INTEGRATED CIRCUITS DATA SHEET TSA6060 Fast radio tuning PLL frequency synthesizer Product specification Supersedes data of April 1994 File under Integrated Circuits, IC01 1995 Nov 23 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 FEATURES • On-chip AM and FM prescalers with high input sensitivity • On-chip high-performance one-input-two-output, tuning voltage amplifier for the AM and FM loop filters • On-chip two-level current amplifier (charge pump) for loop gain adjustment APPLICATIONS • One reference oscillator (4 or 8 MHz) for both AM and FM • FM mains and car radios • VHF receivers 30 to 200 MHz. • High-speed tuning provided by a powerful digital memory phase detector GENERAL DESCRIPTION • 40 kHz output reference frequency for communication between the FM/IF system and microcontroller-based tuning interface IC (TEA6100) • Oscillator frequency range of 500 kHz to 30 MHz and 30 MHz to 200 MHz The TSA6060 is a frequency synthesizer manufactured in SUBILO-N technology (components laterally separated by oxide). The device performs all the tuning functions of a PLL radio tuning system. • Four selectable reference frequencies: 1, 10, 25 or 50 kHz, for both tuning ranges The IC is designed for application in all types of radio receivers. • I2C-bus interface to a microcontroller • Software controlled band switch output • In-lock detector output. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. VCC1 supply voltage (pin 3) 4.5 VCC2 supply voltage (pin 16) ICC1 supply current (pin 3) ICC2 supply current (pin 16) fiAMmax TYP. 5.0 MAX. UNIT 5.5 V VCC1 + 1 8.5 12.0 V no outputs loaded − 15 − mA no outputs loaded 0.7 1.0 1.5 mA maximum AM input frequency 30 − − MHz fiAMmin minimum AM input frequency − − 500 kHz fiFMmax maximum FM input frequency 200 − − MHz fiFMmin minimum FM input frequency − − 30 MHz ViAM(rms) AM input voltage (RMS value) ViFM = 0 V; fi < 15 MHz 30 − 500 mV ViAM = 0 V ViFM(rms) FM input voltage (RMS value) 20 − 300 mV Ptot total power dissipation − 100 − mW Tamb operating ambient temperature −40 − +85 °C ORDERING INFORMATION TYPE NUMBER TSA6060 PACKAGE NAME DIP16 TSA6060T SO16 1995 Nov 23 DESCRIPTION VERSION plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 2 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 BLOCK DIAGRAM Fig.1 Block diagram. 1995 Nov 23 3 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 PINNING SYMBOL PIN DESCRIPTION INCLK 1 in-lock detector output XTAL 2 crystal reference oscillator input VCC1 3 supply voltage (PLL supply 1) VEE 4 ground FMI 5 FM VCO input DEC 6 prescaler decoupling AMI 7 AM VCO input BS 8 band switch output fref 9 40 kHz reference output SDA 10 serial data input (I2C-bus) SCL 11 serial clock input (I2C-bus) AS 12 address select input (I2C-bus) FMO 13 FM output for external loop filter LOOPI 14 tuning voltage amplifier input AMO 15 AM output for external loop filter VCC2 16 supply voltage (PLL supply 2) Fig.2 Pin configuration. impedance to ground by the FM/AM switch in the FM position. The FM output is switched to a low impedance to ground by the AM/FM switch in the AM position. The outputs can deliver a tuning voltage of up to 10.5 V. FUNCTIONAL DESCRIPTION The TSA6060 contains the following parts: • Separate input amplifiers for the AM and FM VCO signals. • An I2C-bus interface with data latches and control logic. The I2C-bus is intended for communication between microcontrollers and different ICs or modules. Detailed information concerning the I2C-bus specification is available on request. • A 17-bit programmable counter. • A digital memory phase detector. • A reference frequency channel which contains a 4 MHz or 8 MHz crystal oscillator which is followed by a reference counter. The reference frequency can be either 1, 5, 10 or 50 kHz and is applied to the digital memory phase detector. The reference counter can also output a 40 kHz reference frequency to pin 9 for communication between the FM/IF system and the microcontroller-based tuning interface IC (TEA6100). • A software controlled band switch output. Controls The TSA6060 is controlled via the 2-wire I2C-bus. For programming there is one module address, a logic 0 (R/W bit) and four data bytes. The module address contains an address select bit (AS) which enables two TSA6060s to be operated in one system. • A programmable current amplifier (charge pump) which consists of a 25 mA and a 500 mA current source. This allows adjustment of the loop gain thereby providing high-current high-speed tuning and low-current stable tuning. The auto-increment facility of the I2C-bus allows programming of the TSA6060 within one transmission (address + 4 data bytes). • A one-input-two-output tuning voltage amplifier. One output is connected to the external AM loop filter and the other output to the external FM loop filter. Under software control, the AM output is switched to a low 1995 Nov 23 The TSA6060 can also be partially programmed. Transmission must then be ended by a STOP condition. 4 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 The bit organization of the 4 data bytes is shown in Fig.3. Further information is given in Tables 2, 3, 4 and 5. The bits S0 to S16 (DB0: D7 to D1; DB1: D7 to D0; DB2: D1 to D0) together with bit FM/AM (DB2: D5) are used to set the divider of the input frequency at inputs AMI (pin 7) or FMI (pin 5). If the system is in-lock the following is valid, as shown in Table 1. Table 1 System-in-lock (note 1). FM/AM INPUT FREQUENCY (fi) + S3 × (S2 × × fref AM 1 (S0 × 20 + S1 × 21 ..... + S15 × 215+ S16 × 216) × fref FM 21 ..... + S15 × INPUT 0 20 213 + S16 × 214) Note 1. The minimum dividing ratio for the AM mode is 26 = 64 and for the FM mode is 28 = 256. Table 2 Bit CP is used to control the charge pump current (DB0: D0). Bit BS controls the open-collector band switch output (DB2: D2). CURRENT BS BAND SWITCH OUTPUT 0 LOW 1 sink current 1 HIGH 0 floating CP Table 3 Bits REF1 and REF2 are used to set the reference frequency applied to the phase detector (DB2: D7 to D6). The bit 8/4 MHz controls a divide-by-1/divide-by-2 divider cell in the reference oscillator section. This allows the use of a 4 MHz or 8 MHz crystal. REFERENCE FREQUENCY (kHZ) Table 6 0 1 T3 T2 T1 1 10 0 X 0 normal 1 0 25 1 0 1 CP source 1 1 50 0 1 1 CP sink 1 1 1 CP 3-state 0 0 1 CP sink + source 1 1 X BS = main divider output 1 0 X BS = reference divider output REF1 REF2 0 0 Table 4 Table 5 Bit FM/AM OPAMP controls the switch AM/FM, FM/AM in the tuning voltage amplifier circuits (DB2: D4). FM/AM OPERATIONAL AMPLIFIER FM/AM 1 closed open 0 open closed 1995 Nov 23 SWITCH AM/FM Test mode. FUNCTION The data byte DB3 must be set to 0.....0. It is also used for test purposes (see Fig.3)). 5 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 Fig.3 Bit organization. 1995 Nov 23 6 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC !34). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC1 supply voltage (pin 3) −0.3 +6 V VCC2 supply voltage (pin 16) VCC1 + 1 12.5 V VXTAL crystal bias voltage 1⁄ VCC1 V 2VCC1 Ptot total power dissipation − 850 mW Tamb operating ambient temperature −40 +85 °C Tstg IC storage temperature −65 +150 °C Ves electrostatic handling −200 +200 V TYP. MAX. note 1 Note 1. Classification: machine model; C = 200 pF; R = 0 Ω; V = ±200 V. CHARACTERISTICS VCC1 = 5 V; VCC2 = 8.5 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. UNIT Supplies VCC1 supply voltage (pin 3) 4.5 5.0 5.5 V VCC2 supply voltage (pin 16) VCC1 + 1 8.5 12.0 V ICC1 supply current (pin 3) no outputs loaded − 15 − mA ICC2 supply current (pin 16) no outputs loaded 0.7 1.0 1.5 mA I2C-bus inputs: SDA and SCL (pins 10 and 11) VIH HIGH level input voltage 3.0 − 5.0 V VIL LOW level input voltage −0.3 − 1.5 V IIH HIGH level input current − − 10 µA IIH LOW level input current − − 10 µA − − 0.4 V SDA output (pin 10) VOL LOW level output voltage open collector; IOL = 3 mA AS input (pin 12) VIH HIGH level input voltage 3.0 − 5.0 V VIL LOW level input voltage −0.3 − 1.0 V IIH HIGH level input current − − 10 µA IIH LOW level input current − − 10 µA INCLK output (pin 1); INCLK = HIGH; see Fig.5 VOH HIGH level output voltage IOH = −10 µA VCC − 1 − VCC V VOL LOW level output voltage IOL = 1 mA 0 − 0.4 V 1995 Nov 23 7 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer SYMBOL PARAMETER TSA6060 CONDITIONS MIN. TYP. MAX. UNIT RF inputs: AMI and FMI (pins 5 and 7) fiAMmax maximum AM input frequency 30 − − MHz fiAMmin minimum AM input frequency − − 500 kHz fiFMmax maximum FM input frequency 200 − − MHz fiFMmin minimum FM input frequency − − 30 MHz ViAM(rms) AM input voltage (RMS value) fi < 15 MHz; measured in Fig.4 30 − 500 mV 15 MHz < fi < 30 MHz; measured in Fig.4 40 − 500 mV − 5.9 − kΩ − 2 − pF 20 − 300 mV RiAM AM input resistance CiAM AM input capacitance ViFM(rms) FM input voltage (RMS value) RiFM FM input resistance − 3.6 − kΩ CiFM FM input capacitance − 2 − pF see Fig.6 − − 150 Ω bit CP = logic 0 16 − 30 µA bit CP = logic 1 400 − 600 µA ViAM = 0 V Oscillator (pin 2) Rxtal crystal resonance resistance (4 or 8 MHz) Programmable charge pump Ichp output current to loop filter Ripple rejection SVRR1 supply voltage ripple rejection; 20 log ∆VCC1/∆Vtune fripple = 100 Hz 40 50 − dB SVRR2 supply voltage ripple rejection; 20 log ∆VCC2/∆Vtune fripple = 100 Hz 40 50 − dB Band switch output: BS (pin 8) Vo(max) maximum output voltage programmed HIGH − − 12 V VOL LOW level output voltage IOL = 3 mA − − 0.8 V |IOL| output leakage current VOH = 12 V − − 10 µA − 40 − kHz Reference frequency output: fref (pin 9) fref reference output frequency VOH HIGH level output voltage Isource = 5 µA 1.2 1.4 1.7 V VOL LOW level output voltage Isource = 5 µA − 0.1 0.2 V 1995 Nov 23 8 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer SYMBOL PARAMETER TSA6060 CONDITIONS MIN. TYP. MAX. UNIT Tuning voltage amplifiers AM OUTPUT (PIN 15) ∆VOH HIGH level output voltage swing IO = −0.6 mA VCC2 − 0.9 − − V ∆VOL LOW level output voltage swing IO = 0.6 mA − 0.8 V VCC2 − 0.9 − − V − FM OUTPUT (PIN 13) ∆VOH HIGH level output voltage swing IO = −0.6 mA IO = 0.6 mA ∆VOL LOW level output voltage swing − − 0.8 V Zo(off) impedance of switched-off output to ground − 500 − Ω |Ibias| input bias current − 1 5 nA Fig.4 Prescaler input sensitivity. 1995 Nov 23 9 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 Fig.5 Timing diagram. APPLICATION INFORMATION Fig.6 Crystal connection. 1995 Nov 23 Fig.7 Equivalent output circuit. 10 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 For FM: VCO = 5 MHz/V; R2 = 10 kΩ; C4 = 68 nF; C6 = 3.9 nF. For AM: VCO = 0.75 MHz/V; R1 = 47 kΩ; C3 = 440 nF; C5 = 0.47 nF. Fig.8 Application example; loop filter dependent on VCO and tuning speed. 1995 Nov 23 11 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE 1995 Nov 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 12 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1995 Nov 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 13 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating 1995 Nov 23 14 Philips Semiconductors Product specification Fast radio tuning PLL frequency synthesizer TSA6060 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1995 Nov 23 15 Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 513061/1100/02/pp16 Document order number: Date of release: 1995 Nov 23 9397 750 00458