PHILIPS 74AHCT373

74AHC373; 74AHCT373
Octal D-type transparant latch; 3-state
Rev. 03 — 20 May 2008
Product data sheet
1. General description
The 74AHC373; 74AHCT373 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard
No. 7-A.
The 74AHC373; 74AHCT373 consists of eight D-type transparent latches featuring
separate D-type inputs for each latch and 3-state true outputs for bus oriented
applications. A latch enable input (LE) and an output enable input (OE) are common to all
latches.
When pin LE is HIGH, data at the Dn inputs enters the latches. In this condition the
latches are transparent, i.e. a latch output will change state each time its corresponding
Dn input changes. When pin LE is LOW, the latches store the information that is present
at the Dn inputs, after a set-up time preceding the HIGH-to-LOW transition of LE.
When pin OE is LOW, the contents of the 8 latches are available at the outputs. When
pin OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE
input does not affect the state of the latches.
The 74AHC373; 74AHCT373 is functionally identical to the 74AHC573; 74AHCT573, but
has a different pin arrangement.
2. Features
n
n
n
n
n
n
Balanced propagation delays
All inputs have a Schmitt-trigger action
Common 3-state output enable input
Inputs accepts voltages higher than VCC
Functionally identical to the 74AHC573; 74AHCT573
Input levels:
u For 74AHC373: CMOS input level
u For 74AHCT373: TTL input level
n ESD protection:
u HBM EIA/JESD22-A114E exceeds 2000 V
u MM EIA/JESD22-A115-A exceeds 200 V
u CDM EIA/JESD22-C101C exceeds 1000 V
n Multiple package options
n Specified from −40 °C to +85 °C and from −40 °C to +125 °C
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74AHC373D
−40 °C to +125 °C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
74AHC373PW
−40 °C to +125 °C
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
74AHCT373D
−40 °C to +125 °C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
74AHCT373PW
−40 °C to +125 °C
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
74AHC373
74AHCT373
4. Functional diagram
3
4
7
8
13
14
17
18
11
1
D0
D1
D2
D3
D4
D5
D6
D7
LATCH
1 TO 8
3-STATE
OUTPUTS
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
2
5
6
9
12
15
16
19
LE
OE
001aae050
Fig 1.
Functional diagram
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
2 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
1
OE
LE
EN
11
C1
11
3
4
7
8
13
14
17
18
D0
Q0
D1
Q1
D2
Q2
D3
Q3
D4
Q4
D5
Q5
D6
Q6
D7
Q7
2
6
D4
15
D5
16
D6
19
D7
1
Q
8
9
13
12
14
15
17
16
18
19
D2
D
Q1
Q2
Q3
Q4
Q5
Q6
Q7
001aae049
Fig 3.
D1
D
6
001aae048
Logic symbol
D0
5
D3
12
Q0
7
D2
9
2
1D
4
D1
5
OE
Fig 2.
3
D0
LE
Q
D3
D
Q
IEC logic symbol
D4
D
Q
D5
D
Q
D6
D
Q
D7
D
Q
D
Q
LATCH
1
LATCH
2
LATCH
3
LATCH
4
LATCH
5
LATCH
6
LATCH
7
LATCH
8
LE LE
LE LE
LE LE
LE LE
LE LE
LE LE
LE LE
LE LE
LE
OE
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
001aae052
Fig 4.
Logic diagram
LE
LE
LE
D
Q
LE
Fig 5.
001aae051
Logic diagram (one latch)
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
3 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
5. Pinning information
5.1 Pinning
74AHC373
74AHCT373
OE
1
20 VCC
Q0
2
19 Q7
D0
3
18 D7
D1
4
17 D6
Q1
5
16 Q6
Q2
6
15 Q5
D2
7
14 D5
D3
8
13 D4
Q3
9
12 Q4
GND 10
11 LE
001aai132
Fig 6.
Pin configuration SO20 and TSSOP20
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
OE
1
3-state output enable input (active LOW)
Q0
2
3-state latch output
D0
3
data input
D1
4
data input
Q1
5
3-state latch output
Q2
6
3-state latch output
D2
7
data input
D3
8
data input
Q3
9
3-state latch output
GND
10
ground (0 V)
LE
11
latch enable input (active HIGH)
Q4
12
3-state latch output
D4
13
data input
D5
14
data input
Q5
15
3-state latch output
Q6
16
3-state latch output
D6
17
data input
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
4 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
Table 2.
Pin description …continued
Symbol
Pin
Description
D7
18
data input
Q7
19
3-state latch output
VCC
20
supply voltage
6. Functional description
Table 3.
Function table[1]
Operating mode
Enable and read register (transparent mode)
Control
Input
OE
LE
Dn
Internal
latch
L
H
L
L
L
H
H
H
l
L
L
h
H
H
X
X
Z
X
X
Z
Latch and read register
L
L
Latch register and disable outputs
H
X
[1]
Output
Q0 to Q7
H = HIGH voltage level;
h = HIGH voltage level one set-up time prior to the HIGH-to-LOW LE transition;
L = LOW voltage level;
l = LOW voltage level one set-up time prior to the HIGH-to-LOW LE transition;
X = don’t care;
Z = high-impedance OFF-state.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
VI
Conditions
Min
Max
Unit
supply voltage
−0.5
+7.0
V
input voltage
−0.5
+7.0
V
−20
-
mA
−20
+20
mA
input clamping current
VI < −0.5 V
[1]
IOK
output clamping current
VO < −0.5 V or VO > VCC + 0.5 V
[1]
VO = −0.5 V to (VCC + 0.5 V)
IIK
IO
output current
−25
+25
mA
ICC
supply current
-
+75
mA
IGND
ground current
−75
-
mA
Tstg
storage temperature
−65
+150
°C
-
500
mW
total power dissipation
Ptot
Tamb = −40 °C to +125 °C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For SO20 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K.
For TSSOP20 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K.
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
5 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
8. Recommended operating conditions
Table 5.
Operating conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
74AHC373
VCC
supply voltage
2.0
5.0
5.5
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
ambient temperature
−40
+25
+125
°C
∆t/∆V
input transition rise and fall rate
VCC = 3.0 V to 3.6 V
-
-
100
ns/V
VCC = 4.5 V to 5.5 V
-
-
20
ns/V
74AHCT373
VCC
supply voltage
4.5
5.0
5.5
V
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
ambient temperature
−40
+25
+125
°C
∆t/∆V
input transition rise and fall rate
-
-
20
ns/V
VCC = 4.5 V to 5.5 V
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
74AHC373
VIH
VIL
VOH
VOL
HIGH-level
input voltage
VCC = 2.0 V
1.5
-
-
1.5
-
1.5
-
V
VCC = 3.0 V
2.1
-
-
2.1
-
2.1
-
V
VCC = 5.5 V
3.85
-
-
3.85
-
3.85
-
V
LOW-level
input voltage
VCC = 2.0 V
-
-
0.5
-
0.5
-
0.5
V
VCC = 3.0 V
-
-
0.9
-
0.9
-
0.9
V
VCC = 5.5 V
-
-
1.65
-
1.65
-
1.65
V
HIGH-level
VI = VIH or VIL
output voltage
IO = −50 µA; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = −50 µA; VCC = 3.0 V
2.9
3.0
-
2.9
-
2.9
-
V
IO = −50 µA; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = −4.0 mA; VCC = 3.0 V
2.58
-
-
2.48
-
2.40
-
V
IO = −8.0 mA; VCC = 4.5 V
3.94
-
-
3.80
-
3.70
-
V
LOW-level
VI = VIH or VIL
output voltage
IO = 50 µA; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
6 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
IOZ
OFF-state
output current
VI = VIH or VIL;
VO = VCC or GND;
VCC = 5.5 V
-
-
±0.2
5
-
±2.5
-
±10.0
µA
II
input leakage
current
VI = VCC or GND;
VCC = 0 V to 5.5 V
-
-
0.1
-
1.0
-
2.0
µA
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
4.0
-
40
-
80
µA
CI
input
capacitance
-
3
10
-
10
-
10
pF
CO
output
capacitance
-
4
-
-
-
-
10
pF
VI = VCC or GND
74AHCT373
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
-
0.8
-
0.8
V
VOH
HIGH-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = −50 µA
IO = −8.0 mA
VOL
LOW-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 50 µA
IO = 8.0 mA
4.4
4.5
-
4.4
-
4.4
-
V
3.94
-
-
3.80
-
3.70
-
V
-
0
0.1
-
0.1
-
0.1
V
-
-
0.36
-
0.44
-
0.55
V
IOZ
OFF-state
output current
VI = VIH or VIL;
VO = VCC or GND per input
pin; other inputs at VCC or
GND; IO = 0 A; VCC = 5.5 V
-
-
±0.2
5
-
±2.5
-
±10.0
µA
II
input leakage
current
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
-
-
0.1
-
1.0
-
2.0
µA
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
4.0
-
40
-
80
µA
∆ICC
additional
per input pin;
supply current VI = VCC − 2.1 V; other pins at
VCC or GND; IO = 0 A;
VCC = 4.5 V to 5.5 V
-
-
1.35
-
1.5
-
1.5
µA
CI
input
capacitance
-
3
10
-
10
-
10
pF
CO
output
capacitance
-
4
-
-
-
-
10
pF
VI = VCC or GND
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
7 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11.
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
Min
Max
CL = 15 pF
-
6.0
11.4
1.0
13.5
1.0
14.5
ns
CL = 50 pF
-
7.8
14.9
1.0
17.0
1.0
19.0
ns
-
4.0
7.2
1.0
8.5
1.0
9.0
ns
-
5.3
9.2
1.0
10.5
1.0
11.5
ns
CL = 15 pF
-
6.3
11.0
1.0
13.0
1.0
14.0
ns
CL = 50 pF
-
8.3
14.5
1.0
16.5
1.0
18.5
ns
-
4.3
7.2
1.0
8.5
1.0
9.0
ns
-
5.6
9.7
1.0
11.1
1.0
12.5
ns
CL = 15 pF
-
5.6
11.4
1.0
13.5
1.0
14.5
ns
CL = 50 pF
-
7.5
14.9
1.0
17.0
1.0
19.0
ns
CL = 15 pF
-
3.8
8.1
1.0
9.5
1.0
10.5
ns
CL = 50 pF
-
5.2
10.1
1.0
11.5
1.0
13.0
ns
CL = 15 pF
-
5.6
10.0
1.0
12.0
1.0
13.0
ns
CL = 50 pF
-
9.2
13.3
1.0
15.0
1.0
17.0
ns
CL = 15 pF
-
4.3
7.2
1.0
8.5
1.0
9.5
ns
CL = 50 pF
-
6.4
9.2
1.0
10.5
1.0
11.5
ns
VCC = 3.0 V to 3.6 V
5.0
-
-
5.0
-
5.0
-
ns
VCC = 4.5 V to 5.5 V
5.0
-
-
5.0
-
5.0
-
ns
VCC = 3.0 V to 3.6 V
4.0
-
-
4.0
-
4.0
-
ns
VCC = 4.5 V to 5.5 V
4.0
-
-
4.0
-
4.0
-
ns
74AHC373
tpd
propagation
delay
Dn to Qn; see Figure 7
[2]
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
CL = 15 pF
CL = 50 pF
LE to Qn; see Figure 8
[2]
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
CL = 15 pF
CL = 50 pF
ten
enable time
OE to Qn; see Figure 9
[3]
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
tdis
disable time
OE to Qn; see Figure 9
[4]
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
tW
tsu
pulse width
set-up time
LE HIGH or LOW;
see Figure 8
Dn to LE; see Figure 10
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
8 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11.
Symbol Parameter
th
CPD
hold time
power
dissipation
capacitance
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
Min
Max
VCC = 3.0 V to 3.6 V
1.0
-
-
1.0
-
1.0
-
ns
VCC = 4.5 V to 5.5 V
1.0
-
-
1.0
-
1.0
-
ns
-
10
-
-
-
-
-
pF
CL = 15 pF
-
4.0
8.5
1.0
9.5
1.0
11.0
ns
CL = 50 pF
-
5.2
9.5
1.0
10.5
1.0
12.0
ns
-
4.3
12.3
1.0
13.5
1.0
15.5
ns
-
5.5
13.3
1.0
14.5
1.0
17.0
ns
-
4.0
10.9
1.0
12.5
1.0
14.0
ns
-
5.2
11.9
1.0
13.5
1.0
15.0
ns
CL = 15 pF
-
4.4
10.2
1.0
11.0
1.0
13.0
ns
CL = 50 pF
-
6.5
11.2
1.0
12.0
1.0
14.0
ns
6.5
-
-
6.5
-
6.5
-
ns
3.5
-
-
3.5
-
3.5
-
ns
Dn to LE; see Figure 10
fi = 1 MHz;
VI = GND to VCC
[5]
74AHCT373; VCC = 4.5 V to 5.5 V
tpd
propagation
delay
Dn to Qn; see Figure 7
[4]
LE to Qn; see Figure 8
CL = 15 pF
[4]
CL = 50 pF
ten
enable time
OE to Qn; see Figure 9
CL = 15 pF
CL = 50 pF
tdis
disable time
[4]
OE to Qn; see Figure 9
tW
pulse width
LE HIGH; see Figure 8
tsu
set-up time
Dn to LE; see Figure 10
th
hold time
Dn to LE; see Figure 10
CPD
power
dissipation
capacitance
fi = 1 MHz;
VI = GND to VCC
[4]
[5]
1.5
-
-
1.5
-
1.5
-
ns
-
12
-
-
-
-
-
pF
[1]
Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).
[2]
tpd is the same as tPHL and tPLH.
[3]
ten is the same as tPZH and tPZL.
[4]
tdis is the same as tPHZ and tPLZ.
[5]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of the outputs.
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
9 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
11. Waveforms
VI
VM
Dn input
GND
tPLH
tPHL
VOH
VM
Qn output
mna811
VOL
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7.
Data input to output propagation delays
1/fmax
VI
LE input
VM
GND
tW
t PHL
t PLH
VOH
VM
Qn output
mna812
VOL
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8.
Latch enable pulse width and input to output propagation delays
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
10 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
VI
OE input
VM
GND
t PLZ
t PZL
VCC
Qn output
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
t PZH
t PHZ
VOH
VY
Qn output
HIGH-to-OFF
OFF-to-HIGH
VM
GND
outputs
enabled
outputs
enabled
outputs
disabled
mna813
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 9.
Enable and disable times
VI
VM
Dn input
GND
th
th
t su
t su
VI
LE input
VM
GND
mna814
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
The shaded areas indicate when the input is permitted to change for predicable output performance.
Fig 10. Data set-up and hold times
Table 8.
Measurement points
Type
Input
Output
VM
VM
VX
VY
74AHC373
0.5 × VCC
0.5 × VCC
VOL + 0.3 V
VOH − 0.3 V
74AHCT373
1.5 V
0.5 × VCC
VOL + 0.3 V
VOH − 0.3 V
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
11 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VCC
VCC
G
VI
VO
RL
S1
open
DUT
RT
CL
001aad983
Test data is given in Table 9.
Definitions test circuit:
RT = termination resistance should be equal to output impedance Zo of the pulse generator.
CL = load capacitance including jig and probe capacitance.
RL = load resistance.
S1 = test selection switch.
Fig 11. Test circuitry for switching times
Table 9.
Test data
Type
Input
Load
S1 position
VI
tr, tf
CL
RL
tPHL, tPLH
tPZH, tPHZ
tPZL, tPLZ
74AHC373
VCC
≤ 3.0 ns
15 pF, 50 pF
1 kΩ
open
GND
VCC
74AHCT373
3.0 V
≤ 3.0 ns
15 pF, 50 pF
1 kΩ
open
GND
VCC
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
12 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
12. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 12. Package outline SOT163-1 (SO20)
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
13 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-153
Fig 13. Package outline SOT360-1 (TSSOP20)
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
14 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
13. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
14. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74AHC_AHCT373_3
20080520
Product data sheet
-
74AHC_AHCT373_2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Table 6: conditions for the input leakage current have been changed.
74AHC_AHCT373_2
19991123
Product specification
-
74AHC_AHCT373_1
74AHC_AHCT373_1
19981211
Product specification
-
-
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
15 of 17
74AHC373; 74AHCT373
NXP Semiconductors
Octal D-type transparant latch; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74AHC_AHCT373_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 May 2008
16 of 17
NXP Semiconductors
74AHC373; 74AHCT373
Octal D-type transparant latch; 3-state
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 20 May 2008
Document identifier: 74AHC_AHCT373_3