PHILIPS 74LVCH16541ADGG

INTEGRATED CIRCUITS
74LVCH16541A
16-bit buffer/line driver (3-State)
Product specification
IC24 Data Handbook
1998 May 19
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5V tolerant I/O (3-State)
FEATURES
74LVCH16541A
PIN CONFIGURATION
• 5 volt tolerant inputs/outputs for interfacing with 5V logic
• Wide supply voltage range of 1.2 V to 3.6 V
• Drive capability ±24mA @ 3.3V
• Complies with JEDEC standard no. 8-1A
• CMOS low power consumption
• MULTIBYTETM flow-through standard pin-out architecture
• Low inductance multiple power and ground pins for minimum
noise and ground bounce
• Direct interface with TTL levels
• All data inputs have bushold
• Bushold inputs eliminate the need for external pull-up resistors to
hold unused inputs
1OE1
1
48 1OE2
1Y0
2
47 1A0
1Y1
3
46 1A1
GND
4
45 GND
1Y2
5
44 1A2
1Y3
6
43 1A3
VCC
7
42 VCC
1Y4
8
41 1A4
1Y5
9
40 1A5
GND
10
39 GND
1Y6 11
38 1A6
1Y7 12
37 1A7
13
36 2A0
2Y1 14
35 2A1
GND 15
34 GND
2Y0
DESCRIPTION
The 74LVCH16541A is a high-performance, low-power, low-voltage,
Si-gate CMOS device, superior to most advanced CMOS
compatible TTL families. Inputs can be driven from either 3.3V or 5V
devices. In 3-State operation, outputs can handle 5V. These
features allow the use of these devices in a mixed 3.3V/5V
environment.
The 74LVCH16541A is a 16-bit inverting buffer/line driver with
3-State outputs. The 3-State outputs are controlled by the output
enable inputs 1OEn and 2OEn. A HIGH on nOEn causes the outputs
to assume a high impedance OFF-state.
To ensure the high impedance state during power up or power
down, OE should be tied to VCC through a pullup resistor; the
minimum value of the resistor is determined by the current-sinking
capability of the driver.
2Y2 16
33 2A2
2Y3
17
32 2A3
VCC
18
31 VCC
2Y4
19
30 2A4
2Y5 20
29 2A5
GND
21
28 GND
2Y6
22
27 2A6
2Y7
23
26 2A7
2OE1 24
25 2OE2
SW00113
QUICK REFERENCE DATA
GND = 0V; Tamb = 25°C; tr = tf ≤ 2.5ns
PARAMETER
SYMBOL
tPHL/tPLH
Propagation delay
1An to 1Yn;
2An to 2Yn
CI
Input capacitance
CPD
CONDITIONS
TYPICAL
UNIT
2.7
ns
5.0
pF
32
5
pF
CL = 50pF
VCC = 3.3V
Power dissipation capacitance per buffer
VI = GND to VCC
outputs enabled
output disabled
1
NOTES:
1. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where:
fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V;
(CL × VCC2 × fo) = sum of outputs.
ORDERING INFORMATION
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
NORTH AMERICA
DWG NUMBER
48-Pin Plastic SSOP Type III
PACKAGES
–40°C to +85°C
74LVCH16541A DL
VCH16541A DL
SOT370-1
48-Pin Plastic TSSOP Type II
–40°C to +85°C
74LVCH16541A DGG
VCH16541A DGG
SOT362-1
1998 May 19
2
853-2063 19403
Philips Semiconductors
Product specification
74LVCH16541A
16-bit buffer/line driver; 5V tolerant I/O (3-State)
PIN DESCRIPTION
LOGIC SYMBOL (IEEE/IEC)
PIN NUMBER
SYMBOL
1, 24
nOE1
NAME AND FUNCTION
Output enable input
(active LOW)
1OE1
1
1OE2
48
2OE1
24
2OE2
25
2, 3, 5, 6, 8, 9,
11, 12
1Y0 to 1Y7
Data outputs
4, 10, 15, 21,
28, 34, 39, 45
GND
Ground (0V)
7, 18, 31, 42
13, 14, 16, 17,
19, 20, 22, 23
VCC
47, 46, 44, 43,
41, 40, 38, 37
1A1
Positive supply voltage
1A2
2Y0 to 2Y7
25, 48
36, 35, 33, 32,
30, 29, 27, 26
1A0
nOE2
Data outputs
1A3
1A4
Output enable input
(active LOW)
1A5
1A6
2A0 to 2A7
1A0 to 1A7
Data inputs
1A7
2A0
Data inputs
2A1
2A2
LOGIC SYMBOL
47
1A0
46
1A1
1A2
1A3
1A4
1A5
1A6
1A7
2A3
2
1Y0
3
1Y1
44
5
43
6
41
8
40
9
38
11
37
12
2A2
1Y3
2A3
1Y4
2A4
1Y5
2A5
1Y6
2A6
1Y7
2A7
2OE1
48
1OE2
2A1
1Y2
1
1OE1
2A0
2OE2
36
35
13
14
33
16
32
17
30
19
29
20
27
22
26
23
2A4
2Y0
2A5
2A6
2Y1
2A7
&
EN
&
47
2
1Y0
46
3
1Y1
44
5
1Y2
43
6
1Y3
41
8
1Y4
40
9
38
11
1Y6
37
12
1Y7
36
13
2Y0
35
14
2Y1
33
16
2Y2
32
17
2Y3
30
19
2Y4
29
20
2Y5
27
22
2Y6
26
23
1
2
1∇
2∇
1Y5
2Y7
SW00114
2Y2
BUSHOLD CIRCUIT
2Y3
VCC
2Y4
2Y5
2Y6
Data Input
To internal circuit
2Y7
24
25
SW00115
SW00044
FUNCTION TABLE
INPUTS
OUTPUT
nOE1
nOE2
nAn
nYn
L
L
L
L
L
L
H
H
X
H
X
Z
H
X
X
Z
H = HIGH voltage level
L = LOW voltage level
X = don’t care
Z = high impedance OFF-state
1998 May 19
3
Philips Semiconductors
Product specification
74LVCH16541A
16-bit buffer/line driver; 5V tolerant I/O (3-State)
RECOMMENDED OPERATING CONDITIONS
SYMBOL
VCC
VI
VO
PARAMETER
CONDITIONS
MIN
MIN.
MAX
MAX.
UNIT
DC supply voltage
(for maximum speed performance)
2.7
3.6
DC supply voltage
(for low-voltage applications)
1.2
3.6
For data input pins with
bus hold
0
VCC
For data input pins without
bus hold
0
5.5
DC output voltage range;
output HIGH or LOW state
0
VCC
DC output voltage range; output 3-State
0
5.5
–40
+85
°C
0
0
20
10
ns/V
V
DC Input voltage range
Tamb
Operating ambient temperature range
in free air
tr, tf
Input rise and fall times
V
VCC = 1.2 to 2.7V
VCC = 2.7 to 3.6V
V
ABSOLUTE MAXIMUM VALUES1, 2
In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V)
SYMBOL
VCC
PARAMETER
CONDITIONS
DC supply voltage
MIN
MAX
UNIT
–0.5
+6.5
V
IIK
DC input diode current
VI < 0
–
–50
mA
VI
DC input voltage
Note 3
–0.5
+6.5
V
IOK
DC output diode current
VO > VCC or VO < 0
–
50
mA
–0.5
VCC + 0.5
–0.5
6.5
–
50
mA
–
100
mA
–65
+150
°C
500
500
mW
VO
DC output voltage; output HIGH or LOW
state
Note 3
DC output voltage; output 3-State
IO
IGND, ICC
DC output source or sink current
VO = 0 to VCC
DC VCC or GND current
Tstg
Storage temperature range
Ptot
Power dissipation per package
– SSOP (plastic medium-shrink)
– TSSOP (plastic thin-medium-shrink)
For temperature range: –40 to +125°C
above +70°C derate linearly 8mW/K
above +60°C derate linearly 5.5mW/K
V
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output clamp current ratings are observed.
1998 May 19
4
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5V tolerant I/O (3-State)
74LVCH16541A
DC CHARACTERISTICS
Over recommended operating conditions
Voltages are referenced to GND (ground = 0V)
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
Temp = -40°C to +85°C
MIN
VIH
HIGH level input voltage
VIL
LOW level input voltage
VOH
O
VOL
VCC = 1.2V
VCC
VCC = 2.7 to 3.6V
2.0
TYP1
LOW level output voltage
MAX
V
VCC = 1.2V
GND
V
VCC = 2.7 to 3.6V
HIGH level output voltage
UNIT
0.8
VCC = 2.7; VI = VIH or VIL; IO = –12mA
VCC-0.5
VCC = 3.0V; VI = VIH or VIL; IO = –100µA
VCC-0.2
VCC = 3.0V; VI = VIH or VIL; IO = –18mA
VCC-0.6
VCC = 3.0V; VI = VIH or VIL; IO = –24mA
VCC-0.8
VCC
V
VCC = 2.7V; VI = VIH or VIL; IO = 12mA
0.40
VCC = 3.0V; VI = VIH or VIL; IO = 100µA
0.20
VCC = 3.0V; VI = VIH or VIL; IO = 24mA
0.55
V
Input leakage current
VCC = 3.6V; VI = 5.5V or GND6
0.1
5
µA
IOZ
3-State output OFF-state current
VCC = 3.6V; VI = VIH or VIL; VO = 5.5V or GND
0.1
5
µA
IOFF
Power off leakage current
VCC = 0.0V; VI or VO = 5.5V
0.1
±10
µA
ICC
Quiescent supply current
VCC = 3.6V; VI = VCC or GND; IO = 0
0.1
20
µA
∆ICC
Additional quiescent supply current
given per input pin
VCC = 2.7 to 3.6V; VI = VCC – 0.6V; IO = 0
5
500
µA
IBHL
Bus hold LOW sustaining current
VCC = 3.0V; VI = 0.8V2, 3, 4
75
µA
IBHH
Bus hold HIGH sustaining current
VCC = 3.0V; VI =
2.0V2, 3, 4
–75
µA
IBHLO
Bus hold LOW overdrive current
VCC = 3.6V2, 3, 5
500
µA
IBHHO
Bus hold HIGH overdrive current
VCC = 3.6V2, 3, 5
–500
µA
II
NOTES:
1. All typical values are at VCC = 3.3V and Tamb = 25°C.
2. Valid for data inputs of bus hold parts (LVCH16-A) only.
3. For data inputs only, control inputs do not have a bus hold circuit.
4. The specified sustaining current at the data input holds the input below the specified VI level.
5. The specified overdrive current at the data input forces the data input to the opposite logic input state.
6. For bus hold parts, the bus hold circuit is switched off when Vi exceeds VCC allowing 5.5V on the input terminal.
1998 May 19
5
Philips Semiconductors
Product specification
74LVCH16541A
16-bit buffer/line driver; 5V tolerant I/O (3-State)
AC CHARACTERISTICS
GND = 0V; tR = tF ≤ 2.5ns; CL = 50pF; RL = 500Ω; Tamb = –40°C to +85°C.
LIMITS
SYMBOL
PARAMETER
VCC = 3.3V ±0.3V
WAVEFORM
VCC = 2.7V
UNIT
MIN
TYP1
MAX
MIN
MAX
tPHL
tPLH
Propagation delay
1An to 1Yn;
2An to 2Yn
1, 3
1.5
2.7
4.5
1.5
5.5
ns
tPZH
tPZL
3-State output enable time
1OEn to 1Yn;
2OEn to 2Yn
2, 3
1.5
3.5
5.9
1.5
6.9
ns
tPHZ
tPLZ
3-State output disable time
1OEn to 1Yn;
2OEn to 2Yn
2, 3
1.5
3.9
5.5
1.5
6.5
ns
NOTE:
1. All typical values are at VCC = 3.3V and Tamb = 25°C.
AC WAVEFORMS
TEST CIRCUIT
VM = 1.5V at VCC w 2.7V; VM = 0.5 VCC at VCC t 2.7V.
VOL and VOH are the typical output voltage drop that occur with the
output load.
VX = VOL + 0.3V at VCC w 2.7V; VX = VOL + 0.1 VCC at VCC t 2.7V
VY = VOH –0.3V at VCC w 2.7V; VY = VOH – 0.1 VCC at VCC t 2.7V
PULSE
GENERATOR
VI
2 x VCC
Open
GND
500Ω
VO
D.U.T.
VI
RT
An
INPUT
S1
VCC
50pF
CL
500Ω
VM
Test
GND
tPHL
tPLH
VOH
Yn
OUTPUT
VM
S1
VCC
VI
tPLH/tPHL
Open
t 2.7V
VCC
tPLZ/tPZL
2 x VCC
2.7V – 3.6V
2.7V
tPHZ/tPZH
GND
SY00003
VOL
Waveform 3. Load circuitry for switching times
SW00116
Waveform 1. Input (An) to output (Yn) propagation delay times
VI
OE INPUT
VM
GND
tPLZ
tPZL
VCC
Y OUTPUT
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
tPHZ
tPZH
VOH
Y OUTPUT
HIGH-to-OFF
OFF-to-HIGH
VY
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
SW00112
Waveform 2. 3-State enable and disable times
1998 May 19
6
Philips Semiconductors
Product specification
16-bit buffer/line driver (3-State)
74LVCH16541A
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
1998 May 19
7
SOT370-1
Philips Semiconductors
Product specification
16-bit buffer/line driver (3-State)
74LVCH16541A
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mm
1998 May 19
8
SOT362-1
Philips Semiconductors
Product specification
16-bit buffer/line driver (3-State)
74LVCH16541A
NOTES
1998 May 19
9
Philips Semiconductors
Product specification
16-bit buffer/line driver (3-State)
74LVCH16541A
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print code
Document order number:
yyyy mmm dd
10
Date of release: 08-98
9397-750-04535