar for NTSC M and PAL M; source impedance for Y/CVBS1 and Y/CVBS2 = 75 Ω, coupled with 10 nF; source impedance for CIN and FSC = 75 Ω, coupled with 100 nF; load impedance for CVBS/YOUT and COUT = 15 pF to analog ground (pin AGND); all voltages are related to analog ground (pin AGND); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VCCA analog supply voltage 4.5 5.0 5.5 V ICCA analog supply current − 25 − mA VDDD digital supply voltage 4.5 5.0 5.5 V IDDD digital supply current − 10 − mA P power dissipation − 175 − mW 0.7 1.0 1.4 V − 20 − lines during clamping −10 0 +10 µA during active video −10 0 +10 nA Luminance or CVBS input 1 and input 2; pins Y/CVBS1 and Y/CVBS2 Vi(Y/CVBS)(p-p) luminance or CVBS input voltage (peak-to-peak value) tclamp(Y/CVBS) clamp time constant Ii(Y/CVBS) input current including sync Chrominance input; pin CIN Vi(CIN)(p-p) chrominance input voltage (peak-to-peak value) − 0.7 1.0 V Ri(CIN) input resistance 30 − − kΩ 100 200 400 mV Colour subcarrier input; pin FSC Vi(FSC)(p-p) subcarrier input voltage (peak-to-peak value) D duty cycle Ri(FSC) input resistance square wave 40 50 60 % 30 − − kΩ no clamping − − 3.3 V clamping 3.7 − − V Sandcastle input; pin SC Vi(SC) sandcastle input voltage tW pulse width clamping; note 1 2.6 − − µs tW(rep) pulse rising edge position with respect to end of line-blanking; note 1 − − − 2.6 µs Ri(SC) input resistance 1 − − MΩ Ci(SC) input capacitance − − 2 pF Input switch select input; pin INPSEL VIL LOW-level input voltage Y/CVBS1 selected − − 0.5 V Y/CVBS2 selected VIH HIGH-level input voltage 2.0 − − V Ri(INPSEL) input resistance 100 − − kΩ Ci(INPSEL) input capacitance − − 2 pF 2000 Nov 22 8 Philips Semiconductors Objective specification Integrated multistandard comb filter SYMBOL PARAMETER TDA9181 CONDITIONS MIN. TYP. MAX. UNIT Output switch select input; pin OUTSEL VIL LOW-level input voltage COMB mode − − 0.5 V VIH HIGH-level input voltage YC mode 2.0 − − V Ri(OUTSEL) input resistance 100 − − kΩ Ci(OUTSEL) input capacitance − − 2 pF Colour subcarrier select input; pin FSCSEL VIL LOW-level input voltage fSC at FSC input; note 2 − − 0.5 V VIH HIGH-level input voltage 2 × fSC at FSC input 2.0 − − V Ri(FSCSEL) input resistance 100 − − kΩ Ci(FSCSEL) input capacitance − − 2 pF − − 0.5 V Standard select inputs 1 and 2; pins SYS1 and SYS2 VIL LOW-level input voltage VIH HIGH-level input voltage 2.0 − − V Ri(SYS) input resistance 100 − − kΩ Ci(SYS) input capacitance − − 2 pF 0.6 1.0 1.54 V −1 0 +1 dB COMB mode; PAL B, G, H, D and I 6 − − MHz COMB mode; NTSC M, PAL M and N 5 − − MHz YC mode 10 − − MHz COMB mode; PAL B, G, H, D and I; note 3 − 650 − ns COMB mode; NTSC M, PAL M and N; note 3 − 800 − ns YC mode − 15 − ns Luminance output; pin Y/CVBSOUT Vo(Y/CVBSOUT)(p-p) luminance output signal (peak-to-peak value) EG(Y) luminance gain error B−3dB(Y) −3 dB luminance bandwidth td(proc)(Y) luminance processing delay including sync Vclamp voltage level during clamping − 1.5 − V Ebl black level error during blanking; note 4 −10 0 +10 mV S/N luminance signal-to-noise ratio (1 V/Vrms noise) unweighted; 200 kHz to 5 MHz 56 − − dB αct crosstalk between different inputs 0 to 5 MHz − − −50 dB fCLK(res)(Y) residues of clock frequencies in the luminance signal (Vrms/1 V) COMB mode; note 2 f = 4 × fSC − − −30 dB f = 2 × fSC − − −30 dB f = 1.33 × fSC − − −30 dB f = fSC − − −40 dB 2000 Nov 22 9 Philips Semiconductors Objective specification Integrated multistandard comb filter SYMBOL FSCres(YC) PARAMETER FSC residue in YC mode (Vrms/1 V) TDA9181 CONDITIONS MIN. TYP. MAX. UNIT − − −60 dB f = 2 × fSC; 2 × fSC at FSC − input − −60 dB − − dB 30 − − dB − 10 − dB − 10 − dB 30 − − dB − 10 − dB − 10 − dB 30 − − dB − 10 − dB − 10 − dB 30 − − dB − 10 − dB − 10 − dB f = fSC; fSC at FSC input; note 2 αct crosstalk suppression at vertical transient black ↔ multi-burst [1 V/V (p-p)] vertical transition active 26 video ↔ vertical blanking; Figs 6 and 7; note 5 SUPcomb(Y) suppression (comb depth) with respect to luminance band-pass nearest to fSC COMB mode; PAL B, G, H, D and I; note 2 and Fig.8 f = fSC 283.75 – 74 f = ------------------------------- × f SC 283.75 283.75 + 74 f = ------------------------------- × f SC 283.75 COMB mode; PAL M; note 2 and Fig.9 f = fSC 227.25 – 59 f = ------------------------------- × f SC 227.25 227.25 + 59 f = ------------------------------- × f SC 227.25 COMB mode, PAL N; see note 2 and Fig.10 f = fSC 229.25 – 59 f = ------------------------------- × f SC 229.25 229.25 + 59 f = ------------------------------- × f SC 229.25 COMB mode, NTSC M; see note 2 and Fig.11 f = fSC 227.5 – 59 f = --------------------------- × f SC 227.5 227.5 + 59 f = ---------------------------- × f SC 227.5 Ro output resistance − − 500 Ω ZL load impedance − − 15 pF 2000 Nov 22 10 Philips Semiconductors Objective specification Integrated multistandard comb filter SYMBOL PARAMETER TDA9181 CONDITIONS MIN. TYP. MAX. UNIT Chrominance output; pin COUT Vo(COUT)(p-p) chrominance output signal (peak-to-peak value) − 0.7 1.1 V EG(chrom) chrominance gain error −1 0 +1 dB B−3dB(chrom) −3 dB chrominance bandwidth COMB mode, around fSC; 1.5 note 2 − − MHz 10 − − MHz ∆t(proc)(Y) difference with luminance processing delay − 0 20 ns VDC DC voltage level − 1.5 − V S/Nchrom chrominance signal-to-noise ratio (0.7 V/Vrms noise) unweighted; fSC ± 0.3fSC; note 2 56 − − dB αct crosstalk between different inputs 0 to 5 MHz − − −50 dB fclk(res)(chrom) residues of clock frequencies in the chrominance signal (Vrms/0.7 V) COMB mode; note 2 YC mode; base-band FSCres(YC) αct 2000 Nov 22 FSC residue in YC mode (Vrms/0.7 V) crosstalk suppression at vertical transient no-colour colour [0.7 V/V (p-p)] f = 4 × fSC − − −30 dB f = 2 × fSC − − −30 dB f = 1.33 × fSC − − −40 dB f = fSC − − −50 dB − − −60 dB f = 2 × fSC; 2 × fSC at FSC − input − −60 dB vertical transition active 26 video ↔ vertical blanking; see Figs 6 and 7 and note 6 − − dB f = fSC; fSC at FSC input; note 2 11 Philips Semiconductors Objective specification Integrated multistandard comb filter SYMBOL SUPcomb(chrom) PARAMETER suppression (comb depth) with respect to chrominance band-pass at f = fSC TDA9181 CONDITIONS MIN. TYP. MAX. UNIT COMB mode; PAL B, G, H, D and I; note 2 and Fig.12 284 f = ------------------ × f SC 283.75 30 − − dB 284 – 74 f = ---------------------- × f SC 283.75 30 − − dB 284 + 74 f = ----------------------- × f SC 283.75 30 − − dB 227 f = ------------------ × f SC 227.25 30 − − dB 227 – 59 f = ---------------------- × f SC 227.25 30 − − dB 227 + 59 f = ----------------------- × f SC 227.25 30 − − dB 229 f = ------------------ × f SC 229.25 30 − − dB 229 – 59 f = ---------------------- × f SC 229.25 30 − − dB 229 + 59 f = ----------------------- × f SC 229.25 30 − − dB 227 f = --------------- × f SC 227.5 30 − − dB 227 – 59 f = ---------------------- × f SC 227.5 30 − − dB 227 + 59 f = ----------------------- × f SC 227.5 30 − − dB COMB mode; PAL M; see note 2 and Fig.13 COMB mode; PAL N; see note 2 and Fig.14 COMB mode; NTSC M; see note 2 and Fig.15 Ro output resistance − − 500 Ω ZL load impedance − − 15 pF 2000 Nov 22 12 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 Notes 1. The pulse should fall inside the line-blanking interval, after the rising edge of the synchronizing pulse. 2. fSC = colour subcarrier frequency; fSC = 4.43361875 MHz for the PAL B, G, H, D and I systems; fSC = 3.57561149 MHz for the PAL M system; fSC = 3.58205625 MHz for the PAL N system; fSC = 3.579545 MHz for the NTSC M system. 3. For PAL B, G, H, D and I: with respect to 567.5 colour subcarrier periods (equals 128.00 µs) due to 2H delay in the comb filter. For PAL M: with respect to 454.5 colour subcarrier periods (equals 127.11 µs) due to 2H delay in the comb filter. For PAL N: with respect to 458.5 colour subcarrier periods (equals 128.00 µs) due to 2H delay in the comb filter. For NTSC M: with respect to 227.5 colour subcarrier periods (equals 63.556 µs) due to 1H delay in the comb filter. 4. With respect to the voltage level during clamping. 5. Test signal for PAL B, G, H, D, I and N: CCIR-18 multi-burst (see Fig.4). For PAL M and NTSC M: 100% amplitude FCC multi-burst (see Fig.5). 6. Test signal for PAL B, G, H, D, I and N: 100/0/75/0 EBU colour bar. For PAL M and NTSC M: 100% white 75% amplitude FCC colour bar. handbook, full pagewidth 1 (V) 0.86 0.5 1.0 2.0 3.8 4.8 5.8 MHz 0.65 0.45 0.44 0.30 0.15 0 MGT521 Fig.4 CCIR-18 multi-burst. 2000 Nov 22 13 Philips Semiconductors Objective specification Integrated multistandard comb filter handbook, full pagewidth 1 TDA9181 0.5 1.5 2.0 3.0 3.58 4.1 MHz (V) 0.65 0.45 0.30 0.15 0 MGT522 Fig.5 100% amplitude FCC multi-burst. 2000 Nov 22 14 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth input output line n − 2 line n − 2 line n − 1 line n line n − 1 line n crosstalk line n + 1 line n + 2 line n + 3 line n + 1 line n + 2 line n + 3 line n + 1 line n + 2 line n + 3 line n + 1 line n + 2 crosstalk Transition at top of field input output line n − 2 line n − 1 line n line n − 2 line n − 1 line n crosstalk line n + 3 crosstalk MGT523 Transition at bottom of field Fig.6 Vertical transitions active video ↔ vertical blanking from line to line (PAL systems). handbook, full pagewidth input output line n − 2 line n − 1 line n − 2 line n − 1 line n line n line n + 1 line n + 2 line n + 3 line n + 1 line n + 2 line n + 3 line n + 2 line n + 3 line n + 2 line n + 3 crosstalk Transition at top of field input output line n − 2 line n − 1 line n line n − 2 line n − 1 line n line n + 1 line n + 1 crosstalk MGT524 Transition at bottom of field Fig.7 Vertical transitions active video ↔ vertical blanking from line to line (NTSC system). 2000 Nov 22 15 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 1 × f SC 0 2 × f SC Detailed view comb depth at f = f SC Y Y 1 0.5 U V U V U 0 282.75 f 283.75 SC 283 f 283.75 SC 283.25 f 283.75 SC 283.5 f 283.75 SC 283.75 f 283.75 SC 284 f 283.75 SC 284.25 f 283.75 SC 284.5 f 283.75 SC 284.75 f 283.75 SC MGT525 Fig.8 Luminance transfer characteristic (PAL B, G, H, D and I systems). 2000 Nov 22 16 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 1 × f SC 0 2 × f SC Detailed view comb depth at f = f SC Y Y 1 0.5 U V U V U 0 226.25 f 227.25 SC 226.5 f 227.25 SC 226.75 f 227.25 SC 227 f 227.25 SC 227.25 f 227.25 SC 227.5 f 227.25 SC 227.75 f 227.25 SC 228 f 227.25 SC 228.25 f 227.25 SC MGT526 Fig.9 Luminance transfer characteristic (PAL M system). 2000 Nov 22 17 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 1 × f SC 0 2 × f SC Detailed view comb depth at f = f SC Y Y 1 0.5 U V U V U 0 228.25 f 229.25 SC 228.5 f 229.25 SC 228.75 f 229.25 SC 229 f 229.25 SC 229.25 f 229.25 SC 229.5 f 229.25 SC 229.75 f 229.25 SC 230 f 229.25 SC 230.25 f 229.25 SC MGT527 Fig.10 Luminance transfer characteristic (PAL N system). 2000 Nov 22 18 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 1 × f SC 0 2 × f SC Detailed view comb depth at f = f SC Y Y Y Y 1 0.5 C C C C C 0 225.5 f 227.5 SC 226 f 227.5 SC 226.5 f 227.5 SC 227 f 227.5 SC 227.5 f 227.5 SC 228 f 227.5 SC 228.5 f 227.5 SC 229 f 227.5 SC 229.5 f 227.5 SC MGT528 Fig.11 Luminance transfer characteristic (NTSC M system). 2000 Nov 22 19 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 1 × f SC 0 2 × f SC Detailed view comb depth at f = U V U 284 f 283.75 SC V 1 0.5 U Y Y 0 282.75 f 283.75 SC 283 f 283.75 SC 283.25 f 283.75 SC 283.5 f 283.75 SC 283.75 f 283.75 SC 284 f 283.75 SC 284.25 f 283.75 SC 284.5 f 283.75 SC MGT529 Fig.12 Chrominance transfer characteristic (PAL B, G, D, H and I systems). 2000 Nov 22 20 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 1 × f SC 0 2 × f SC Detailed view 227 f comb depth at f = 227.25 SC U V U V 1 Y 0.5 Y 0 226.25 f 227.25 SC 226.5 f 227.25 SC 226.75 f 227.25 SC 227 f 227.25 SC 227.25 f 227.25 SC 227.5 f 227.25 SC 227.75 f 227.25 SC 228 f 227.25 SC MGT530 Fig.13 Chrominance transfer characteristic (PAL M system). 2000 Nov 22 21 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 1 × f SC 0 2 × f SC Detailed view comb depth at f = U 229 f 229.25 SC V U V 1 Y 0.5 Y 0 228.25 f 229.25 SC 228.5 f 229.25 SC 228.75 f 229.25 SC 229 f 229.25 SC 229.25 f 229.25 SC 229.5 f 229.25 SC 229.75 f 229.25 SC 230 f 229.25 SC MGT531 Fig.14 Chrominance transfer characteristic (PAL N system). 2000 Nov 22 22 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 1 × f SC 0 2 × f SC Detailed view comb depth at f = C 227 f 227.5 SC C C C 1 0.5 Y Y Y Y 0 225.5 f 227.5 SC 226 f 227.5 SC 226.5 f 227.5 SC 227 f 227.5 SC 227.5 f 227.5 SC 228 f 227.5 SC 228.5 f 227.5 SC 229 f 227.5 SC MGT532 Fig.15 Chrominance transfer characteristic (NTSC M system). 2000 Nov 22 23 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 APPLICATION INFORMATION C1 handbook, full pagewidth CIN 1 16 COUT 2 15 OUTSEL 3 14 Y/CVBSOUT 100 nF INPSEL C3 Y/CVBS2 L5 10 nF C4 220 µH 100 nF 4 13 TDA9181 5 C12 10 nF L6 5V Y/CVBS1 12 220 µH SC 6 11 7 10 SYS1 SYS2 C9 8 FSCSEL C6 9 FSC 100 nF 100 nF MGT533 Fig.16 Application diagram. 2000 Nov 22 24 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.030 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-14 SOT38-4 2000 Nov 22 EUROPEAN PROJECTION 25 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013 2000 Nov 22 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 26 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: Through-hole mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Surface mount packages Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 2000 Nov 22 27 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING − suitable BGA, LFBGA, SQFP, TFBGA not suitable suitable − HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(3) suitable − PLCC(4), SO, SOJ suitable suitable − suitable − suitable − recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Nov 22 28 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2000 Nov 22 29 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 NOTES 2000 Nov 22 30 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 NOTES 2000 Nov 22 31 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753504/25/01/pp32 Date of release: 2000 Nov 22 Document order number: 9397 750 07313