PHILIPS 74ABT861DB

INTEGRATED CIRCUITS
74ABT861
10-bit bus transceiver (3-State)
Product specification
Supersedes data of 1995 Sep 06
IC23 Data Handbook
1998 Jan 16
Philips Semiconductors
Product specification
10-bit bus transceiver (3-State)
74ABT861
FEATURES
DESCRIPTION
• Provides high performance bus interface buffering for wide
The 74ABT861 bus transceiver provides high performance bus
interface buffering for wide data/address paths of buses carrying
parity.
data/address paths or buses carrying parity
• Buffered control inputs for light loading, or increased fan-in as
The 74ABT861 10-bit bus transceiver has NOR-ed transmit and
receive output enables for maximum control flexibility.
required with MOS microprocessors
• Output capability: +64mA/–32mA
• Latch-up protection exceeds 500mA per Jedec Std 17
• ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
• Power-up 3-State
• Inputs are disabled during 3-State mode
QUICK REFERENCE DATA
SYMBOL
CONDITIONS
Tamb = 25°C; GND = 0V
PARAMETER
TYPICAL
UNIT
3.4
ns
tPLH
tPHL
Propagation delay
An to Bn or Bn to An
CL = 50pF; VCC = 5V
CIN
Input capacitance
VI = 0V or VCC
4
pF
CI/O
I/O capacitance
Outputs disabled; VO = 0V or VCC
7
pF
ICCZ
Total supply current
Outputs disabled; VCC =5.5V
500
nA
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
NORTH AMERICA
DWG NUMBER
24-Pin Plastic DIP
–40°C to +85°C
74ABT861 N
74ABT861 N
SOT222-1
24-Pin plastic SO
–40°C to +85°C
74ABT861 D
74ABT861 D
SOT137-1
24-Pin Plastic SSOP Type II
–40°C to +85°C
74ABT861 DB
74ABT861 DB
SOT340-1
24-Pin Plastic TSSOP Type I
–40°C to +85°C
74ABT861 PW
74ABT861PW DH
SOT355-1
PIN CONFIGURATION
PIN DESCRIPTION
OEBA
1
24
VCC
A0
2
23
B0
A1
3
22
B1
A2
4
21
B2
A3
5
20
B3
A4
6
19
B4
A5
7
18
B5
A6
8
17
B6
A7
9
16
B7
15
B8
A9 11
14
B9
GND 12
13
OEAB
A8 10
TOP VIEW
PIN NUMBER
SYMBOL
FUNCTION
13
OEAB
A side to B side output enable
input (active-Low)
2, 3, 4, 5, 6,
7, 8, 9, 10, 11
A0-A9
Data inputs/outputs (A side)
23, 22, 21, 20, 19,
18, 17, 16, 15, 14
B0-B9
Data inputs/outputs (B side)
1
OEBA
B side to A side output enable
input (active-Low)
12
GND
Ground (0V)
24
VCC
Positive supply voltage
SA00278
1998 Jan 16
2
853-1621 18866
Philips Semiconductors
Product specification
10-bit bus transceiver (3-State)
74ABT861
LOGIC SYMBOL
LOGIC SYMBOL (IEEE/IEC)
1
EN1(BA)
13
EN2(AB)
2
3
4
5
6
7
8
9
10
11
2
23
1
2
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9
3
22
1
OEBA
4
21
13
OEAB
5
20
6
19
7
18
8
17
9
16
B0 B1 B2 B3 B4 B5 B6 B7 B8 B9
23 22 21 20
19 18 17
16 15
14
SA00279
10
15
11
14
SA00280
LOGIC DIAGRAM
FUNCTION TABLE
INPUTS
OEAB
10
10
An
Bn
H
L
X
Z
OEBA
=
=
=
=
OPERATING
OEAB
OEBA
MODE
L
H
A data to B bus
H
L
B data to A bus
H
H
Z
High voltage level
Low voltage level
Don’t care
High impedance “off” state
SA00281
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL
VCC
PARAMETER
CONDITIONS
RATING
UNIT
–0.5 to +7.0
V
–18
mA
–1.2 to +7.0
V
VO < 0
–50
mA
DC supply voltage
IIK
DC input diode current
VI
DC input voltage3
IOK
DC output diode current
VI < 0
VOUT
DC output voltage3
output in Off or High state
–0.5 to +5.5
V
IOUT
DC output current
output in Low state
128
mA
Tstg
Storage temperature range
–65 to 150
°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Jan 16
3
Philips Semiconductors
Product specification
10-bit bus transceiver (3-State)
74ABT861
RECOMMENDED OPERATING CONDITIONS
SYMBOL
VCC
PARAMETER
LIMITS
DC supply voltage
UNIT
Min
Max
4.5
5.5
V
0
VCC
V
VI
Input voltage
VIH
High-level input voltage
VIL
Low-level input voltage
0.8
V
IOH
High-level output current
–32
mA
IOL
Low-level output current
64
mA
0
5
ns/V
–40
+85
°C
2.0
∆t/∆v
Input transition rise or fall rate
Tamb
Operating free-air temperature range
V
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
Min
VIK
Input clamp voltage
VOH
High–level output voltage
VOL
Tamb = –40°C
to +85°C
Tamb = +25°C
VCC = 4.5V; IIK = –18mA
Typ
Max
–0.9
–1.2
Min
UNIT
Max
–1.2
V
VCC = 4.5V; IOH = –3mA; VI = VIL or VIH
2.5
3.5
2.5
V
VCC = 5.0V; IOH = –3mA; VI = VIL or VIH
3.0
4.0
3.0
V
VCC = 4.5V; IOH = –32mA; VI = VIL or VIH
2.0
2.6
2.0
V
Low–level output voltage
VCC = 4.5V; IOL = 64mA; VI = VIL or VIH
0.42
0.55
0.55
V
Input leakage
Control pins
VCC = 5.5V; VI = GND or 5.5V
±0.01
±1.0
±1.0
µA
current
Data pins
VCC = 5.5V; VI = GND or 5.5V
±5.0
±100
±100
µA
Power-off leakage current
VCC = 0.0V; VO or VI ≤ 4.5V
±5.0
±100
±100
µA
Power–up/down 3-State
output current3
VCC = 2.1V; VO = 0.5V; VI = GND or VCC;
V OE = VCC
±5.0
±50
±50
µA
IIH + IOZH
3-State output High current
VCC = 5.5V; VO = 2.7V; VI = VIL or VIH
5.0
50
50
µA
IIL + IOZL
3-State output Low current
VCC = 5.5V; VO = 0.5V; VI = VIL or VIH
–5.0
–50
–50
µA
ICEX
Output high leakage current
VCC = 5.5V; VO = 5.5V; VI = GND or VCC
5.0
50
50
µA
II
IOFF
IPU/PD
IO
Output
current1
ICCH
ICCL
Quiescent supply current
ICCZ
∆ICC
Additional supply current per
input pin2
VCC = 5.5V; VO = 2.5V
–100
–180
–180
mA
VCC = 5.5V; Outputs High, VI = GND or VCC
–50
0.5
250
–50
250
µA
VCC = 5.5V; Outputs Low, VI = GND or VCC
25
38
38
mA
VCC = 5.5V; Outputs 3-State;
VI = GND or VCC
0.5
50
50
µA
Outputs enabled, one input at 3.4V,
other inputs at VCC or GND; VCC = 5.5V
0.5
1.5
1.5
mA
Outputs 3-State, one data input at 3.4V,
other inputs at VCC or GND; VCC = 5.5V
0.01
50
50
µA
Outputs 3-State, one enable input at 3.4V,
other inputs at VCC or GND; VCC = 5.5V
0.5
1.5
1.5
mA
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any VCC between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V 10%, a
transition time of up to 100µsec is permitted.
1998 Jan 16
4
Philips Semiconductors
Product specification
10-bit bus transceiver (3-State)
74ABT861
AC CHARACTERISTICS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω
LIMITS
SYMBOL
PARAMETER
Tamb = -40 to
+85oC
VCC = +5.0V ±0.5V
Tamb = +25oC
VCC = +5.0V
WAVEFORM
Min
Typ
Max
Min
Max
UNIT
tPLH
tPHL
Propagation delay
An to Bn or Bn to An
1
1.1
1.0
3.4
3.2
4.9
4.9
1.1
1.0
5.2
5.2
ns
tPZH
tPZL
Output enable time
to High and Low level
2
1.2
2.4
3.5
4.6
5.0
6.0
1.2
2.4
5.9
6.9
ns
tPHZ
tPLZ
Output disable time
from High and Low level
2
3.1
3.7
5.3
5.3
6.5
6.6
3.1
3.7
7.5
7.1
ns
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
INPUT
OEXX
INPUT
VM
VM
VM
VM
tPLZ
tPZL
tPLH
tPHL
OUTPUT
VM
VOL + 0.3V
VM
VM
OUTPUT
tPHZ
tPZH
SA00023
3.5V
VOL
VOH
Waveform 1. Input to Output Propagation Delays
OUTPUT
VOH – 0.3V
VM
0V
SA00282
Waveform 2. 3-State Output Enable and Disable Times
TEST CIRCUIT AND WAVEFORM
7V
500 Ω
From Output
Under Test
S1
Open
GND
500 Ω
CL = 50 pF
Load Circuit
TEST
S1
tpd
open
tPLZ/tPZL
7V
tPHZ/tPZH
open
DEFINITIONS
Load capacitance includes jig and probe capacitance;
CL =
see AC CHARACTERISTICS for value.
SA00012
1998 Jan 16
5
Philips Semiconductors
Product specification
10-bit bus transceiver (3-State)
74ABT861
DIP24: plastic dual in-line package; 24 leads (300 mil)
1998 Jan 16
6
SOT222-1
Philips Semiconductors
Product specification
10-bit bus transceiver (3-State)
74ABT861
SO24: plastic small outline package; 24 leads; body width 7.5 mm
1998 Jan 16
7
SOT137-1
Philips Semiconductors
Product specification
10-bit bus transceiver (3-State)
74ABT861
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
1998 Jan 16
8
SOT340-1
Philips Semiconductors
Product specification
10-bit bus transceiver (3-State)
74ABT861
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
1998 Jan 16
9
SOT355-1
Philips Semiconductors
Product specification
10-bit bus transceiver (3-State)
74ABT861
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
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Document order number:
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Date of release: 05-96
9397-750-03476