Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2507DF GENERAL DESCRIPTION Enhanced performance, new generation, high-voltage, high-speed switching npn transistor with an integrated damper diode in a plastic full-pack envelope intended for use in horizontal deflection circuits of colour television receivers and computer monitors. Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case dissipation. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT VCESM VCEO IC ICM Ptot VCEsat ICsat VF tf Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Collector saturation current Diode forward voltage Fall time VBE = 0 V 4 1.7 0.25 1500 700 8 15 45 5.0 2.0 0.5 V V A A W V A V µs PINNING - SOT199 PIN Ths ≤ 25 ˚C IC = 4 A; IB = 0.8 A f = 16kHz IF = 4 A ICsat = 4 A; f = 16kHz PIN CONFIGURATION SYMBOL DESCRIPTION 1 base 2 collector 3 emitter case isolated c case b Rbe 1 2 e 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL PARAMETER CONDITIONS VCESM VCEO IC ICM IB IBM -IB(AV) -IBM Ptot Tstg Tj Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Reverse base current Reverse base current peak value 1 Total power dissipation Storage temperature Junction temperature VBE = 0 V average over any 20 ms period Ths ≤ 25 ˚C MIN. MAX. UNIT -65 - 1500 700 8 15 4 6 100 5 45 150 150 V V A A A A mA A W ˚C ˚C 1 Turn-off current. September 1997 1 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2507DF THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-hs Junction to heatsink without heatsink compound Rth j-hs Junction to heatsink with heatsink compound Rth j-a Junction to ambient in free air TYP. MAX. UNIT - 3.7 K/W - 2.8 K/W 35 - K/W TYP. MAX. UNIT 2500 V ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Visol Repetitive peak voltage from all three terminals to external heatsink R.H. ≤ 65 % ; clean and dustfree Cisol Capacitance from T2 to external f = 1 MHz heatsink MIN. - - 22 - pF MIN. TYP. MAX. UNIT - - 1.0 2.0 mA mA 700 - - V 7.5 - 160 13.5 45 - 5 mA V Ω V 5 - 14 7 1.7 1.1 9 2.0 V TYP. MAX. UNIT 68 - pF 5.0 0.25 6.0 0.5 µs µs STATIC CHARACTERISTICS Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER ICES ICES Collector cut-off current 2 VCEOsust IEBO BVEBO Rbe VCEsat VBEsat hFE hFE VF CONDITIONS VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 ˚C Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA; L = 25 mH Emitter cut-off current VEB = 7.5 V; IC = 0 A Emitter-base breakdown voltage IB = 600 mA Base-emitter resistance VEB = 7.5 V Collector-emitter saturation voltages IC = 4 A; IB = 0.8 A Base-emitter saturation voltage DC current gain Diode forward voltage IC = 4 A; IB = 0.8 A IC = 1 A; VCE = 5 V IC = 4 A; VCE = 5 V IF = 4 A V DYNAMIC CHARACTERISTICS Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Cc Collector capacitance IE = 0 A; VCB = 10 V; f = 1 MHz ts tf Switching times (16 kHz line deflection circuit) Turn-off storage time Turn-off fall time ICsat = 4 A; IB(end) = 0.7 A; LB = 6 µH; -VBB = 4 V 2 Measured with half sine-wave voltage (curve tracer). September 1997 2 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor ICsat TRANSISTOR IC BU2507DF 100 BU2507DF/X hFE DIODE VCE = 1 V Ths = 25 C Ths = 85 C t IBend IB 10 t 20us 26us 64us VCE 1 0.01 t Fig.1. Switching times waveforms. 0.1 1 IC / A 10 Fig.4. High and low DC current gain. hFE = f (IC) VCE = 1 V ICsat 100 90 % BU2507DF/X hFE VCE = 5 V Ths = 25 C Ths = 85 C IC 10 % tf 10 t ts IB IBend t 1 0.01 - IBM Fig.2. Switching times definitions. 0.1 1 IC / A 10 Fig.5. High and low DC current gain. hFE = f (IC) VCE = 5 V + 150 v nominal adjust for ICsat 10 BU2507DF/X VCESAT / V Ths = 25 C Ths = 85 C 1mH 1 IC/IB = 3 IC/IB = 4 IC/IB = 5 D.U.T. LB IBend 0.1 12nF -VBB Rbe 0.01 0.1 September 1997 1 10 IC / A 100 Fig.6. Typical collector-emitter saturation voltage. VCEsat = f (IC); parameter IC/IB Fig.3. Switching times test circuit. 3 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor 1.2 VBEsat / V 1.1 BU2507DF BU2507DF/DX 120 Ths = 25 C Ths = 85 C 110 with heatsink compound 100 90 80 70 IC = 4 A 1 Normalised Power Derating PD% 60 0.9 50 40 IC = 3 A 0.8 30 20 0.7 10 0 0.6 0 0 0.5 1 1.5 IB / A BU2507AF/DF/AX/DX Ptot / W 40 60 80 Ths / C 100 120 140 Fig.10. Normalised power dissipation. PD% = 100⋅PD/PD 25˚C = f (Tmb) Fig.7. Typical base-emitter saturation voltage. VBEsat = f (IB); parameter IC 10 20 2 BU2507AF/X/DF/X Zth / K/W 10 Ths = 25 C Ths = 85 C 0.5 1 0.1 1 0.2 0.1 0.05 0.02 PD 0.01 tp D= tp T D=0 t T 0.1 0.001 1E-06 0 0.5 1 IB / A 1.5 2 ts/tf/ us 10E-2 1E+00 t/s Fig.8. Typical losses. PTOT = f (IB); IC = 4 A; f = 16 kHz 10 1E-4 Fig.11. Transient thermal impedance. Zth j-hs = f(t); parameter D = tp/T BU2507AF/AX/Df/DX85ts/tf 8 6 4 2 0 0 0.5 1 1.5 IB / A 2 Fig.9. Typical collector storage and fall time. ts = f (IB); tf = f (IB); IC = 4.0 A; Tj = 85˚C; f = 16 kHz September 1997 4 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2507DF MECHANICAL DATA Dimensions in mm 15.3 max Net Mass: 5.5 g 5.2 max 3.1 3.3 0.7 7.3 3.2 o 45 6.2 5.8 21.5 max seating plane 3.5 max not tinned 3.5 15.7 min 1 2 2.1 max 5.45 3 1.2 1.0 0.7 max 0.4 M 2.0 5.45 Fig.12. SOT199; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 5 Rev 1.200 Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2507DF DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 6 Rev 1.200