INTEGRATED CIRCUITS DATA SHEET TDA1510AQ 24 W BTL or 2 x 12 W stereo car radio power amplifier Product specification File under Integrated Circuits, IC01 January 1992 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier TDA1510AQ GENERAL DESCRIPTION The TDA1510AQ is a class-B integrated output amplifier encapsulated in a 13-lead single in-line (SlL) plastic power package. Developed primarily for car radio application, the device can also be used to drive low impedance loads (down to 1,6 Ω). With a supply voltage (VP) of 14,4 V, an output power of 24 W can be delivered into a 4 Ω Bridge Tied Load (BTL), or when used as a stereo amplifier, 2 × 12 W into 2 Ω or 2 × 7 W into 4 Ω. Features • Flexibility − stereo as well as mono BTL • High output power • Low offset voltage at the output (important for BTL) • Large useable gain variation • Load dump protection • Good ripple rejection • A.C. short-circuit-safe to ground • Thermal protection • Low number, small sized external components • Low stand-by current possibility • Internal limiting of bandwidth for high frequencies • High reliability. QUICK REFERENCE DATA PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage range: operating VP 6,0 14,4 18,0 V non-operating VP − − 28,0 V VP − − 45,0 V IORM − − 4,0 A Itot − 75 120 mA Stand-by current Isb − − 2 mA Switch-on current Iso 0,15 0,35 0,80 mA |ZI| 1 − − MΩ Storage temperature range Tstg −65 − + 150 °C Crystal temperature Tc − − 150 °C non-operating, load dump protection Repetitive peak output current Total quiescent current Input impedance pins 1, 2, 12 and 13 PACKAGE OUTLINE TDA1510AQ: 13-lead SIL-bent-to-DIL; plastic power (SOT 141C); SOT141-6; 1996 Aug 01. January 1992 2 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier Fig.1 Functional diagram; heavy lines indicate signal paths. January 1992 3 TDA1510AQ Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier TDA1510AQ RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT Supply voltage: operating pin 10 non-operating VP − 18 V VP − 28 V VP − 45 V IOM − 6 A non-operating, load dump protection during 50 ms Peak output current Total power dissipation see Fig.2 Ptot Storage temperature range Tstg −65 + 150 °C Crystal temperature Tc − + 150 °C Fig.2 Power derating curves. January 1992 4 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier TDA1510AQ HEATSINK DESIGN EXAMPLE The derating of the encapsulation requires the following external heatsink (for sine-wave drive): (Rth j-mb) = 3,5 K/W 24 W BTL (4 Ω) or 2 × 12 W stereo (2 Ω); maximum sine-wave dissipation = 12 W; Tamb = 65 °C (maximum): 150 – 65 R th h-a = ---------------------- – 3,5 = 3,5 K/W 12 2 × 7 W stereo (4 Ω); maximum sine-wave dissipation = 6 W; Tamb = 65 °C (maximum): 150 – 65 R th h-a = ---------------------- – 3,5 = 10,5 K/W 12 D.C. CHARACTERISTICS PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage range VP 6,0 14,4 18,0 V Repetitive peak output current IORM − − 4,0 A Total quiescent current Itot − 75 120 mA Stand-by current Isb − − 2 mA Iso 0,15 0,35 0,80 mA Switch-on current January 1992 V11 ≤ V10; note 1 5 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier TDA1510AQ A.C. CHARACTERISTICS Tamb = 25 °C; VP = 14,4 V; f = 1 kHz; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Bridge Tied Load application (BTL) Output power with bootstrap note 6; RL = 4 Ω VP = 13,2 V dtot = 0,5% Po − 15,0 − W dtot = 10% Po − 20,0 − W dtot = 0,5% Po 15,5 18,0 − W dtot = 10% Po 20,0 24,0 − W Go − 75 − dB 40,5 VP = 14,4 V Open loop voltage gain Closed loop voltage gain note 2 Gc 39,5 40,0 Frequency response at −3 dB; note 3 fr − 20 to > 20 k − Hz dB Input impedance note 4 |Zi| 1 − − MΩ RS = 0 Ω Vn (rms) − 0,2 − mV RS = 10 Ω Vn (rms) − 0,35 0,8 mV IEC 179 curve A Vn (rms) − 0,25 − mV f = 100 Hz; note 5 SVRR 42 50 − dB |∆V5-9| − 2 50 mV B − 30 to > 40 k − Noise output voltage (r.m.s. value) f = 20 Hz to 20 kHz RS = 10 kΩ; according to Supply voltage ripple rejection D.C. output offset voltage between channels Power bandwidth −1 dB; dtot = 0,5% January 1992 6 Hz Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier PARAMETER CONDITIONS TDA1510AQ SYMBOL MIN. TYP. MAX. UNIT Stereo application Output power; with bootstrap note 6; RL = 4 Ω VP = 13,2 V dtot = 0,5% Po − 4,5 − W dtot = 10% Po − 6,0 − W dtot = 0,5% Po 4,5 5,5 − W dtot = 10% Po 6,0 7,0 − W dtot = 0,5% Po − 7,5 − W dtot = 10% Po − 10,0 − W dtot = 0,5% Po 7,75 9,0 − W dtot = 10% Po 10,0 12,0 − W Po − 6 − W fr − 40 to > 20 k − Hz SVRR − 50 − dB f = 1 kHz α 40 50 − dB note 7 Gc 39,5 40,0 40,5 dB RS = 0 Ω Vn (rms) − 0,15 − mV RS = 10 kΩ Vn (rms) − 0,25 − mV Vn (rms) − 0,2 − mV VP = 14,4 V RL = 2 Ω VP = 13,2 V VP = 14,4 V Output power; without bootstrap notes 6, 8 and 9 RL = 4 Ω VP = 14,4 V dtot = 10% Frequency response notes 3 and 6 −3 dB Supply voltage ripple rejection note 5 f = 1 kHz Channel separation Closed loop voltage gain RS = 10 kΩ; Noise output voltage (r.m.s. value) f = 20 Hz to 20 kHz; RS = 10 kΩ; according to IEC179 curve A January 1992 7 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier TDA1510AQ Notes to the characteristics 1. If V11 > V10 then I11 must be < 10 mA. 2. Closed loop voltage gain can be chosen between 32 and 56 dB (BTL), and is determined by external components. 3. Frequency response externally fixed. 4. The input impedance in the test circuit (Fig.3) is typ. 100 kΩ. 5. Supply voltage ripple rejection measured with a source impedance of 0 Ω (maximum ripple amplitude 2 V). 6. Output power is measured directly at the output pins of the IC. 7. Closed loop voltage gain can be chosen between 26 and 50 dB (stereo), and is determined by external components. 8. A resistor of 56 kΩ between pins 3 and 7 is required for symmetrical clipping. 9. Without bootstrap the 100 µF capacitor between pins 5 and 6 and the 100 µF capacitor between pins 8 and 9 can be omitted. Pins 6 and 8 connected to pin 10. January 1992 8 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier APPLICATION INFORMATION (1) belongs to power supply. Fig.3 Test and application circuit; Bridge Tied Load (BTL). (1) belongs to power supply. Fig.4 Test and application circuit; stereo mode. January 1992 9 TDA1510AQ Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier TDA1510AQ PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 13 e1 Z e bp e2 m w M 0 5 v M 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1) mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 3.4 1.7 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT141-6 January 1992 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification 24 W BTL or 2 x 12 W stereo car radio power amplifier TDA1510AQ The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1992 11