PHILIPS 74ALVC02BQ

INTEGRATED CIRCUITS
DATA SHEET
74ALVC02
Quad 2-input NOR gate
Product specification
Supersedes data of 2003 Feb 05
2003 Jul 14
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
FEATURES
DESCRIPTION
• Wide supply voltage range from 1.65 to 3.6 V
The 74ALVC02 is a high-performance, low-power,
low-voltage, Si-gate CMOS device and superior to most
advanced CMOS compatible TTL families.
• 3.6 V tolerant inputs/outputs
• CMOS low power consumption
Schmitt-trigger action at all inputs makes the circuit
tolerant for slower input rise and fall times.
• Direct interface with TTL levels (2.7 to 3.6 V)
• Power-down mode
The 74ALVC02 provides the 2-input NOR function.
• Latch-up performance exceeds 250 mA
• Complies with JEDEC standard:
JESD8-7 (1.65 to 1.95 V)
JESD8-5 (2.3 to 2.7 V)
JESD8B/JESD36 (2.7 to 3.6 V).
• ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C.
SYMBOL
tPHL/tPLH
PARAMETER
propagation delay nA, nB to nY
CI
input capacitance
CPD
power dissipation capacitance per buffer
CONDITIONS
UNIT
VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ
2.8
ns
VCC = 2.5 V; CL = 30 pF; RL = 500 Ω
2.0
ns
VCC = 2.7 V; CL = 50 pF; RL = 500 Ω
2.5
ns
VCC = 3.3 V; CL = 50 pF; RL = 500 Ω
2.2
ns
3.5
pF
32
pF
VCC = 3.3 V; notes 1 and 2
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL × VCC2 × fo) = sum of the outputs.
2. The condition is VI = GND to VCC.
2003 Jul 14
TYPICAL
2
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
TEMPERATURE
RANGE
PINS
PACKAGE
MATERIAL
CODE
SO14
plastic
SOT108-1
74ALVC02D
−40 to +85 °C
14
74ALVC02PW
−40 to +85 °C
14
TSSOP14
plastic
SOT402-1
74ALVC02BQ
−40 to +85 °C
14
DHVQFN14
plastic
SOT762-1
FUNCTION TABLE
See note 1.
INPUT
OUTPUT
nA
nB
nY
L
L
H
L
H
L
H
L
L
H
H
L
Note
1. H = HIGH voltage level;
L = LOW voltage level
PINNING
Pin
SYMBOL
DESCRIPTION
1
1Y
data output
2
1A
data input
3
1B
data input
1Y
1
14 VCC
4
2Y
data output
1A
2
13 4Y
5
2A
data input
1B
3
12 4B
6
2B
data input
2Y
4
7
GND
ground (0 V)
8
3A
data input
2A
5
10 3Y
9
3B
data input
2B
6
9
10
3Y
data output
GND
7
8 3A
11
4A
data input
12
4B
data input
13
4Y
data output
14
VCC
supply voltage
2003 Jul 14
handbook, halfpage
02
11 4A
3B
MNA214
Fig.1 Pin configuration SO14 and TSSOP14.
3
Philips Semiconductors
Product specification
Quad 2-input NOR gate
handbook, halfpage
1Y
VCC
1
14
74ALVC02
1A
2
13
4Y
1B
3
12
4B
2Y
4
2A
2B
GND(1)
11
4A
5
10
3Y
6
9
3B
Top view
7
8
GND
3A
handbook, halfpage
A
Y
B
MNA215
MNA951
(1) (1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
Fig.2 Pin configuration DHVQFN14.
Fig.3 Logic diagram (one gate).
handbook, halfpage
2
≥1
1
≥1
4
≥1
10
≥1
13
3
handbook, halfpage
2
1A
3
1B
5
2A
6
2B
8
3A
9
3B
11
4A
12
4B
1Y
1
5
2Y
4
6
3Y
10
8
9
4Y
13
11
MNA216
12
MNA217
Fig.4 Function diagram.
2003 Jul 14
Fig.5 IEC logic symbol.
4
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage
1.65
3.6
V
VI
input voltage
0
3.6
V
VO
output voltage
VCC = 1.65 to 3.6 V
0
VCC
V
VCC = 0 V; Power-down mode
0
4.6
V
Tamb
operating ambient temperature
−40
+85
°C
tr, tf
input rise and fall times
VCC = 1.65 to 2.7 V
0
20
ns/V
VCC = 2.7 to 3.6 V
0
10
ns/V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
VCC
supply voltage
IIK
input diode current
VI
input voltage
IOK
output diode current
VO
output voltage
CONDITIONS
VI < 0
VO > VCC or VO < 0
MIN.
MAX.
UNIT
−0.5
+4.6
V
−
−50
mA
−0.5
+4.6
V
−
±50
mA
notes 1 and 2
−0.5
VCC + 0.5
V
Power-down mode; note 2
−0.5
+4.6
V
VO = 0 to VCC
−
±50
mA
IO
output source or sink current
ICC, IGND
VCC or GND current
−
±100
mA
Tstg
storage temperature
−65
+150
°C
Ptot
power dissipation
−
500
mW
Tamb = −40 to +85 °C; note 3
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation.
3. For SO14 packages: above 70 °C derate linearly with 8 mW/K.
For TSSOP14 packages: above 60 °C derate linearly with 5.5 mW/K.
For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K.
2003 Jul 14
5
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
DC CHARACTERISTICS
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
OTHER
TYP.(1)
MAX.
UNIT
VCC (V)
Tamb = −40 to +85 °C
VIH
VIL
VOL
VOH
1.65 to 1.95 0.65 × VCC −
−
V
1.7
−
−
V
2
−
−
V
1.65 to 1.95 −
−
0.35 × VCC V
2.3 to 2.7
−
−
0.7
V
2.7 to 3.6
−
−
0.8
V
IO = 100 µA
1.65 to 3.6
−
−
0.2
V
IO = 6 mA
1.65
−
0.11
0.3
V
IO = 12 mA
2.3
−
0.17
0.4
V
IO = 18 mA
2.3
−
0.25
0.6
V
IO = 12 mA
2.7
−
0.16
0.4
V
IO = 18 mA
3.0
−
0.23
0.4
V
IO = 24 mA
3.0
−
0.30
0.55
V
IO = −100 µA
1.65 to 3.6
VCC − 0.2
−
−
V
HIGH-level input
voltage
LOW-level input
voltage
LOW-level output
voltage
HIGH-level output
voltage
2.3 to 2.7
2.7 to 3.6
VI = VIH or VIL
VI = VIH or VIL
IO = −6 mA
1.65
1.25
1.51
−
V
IO = −12 mA
2.3
1.8
2.10
−
V
IO = −18 mA
2.3
1.7
2.01
−
V
IO = −12 mA
2.7
2.2
2.53
−
V
IO = −18 mA
3.0
2.4
2.76
−
V
IO = −24 mA
3.0
2.2
2.68
−
V
VI = 3.6 V or GND
3.6
−
±0.1
±5
µA
ILI
input leakage
current
Ioff
power OFF leakage VI or VO = 3.6 V
current
0.0
−
±0.1
±10
µA
ICC
quiescent supply
current
3.6
−
0.2
20
µA
∆ICC
additional quiescent VI = VCC − 0.6 V; IO = 0
supply current per
input pin
3.0 to 3.6
−
5
750
µA
VI = VCC or GND; IO = 0
Note
1. All typical values are measured at Tamb = 25 °C.
2003 Jul 14
6
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
AC CHARACTERISTICS
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
WAVEFORMS
TYP.(1)
MAX.
UNIT
VCC (V)
Tamb = −40 to +85 °C
tPHL/tPLH
propagation delay
nA, nB to nY
see Figs 6 and 7
1.65 to 1.95
1.0
2.8
4.7
ns
2.3 to 2.7
1.0
2.0
3.1
ns
2.7
1.0
2.5
2.9
ns
3.0 to 3.6
1.0
2.2
2.8
ns
Note
1. All typical values are measured at Tamb = 25 °C.
AC WAVEFORMS
handbook, halfpage
VI
VM
nA, nB input
GND
tPHL
tPLH
VOH
VM
nY output
VOL
tTHL
tTLH
MNA218
INPUT
VCC
VM
VI
tr = tf
1.65 to 1.95 V 0.5 × VCC
VCC
≤ 2.0 ns
2.3 to 2.7 V
0.5 × VCC
VCC
≤ 2.0 ns
2.7 V
1.5 V
2.7 V
≤ 2.5 ns
3.0 to 3.6 V
1.5 V
2.7 V
≤ 2.5 ns
Fig.6 Inputs nA, nB to output nY propagation delay times.
2003 Jul 14
7
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
VEXT
handbook, full pagewidth
VCC
PULSE
GENERATOR
VI
RL
VO
D.U.T.
CL
RT
RL
MNA616
VCC
VI
CL
RL
VEXT
tPLH/tPHL
tPZH/tPHZ
tPZL/tPLZ
1.65 to 1.95 V
VCC
30 pF
1 kΩ
open
GND
2 × VCC
2.3 to 2.7 V
VCC
30 pF
500 Ω
open
GND
2 × VCC
2.7 V
2.7 V
50 pF
500 Ω
open
GND
6V
3.0 to 3.6 V
2.7 V
50 pF
500 Ω
open
GND
6V
Definitions for test circuit:
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.7 Load circuitry for switching times.
2003 Jul 14
8
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
PACKAGE OUTLINES
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039 0.028
0.041
0.228
0.016 0.024
0.01
0.01
0.028
0.004
0.012
θ
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
2003 Jul 14
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
9
o
8
0o
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
2003 Jul 14
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
10
o
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT762-1
14 terminals; body 2.5 x 3 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
6
y
y1 C
v M C A B
w M C
b
L
1
7
Eh
e
14
8
13
9
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
0.5
2
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT762-1
---
MO-241
---
2003 Jul 14
11
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Philips Semiconductors
Product specification
Quad 2-input NOR gate
74ALVC02
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Jul 14
12
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA75
© Koninklijke Philips Electronics N.V. 2003
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Printed in The Netherlands
613508/02/pp13
Date of release: 2003
Jul 14
Document order number:
9397 750 11272