PHILIPS BLS2933-100

BLS2933-100
Microwave power LDMOS transistor
Rev. 01 — 1 August 2006
Product data sheet
1. Product profile
1.1 General description
100 W LDMOS power transistor (at a supply voltage of 32 V) for S-band radar applications
in the 2.9 GHz to 3.3 GHz frequency range.
Table 1:
Typical performance
tp = 200 µs; δ = 12 %; Tcase = 25 °C; in a class-AB production test circuit.
VDS
PL
Gp
ηD
Mode of operation
f
IDq
(GHz)
(V)
(W)
(dB)
(%)
(mA)
class AB
2.9 to 3.3
32
100
8
40
20
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
n
n
n
n
n
n
Easy power control
Integrated ESD protection
Excellent ruggedness
Excellent thermal stability
Designed for broadband operation (2.9 GHz to 3.3 GHz)
Internally matched for ease of use
1.3 Applications
n S-band radar applications
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
2. Pinning information
Table 2.
Pinning
Pin
Description
1
drain
2
gate
3
source
Simplified outline
Symbol
1
1
3
[1]
2
2
3
sym112
[1]
connected to flange
3. Ordering information
Table 3.
Ordering information
Type number
BLS2933-100
Package
Name
Description
Version
-
flanged LDMOST ceramic package; 2 mounting
holes; 2 leads
SOT502A
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
-
65
V
VGS
gate-source voltage
-
15
V
ID
drain current
-
12
A
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
200
°C
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Zth(j-h)
transient thermal impedance from Th = 25 °C;
junction to heatsink
tp = 200 µs; δ = 12 %
BLS2933-100_1
Product data sheet
Conditions
Typ
Unit
0.4
K/W
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
2 of 12
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
6. Characteristics
Table 6.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V(BR)DSS
drain-source breakdown
voltage
VGS = 0 V; ID = 2.1 mA
65
-
-
V
VGS(th)
gate-source threshold voltage VDS = 10 V;
ID = 180 mA
2.5
3.1
3.5
V
VGSq
gate-source quiescent
voltage
VDS = 28 V;
IDS = 900 mA
-
3.3
4.5
V
IDSS
drain leakage current
VGS = 0 V; VDS = 28 V
-
-
2
µA
IDSX
drain cut-off current
VGS = VGS(th) + 9 V;
VDS = 10 V
27
30
-
A
IGSS
gate leakage current
VGS = 15 V; VDS = 0 V
-
-
200
nA
gfs
forward transconductance
VDS = 10 V; ID = 10 A
-
9.0
-
S
RDS(on)
drain-source on-state
resistance
VGS = VGS(th) + 6 V;
ID = 6 A
-
0.09
-
Ω
Crs
feedback capacitance
VGS = 0 V; VDS = 28 V;
f = 1 MHz
-
2.5
-
pF
7. Application information
Table 7.
Application information
RF performance in common source class-AB circuit; Th = 25 °C; tp = 200 µs; δ = 12 %;
Zth(mb-h) = 0.15 K/W; unless otherwise specified.
Symbol
Parameter
Min
Typ
Max
Unit
foper
operating frequency
Conditions
2.9
-
3.3
GHz
VCC
supply voltage
-
-
32
V
tp
pulse duration
-
200
-
µs
δ
duty cycle
-
12
-
%
PL
output power
100
-
-
W
PL(1dB)
output power at 1 dB gain
compression
-
120
-
W
Gp
power gain
6
8
-
dB
ηD
drain efficiency
33
40
-
%
Pdroop(pulse)
pulse droop power
-
0.1
0.5
dB
tr
rise time
-
20
50
ns
tf
fall time
-
6
50
ns
VSWRload
load voltage standing wave ratio
10 : 1
-
-
IRL
input return loss
-
−10
-
BLS2933-100_1
Product data sheet
dB
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
3 of 12
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
Table 8.
Typical impedance
f
ZS
ZL
GHz
Ω
Ω
2.9
3.3 − j5.6
3.5 − j3.3
3.0
3.7 − j5.3
3.1 − j3.6
3.1
5.9 − j5.8
3.3 − j3.3
3.2
6.8 − j3.4
3.2 − j3.5
3.3
6.6 − j2.7
3.1 − j3.6
drain
ZL
gate
ZS
001aaf059
Fig 1. Definition of transistor impedance
7.1 Ruggedness in class-AB operation
The BLS2933-100 is capable of withstanding a load mismatch corresponding to
VSWR > 10 : 1 through all phases under the following conditions: VDS = 32 V;
IDq = 20 mA; PL = 100 W pulsed, tp = 200 µs; δ = 12 %.
BLS2933-100_1
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
4 of 12
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
001aaf066
10
50
ηD
(%)
Gp
(dB)
ηD
8
001aaf070
10
Gp
(dB)
40
(1)
(2)
(3)
8
Gp
(4)
(5)
6
30
6
4
20
4
2
10
2
0
2.8
3.0
0
0
3.4
3.2
0
40
80
120
f (GHz)
160
PL (W)
VDS = 32 V; IDq = 20 mA; tp = 200 µs; δ = 12 %;
PL = 100 W.
(1) f = 2.9 MHz.
(2) f = 3.0 MHz.
(3) f = 3.1 MHz.
(4) f = 3.2 MHz.
(5) f = 3.3 MHz.
VDS = 32 V; IDq = 20 mA; tp = 200 µs; δ = 12 %.
Fig 2. Power gain and drain efficiency as functions of
frequency; typical values
001aaf071
50
(1)
(2)
(3)
(4)
(5)
ηD
(%)
40
Fig 3. Power gain as a function of load power; typical
values
001aaf072
160
PL
(W)
(1) (2) (3)
(4)
(5)
120
30
80
20
40
10
0
0
0
40
80
120
160
0
PL (W)
20
30
Pi (W)
(1) f = 2.9 MHz.
(1) f = 2.9 MHz.
(2) f = 3.0 MHz.
(2) f = 3.0 MHz.
(3) f = 3.1 MHz.
(3) f = 3.1 MHz.
(4) f = 3.2 MHz.
(4) f = 3.2 MHz.
(5) f = 3.3 MHz.
(5) f = 3.3 MHz.
VDS = 32 V; IDq = 20 mA; tp = 200 µs; δ = 12 %.
Fig 4. Efficiency as a function of power load; typical
values
VDS = 32 V; IDq = 20 mA; tp = 200 µs; δ = 12 %.
Fig 5. Load power as a function of input power;
typical values
BLS2933-100_1
Product data sheet
10
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
5 of 12
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
001aaf073
12
001aaf074
10
Gp
(dB)
Gp
(dB)
10
(1)
(2)
(3)
8
(3)
(2)
(1)
8
6
2.8
6
3.0
3.2
4
2.8
3.4
3.0
f (GHz)
3.2
3.4
f (GHz)
(1) IDq = 20 mA.
(1) tp = 100 µs.
(2) IDq = 150 mA.
(2) tp = 300 µs.
(3) IDq = 500 mA.
(3) tp = 500 µs.
VDS = 32 V; IDq = 20 mA; tp = 200 µs; δ = 12 %;
PL = 100 W.
VDS = 32 V; IDq = 20 mA; tp = 100 µs, 200 µs and
500 µs; δ = 10 %; PL = 100 W.
Fig 6. Power gain as a function of frequency and IDq;
typical values
Fig 7. Power gain as a function of frequency; typical
values
001aaf081
50
ηD
(%)
45
(1)
(2)
(3)
40
35
2.8
3.0
3.2
3.4
f (GHz)
(1) tp = 100 µs.
(2) tp = 300 µs.
(3) tp = 500 µs.
VDS = 32 V; IDq = 20 mA; δ = 10 %; PL = 100 W.
Fig 8. Efficiency as a function of frequency; typical values
BLS2933-100_1
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
6 of 12
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
001aaf082
1.0
Zth
(K/W)
0.8
0.6
0.4
(1)
(2)
(3)
(4)
(5)
0.2
0
10−5
10−4
10−3
10−2
tp (s)
(1) 1 % duty cycle
(2) 2 % duty cycle
(3) 5 % duty cycle
(4) 10 % duty cycle
(5) 20 % duty cycle
Fig 9. Thermal resistance as function of pulse duration and duty cycle; typical values
001aaf083
800
Pmax
(W)
(1)
(2)
(3)
(4)
600
400
200
0
10−5
10−4
10−3
10−2
tp (s)
Th = 70 °C
(1) 1 % duty cycle
(2) 2 % duty cycle
(3) 10 % duty cycle
(4) 20 % duty cycle
Fig 10. Maximum allowable dissipated power as function of pulse duration and duty cycle for reaching 200 °C
junction temperature
BLS2933-100_1
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
7 of 12
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
8. Test information
C3
C2
C4
C5
C6
+Vgs
+Vds
C7
C8
C9
R1
C12
C11
R2
L1
C1
C10
BLS2933-100 in
BLS2933-100 out
001aaf084
The components are situated on one side of the copper-clad Duroid 6006 Printed-Circuit Board (PCB). Both the input and
output PCB are 40 mm × 60 mm with εr = 6.15 and thickness 0.64 mm.
See Table 9 for list of components
Fig 11. Component layout for test circuit
Table 9.
List of components (see Figure 11)
Component
Description
Value
Dimensions
Catalogue number
C1, C2, C4, C5, multilayer ceramic chip capacitor
C6, C7, C10
[1]
22 pF
C3, C8, C9
multilayer ceramic chip capacitor
[2]
470 pF
C11
tantalum capacitor
4.7 µF; 50 V
C12
electrolytic capacitor
220 µF; 63 V
R1
resistor
560 Ω
R2
metafilm resistor
49.9 Ω; 0.6 W
L1
copper wire 1 mm diameter
N1
N-connector male
Suhner 13N-50-057/1
N2
N-connector female
Suhner 23N-50-057/1
Kemet T491D475K050AS
SMD 0805
length of loop = 20 mm;
height of loop = 10 mm
[1]
American Technical Ceramics type 100A or capacitor of same quality.
[2]
American Technical Ceramics type 100B or capacitor of same quality.
BLS2933-100_1
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
8 of 12
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
9. Package outline
Flanged LDMOST ceramic package; 2 mounting holes; 2 leads
SOT502A
D
A
F
3
D1
U1
B
q
c
C
1
H
L
E1
p
U2
E
w1 M A M B M
A
2
w2 M C M
b
0
5
Q
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
A
b
c
mm
4.72
3.43
12.83
12.57
0.15
0.08
inches
0.186
0.135
0.505 0.006
0.495 0.003
OUTLINE
VERSION
E
E1
F
H
L
p
Q
q
U1
U2
w1
w2
20.02 19.96
19.61 19.66
9.50
9.30
9.53
9.25
1.14
0.89
19.94
18.92
5.33
4.32
3.38
3.12
1.70
1.45
27.94
34.16
33.91
9.91
9.65
0.25
0.51
0.788 0.786
0.772 0.774
0.374 0.375
0.366 0.364
0.067
1.100
0.057
1.345
1.335
0.390
0.380
0.01
0.02
D
D1
0.045 0.785
0.035 0.745
0.210 0.133
0.170 0.123
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-28
03-01-10
SOT502A
Fig 12. Package outline SOT502A
BLS2933-100_1
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
9 of 12
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
10. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BLS2933-100_1
20060801
Product data sheet
-
-
BLS2933-100_1
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
10 of 12
BLS2933-100
Philips Semiconductors
Microwave power LDMOS transistor
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.semiconductors.philips.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and and
operation of the device at these or any other conditions above those given in
the Characteristics sections of this document is not implied. Exposure to
limiting values for extended periods may affect device reliability.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.semiconductors.philips.com/profile/terms, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
BLS2933-100_1
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 1 August 2006
11 of 12
Philips Semiconductors
BLS2933-100
Microwave power LDMOS transistor
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
7.1
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 3
Ruggedness in class-AB operation. . . . . . . . . . 4
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: [email protected].
Date of release: 1 August 2006
Document identifier: BLS2933-100_1