INTEGRATED CIRCUITS DATA SHEET TDA1308; TDA1308A Class AB stereo headphone driver Product specification Supersedes data of 2002 Feb 27 2002 Jul 19 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308; TDA1308A is an integrated class AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. • No switch ON/OFF clicks • Excellent power supply ripple rejection • Low power consumption • Short-circuit resistant The difference between the TDA1308 and the TDA1308A is that the TDA1308A can be used at low supply voltages. • High performance – high signal-to-noise ratio – high slew rate – low distortion • Large output voltage swing. QUICK REFERENCE DATA VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. SYMBOL VDD PARAMETER supply voltage CONDITIONS MIN. TYP. MAX. UNIT TDA1308 single 3.0 5.0 7.0 V dual 1.5 2.5 3.5 V single 2.4 5.0 7.0 V dual 1.2 2.5 3.5 V supply voltage TDA1308A VSS negative supply voltage −1.5 −2.5 −3.5 V IDD supply current no load − 3 5 mA Ptot total power dissipation no load − 15 25 mW Po maximum output power THD < 0.1%; note 1 − 60 − mW (THD + N)/S total harmonic distortion plus noise-to-signal ratio note 1 − 0.03 0.06 % − −70 −65 dB RL = 5 kΩ; note 2 − −92 −89 dB RL = 5 kΩ; note 3 − −52 −40 dB RL = 5 kΩ − −101 − dB S/N signal-to-noise ratio 100 110 − dB αcs channel separation − 70 − dB − 105 − dB RL = 5 kΩ PSRR power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV − 90 − dB Tamb ambient temperature −40 − +85 °C Notes 1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB). 2. VDD = 2.4 V; VO(p-p) = 1.62 V (at −4.8 dBV); for TDA1308A only. 3. VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only. 2002 Jul 19 2 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TDA1308AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 BLOCK DIAGRAM handbook, halfpage OUTA INA(neg) INA(pos) VSS 1 TDA1308(A) 8 VDD 2 3 7 6 4 5 OUTB INB(neg) INB(pos) MKA779 Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION OUTA 1 output A CD) 2 inverting input A INA(pos) 3 non-inverting input A VSS 4 negative supply INB(pos) 5 non-inverting input B INB(neg) 6 inverting input B OUTB 7 output B VDD 8 positive supply 2002 Jul 19 handbook, halfpage OUTA 1 8 VDD INA(neg) 2 7 OUTB TDA1308(A) INA(pos) 3 6 INB(neg) VSS 4 5 INB(pos) MKA780 Fig.2 Pin configuration. 3 Philips Semiconductors Product specification Class AB stereo headphone driver handbook, full pagewidth TDA1308; TDA1308A VDD I1 INA/B(pos) M1 M2 A1 M3 INA/B(neg) OUTA/B Cm M5 M4 D1 D2 D3 D4 A2 VSS M6 MKA781 Fig.3 Equivalent schematic diagram. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS VDD supply voltage tSC(O) output short-circuit duration Tstg storage temperature Tamb operating ambient temperature Vesd electrostatic discharge MIN. 0 MAX. UNIT 8.0 V 20 − s −65 +150 °C −40 +85 °C note 1 −2000 +2000 V note 2 −200 +200 V Tamb = 25 °C; Ptot = 1 W Notes 1. Human body model: C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative. 2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 Ω; 3 pulses positive plus 3 pulses negative. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER VALUE UNIT DIP8 109 K/W SO8 210 K/W TSSOP8 220 K/W thermal resistance from junction to ambient in free air QUALITY SPECIFICATION In accordance with “UZW-BO/FQ-0601”. The numbers of the quality specification can be found in the “Quality Reference Handbook”. The handbook can be ordered using the code 9398 510 63011. 2002 Jul 19 4 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A CHARACTERISTICS VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDD VSS IDD Ptot supply voltage single dual supply voltage single dual negative supply voltage supply current total power dissipation TDA1308 3.0 5.0 7.0 V 1.5 2.5 3.5 V 2.4 1.2 −1.5 − − 5.0 2.5 −2.5 3 15 7.0 3.5 −3.5 5 25 V V V mA mW − − 0 − − − 0.75 1.5 0.1 − 10 10 − 70 60 0.25 − − − 90 − − 3.5 − − − 4.25 3.5 4.9 − mV pA V dB mA Ω V V V dB − 70 − dB − − 105 − − 200 dB pF − −70 −65 dB − − − − − 100 0.03 −52 0.25 −101 0.0009 110 0.06 −40 1.0 − − − % dB % dB % dB 5.5 60 3 5 − − − − MHz mW pF V/µs 20 − kHz TDA1308A no load no load DC characteristics VI(os) Ibias VCM Gv IO RO VO input offset voltage input bias current common mode voltage open-loop voltage gain maximum output current output resistance output voltage swing PSRR power supply rejection ratio αcs channel separation CL load capacitance RL = 5 kΩ (THD + N)/S < 0.1% note 1 RL = 16 Ω RL = 5 kΩ fi = 100 Hz; Vripple(p-p) = 100 mV RL = 5 kΩ AC characteristics (THD + N)/S total harmonic distortion plus note 2 noise-to-signal ratio note 3 RL = 5 kΩ; note 2 S/N fG signal-to-noise ratio Po Ci SR unity gain frequency maximum output power input capacitance slew rate open-loop; RL = 5 kΩ (THD + N)/S < 0.1% unity gain inverting − − − − B power bandwidth unity gain inverting − 2002 Jul 19 5 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A Notes 1. Values are proportional to VDD; (THD + N)/S < 0.1%. 2. VDD = 5.0 V; VO(p-p) = 3.5 V (at 0 dB). 3. VDD = 2.4 V; VO(p-p) = 1.13 V (at −7.96 dBV); for TDA1308A only. TEST AND APPLICATION INFORMATION handbook, full pagewidth VDD 100 µF 3.9 kΩ VOUTA RL 3.9 kΩ VINA 1 8 2 3 Vref (typ. 2.5 V) 5 3.9 kΩ VINB C6 100 µF TDA1308(A) 6 7 4 100 µF 3.9 kΩ VOUTB RL MKA782 Fig.4 Measurement circuit for inverting application. 2002 Jul 19 6 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A VDD handbook, full pagewidth C5 C2 10 µF C1 100 nF R1 22 kΩ 100 µF R5 10 kΩ 3.9 kΩ 5 1 2 8 1 BCK C7 1 nF R3 8 3 Vref R2 TDA1545A 2 WS 7 3 DATA C6 100 µF TDA1308(A) 33 kΩ 5 6 6 4 7 C3 1 µF 4 R4 C8 3.9 kΩ C4 100 µF 1 nF R6 10 kΩ MKA783 Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC). MKA784 MKA785 −70 handbook, halfpage handbook, halfpage Gv (dB) 80 Gv (dB) −90 RL = 32 Ω 40 RL = 16 Ω no load −110 32 Ω 0 5 kΩ 10−2 Fig.6 10−3 10−4 10−5 10−6 −130 10−1 10−7 10−8 fi (Hz) Open-loop gain as a function of input frequency. 2002 Jul 19 10−2 10−3 10−4 fi (Hz) 10−5 Fig.7 Crosstalk as a function of input frequency. 7 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A MKA786 100 handbook, halfpage Po (mW) RL = 16 Ω 60 32 Ω 40 8Ω 20 10 3 4 5 VDD (V) Fig.8 Output power as a function of supply voltage. MKA787 −50 handbook, halfpage (THD+N)/S (dB) −70 RL = 16 Ω; Po = 50 mW RL = 32 Ω; Po = 50 mW −90 RL = 5 kΩ; VO(p-p) = 3.5 V −110 10−1 10−2 10−3 10−4 fi (Hz) 10−5 Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency. 2002 Jul 19 8 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A MKA788 −40 handbook, halfpage (THD+N)/S (dB) RL = 8 Ω 16 Ω −60 32 Ω −80 5 kΩ f i = 1 kHz −100 10−2 10−1 1 VO(p-p) (V) 10 Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level. 2002 Jul 19 9 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC EIAJ SOT97-1 050G01 MO-001 SC-504-8 2002 Jul 19 10 EUROPEAN PROJECTION ISSUE DATE 95-02-04 99-12-27 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 2002 Jul 19 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 11 o 8 0o Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm D E SOT505-1 A X c y HE v M A Z 5 8 A2 pin 1 index (A3) A1 A θ Lp L 1 4 detail X e w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z(1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.45 0.25 0.28 0.15 3.10 2.90 3.10 2.90 0.65 5.10 4.70 0.94 0.70 0.40 0.1 0.1 0.1 0.70 0.35 6° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 99-04-09 SOT505-1 2002 Jul 19 EUROPEAN PROJECTION 12 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: Through-hole mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Surface mount packages Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 2002 Jul 19 13 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING − suitable BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable − HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable(3) suitable − PLCC(4), SO, SOJ suitable suitable − suitable − suitable − recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2002 Jul 19 14 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308; TDA1308A DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2002 Jul 19 15 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA74 © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753503/03/pp16 Date of release: 2002 Jul 19 Document order number: 9397 750 09985