PHILIPS BGY122A

DISCRETE SEMICONDUCTORS
DATA SHEET
M3D369
BGY122A; BGY122B
UHF amplifier modules
Product specification
Supersedes data of 1997 Dec 01
1998 May 11
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
FEATURES
PINNING - SOT388B
• Single 4.8 V nominal supply voltage
PIN
DESCRIPTION
• 1.2 W output power
1
RF input
• Easy control of output power by DC voltage
2
VC
• Very high efficiency (typ. 55%)
3
VS
4
RF output
• Silicon bipolar technology
• Standby current less than 100 µA.
Flange
ground
APPLICATIONS
• Hand-held transmitting equipment operating in the
824 to 849 MHz and 872 to 905 MHz frequency ranges.
handbook, halfpage
DESCRIPTION
The BGY122A and BGY122B are three-stage UHF
amplifier modules in a SOT388B package. Each module
consists of three NPN silicon planar transistor dies
mounted together with matching and bias circuit
components on a metallized ceramic substrate.
The modules produce an output power of 1.2 W into a load
of 50 Ω with an RF drive power of 2 mW.
1
Top view
2
3
4
MBK197
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C.
TYPE
MODE OF
OPERATION
f
(MHz)
VS
(V)
PL
(W)
Gp
(dB)
η
(%)
ZS; ZL
(Ω)
BGY122A
CW
824 to 849
4.8
1.2
≥27.8
typ. 55
50
BGY122B
CW
872 to 905
4.8
1.2
≥27.8
typ. 55
50
1998 May 11
2
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VS
DC supply voltage
−
10
V
VC
DC control voltage
−
3.5
V
PD
input drive power
−
5
mW
PL
load power
−
1.6
W
Tstg
storage temperature
−40
+100
°C
Tmb
operating mounting base temperature
−30
+100
°C
VC = 0; PD = 0
MDA147
2.0
PL
(W)
handbook, halfpage
VSWR = 1:1
1.6
VSWR = 3:1
1.2
0.8
0.4
0
0
40
80
120
T mb (oC)
VS = 6.5 V.
Fig.2 Load power derating curve.
1998 May 11
3
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
CHARACTERISTICS
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC ≤ 3 V; Tmb = 25 °C; unless otherwise specified.
SYMBOL
f
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
frequency
BGY122A
824
−
849
MHz
BGY122B
872
−
905
MHz
−
−
100
µA
IQ
total quiescent current
VC = 0; PD < −60 dBm
IC
control current
adjust VC for PL = 1.2 W
−
−
500
µA
PL
load power
VC = 3 V
1.2
−
−
W
Gp
power gain
adjust VC for PL = 1.2 W
27.8
−
−
dB
η
efficiency
adjust VC for PL = 1.2 W
50
55
−
%
H2
second harmonic
adjust VC for PL = 1.2 W
−
−
−36
dBc
H3
third harmonic
adjust VC for PL = 1.2 W
−
−
−36
dBc
VSWRin
input VSWR
adjust VC for PL = 1.2 W
−
−
3:1
stability
PD = 0 to +6 dBm; VS = 4 to 6.5 V;
VC = 0 to 3 V; PL ≤ 1.2 W;
VSWR ≤ 6 : 1 through all phases
−
−
−60
dBc
isolation
VC = 0
−
−40
−
dBm
noise power
adjust VC for PL = 1.2 W;
bandwidth = 30 kHz; fn = fo + 45 MHz
−
−
−90
dBm
ruggedness
VS = 6.5 V; adjust VC for PL = 1.4 W;
VSWR ≤ 10 : 1 through all phases
Pn
1998 May 11
4
no degradation
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
MDA148
MDA149
80
2.0
PL
(W)
handbook, halfpage
handbook, halfpage
η
(%)
1.6
60
824 MHz
849 MHz
849 MHz
1.2
824 MHz
40
0.8
20
0.4
0
0
0
1
2
3
VC (V)
0
4
0.4
0.8
1.2
1.6
2.0
PL (W)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
Fig.3
Fig.4
Load power as a function of control voltage;
BGY122A; typical values.
MDA150
Efficiency as a function of load power;
BGY122A; typical values.
MDA151
2.0
PL
(W)
2.0
PL
(W)
handbook, halfpage
handbook, halfpage
1.6
1.6
849 MHz
VS = 4.8 V
824 MHz
1.2
1.2
4V
0.8
0.8
0.4
0.4
0
820
830
840
850
f (MHz)
0
−40
860
0
40
80
120
Tmb (oC)
ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC = 3 V.
Fig.5
Fig.6
Load power as a function of frequency;
BGY122A; typical values.
1998 May 11
5
Load power as a function of mounting base
temperature; BGY122A; typical values.
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
MDA152
4
handbook, halfpage
VC
(V)
3.0
PL
(dBm)
VSWRin
3
MDA153
40
handbook, halfpage
2.5
20
2.0
0
VC
849 MHz
2
824 MHz
VSWRin
1
−20
1.5
0
820
830
840
−40
−40
1.0
860
850
−30
−20
−10
0
10
PD (dBm)
f (MHz)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; PL = 1.2 W; Tmb = 25 °C.
ZS = ZL = 50 Ω; VS = 4.8 V; VC = 3 V; Tmb = 25 °C.
Fig.7
Fig.8
Control voltage and input VSWR as functions
of frequency; BGY122A; typical values.
Load power as a function of drive power;
BGY122A; typical values.
MDA154
−30
MDA155
2.0
PL
(W)
handbook, halfpage
H2, H3
(dBc)
1.6
H3
−40
H2
1.2
872 MHz
905 MHz
0.8
−50
0.4
−60
820
830
840
850
f (MHz)
0
860
0
1
2
3
VC (V)
4
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; PL = 1.2 W; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
Fig.9
Fig.10 Load power as a function of control voltage;
BGY122B; typical values.
Harmonics as a function of frequency;
BGY122A; typical values.
1998 May 11
6
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
MDA157
MDA156
2.0
PL
(W)
80
handbook, halfpage
handbook, halfpage
η
(%)
1.6
60
VS = 4.8 V
872 MHz
905 MHz
1.2
4V
40
0.8
20
0.4
0
840
0
0
0.4
0.8
1.2
1.6
2.0
PL (W)
860
880
900
f (MHz)
920
ZS = ZL = 50 Ω; PD =2 mW; VS = 4.8 V; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C.
Fig.11 Efficiency as a function of load power;
BGY122B; typical values.
Fig.12 Load power as a function of frequency;
BGY122B; typical values.
MDA158
MDA160
40
2.0
PL
(W)
handbook, halfpage
handbook, halfpage
PL
(dBm)
1.6
872 MHz
20
905 MHz
1.2
905 MHz
0
872 MHz
0.8
−20
0.4
0
−40
0
40
80
−40
−40
120
Tmb (oC)
−30
−20
−10
0
10
PD (dBm)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC = 3 V.
ZS = ZL = 50 Ω; VS = 4.8 V; VC = 3 V; Tmb = 25 °C.
Fig.13 Load power as a function of mounting base
temperature; BGY122B; typical values.
Fig.14 Load power as a function of drive power;
BGY122B; typical values.
1998 May 11
7
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
MDA159
4
handbook, halfpage
VC
(V)
MDA161
−30
3.0
VSWRin
H2, H3
(dBc)
2.5
3
H3
−40
VC
2.0
2
H2
VSWRin
−50
1
0
840
1.5
860
880
−60
840
1.0
920
900
860
880
f (MHz)
900
f (MHz)
920
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; PL = 1.2 W; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; PL = 1.2 W; Tmb = 25 °C.
Fig.15 Control voltage and input VSWR as functions
of frequency; BGY122B; typical values.
Fig.16 Harmonics as a function of frequency;
BGY122B; typical values.
handbook, full pagewidth
pin
numbers
1
2
3
L2
L1
Z1
C1
C4
C3
C5
Z2
C2
RF input
C6
VC
MSA914
Fig.17 Test circuit.
1998 May 11
4
8
VS
RF output
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
handbook, full pagewidth
1
90
2 3 4
50 Ω
input
50 Ω
output
47
VC
VS
MBH435
Dimensions in mm.
Fig.18 Printed-circuit board test-fixture.
List of components (See Figs 17 and 18)
COMPONENT
DESCRIPTION
VALUE
CATALOGUE NO.
C1, C4
multilayer ceramic chip capacitor
100 nF
2222 852 47104
C2, C5
tantalum capacitor
2.2 µF; 35 V
−
C3, C6
multilayer ceramic chip capacitor
33 pF
2222 851 13339
L1, L2
Grade 4S2 Ferroxcube chip bead
−
4330 030 36300
Z1, Z2
stripline; note 1
50 Ω
−
Note
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr = 2.2); thickness
1⁄ inch.
32
1998 May 11
9
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
SOLDERING
The indicated temperatures are those at the solder
interfaces.
MGM159
300
handbook, halfpage
Advised solder types are types with a liquidus less than or
equal to 210 °C.
T
(°C)
Solder dots or solder prints must be large enough to wet
the contact areas.
200
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
100
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 °C and damage the module.
The maximum allowed temperature is 250 °C for a
maximum of 5 seconds.
0
0
1
2
3
4
t (min)
5
The maximum ramp-up is 10 °C per second.
The maximum cool-down is 5 °C per second.
Fig.19 Recommended reflow temperature profile.
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
• Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1998 May 11
10
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
17.7
handbook, full pagewidth
12.5
12
6
4
8.75
6.75
footprint metallization
1
solder area
1.8
2.9
occupied area
0.57
0.7
1.37
5.08
1.7
5.08
2.54
17.9
17.1
12.4
12.1
6.4
solder area
7.55
5.55
2.45
1.67
2.7
1.1
0.5
1.37
5.08
1.5
5.08
Dimensions in mm.
Fig.20 Footprint SOT388B.
1998 May 11
11
2.54
MGM150
12.5
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
PACKAGE OUTLINE
Rectangular single-ended surface-mount package; metal cap; 4 in-line leads
SOT388B
U
A
y
U1
E
1
2
3
Q
4
L
b
Z
e
c
w M
e1
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
e
e1
E
L
Q
U
U1
w
y
Z
mm
2.2
1.8
0.56
0.46
0.30
0.20
5.08
2.54
12.2
11.8
0.7
0.3
3.4
3.0
17.3
16.9
6.0
5.6
0.25
0.15
2.3
1.9
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
97-11-19
SOT388B
1998 May 11
EUROPEAN
PROJECTION
12
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 May 11
13
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
NOTES
1998 May 11
14
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
NOTES
1998 May 11
15
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© Philips Electronics N.V. 1998
SCA60
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Printed in The Netherlands
125108/00/04/pp16
Date of release: 1998 May 11
Document order number:
9397 750 03828