PCA8575 Remote 16-bit I/O expander for I2C-bus with interrupt Rev. 01 — 30 November 2006 Objective data sheet 1. General description The PCA8575 provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional I2C-bus (serial clock (SCL), serial data (SDA)). The device consists of a 16-bit quasi-bidirectional port and an I2C-bus interface. The PCA8575 has a low current consumption and includes latched outputs with high current drive capability for directly driving LEDs. The PCA8575 also possesses an interrupt line (INT) which can be connected to the interrupt logic of the microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C-bus. The internal Power-On Reset (POR) initializes the I/Os as inputs. 2. Features n n n n n n n n n n n 400 kHz I2C-bus interface 2.3 V to 5.5 V operation with 5.5 V tolerant I/Os 16-bit remote I/O pins that default to inputs at power-up Latched outputs with 25 mA sink capability for directly driving LEDs Total package sink capability of 400 mA Active LOW open-drain interrupt output 8 programmable slave addresses using 3 address pins Readable device ID (manufacturer, device type, and revision) Low standby current (10 µA max.) −40 °C to +85 °C operation ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 n Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA n Packages offered: SO24, SSOP24 (QSOP24), TSSOP24, HVQFN24, DHVQFN24 3. Applications n n n n n n LED signs and displays Servers Industrial control Medical equipment PLCs Cellular telephones PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt n Gaming machines n Instrumentation and test measurement 4. Ordering information Table 1. Ordering information Type number Topside mark Package Name Description Version PCA8575D PCA8575D SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 PCA8575DB PCA8575DB SSOP24 SSOP24[1] plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm SOT556-1 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 8575 DHVQFN24 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 × 5.5 × 0.85 mm SOT815-1 8575 HVQFN24 SOT616-1 PCA8575DK PCA8575 PCA8575PW PCA8575PW TSSOP24 PCA8575BQ PCA8575BS [1] plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 × 4 × 0.85 mm Also known as QSOP24. 5. Block diagram PCA8575 INTERRUPT LOGIC INT LP FILTER AD0 AD1 AD2 SCL SDA INPUT FILTER I2C-BUS CONTROL SHIFT REGISTER 16 BITS P00 to P07 I/O PORT P10 to P17 write pulse read pulse VDD VSS POWER-ON RESET 002aac669 Fig 1. Block diagram of PCA8575 PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 2 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt write pulse 100 µA VDD IOH Itrt(pu) D data from Shift Register Q P00 to P07 P10 to P17 FF IOL CI S power-on reset VSS D Q FF CI read pulse S to interrupt logic data to Shift Register 002aab631 Fig 2. Simplified schematic diagram of P00 to P17 6. Pinning information 6.1 Pinning INT 1 24 VDD INT 1 24 VDD AD1 2 23 SDA AD1 2 23 SDA AD2 3 22 SCL AD2 3 22 SCL P00 4 21 AD0 P00 4 21 AD0 P01 5 20 P17 P01 5 20 P17 P02 6 19 P16 P02 6 P03 7 18 P15 P03 7 P04 8 17 P14 P04 8 17 P14 P05 9 16 P13 P05 9 16 P13 P06 10 15 P12 P06 10 15 P12 P07 11 14 P11 P07 11 14 P11 VSS 12 13 P10 VSS 12 PCA8575D 002aac670 Fig 3. Pin configuration for SO24 PCA8575_1 Objective data sheet PCA8575PW 19 P16 18 P15 13 P10 002aac671 Fig 4. Pin configuration for TSSOP24 © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 3 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt INT 1 24 VDD INT 1 24 VDD AD1 2 23 SDA AD1 2 23 SDA AD2 3 22 SCL AD2 3 22 SCL P00 4 21 AD0 P00 4 21 AD0 P01 5 20 P17 P01 5 20 P17 P02 6 19 P16 P02 6 P03 7 18 P15 P03 7 P04 8 17 P14 P04 8 17 P14 P05 9 16 P13 P05 9 16 P13 P06 10 15 P12 P06 10 15 P12 P07 11 14 P11 P07 11 14 P11 VSS 12 13 P10 VSS 12 13 P10 002aac672 INT Fig 6. Pin configuration for SSOP24 19 SCL 20 SDA 21 VDD 22 INT 23 AD1 24 AD2 1 terminal 1 index area AD1 2 23 SDA AD2 3 22 SCL P00 4 21 AD0 P01 5 20 P17 P00 1 18 AD0 P02 6 P01 2 17 P17 P03 7 P02 3 16 P16 P04 8 17 P14 P03 4 15 P15 P05 9 16 P13 P04 5 14 P14 P06 10 15 P12 P05 6 13 P13 P07 11 14 P11 Fig 7. Pin configuration for HVQFN24 PCA8575_1 P10 13 002aac674 PCA8575BQ VSS 12 P12 12 9 VSS P11 11 8 P07 P10 10 7 P06 PCA8575BS Transparent top view Objective data sheet 18 P15 002aac673 Fig 5. Pin configuration for SSOP24 (QSOP24) terminal 1 index area 19 P16 PCA8575DB 24 VDD PCA8575DK 19 P16 18 P15 002aac675 Transparent top view Fig 8. Pin configuration for DHVQFN24 © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 4 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 6.2 Pin description Table 2. Symbol Pin description Pin Description SO24, SSOP24, HVQFN24 TSSOP24, DHVQFN24 INT 1 22 interrupt output (active LOW) AD1 2 23 address input 1 AD2 3 24 address input 2 P00 4 1 quasi-bidirectional I/O 00 P01 5 2 quasi-bidirectional I/O 01 P02 6 3 quasi-bidirectional I/O 02 P03 7 4 quasi-bidirectional I/O 03 P04 8 5 quasi-bidirectional I/O 04 P05 9 6 quasi-bidirectional I/O 05 P06 10 7 quasi-bidirectional I/O 06 P07 11 8 quasi-bidirectional I/O 07 VSS 12[1] 9[1] supply ground P10 13 10 quasi-bidirectional I/O 10 P11 14 11 quasi-bidirectional I/O 11 P12 15 12 quasi-bidirectional I/O 12 P13 16 13 quasi-bidirectional I/O 13 P14 17 14 quasi-bidirectional I/O 14 P15 18 15 quasi-bidirectional I/O 15 P16 19 16 quasi-bidirectional I/O 16 P17 20 17 quasi-bidirectional I/O 17 AD0 21 18 address input 0 SCL 22 19 serial clock line input SDA 23 20 serial data line input/output VDD 24 21 supply voltage [1] HVQFN and DHVQFN package die supply ground is connected to both the VSS pin and the exposed center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias need to be incorporated in the PCB in the thermal pad region. PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 5 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 7. Functional description Refer to Figure 1 “Block diagram of PCA8575”. 7.1 Device address Following a START condition, the bus master must send the address of the slave it is accessing and the operation it wants to perform (read or write). The address of the PCA8575 is shown in Figure 9. Slave address pins AD2, AD1, and AD0 choose 1 of 8 slave addresses. To conserve power, no internal pull-up resistors are incorporated on AD2, AD1, and AD0. Address values depending on AD2, AD1, and AD0 can be found in Table 3 “PCA8575 address map”. Remark: The General Call address (0000 0000b) and the Device ID address (1111 100Xb) are reserved and cannot be used as device address. Failure to follow this requirement will cause the PCA8575 not to acknowledge. slave address A6 A5 A4 A3 A2 A1 programmable A0 R/W 002aab636 Fig 9. PCA8575 address The last bit of the first byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. When AD2, AD1 and AD0 are held to VDD or VSS, the same address as the PCF8575 is applied. 7.1.1 Address map Table 3. PCA8575 address map A6 A5 A4 A3 A2 A1 A0 Address (hex) 0 1 0 0 0 0 0 20h 0 1 0 0 0 0 1 21h 0 1 0 0 0 1 0 22h 0 1 0 0 0 1 1 23h 0 1 0 0 1 0 0 24h 0 1 0 0 1 0 1 25h 0 1 0 0 1 1 0 26h 0 1 0 0 1 1 1 27h PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 6 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 8. I/O programming 8.1 Quasi-bidirectional I/O architecture The PCA8575’s 16 ports (see Figure 2) are entirely independent and can be used either as input or output ports. Input data is transferred from the ports to the microcontroller in the Read mode (see Figure 12). Output data is transmitted to the ports in the Write mode (see Figure 11). Every data transmission from the PCA8575 must consist of an even number of bytes, the first byte will be referred to as P07 to P00, and the second byte as P17 to P10. The third will be referred to as P07 to P00, and so on. This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data directions. At power-on the I/Os are HIGH. In this mode only a current source (IOH) to VDD is active. An additional strong pull-up to VDD (Itrt(pu)) allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH, and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs. After power-on, as all the I/Os are set HIGH, all of them can be used as inputs. Any change in setting of the I/Os as either inputs or outputs can be done with the write mode. Remark: If a HIGH is applied to an I/O which has been written earlier to LOW, a large current (IOL) will flow to VSS. 8.2 Writing to the port (Output mode) To write, the master (microcontroller) first addresses the slave device. By setting the last bit of the byte containing the slave address to logic 0 the Write mode is entered. The PCA8575 acknowledges and the master sends the first data byte for P07 to P00. After the first data byte is acknowledged by the PCA8575, the second data byte P17 to P10 is sent by the master. Once again, the PCA8575 acknowledges the receipt of the data. Each 8-bit data is presented on the port lines after it has been acknowledged by the PCA8575. The number of data bytes that can be sent successively is not limited. After every two bytes, the previous data is overwritten. The first data byte in every pair refers to Port 0 (P07 to P00), whereas the second data byte in every pair refers to Port 1 (P17 to P10). See Figure 10. first byte 07 06 05 04 03 second byte 02 01 00 A P07 P06 P05 P04 P03 P02 P01 P00 17 16 15 14 13 12 11 10 A P17 P16 P15 P14 P13 P12 P11 P10 002aab634 Fig 10. Correlation between bits and ports PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 7 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt SCL 1 2 3 4 5 6 7 8 slave address data to port 0 SDA S A6 A5 A4 A3 A2 A1 A0 0 START condition 9 R/W data to port 1 P P 1 P P P P P A P 1 P P P P P P A A 07 06 04 03 02 01 00 17 15 14 13 12 11 10 P05 acknowledge from slave P16 acknowledge from slave acknowledge from slave write to port tv(Q) data output from port tv(Q) data A0 and B0 valid data A0 and B0 valid P05 output voltage P05 pull-up output current Itrt(pu) IOH P16 output voltage Itrt(pu) P16 pull-up output current IOH INT td(rst) 002aab632 Fig 11. Write mode (output) 8.3 Reading from a port (Input mode) All ports programmed as input should be set to logic 1. To read, the master (microcontroller) first addresses the slave device after it receives the interrupt. By setting the last bit of the byte containing the slave address to logic 1 the Read mode is entered. The data bytes that follow on the SDA are the values on the ports. If the data on the input port changes faster than the master can read, this data may be lost. PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 8 of 30 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx 1 2 3 4 5 6 7 8 9 P1x P0x SDA S 0 1 0 0 A2 A1 A0 1 START condition NXP Semiconductors PCA8575_1 Objective data sheet SCL A DATA 00 A acknowledge from master R/W acknowledge from slave DATA 11 P0x A DATA 00 acknowledge from master P1x A acknowledge from master DATA 12 1 P no acknowledge from master read from port 0 DATA 00 data into port 0 read from port 1 Rev. 01 — 30 November 2006 DATA 10 data into port 1 DATA 11 DATA 12 INT td(rst) Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). Fig 12. Read input port register, scenario 1 002aab810 PCA8575 9 of 30 © NXP B.V. 2006. All rights reserved. Remote 16-bit I/O expander for I2C-bus with interrupt tv(D) xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx 1 2 3 4 5 6 7 8 9 P1x P0x SDA S 0 1 0 0 A2 A1 A0 1 START condition NXP Semiconductors PCA8575_1 Objective data sheet SCL A A DATA 00 A DATA 10 acknowledge from master R/W acknowledge from slave P0x P1x A DATA 03 acknowledge from master acknowledge from master DATA 12 1 P no acknowledge from master read from port 0 tsu(D) th(D) DATA 00 data into port 0 DATA 01 DATA 02 DATA 03 th(D) read from port 1 Rev. 01 — 30 November 2006 tsu(D) DATA 10 data into port 1 DATA 11 DATA 12 INT td(rst) Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). Fig 13. Read input port register, scenario 2 002aab811 PCA8575 10 of 30 © NXP B.V. 2006. All rights reserved. Remote 16-bit I/O expander for I2C-bus with interrupt tv(D) PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 8.4 Power-on reset When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA8575 in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA8575 registers and I2C-bus/SMBus state machine will initialize to their default states. Thereafter VDD must be lowered below 0.2 V to reset the device. 8.5 Interrupt output (INT) The PCA8575 provides an open-drain interrupt (INT) which can be fed to a corresponding input of the microcontroller (see Figure 12, Figure 13, and Figure 14). This gives these chips a kind of master function which can initiate an action elsewhere in the system. An interrupt is generated by any rising or falling edge of the port inputs. After time tv(D) the signal INT is valid. The interrupt disappears when data on the port is changed to the original setting or data is read from or written to the device which has generated the interrupt. In the write mode, the interrupt may become deactivated (HIGH) on the rising edge of the write to port pulse. On the falling edge of the write to port pulse the interrupt is definitely deactivated (HIGH). The interrupt is reset in the read mode on the rising edge of the read from port pulse. During the resetting of the interrupt itself, any changes on the I/Os may not generate an interrupt. After the interrupt is reset any change in I/Os will be detected and transmitted as an INT. VDD device 1 device 2 device 8 PCA8575 PCA8575 PCA8575 INT INT INT MICROCOMPUTER INT 002aac676 Fig 14. Application of multiple PCA8575s with interrupt PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 11 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 9. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 9.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 15). SDA SCL data line stable; data valid change of data allowed mba607 Fig 15. Bit transfer 9.1.1 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 16.) SDA SDA SCL SCL S P START condition STOP condition mba608 Fig 16. Definition of START and STOP conditions 9.2 System configuration A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 17). PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 12 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER SLAVE 002aaa966 Fig 17. System configuration 9.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. data output by transmitter not acknowledge data output by receiver acknowledge SCL from master 1 S START condition 2 8 9 clock pulse for acknowledgement 002aaa987 Fig 18. Acknowledgement on the I2C-bus PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 13 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 10. Application design-in information 10.1 Bidirectional I/O expander applications In the 8-bit I/O expander application shown in Figure 19, P00 and P01 are inputs, and P02 to P07 are outputs. When used in this configuration, during a write, the input (P00 and P01) must be written as HIGH so the external devices fully control the input ports. The desired HIGH or LOW logic levels may be written to the I/Os used as outputs (P02 to P07). During a read, the logic levels of the external devices driving the input ports (P00 and P01) and the previous written logic level to the output ports (P02 to P07) will be read. The GPIO also has an interrupt line (INT) that can be connected to the interrupt logic of the microprocessor. By sending an interrupt signal on this line, the remote I/O informs the microprocessor that there is incoming data or a change of data on its ports without having to communicate via the I2C-bus. VDD VDD VDD P00 P01 P02 P03 P04 P05 P06 P07 SDA SCL INT CORE PROCESSOR AD0 AD1 AD2 temperature sensor battery status control for latch control for switch control for audio control for camera control for MP3 002aab812 Fig 19. Bidirectional I/O expander application 10.2 High current-drive load applications The GPIO has a maximum sinking current of 25 mA per bit. In applications requiring additional drive, two port pins in the same octal may be connected together to sink up to 50 mA current. Both bits must then always be turned on or off together. Up to 8 pins (one octal) can be connected together to drive 200 mA. VDD CORE PROCESSOR VDD SDA SCL INT AD0 AD1 AD2 VDD P00 P01 P02 P03 P04 P05 P06 P07 LOAD 002aab813 Fig 20. High current-drive load application PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 14 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 10.3 Differences between the PCA8575 and the PCF8575 The PCA8575 is a drop in replacement for the PCF8575 and can used without electrical or software modifications, but there is a difference in interrupt output release timing during the read operation. Write operations are identical. At the completion of each 8-bit write sequence the data is stored in its associated 8-bit write register at ACK or NACK. The first byte goes to P0n while the second goes to P1n. Subsequent writes without a STOP wrap around to P0n then P1n again. Any write will update both read registers and clear interrupts. Read operations are identical. Both devices update the byte register with the pin data as each 8-bit read is initiated, the very first read after an address cycle corresponds to ports P0n while the second (even byte) corresponds to P1n and subsequent reads without a STOP wrap around to P0n then P1n again. During read operations, the PCA8575 interrupt output will be cleared in a byte-wise fashion as each byte is read. Reading the first byte will clear any interrupts associated with the P0n pins. This first byte read operation will have no effect on interrupts associated with changes of state on the P1n pins. Interrupts associated with the P1n pins will be cleared when the second byte is read. Reading the second byte has no effect on interrupts associated with the changes of state on the P0x pins. The PCF8575 interrupt output will clear after reading both bytes of data regardless of whether data was changed in the first byte or the second byte or both bytes. 11. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Max Unit VDD supply voltage −0.5 +6 V IDD supply current - ±100 mA ISS ground supply current - ±600 mA VI input voltage VSS − 0.5 5.5 V II input current - ±20 mA IO output current - ±50[1] mA Ptot total power dissipation - 600 mW P/out power dissipation per output - 200 mW Tstg storage temperature −65 +150 °C Tamb ambient temperature −40 +85 °C [1] operating Total package (maximum) output current is 600 mA. PCA8575_1 Objective data sheet Min © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 15 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 12. Static characteristics Table 5. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supplies VDD supply voltage 2.3 - 5.5 V IDD supply current Operating mode; no load; VI = VDD or VSS; fSCL = 400 kHz - 100 200 µA Istb standby current Standby mode; no load; VI = VDD or VSS - 2.5 10 µA VPOR power-on reset voltage - 1.8 2.0 V −0.5 - +0.3VDD V [1] Input SCL; input/output SDA VIL LOW-level input voltage VIH HIGH-level input voltage 0.7VDD - 5.5 V IOL LOW-level output current VOL = 0.4 V 20 - - mA IL leakage current VI = VDD or VSS −1 - +1 µA Ci input capacitance VI = VSS - 5 10 pF VOL = 0.5 V; VDD = 2.3 V 12 <tbd> - mA VOL = 0.5 V; VDD = 3.0 V 17 <tbd> - mA VOL = 0.5 V; VDD = 4.5 V 25 <tbd> - mA I/Os; P00 to P07 and P10 to P17 LOW-level output current[2] IOL current[2] IOL(tot) total LOW-level output IOH HIGH-level output current Itrt(pu) transient boosted pull-up current VOH = VSS; see Figure 11 Ci Co VOL = 0.5 V; VDD = 4.5 V - - 400 mA VOH = VSS −30 <tbd> −300 µA −0.5 −1.0 - mA input capacitance [3] - <tbd> 10 pF output capacitance [3] - <tbd> 10 pF 6 - - mA - 3 5 pF Interrupt INT IOL LOW-level output current Co output capacitance VOL = 0.4 V Inputs AD0, AD1, AD2 VIL LOW-level input voltage −0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V ILI input leakage current −1 - +1 µA Ci input capacitance - 3.5 5 pF [1] The power-on reset circuit resets the I2C-bus logic with VDD < VPOR and set all I/Os to logic 1 (with current source to VDD). [2] Each bit must be limited to a maximum of 25 mA and the total package limited to 400 mA due to internal busing limits. [3] The value is not tested, but verified on sampling basis. PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 16 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 13. Dynamic characteristics Table 6. Dynamic characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Fast mode I2C-bus Conditions Min Typ Unit Max fSCL SCL clock frequency 0 - 400 kHz tBUF bus free time between a STOP and START condition 1.3 - - µs tHD;STA hold time (repeated) START condition 0.6 - - µs tSU;STA set-up time for a repeated START condition 0.6 - - µs tSU;STO set-up time for STOP condition 0.6 - - µs tHD;DAT data hold time 0 - - ns data valid acknowledge time [1] 0.1 - 0.9 µs tVD;DAT data valid time [2] 50 - - ns tSU;DAT data set-up time 100 - - ns tLOW LOW period of the SCL clock 1.3 - - µs tHIGH HIGH period of the SCL clock - - µs tVD;ACK 0.6 tf fall time of both SDA and SCL signals tr rise time of both SDA and SCL signals [3][4] pulse width of spikes that must be suppressed by the input filter tSP [6] 20 + 0.1Cb [5] - 300 ns 20 + 0.1Cb [5] - 300 ns - - 50 ns Port timing; CL ≤ 100 pF (see Figure 11 and Figure 12) tv(Q) data output valid time - - 4 µs tsu(D) data input set-up time 0 - - µs th(D) data input hold time 4 - - µs Interrupt timing; CL ≤ 100 pF (see Figure 11 and Figure 12) tv(D) data input valid time - - 4 µs td(rst) reset delay time - - 4 µs [1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW. [2] tVD;DAT = minimum time for SDA data out to be valid following SCL LOW. [3] A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to bridge the undefined region SCL’s falling edge. [4] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. [5] Cb = total capacitance of one bus line in pF. [6] Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns. PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 17 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt protocol START condition (S) tSU;STA bit 7 MSB (A7) tLOW bit 6 (A6) tHIGH bit 0 (R/W) acknowledge (A) STOP condition (P) 1/f SCL SCL tBUF tr tf SDA tHD;STA tSU;DAT tHD;DAT tVD;DAT tVD;ACK tSU;STO 002aab175 Rise and fall times refer to VIL and VIH. Fig 21. I2C-bus timing diagram PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 18 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 14. Package outline SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 22. Package outline SOT137-1 (SO24) PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 19 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 o 0 o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC JEITA MO-150 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 23. Package outline SOT340-1 (SSOP24) PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 20 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT556-1 A X c y HE v M A Z 13 24 A2 A (A 3) A1 θ Lp L 12 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.73 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 8.8 8.6 4.0 3.8 0.635 6.2 5.8 1 0.89 0.41 0.25 0.18 0.1 1.05 0.66 8 o 0 inches 0.068 0.0098 0.061 0.0040 0.055 0.01 0.012 0.0098 0.344 0.157 0.244 0.035 0.025 0.041 0.008 0.0075 0.337 0.150 0.228 0.016 0.01 0.007 0.004 0.040 0.026 8o o 0 o Note 1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included. OUTLINE VERSION SOT556-1 REFERENCES IEC JEDEC JEITA MO-137 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 24. Package outline SOT556-1 (SSOP24) PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 21 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE y v M A Z 13 24 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 25. Package outline SOT355-1 (TSSOP24) PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 22 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm B D SOT815-1 A A E A1 c detail X terminal 1 index area C e1 terminal 1 index area e y1 C v M C A B w M C b 2 y 11 L 12 1 e2 Eh 24 13 23 14 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 5.6 5.4 4.25 3.95 3.6 3.4 2.25 1.95 0.5 4.5 1.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT815-1 --- --- --- EUROPEAN PROJECTION ISSUE DATE 03-04-29 Fig 26. Package outline SOT815-1 (DHVQFN24) PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 23 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm A B D SOT616-1 terminal 1 index area A A1 E c detail X e1 C 1/2 e e 12 y y1 C v M C A B w M C b 7 L 13 6 e e2 Eh 1/2 e 1 18 terminal 1 index area 24 19 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 4.1 3.9 2.25 1.95 4.1 3.9 2.25 1.95 0.5 2.5 2.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT616-1 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-22 Fig 27. Package outline SOT616-1 (HVQFN24) PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 24 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 15. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe you must take normal precautions appropriate to handling integrated circuits. 16. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering 16.3 Wave soldering Key characteristics in wave soldering are: PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 25 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 28) than a PbSn process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 7 and 8 Table 7. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 8. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 28. PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 26 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 28. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 9. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal Oxide Semiconductor ESD ElectroStatic Discharge GPIO General Purpose Input/Output HBM Human Body Model I/O Input/Output I2C-bus Inter-Integrated Circuit bus IC Integrated Circuit ID Identification LED Light Emitting Diode LSB Least Significant Bit MM Machine Model MSB Most Significant Bit PLC Programmable Logic Controller RAID Redundant Array of Independent Disks SMBus System Management Bus PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 27 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 18. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA8575_1 20061130 Objective data sheet - - PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 28 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 19.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 20. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] PCA8575_1 Objective data sheet © NXP B.V. 2006. All rights reserved. Rev. 01 — 30 November 2006 29 of 30 PCA8575 NXP Semiconductors Remote 16-bit I/O expander for I2C-bus with interrupt 21. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.1.1 8 8.1 8.2 8.3 8.4 8.5 9 9.1 9.1.1 9.2 9.3 10 10.1 10.2 10.3 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 19 19.1 19.2 19.3 19.4 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6 Address map. . . . . . . . . . . . . . . . . . . . . . . . . . . 6 I/O programming . . . . . . . . . . . . . . . . . . . . . . . . 7 Quasi-bidirectional I/O architecture . . . . . . . . . 7 Writing to the port (Output mode) . . . . . . . . . . . 7 Reading from a port (Input mode) . . . . . . . . . . 8 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 11 Interrupt output (INT) . . . . . . . . . . . . . . . . . . . 11 Characteristics of the I2C-bus. . . . . . . . . . . . . 12 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 START and STOP conditions . . . . . . . . . . . . . 12 System configuration . . . . . . . . . . . . . . . . . . . 12 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 13 Application design-in information . . . . . . . . . 14 Bidirectional I/O expander applications . . . . . 14 High current-drive load applications . . . . . . . . 14 Differences between the PCA8575 and the PCF8575. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15 Static characteristics. . . . . . . . . . . . . . . . . . . . 16 Dynamic characteristics . . . . . . . . . . . . . . . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19 Handling information. . . . . . . . . . . . . . . . . . . . 25 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Introduction to soldering . . . . . . . . . . . . . . . . . 25 Wave and reflow soldering . . . . . . . . . . . . . . . 25 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 25 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 26 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28 Legal information. . . . . . . . . . . . . . . . . . . . . . . 29 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 20 21 Contact information . . . . . . . . . . . . . . . . . . . . 29 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 30 November 2006 Document identifier: PCA8575_1