INTEGRATED CIRCUITS DATA SHEET 74LVC2G126 Dual bus buffer/line driver; 3-state Product specification Supersedes data of 2003 Sep 01 2004 Sep 22 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 FEATURES DESCRIPTION • Wide supply voltage range from 1.65 V to 5.5 V The 74LVC2G126 is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. • 5 V tolerant input/output for interfacing with 5 V logic • High noise immunity Inputs can be driven from either 3.3 V or 5 V devices. These feature allows the use of these devices as translators in a mixed 3.3 V and 5 V environment. • Complies with JEDEC standard: – JESD8-7 (1.65 V to 1.95 V) – JESD8-5 (2.3 V to 2.7 V) This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. – JESD8B/JESD36 (2.7 V to 3.6 V). • ESD protection: – HBM EIA/JESD22-A114-B exceeds 2000 V The 74LVC2G126 provides a dual non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (pin nOE). A LOW-level at pin nOE causes the output to assume a high-impedance OFF-state. Schmitt-trigger action at all inputs makes the circuit highly tolerant for slower input rise and fall times. – MM EIA/JESD22-A115-A exceeds 200 V. • ±24 mA output drive (VCC = 3.0 V) • CMOS low power consumption • Latch-up performance exceeds 250 mA • Direct interface with TTL levels • Inputs accept voltages up to 5 V • Multiple package options • Specified from −40 °C to +85 °C and −40 °C to +125 °C. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C. SYMBOL tPHL/tPLH PARAMETER CONDITIONS propagation delay inputs nA to output nY VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ TYPICAL UNIT 3.9 ns VCC = 2.5 V; CL = 30 pF; RL = 500 Ω 2.6 ns VCC = 2.7 V; CL = 50 pF; RL = 500 Ω 2.8 ns VCC = 3.3 V; CL = 50 pF; RL = 500 Ω 2.4 ns VCC = 5.0 V; CL = 50 pF; RL = 500 Ω 1.9 ns CI input capacitance 2 pF CPD power dissipation capacitance per buffer output enabled; notes 1 and 2 17 pF 5 pF output disabled; notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; ∑(CL × VCC2 × fo) = sum of outputs. 2. The condition is VI = GND to VCC. 2004 Sep 22 2 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 FUNCTION TABLE See note 1. INPUT OUTPUT nOE nA nY H L L H H H L X Z Note 1. H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE MARKING 74LVC2G126DP −40 °C to +125 °C 8 TSSOP8 plastic SOT505-2 V126 74LVC2G126DC −40 °C to +125 °C 8 VSSOP8 plastic SOT765-1 V26 74LVC2G126GM −40 °C to +125 °C 8 XSON8 plastic SOT833-1 V26 PINNING PIN SYMBOL DESCRIPTION 1 1OE output enable input 2 1A data input 3 2Y data output 4 GND ground (0 V) 5 2A data input 6 1Y data output 7 2OE output enable input 8 VCC supply voltage 2004 Sep 22 3 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 126 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 126 001aab740 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 001aab741 Transparent top view Fig.1 Pin configuration TSSOP8 and VSSOP8. Fig.2 Pin configuration XSON8. handbook, halfpage 2 1 5 7 1A 1Y 6 1OE 2A 2Y 3 2OE MNA946 Fig.3 Logic symbol. 2004 Sep 22 4 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage 1.65 5.5 V VI input voltage 0 5.5 V VO output voltage VCC = 1.65 V to 5.5 V; enable mode 0 VCC V VCC = 1.65 V to 5.5 V; disable mode 0 5.5 V VCC = 0 V; Power-down mode 0 5.5 V −40 +125 °C VCC = 1.65 V to 2.7 V 0 20 ns/V VCC = 2.7 V to 5.5 V 0 10 ns/V Tamb operating ambient temperature tr, tf input rise and fall times LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.5 +6.5 V IIK input diode current VI < 0 V − −50 mA VI input voltage note 1 −0.5 +6.5 V IOK output diode current VO > VCC or VO < 0 V − ±50 mA VO output voltage enable mode; notes 1 and 2 −0.5 VCC + 0.5 V disable mode; notes 1 and 2 −0.5 +6.5 Power-down mode; notes 1 and 2 −0.5 IO output source or sink current ICC, IGND VCC or GND current Tstg storage temperature Ptot power dissipation VO = 0 V to VCC Tamb = −40 °C to +125 °C V +6.5 V − ±50 mA − ±100 mA −65 +150 °C − 300 mW Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. 2004 Sep 22 5 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCC (V) OTHER Tamb = −40 °C to +85 °C; note 1 VIH VIL VOL VOH HIGH-level input voltage LOW-level input voltage 1.65 to 1.95 0.65 × VCC − − V 2.3 to 2.7 1.7 − − V 2.7 to 3.6 2.0 − − V 4.5 to 5.5 0.7 × VCC − − V 1.65 to 1.95 − − 0.35 × VCC V 2.3 to 2.7 − − 0.7 V 2.7 to 3.6 − − 0.8 V 4.5 to 5.5 − − 0.3 × VCC V LOW-level output voltage VI = VIH or VIL HIGH-level output voltage IO = 100 µA 1.65 to 5.5 − − 0.1 V IO = 4 mA 1.65 − − 0.45 V IO = 8 mA 2.3 − − 0.3 V IO = 12 mA 2.7 − − 0.4 V IO = 24 mA 3.0 − − 0.55 V IO = 32 mA 4.5 − − 0.55 V VI = VIH or VIL IO = −100 µA 1.65 to 5.5 VCC − 0.1 − − V IO = −4 mA 1.65 1.2 − − V IO = −8 mA 2.3 1.9 − − V IO = −12 mA 2.7 2.2 − − V IO = −24 mA 3.0 2.3 − − V IO = −32 mA 4.5 3.8 − − V ILI input leakage current 5.5 − ±0.1 ±5 µA IOZ 3-state output OFF-state VI = VIH or VIL; current VO = 5.5 V or GND 3.6 − ±0.1 ±10 µA Ioff power OFF leakage current 0 − ±0.1 ±10 µA ICC quiescent supply current VI = VCC or GND; IO = 0 A 5.5 − 0.1 10 µA ∆ICC additional quiescent supply current per pin 2.3 to 5.5 − 5 500 µA 2004 Sep 22 VI = 5.5 V or GND VI or VO = 5.5 V VI = VCC − 0.6 V; IO = 0 A 6 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 TEST CONDITIONS SYMBOL PARAMETER MIN. OTHER TYP. MAX. UNIT VCC (V) Tamb = −40 °C to +125 °C VIH VIL VOL VOH 1.65 to 1.95 0.65 × VCC − − V 2.3 to 2.7 1.7 − − V 2.7 to 3.6 2.0 − − V 4.5 to 5.5 0.7 × VCC − − V 1.65 to 1.95 − − 0.35 × VCC V 2.3 to 2.7 − − 0.7 V 2.7 to 3.6 − − 0.8 V 4.5 to 5.5 − − 0.3 × VCC V IO = 100 µA 1.65 to 5.5 − − 0.1 V IO = 4 mA 1.65 − − 0.70 V IO = 8 mA 2.3 − − 0.45 V IO = 12 mA 2.7 − − 0.60 V IO = 24 mA 3.0 − − 0.80 V IO = 32 mA 4.5 − − 0.80 V IO = −100 µA 1.65 to 5.5 VCC − 0.1 − − V IO = −4 mA 1.65 0.95 − − V IO = −8 mA 2.3 1.7 − − V IO = −12 mA 2.7 1.9 − − V IO = −24 mA 3.0 2.0 − − V HIGH-level input voltage LOW-level input voltage LOW-level output voltage VI = VIH or VIL HIGH-level output voltage VI = VIH or VIL IO = −32 mA 4.5 3.4 − − V VI = 5.5 V or GND 5.5 − − ±20 µA 3-state output OFF-state VI = VIH or VIL; current VO = 5.5 V or GND 3.6 − − ±20 µA Ioff power OFF leakage current 0 − − ±20 µA ICC quiescent supply current VI = VCC or GND; IO = 0 A 5.5 − − 40 µA ∆ICC additional quiescent supply current per pin 2.3 to 5.5 − − 5000 µA ILI input leakage current IOZ VI or VO = 5.5 V VI = VCC − 0.6 V; IO = 0 A Note 1. All typical values are measured at VCC = 3.3 V and Tamb = 25 °C. 2004 Sep 22 7 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 AC CHARACTERISTICS GND = 0 V. TEST CONDITIONS SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCC (V) WAVEFORMS Tamb = −40 °C to +85 °C; note 1 tPHL/tPLH tPZH/tPZL tPHZ/tPLZ propagation delay nA to nY 3-state output enable time nOE to nY 3-state output disable time nOE to nY see Figs 4 and 6 see Figs 5 and 6 see Figs 5 and 6 1.65 to 1.95 1.0 3.9 9.8 ns 2.3 to 2.7 0.5 2.6 4.9 ns 2.7 1.0 2.8 4.7 ns 3.0 to 3.6 0.5 2.4 4.3 ns 4.5 to 5.5 0.5 1.9 3.2 ns 1.65 to 1.95 1.0 4.1 10.0 ns 2.3 to 2.7 1.0 2.6 5.0 ns 2.7 1.0 2.8 4.7 ns 3.0 to 3.6 1.0 2.4 4.1 ns 4.5 to 5.5 0.5 1.8 3.1 ns 1.65 to 1.95 1.0 3.3 12.6 ns 2.3 to 2.7 0.5 1.9 5.7 ns 2.7 1.5 3.0 4.8 ns 3.0 to 3.6 1.0 2.5 4.4 ns 4.5 to 5.5 0.5 1.8 3.3 ns Tamb = −40 °C to +125 °C tPHL/tPLH tPZH/tPZL tPHZ/tPLZ propagation delay nA to nY 3-state output enable time nOE to nY 3-state output disable time nOE to nY see Figs 4 and 6 see Figs 5 and 6 see Figs 5 and 6 Note 1. All typical values are measured at Tamb = 25 °C. 2004 Sep 22 8 1.65 to 1.95 1.0 − 12.3 ns 2.3 to 2.7 0.5 − 6.3 ns 2.7 1.0 − 5.9 ns 3.0 to 3.6 0.5 − 5.4 ns 4.5 to 5.5 0.5 − 4.0 ns 1.65 to 1.95 1.0 − 12.5 ns 2.3 to 2.7 1.0 − 6.3 ns 2.7 1.0 − 5.9 ns 3.0 to 3.6 1.0 − 5.1 ns 4.5 to 5.5 0.5 − 3.9 ns 1.65 to 1.95 1.0 − 15.4 ns 2.3 to 2.7 0.5 − 7.5 ns 2.7 1.5 − 6.2 ns 3.0 to 3.6 1.0 − 5.7 ns 4.5 to 5.5 0.5 − 4.4 ns Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 AC WAVEFORMS VI handbook, halfpage VM nA input GND tPHL tPLH VOH VM nY output VOL MNA230 INPUT VCC VM VI tr = tf 1.65 V to 1.95 V 0.5 × VCC VCC ≤ 2.0 ns 2.3 V to 2.7 V 0.5 × VCC VCC ≤ 2.0 ns 2.7 V 1.5 V 2.7 V ≤ 2.5 ns 3.0 V to 3.6 V 1.5 V 2.7 V ≤ 2.5 ns 4.5 V to 5.5 V 0.5 × VCC VCC ≤ 2.5 ns VOL and VOH are typical output voltage drop that occur with the output load. Fig.4 The input (nA) to output (nY) propagation delays and the output transition times. 2004 Sep 22 9 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 VI handbook, full pagewidth VM nOE input GND tPLZ output LOW-to-OFF OFF-to-LOW tPZL VCC VM VX VOL tPHZ tPZH VOH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled MNA684 INPUT VCC VM VI tr = tf 1.65 V to 1.95 V 0.5 × VCC VCC ≤ 2.0 ns 2.3 V to 2.7 V 0.5 × VCC VCC ≤ 2.0 ns 2.7 V 1.5 V 2.7 V ≤ 2.5 ns 3.0 V to 3.6 V 1.5 V 2.7 V ≤ 2.5 ns VX = VOL + 0.3 V at VCC ≥ 2.7 V; VX = VOL + 0.15 V at VCC < 2.7 V; VY = VOH − 0.3 V at VCC ≥ 2.7 V; VY = VOH − 0.15 V at VCC < 2.7 V. 4.5 V to 5.5 V 0.5 × VCC VCC ≤ 2.5 ns VOL and VOH are typical output voltage drop that occur with the output load. Fig.5 3-state enable and disable times. 2004 Sep 22 10 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 VEXT handbook, full pagewidth VCC PULSE GENERATOR VI RL VO D.U.T. CL RT RL MNA616 VCC VEXT CL RL VCC 30 pF 1 kΩ open GND 2 × VCC 2.3 V to 2.7 V VCC 30 pF 500 Ω open GND 2 × VCC 2.7 V 2.7 V 50 pF 500 Ω open GND 6V 3.0 V to 3.6 V 2.7 V 50 pF 500 Ω open GND 6V 4.5 V to 5.5 V VCC 50 pF 500 Ω open GND 2 × VCC 1.65 V to 1.95 V VI tPLH/tPHL tPZH/tPHZ tPZL/tPLZ Definitions for test circuit: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.6 Load circuitry for switching times. 2004 Sep 22 11 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 PACKAGE OUTLINES TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 2004 Sep 22 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- 12 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 2004 Sep 22 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 13 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 0.95 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.0 0.9 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- 2004 Sep 22 14 EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 Philips Semiconductors Product specification Dual bus buffer/line driver; 3-state 74LVC2G126 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Sep 22 15 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R20/03/pp16 Date of release: 2004 Sep 22 Document order number: 9397 750 13778