INTEGRATED CIRCUITS 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) Product specification Supersedes data of 1995 Sep 18 IC23 Data Handbook 1998 Feb 25 Philips Semiconductors Product specification 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) FEATURES DESCRIPTION • Power-up 3-State • Multiple VCC and GND pins minimize switching noise • Provides ideal interface and increases fan-out of MOS The 74ABT16541 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. Microprocessors 3-State buffers sink 64mA and source 32mA The 74ABT16541 has two octal buffers that are ideal for driving bus lines. The outputs are all capable of sinking 64mA and sourcing 32mA. the need for external pull-up resistors to hold unused inputs Two options are available, 74ABT16541 which does not have the bus-hold feature and 74ABTH16541 which incorporates the bus-hold feature. • • 74ABTH16541 incorporates bus-hold data inputs which eliminate • Latch-up protection exceeds 500mA per Jedec Std 17 • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V per Machine Model • Two 8-bit bus interfaces • Bus-hold data inputs eliminate the need for external pull-up resistors to hold unused inputs QUICK REFERENCE DATA SYMBOL CONDITIONS Tamb = 25°C; GND = 0V PARAMETER TYPICAL UNIT 2.0 1.5 ns tPLH tPHL Propagation delay nAx to nYx CL = 50pF; VCC = 5V CIN Input capacitance VI = 0V or VCC 4 pF Output capacitance VO = 0V or VCC; 3-State 6 pF 500 µA 8 mA COUT ICCZ Quiescent supply current ICCL Outputs disabled; VCC =5.5V Outputs LOW; VCC = 5.5V ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 48-Pin Plastic SSOP Type III –40°C to +85°C 74ABT16541 DL BT16541 DL SOT370-1 48-Pin Plastic TSSOP Type II –40°C to +85°C 74ABT16541 DGG BT16541 DGG SOT362-1 48-Pin Plastic SSOP Type III –40°C to +85°C 74ABTH16541 DL BH16541 DL SOT370-1 48-Pin Plastic TSSOP Type II –40°C to +85°C 74ABTH16541 DGG BH16541 DGG SOT362-1 PIN DESCRIPTION PIN NUMBER SYMBOL 47, 46, 44, 43, 41, 40, 38, 37, 36, 35, 33, 32, 30, 29, 27, 26 1A0 - 1A7 2A0 - 2A7 Data inputs 2, 3, 5, 6, 8, 9, 11, 12, 13, 14, 16, 17 19, 20, 22, 23 1Y0 - 1Y7, 2Y0 - 2Y7 Data outputs 1, 48 24, 25 1OE0, 1OE1, 2OE0, 2OE1 4, 10, 15, 21 28, 34, 39, 45 GND Ground (0V) 7, 18, 31, 42 VCC Positive supply voltage 1998 Feb 25 NAME AND FUNCTION Output enables 2 853-1807 19018 Philips Semiconductors Product specification 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) LOGIC SYMBOL 1OE0 1OE1 LOGIC SYMBOL (IEEE/IEC) 1 2OE0 48 2OE1 24 25 1OE0 1 1OE1 48 & EN1 2OE0 24 1A0 47 2 1Y0 2A0 36 13 2Y0 2OE1 25 1A1 46 3 1Y1 2A1 35 14 2Y1 1A0 47 2 1Y0 1A1 46 3 1Y1 1A2 44 5 1Y2 1A3 43 6 1Y3 1A4 41 8 1Y4 1A5 40 9 1Y5 1A6 38 11 1Y6 1A7 37 12 1Y7 2A0 36 13 2Y0 2A1 35 14 2Y1 2A2 33 16 2Y2 2A3 32 17 2Y3 2A4 30 19 2Y4 2A5 29 20 2Y5 2A6 27 22 2Y6 2A7 26 23 2Y7 1A2 44 1A3 43 1A4 41 1A5 40 1A6 38 1A7 37 5 6 8 9 1Y2 1Y3 1Y4 1Y5 11 1Y6 12 1Y7 2A2 33 2A3 32 2A4 30 2A5 29 2A6 27 2A7 26 16 17 19 20 22 23 2Y2 2Y3 2Y4 2Y5 2Y6 2Y7 SA00069 PIN CONFIGURATION 1OE0 1 48 1OE1 1Y0 2 47 1A0 1Y1 3 46 1A1 GND 4 45 GND 1Y2 5 44 1A2 1Y3 6 43 1A3 VCC 7 42 VCC 1Y4 8 41 1Y5 9 40 GND 10 39 GND 1Y6 11 38 1A6 1Y7 12 37 1A7 EN2 1∇ 1 2∇ 1 SA00070 FUNCTION TABLE INPUTS OUTPUTS nOE0 nOE1 nIx nYx 1A4 L L L L 1A5 L L H H X H X Z H X X Z 2Y0 13 36 2A0 2Y1 14 35 2A1 GND 15 34 GND 2Y2 16 33 2A2 2Y3 17 32 2A3 VCC 18 31 VCC 2Y4 19 30 2A4 2Y5 20 29 2A5 GND 21 28 GND 2Y6 22 27 2A6 2Y7 23 26 2A7 2OE0 24 25 2OE1 H L X Z SA00068 1998 Feb 25 & 3 = HIGH voltage level = LOW voltage level = D0n’t care = High impedance “off” state Philips Semiconductors Product specification 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) ABSOLUTE MAXIMUM RATINGS1, 2 PARAMETER SYMBOL VCC IIK CONDITIONS RATING UNIT –0.5 to +7.0 V -18 mA –1.2 to +7.0 V VO < 0 –50 mA output in Off or High state –0.5 to +5.5 V output in Low state 128 mA –65 to 150 °C DC supply voltage DC input diode current VI < 0 voltage3 VI DC input IOK DC output diode current voltage3 VOUT DC output IOUT DC output current Tstg Storage temperature range NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS LIMITS SYMBOL VCC PARAMETER UNIT DC supply voltage Min Max 4.5 5.5 V 0 VCC V VI Input voltage VIH High-level input voltage VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA 0 10 ns/V –40 +85 °C ∆t/∆v Input transition rise or fall rate Tamb Operating free-air temperature range 1998 Feb 25 2.0 4 V Philips Semiconductors Product specification 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER Tamb = –40°C to +85°C Tamb = +25°C TEST CONDITIONS Min Typ Max –0.9 –1.2 Min Max VIK Input clamp voltage VOH High-level output voltage VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA ±0.01 ±1 ±1 µA 0.01 1 1 µA –2 –3 –5 µA II VCC = 4.5V; IIK = –18mA UNIT In ut leakage current Input 74ABTH16541 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 VCC = 5.5V; VI = VCC or GND II –1.2 VCC = 5.5V; VI = VCC 2.4 Control pins Data pins ins VCC = 5.5V; VI = 0 2.0 V VCC = 4.5V; VI = 0.8V 50 50 VCC = 4.5V; VI = 2.0V –75 –75 VCC = 5.5V; VI = 0 to 5.5V ±500 IHOLD Bus Hold current A inputs3 74ABTH16541 IOFF Power-off leakage current VCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±100 ±100 µA Power-up/down 3-State output current VCC = 2.0V; VO = 0.5V; VI = GND or VCC; VOE = VCC ±5.0 ±50 ±50 µA IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 1.0 10 10 µA IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –1.0 –10 –10 µA ICEX Output high leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC 1.0 50 50 µA IPU/IPD IO Output current1 –70 –180 –180 mA ICCH VCC = 5.5V; Outputs High, VI = GND or VCC 0.5 1.0 1.0 mA ICCL VCC = 5.5V; Outputs Low, VI = GND or VCC 8 19 19 mA VCC = 5.5V; Outputs 3-State; VI = GND or VCC 0.5 1.0 1.0 mA Quiescent su supply ly current ICCZ VCC = 5.5V; VO = 2.5V –50 –50 µA ∆ICC Additional supply current per input pin2 74ABT16541 Outputs enabled, one input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 100 250 250 µA ∆ICC Additional supply current per input pin2 74ABTH16541 Outputs enabled, one input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.2 1.0 1.0 mA NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This is the bus hold overdrive current required to force the input to the opposite logic state. AC CHARACTERISTICS GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER Tamb = +25°C VCC = +5.0V WAVEFORM Tamb = –40°C to +85°C VCC = +5.0V ±0.5V Min Typ Max Min Max UNIT tPLH tPHL Propagation delay nIx to nYx 1 1.0 1.0 2.0 1.5 3.0 3.6 1.0 1.0 3.4 4.2 ns tPZH tPZL Output enable time to High and Low level 2 1.3 1.6 2.9 3.1 4.3 4.7 1.3 1.6 5.2 6.0 ns tPHZ tPLZ Output disable time from High and Low level 2 1.3 1.0 3.5 2.8 4.4 3.6 1.3 1.0 5.1 3.9 ns 1998 Feb 25 5 Philips Semiconductors Product specification 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V VIN nOEx INPUT VM VM nAx INPUT VM VM tPHL tPZL tPLH nYx OUTPUT tPLZ 3.5V VM VOL + 0.3V VOL nYx OUTPUT tPHZ tPZH VM VM VOH VOH – 0.3V nYx OUTPUT VM 0V SA00037 SA00071 Waveform 1. Input (An) to Output (Yn) Propagation Delays Waveform 2. 3-State Output Enable and Disable Times TEST CIRCUIT AND WAVEFORMS VCC 7.0V PULSE GENERATOR VIN tW 90% VOUT VM NEGATIVE PULSE CL 10% 0V RL tTHL (tF) tTLH (tR) tTLH (tR) tTHL (tF) 90% POSITIVE PULSE Test Circuit for 3-State Outputs AMP (V) 90% VM VM 10% 10% tW SWITCH POSITION TEST SWITCH tPLZ closed tPZL closed All other open AMP (V) VM 10% RL D.U.T. RT 90% 0V VM = 1.5V Input Pulse Definition INPUT PULSE REQUIREMENTS DEFINITIONS FAMILY RL = Load resistor; see AC CHARACTERISTICS for value. CL = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. RT = Termination resistance should be equal to ZOUT of pulse generators. 74ABT Amplitude Rep. Rate tW tR tF 3.0V 1MHz 500ns 2.5ns 2.5ns SA00012 1998 Feb 25 6 Philips Semiconductors Product specification 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm 1998 Feb 25 7 SOT370-1 Philips Semiconductors Product specification 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mm 1998 Feb 25 8 SOT362-1 Philips Semiconductors Product specification 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) NOTES 1998 Feb 25 9 Philips Semiconductors Product specification 74ABT16541 74ABTH16541 16-bit buffer/line driver (3-State) Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 print code Document order number: yyyy mmm dd 10 Date of release: 05-96 9397-750-03495