PHILIPS PCA9622BS

PCA9622
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
Rev. 03 — 31 August 2009
Product data sheet
1. General description
The PCA9622 is an I2C-bus controlled 16-bit LED driver optimized for voltage switch
dimming and blinking 100 mA Red/Green/Blue/Amber (RGBA) LEDs. Each LED output
has its own 8-bit resolution (256 steps) fixed frequency individual PWM controller that
operates at 97 kHz with a duty cycle that is adjustable from 0 % to 99.6 % to allow the
LED to be set to a specific brightness value. An additional 8-bit resolution (256 steps)
group PWM controller has both a fixed frequency of 190 Hz and an adjustable frequency
between 24 Hz to once every 10.73 seconds with a duty cycle that is adjustable from 0 %
to 99.6 % that is used to either dim or blink all LEDs with the same value.
Each LED output can be off, on (no PWM control), set at its individual PWM controller
value or at both individual and group PWM controller values. The PCA9622 operates with
a supply voltage range of 2.3 V to 5.5 V and the 100 mA open-drain outputs allow
voltages up to 40 V.
The PCA9622 is one of the first LED controller devices in a new Fast-mode Plus (Fm+)
family. Fm+ devices offer higher frequency (up to 1 MHz) and more densely populated bus
operation (up to 4000 pF).
The active LOW Output Enable input pin (OE) blinks all the LED outputs and can be used
to externally PWM the outputs, which is useful when multiple devices need to be dimmed
or blinked together without using software control.
Software programmable LED Group and three Sub Call I2C-bus addresses allow all or
defined groups of PCA9622 devices to respond to a common I2C-bus address, allowing
for example, all red LEDs to be turned on or off at the same time or marquee chasing
effect, thus minimizing I2C-bus commands. Seven hardware address pins allow up to
126 devices on the same bus.
The Software Reset (SWRST) Call allows the master to perform a reset of the PCA9622
through the I2C-bus, identical to the Power-On Reset (POR) that initializes the registers to
their default state causing the outputs to be set HIGH (LED off). This allows an easy and
quick way to reconfigure all device registers to the same condition.
The PCA9622, PCA9625 and PCA9635 software is identical and if the PCA9622 on-chip
100 mA NAND FETs do not provide enough current or voltage to drive the LEDs, then the
PCA9635 with larger current or higher voltage external drivers can be used.
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
2. Features
n 16 LED drivers. Each output programmable at:
u Off
u On
u Programmable LED brightness
u Programmable group dimming/blinking mixed with individual LED brightness
n 1 MHz Fast-mode Plus compatible I2C-bus interface with 30 mA high drive capability
on SDA output for driving high capacitive buses
n 256-step (8-bit) linear programmable brightness per LED output varying from fully off
(default) to maximum brightness using a 97 kHz PWM signal
n 256-step group brightness control allows general dimming (using a 190 Hz PWM
signal) from fully off to maximum brightness (default)
n 256-step group blinking with frequency programmable from 24 Hz to 10.73 s and duty
cycle from 0 % to 99.6 %
n Sixteen open-drain outputs can sink between 0 mA to 100 mA and are tolerant to a
maximum off state voltage of 40 V. No input function.
n Output state change programmable on the Acknowledge or the STOP Command to
update outputs byte-by-byte or all at the same time (default to ‘Change on STOP’).
n Active LOW Output Enable (OE) input pin allows for hardware blinking and dimming of
the LEDs
n 7 hardware address pins allow 126 PCA9622 devices to be connected to the same
I2C-bus and to be individually programmed
n 4 software programmable I2C-bus addresses (one LED Group Call address and three
LED Sub Call addresses) allow groups of devices to be addressed at the same time in
any combination (for example, one register used for ‘All Call’ so that all the PCA9622s
on the I2C-bus can be addressed at the same time and the second register used for
three different addresses so that 1⁄3 of all devices on the bus can be addressed at the
same time in a group). Software enable and disable for I2C-bus address.
n Software Reset feature (SWRST Call) allows the device to be reset through the
I2C-bus
n 25 MHz internal oscillator requires no external components
n Internal power-on reset
n Noise filter on SDA/SCL inputs
n No glitch on power-up
n Supports hot insertion
n Low standby current
n Operating power supply voltage (VDD) range of 2.3 V to 5.5 V
n 5.5 V tolerant inputs on non-LED pins
n −40 °C to +85 °C operation
n ESD protection exceeds 2000 V HBM per JESD22-A114, 100 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Packages offered: TSSOP32, HVQFN32
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
2 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
3. Applications
n
n
n
n
n
RGB or RGBA LED drivers
LED status information
LED displays
LCD backlights
Keypad backlights for cellular phones or handheld devices
4. Ordering information
Table 1.
Ordering information
Type number
Topside mark
Package
Name
Description
Version
PCA9622BS[1]
P9622
HVQFN32 plastic thermal enhanced very thin quad flat package;
no leads; 32 terminals; body 5 × 5 × 0.85 mm
SOT617-3
PCA9622DR
PCA9622DR
TSSOP32
SOT487-1
[1]
plastic thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm
HVQFN32 package under development.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
3 of 39
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx
xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x
PCA9622
SCL
INPUT FILTER
NXP Semiconductors
5. Block diagram
PCA9622_3
Product data sheet
A0 A1 A2 A3 A4 A5 A6
SDA
I2C-BUS
CONTROL
VDD
POWER-ON
RESET
Rev. 03 — 31 August 2009
VSS
LED
STATE
SELECT
REGISTER
PWM
REGISTER X
BRIGHTNESS
CONTROL
24.3 kHz
GRPFREQ
REGISTER
25 MHz
OSCILLATOR
MUX/
CONTROL
FET
DRIVER
GRPPWM
REGISTER
190 Hz
'0' – permanently OFF
'1' – permanently ON
OE
002aad528
Fig 1.
Block diagram of PCA9622
PCA9622
4 of 39
© NXP B.V. 2009. All rights reserved.
Remark: Only one LED output shown for clarity.
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
97 kHz
LEDn
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
6. Pinning information
6.1 Pinning
4
29 A6
A3
5
28 A5
A4
6
27 OE
A3
1
24 A5
26 LED15
A4
2
23 OE
25 LED14
LED0
3
22 LED15
24 VSS
LED1
4
23 LED13
VSS
5
LED3 11
22 LED12
LED2
6
20 VSS
19 LED13
LED4 12
21 LED11
LED3
7
18 LED12
20 LED10
LED4
8
17 LED11
32 A2
17 LED8
002aad531
Transparent top view
002aad530
Fig 2.
LED10 16
9
18 LED9
LED7 16
VSS 14
VSS 15
19 VSS
LED6 15
LED5
LED5 13
LED9 14
LED2 10
21 LED14
PCA9622BS
LED8 13
9
PCA9622DR
LED7 12
VSS
8
LED6 11
LED1
7
VSS 10
LED0
terminal 1
index area
25 A6
30 SCL
A2
26 SCL
3
27 SDA
31 SDA
A1
29 VSS
28 VDD
32 VDD
2
30 A0
1
A0
31 A1
VSS
Pin configuration for TSSOP32
Fig 3.
Pin configuration for HVQFN32
6.2 Pin description
Table 2.
Symbol
Pin description
Pin
Type
Description
29[1]
power supply
supply ground
2
30
I
address input 0
A1
3
31
I
address input 1
A2
4
32
I
address input 2
A3
5
1
I
address input 3
A4
6
2
I
address input 4
LED0
7
3
O
LED driver 0
LED1
8
4
O
LED driver 1
VSS
9
5[1]
power supply
supply ground
LED2
10
6
O
LED driver 2
LED3
11
7
O
LED driver 3
LED4
12
8
O
LED driver 4
LED5
13
9
O
LED driver 5
VSS
14
10[1]
power supply
supply ground
LED6
15
11
O
LED driver 6
LED7
16
12
O
LED driver 7
LED8
17
13
O
LED driver 8
TSSOP32
HVQFN32
VSS
1
A0
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
5 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
Table 2.
Symbol
Pin description …continued
Pin
Type
Description
14
O
LED driver 9
19
15[1]
power supply
supply ground
LED10
20
16
O
LED driver 10
LED11
21
17
O
LED driver 11
LED12
22
18
O
LED driver 12
LED13
23
19
O
LED driver 12
VSS
24
20[1]
power supply
supply ground
LED14
25
21
O
LED driver 14
LED15
26
22
O
LED driver 15
OE
27
23
I
active LOW output enable
A5
28
24
I
address input 5
A6
29
25
I
address input 6
SCL
30
26
I
serial clock line
SDA
31
27
I/O
serial data line
VDD
32
28
power supply
supply voltage
TSSOP32
HVQFN32
18
VSS
LED9
[1]
HVQFN32 package supply ground is connected to both VSS pins and exposed center pad. VSS pins must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
6 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
7. Functional description
Refer to Figure 1 “Block diagram of PCA9622”.
7.1 Device addresses
Following a START condition, the bus master must output the address of the slave it is
accessing.
There are a maximum of 128 possible programmable addresses using the 7 hardware
address pins. Two of these addresses, Software Reset and LED All Call, cannot be used
because their default power-up state is ON, leaving a maximum of 126 addresses. Using
other reserved addresses, as well as any other Sub Call address, will reduce the total
number of possible addresses even further.
7.1.1 Regular I2C-bus slave address
The I2C-bus slave address of the PCA9622 is shown in Figure 4. To conserve power, no
internal pull-up resistors are incorporated on the hardware selectable address pins and
they must be pulled HIGH or LOW.
Remark: Using reserved I2C-bus addresses will interfere with other devices, but only if the
devices are on the bus and/or the bus will be open to other I2C-bus systems at some later
date. In a closed system where the designer controls the address assignment these
addresses can be used since the PCA9622 treats them like any other address. The
LED All Call, Software Rest and PCA9564 or PCA9665 slave address (if on the bus) can
never be used for individual device addresses.
• PCA9622 LED All Call address (1110 000) and Software Reset (0000 0110) which
are active on start-up
• PCA9564 (0000 000) or PCA9665 (1110 000) slave address which is active on
start-up
•
•
•
•
‘reserved for future use’ I2C-bus addresses (0000 011, 1111 1XX)
slave devices that use the 10-bit addressing scheme (1111 0XX)
slave devices that are designed to respond to the General Call address (0000 000)
High-speed mode (Hs-mode) master code (0000 1XX)
slave address
A6
A5
A4
A3
A2
A1
hardware selectable
Fig 4.
A0 R/W
002aab319
Slave address
The last bit of the address byte defines the operation to be performed. When set to logic 1
a read is selected, while a logic 0 selects a write operation.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
7 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.1.2 LED All Call I2C-bus address
• Default power-up value (ALLCALLADR register): E0h or 1110 000
• Programmable through I2C-bus (volatile programming)
• At power-up, LED All Call I2C-bus address is enabled. PCA9622 sends an ACK when
E0h (R/W = 0) or E1h (R/W = 1) is sent by the master.
See Section 7.3.8 “ALLCALLADR, LED All Call I2C-bus address” for more detail.
Remark: The default LED All Call I2C-bus address (E0h or 1110 000) must not be used
as a regular I2C-bus slave address since this address is enabled at power-up. All the
PCA9622s on the I2C-bus will acknowledge the address if sent by the I2C-bus master.
7.1.3 LED Sub Call I2C-bus addresses
• 3 different I2C-bus addresses can be used
• Default power-up values:
– SUBADR1 register: E2h or 1110 001
– SUBADR2 register: E4h or 1110 010
– SUBADR3 register: E8h or 1110 100
• Programmable through I2C-bus (volatile programming)
• At power-up, Sub Call I2C-bus addresses are disabled. PCA9622 does not send an
ACK when E2h (R/W = 0) or E3h (R/W = 1), E4h (R/W = 0) or E5h (R/W = 1), or
E8h (R/W = 0) or E9h (R/W = 1) is sent by the master.
See Section 7.3.7 “SUBADR1 to SUBADR3, I2C-bus subaddress 1 to 3” for more detail.
Remark: The default LED Sub Call I2C-bus addresses may be used as regular I2C-bus
slave addresses as long as they are disabled.
7.1.4 Software Reset I2C-bus address
The address shown in Figure 5 is used when a reset of the PCA9622 needs to be
performed by the master. The Software Reset address (SWRST Call) must be used with
R/W = logic 0. If R/W = logic 1, the PCA9622 does not acknowledge the SWRST. See
Section 7.6 “Software reset” for more detail.
R/W
0
0
0
0
0
1
1
0
002aab416
Fig 5.
Software Reset address
Remark: The Software Reset I2C-bus address is a reserved address and cannot be used
as a regular I2C-bus slave address or as an LED All Call or LED Sub Call address.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
8 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.2 Control register
Following the successful acknowledgement of the slave address, LED All Call address or
LED Sub Call address, the bus master will send a byte to the PCA9622, which will be
stored in the Control register.
The lowest 5 bits are used as a pointer to determine which register will be accessed
(D[4:0]). The highest 3 bits are used as Auto-Increment flag and Auto-Increment options
(AI[2:0]).
register address
AI2 AI1 AI0
D4
D3
D2
D1
D0
002aac147
Auto-Increment options
Auto-Increment flag
reset state = 80h
Remark: The Control register does not apply to the Software Reset I2C-bus address.
Fig 6.
Control register
When the Auto-Increment flag is set (AI2 = logic 1), the five low order bits of the Control
register are automatically incremented after a read or write. This allows the user to
program the registers sequentially. Four different types of Auto-Increment are possible,
depending on AI1 and AI0 values.
Table 3.
Auto-Increment options
AI2
AI1
AI0
Function
0
0
0
no Auto-Increment
1
0
0
Auto-Increment for all registers. D[4:0] roll over to ‘0 0000’ after the last
register (1 1011) is accessed.
1
0
1
Auto-Increment for individual brightness registers only. D[4:0] roll over to
‘0 0010’ after the last register (1 0001) is accessed.
1
1
0
Auto-Increment for global control registers only. D[4:0] roll over to
‘1 0010’ after the last register (1 0011) is accessed.
1
1
1
Auto-Increment for individual and global control registers only. D[4:0] roll
over to ‘0 0010’ after the last register (1 0011) is accessed.
Remark: Other combinations not shown in Table 3 (AI[2:0] = 001, 010, and 011) are
reserved and must not be used for proper device operation.
AI[2:0] = 000 is used when the same register must be accessed several times during a
single I2C-bus communication, for example, changes the brightness of a single LED. Data
is overwritten each time the register is accessed during a write operation.
AI[2:0] = 100 is used when all the registers must be sequentially accessed, for example,
power-up programming.
AI[2:0] = 101 is used when the 16 LED drivers must be individually programmed with
different values during the same I2C-bus communication, for example, changing color
setting to another color setting.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
9 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
AI[2:0] = 110 is used when the LED drivers must be globally programmed with different
settings during the same I2C-bus communication, for example, global brightness or
blinking change.
AI[2:0] = 111 is used when individual and global changes must be performed during the
same I2C-bus communication, for example, changing a color and global brightness at the
same time.
Only the 5 least significant bits D[4:0] are affected by the AI[2:0] bits.
When the Control register is written, the register entry point determined by D[4:0] is the
first register that will be addressed (read or write operation), and can be anywhere
between 0 0000 and 1 1011 (as defined in Table 4). When AI[2] = 1, the Auto-Increment
flag is set and the rollover value at which the register increment stops and goes to the next
one is determined by AI[2:0]. See Table 3 for rollover values. For example, if the Control
register = 1111 0100 (F4h), then the register addressing sequence will be (in hex):
14 → … → 1B → 00 → … → 13 → 02 → … → 13 → 02 → … → 13 → 02 → … as long
as the master keeps sending or reading data.
7.3 Register definitions
Table 4.
Register summary[1][2]
Register number (hex) D4
D3
D2
D1
D0
Name
Type
Function
00
0
0
0
0
0
MODE1
read/write
Mode register 1
01
0
0
0
0
1
MODE2
read/write
Mode register 2
02
0
0
0
1
0
PWM0
read/write
brightness control LED0
03
0
0
0
1
1
PWM1
read/write
brightness control LED1
04
0
0
1
0
0
PWM2
read/write
brightness control LED2
05
0
0
1
0
1
PWM3
read/write
brightness control LED3
06
0
0
1
1
0
PWM4
read/write
brightness control LED4
07
0
0
1
1
1
PWM5
read/write
brightness control LED5
08
0
1
0
0
0
PWM6
read/write
brightness control LED6
09
0
1
0
0
1
PWM7
read/write
brightness control LED7
0A
0
1
0
1
0
PWM8
read/write
brightness control LED8
0B
0
1
0
1
1
PWM9
read/write
brightness control LED9
0C
0
1
1
0
0
PWM10
read/write
brightness control LED10
0D
0
1
1
0
1
PWM11
read/write
brightness control LED11
0E
0
1
1
1
0
PWM12
read/write
brightness control LED12
0F
0
1
1
1
1
PWM13
read/write
brightness control LED13
10
1
0
0
0
0
PWM14
read/write
brightness control LED14
11
1
0
0
0
1
PWM15
read/write
brightness control LED15
12
1
0
0
1
0
GRPPWM
read/write
group duty cycle control
13
1
0
0
1
1
GRPFREQ
read/write
group frequency
14
1
0
1
0
0
LEDOUT0
read/write
LED output state 0
15
1
0
1
0
1
LEDOUT1
read/write
LED output state 1
16
1
0
1
1
0
LEDOUT2
read/write
LED output state 2
17
1
0
1
1
1
LEDOUT3
read/write
LED output state 3
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
10 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
Table 4.
Register summary[1][2] …continued
Register number (hex) D4
D3
D2
D1
D0
Name
Type
Function
18
1
1
0
0
0
SUBADR1
read/write
I2C-bus subaddress 1
19
1
1
0
0
1
SUBADR2
read/write
I2C-bus subaddress 2
1A
1
1
0
1
0
SUBADR3
read/write
I2C-bus subaddress 3
1B
1
1
0
1
1
ALLCALLADR
read/write
LED All Call I2C-bus address
[1]
Only D[4:0] = 0 0000 to 1 1011 are allowed and will be acknowledged. D[4:0] = 1 1100 to 1 1111 are reserved and will not be
acknowledged.
[2]
When writing to the Control register, bit 4 must be programmed with logic 0 for proper device operation.
7.3.1 Mode register 1, MODE1
Table 5.
MODE1 - Mode register 1 (address 00h) bit description
Legend: * default value.
Bit
Symbol
Access
Value
Description
7
AI2
read only
0
Register Auto-Increment disabled.
1*
Register Auto-Increment enabled.
6
AI1
read only
0*
Auto-Increment bit 1 = 0.
1
Auto-Increment bit 1 = 1.
Auto-Increment bit 0 = 0.
5
AI0
read only
0*
1
Auto-Increment bit 0 = 1.
4
SLEEP
R/W
0
Normal mode[1].
1*
Low power mode. Oscillator off[2].
0*
PCA9622 does not respond to I2C-bus subaddress 1.
1
PCA9622 responds to I2C-bus subaddress 1.
0*
PCA9622 does not respond to I2C-bus subaddress 2.
1
PCA9622 responds to I2C-bus subaddress 2.
0*
PCA9622 does not respond to I2C-bus subaddress 3.
1
PCA9622 responds to I2C-bus subaddress 3.
0
PCA9622 does not respond to LED All Call I2C-bus address.
1*
PCA9622 responds to LED All Call I2C-bus address.
3
SUB1
2
SUB2
1
SUB3
0
ALLCALL
R/W
R/W
R/W
R/W
[1]
It takes 500 µs max. for the oscillator to be up and running once SLEEP bit has been set to logic 1. Timings on LEDn outputs are not
guaranteed if PWMx, GRPPWM or GRPFREQ registers are accessed within the 500 µs window.
[2]
No blinking or dimming is possible when the oscillator is off.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
11 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.3.2 Mode register 2, MODE2
Table 6.
MODE2 - Mode register 2 (address 01h) bit description
Legend: * default value.
Bit
Symbol
Access
Value
Description
7
-
read only
0*
reserved
6
-
read only
0*
reserved
5
DMBLNK
R/W
0*
group control = dimming
1
group control = blinking
4
INVRT
R/W
0*
reserved; write must always be a logic 0
3
OCH
R/W
0*
outputs change on STOP command[1]
1
outputs change on ACK
2
-
R/W
1*
reserved; write must always be a logic 1
1
-
R/W
0*
reserved; write must always be a logic 0
0
-
R/W
1*
reserved; write must always be a logic 1
[1]
Change of the outputs at the STOP command allows synchronizing outputs of more than one PCA9622. Applicable to registers from
02h (PWM0) to 17h (LEDOUT) only.
7.3.3 PWM0 to PWM15, individual brightness control
Table 7.
PWM0 to PWM15 - PWM registers 0 to 15 (address 02h to 11h) bit description
Legend: * default value.
Address
Register
Bit
Symbol
Access Value
Description
02h
PWM0
7:0
IDC0[7:0]
R/W
0000 0000* PWM0 Individual Duty Cycle
03h
PWM1
7:0
IDC1[7:0]
R/W
0000 0000* PWM1 Individual Duty Cycle
04h
PWM2
7:0
IDC2[7:0]
R/W
0000 0000* PWM2 Individual Duty Cycle
05h
PWM3
7:0
IDC3[7:0]
R/W
0000 0000* PWM3 Individual Duty Cycle
06h
PWM4
7:0
IDC4[7:0]
R/W
0000 0000* PWM4 Individual Duty Cycle
07h
PWM5
7:0
IDC5[7:0]
R/W
0000 0000* PWM5 Individual Duty Cycle
08h
PWM6
7:0
IDC6[7:0]
R/W
0000 0000* PWM6 Individual Duty Cycle
09h
PWM7
7:0
IDC7[7:0]
R/W
0000 0000* PWM7 Individual Duty Cycle
0Ah
PWM8
7:0
IDC8[7:0]
R/W
0000 0000* PWM8 Individual Duty Cycle
0Bh
PWM9
7:0
IDC9[7:0]
R/W
0000 0000* PWM9 Individual Duty Cycle
0Ch
PWM10
7:0
IDC10[7:0]
R/W
0000 0000* PWM10 Individual Duty Cycle
0Dh
PWM11
7:0
IDC11[7:0]
R/W
0000 0000* PWM11 Individual Duty Cycle
0Eh
PWM12
7:0
IDC12[7:0]
R/W
0000 0000* PWM12 Individual Duty Cycle
0Fh
PWM13
7:0
IDC13[7:0]
R/W
0000 0000* PWM13 Individual Duty Cycle
10h
PWM14
7:0
IDC14[7:0]
R/W
0000 0000* PWM14 Individual Duty Cycle
11h
PWM15
7:0
IDC15[7:0]
R/W
0000 0000* PWM15 Individual Duty Cycle
A 97 kHz fixed frequency signal is used for each output. Duty cycle is controlled through
256 linear steps from 00h (0 % duty cycle = LED output off) to FFh
(99.6 % duty cycle = LED output at maximum brightness). Applicable to LED outputs
programmed with LDRx = 10 or 11 (LEDOUT0 to LEDOUT3 registers).
IDCx [ 7:0 ]
duty cycle = --------------------------256
PCA9622_3
Product data sheet
(1)
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
12 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.3.4 GRPPWM, group duty cycle control
Table 8.
GRPPWM - Group brightness control register (address 12h) bit description
Legend: * default value
Address
Register
Bit
Symbol
Access
Value
Description
12h
GRPPWM
7:0
GDC[7:0]
R/W
1111 1111
GRPPWM register
When DMBLNK bit (MODE2 register) is programmed with logic 0, a 190 Hz fixed
frequency signal is superimposed with the 97 kHz individual brightness control signal.
GRPPWM is then used as a global brightness control allowing the LED outputs to be
dimmed with the same value. The value in GRPFREQ is then a ‘Don’t care’.
General brightness for the 16 outputs is controlled through 256 linear steps from 00h
(0 % duty cycle = LED output off) to FFh (99.6 % duty cycle = maximum brightness).
Applicable to LED outputs programmed with LDRx = 11 (LEDOUT0 to LEDOUT3
registers).
When DMBLNK bit is programmed with logic 1, GRPPWM and GRPFREQ registers
define a global blinking pattern, where GRPFREQ contains the blinking period (from
24 Hz to 10.73 s) and GRPPWM the duty cycle (ON/OFF ratio in %).
GDC [ 7:0 ]
duty cycle = --------------------------256
(2)
7.3.5 GRPFREQ, group frequency
Table 9.
GRPFREQ - Group Frequency register (address 13h) bit description
Legend: * default value.
Address
Register
Bit
Symbol
Access
Value
Description
13h
GRPFREQ
7:0
GFRQ[7:0]
R/W
0000 0000*
GRPFREQ register
GRPFREQ is used to program the global blinking period when DMBLNK bit (MODE2
register) is equal to 1. Value in this register is a ‘Don’t care’ when DMBLNK = 0.
Applicable to LED outputs programmed with LDRx = 11 (LEDOUT0 to LEDOUT3
registers).
Blinking period is controlled through 256 linear steps from 00h (41 ms, frequency 24 Hz)
to FFh (10.73 s).
GFRQ [ 7:0 ] + 1
global blinking period = ---------------------------------------- ( s )
24
PCA9622_3
Product data sheet
(3)
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
13 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.3.6 LEDOUT0 to LEDOUT3, LED driver output state
Table 10.
LEDOUT0 to LEDOUT3 - LED driver output state register (address 14h to 17h)
bit description
Legend: * default value.
Address
Register
Bit
Symbol
Access
Value
Description
14h
LEDOUT0
7:6
LDR3
R/W
00*
LED3 output state control
5:4
LDR2
R/W
00*
LED2 output state control
3:2
LDR1
R/W
00*
LED1 output state control
15h
16h
17h
LEDOUT1
LEDOUT2
LEDOUT3
1:0
LDR0
R/W
00*
LED0 output state control
7:6
LDR7
R/W
00*
LED7 output state control
5:4
LDR6
R/W
00*
LED6 output state control
3:2
LDR5
R/W
00*
LED5 output state control
1:0
LDR4
R/W
00*
LED4 output state control
7:6
LDR11
R/W
00*
LED11 output state control
5:4
LDR10
R/W
00*
LED10 output state control
3:2
LDR9
R/W
00*
LED9 output state control
1:0
LDR8
R/W
00*
LED8 output state control
7:6
LDR15
R/W
00*
LED15 output state control
5:4
LDR14
R/W
00*
LED14 output state control
3:2
LDR13
R/W
00*
LED13 output state control
1:0
LDR12
R/W
00*
LED12 output state control
LDRx = 00 — LED driver x is off (default power-up state).
LDRx = 01 — LED driver x is fully on (individual brightness and group dimming/blinking
not controlled).
LDRx = 10 — LED driver x individual brightness can be controlled through its PWMx
register.
LDRx = 11 — LED driver x individual brightness and group dimming/blinking can be
controlled through its PWMx register and the GRPPWM registers.
7.3.7 SUBADR1 to SUBADR3, I2C-bus subaddress 1 to 3
SUBADR1 to SUBADR3 - I2C-bus subaddress registers 0 to 3 (address 18h to
1Ah) bit description
Legend: * default value.
Table 11.
Address
Register
Bit
Symbol
Access Value
Description
18h
SUBADR1
7:1
A1[7:1]
R/W
1110 001*
I2C-bus subaddress 1
0
A1[0]
R only
0*
reserved
7:1
A2[7:1]
R/W
1110 010*
I2C-bus subaddress 2
0
A2[0]
R only
0*
reserved
7:1
A3[7:1]
R/W
1110 100*
I2C-bus subaddress 3
0
A3[0]
R only
0*
reserved
19h
1Ah
SUBADR2
SUBADR3
Subaddresses are programmable through the I2C-bus. Default power-up values are E2h,
E4h, E8h, and the device(s) will not acknowledge these addresses right after power-up
(the corresponding SUBx bit in MODE1 register is equal to 0).
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
14 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
Once subaddresses have been programmed to their right values, SUBx bits need to be
set to logic 1 in order to have the device acknowledging these addresses (MODE1
register).
Only the 7 MSBs representing the I2C-bus subaddress are valid. The LSB in SUBADRx
register is a read-only bit (0).
When SUBx is set to logic 1, the corresponding I2C-bus subaddress can be used during
either an I2C-bus read or write sequence.
7.3.8 ALLCALLADR, LED All Call I2C-bus address
ALLCALLADR - LED All Call I2C-bus address register (address 1Bh) bit
description
Legend: * default value.
Table 12.
Address
Register
Bit
Symbol
Access Value
Description
1Bh
ALLCALLADR
7:1
AC[7:1]
R/W
1110 000*
ALLCALL I2C-bus
address register
0
AC[0]
R only
0*
reserved
The LED All Call I2C-bus address allows all the PCA9622s on the bus to be programmed
at the same time (ALLCALL bit in register MODE1 must be equal to 1 (power-up default
state)). This address is programmable through the I2C-bus and can be used during either
an I2C-bus read or write sequence. The register address can also be programmed as a
Sub Call.
Only the 7 MSBs representing the All Call I2C-bus address are valid. The LSB in
ALLCALLADR register is a read-only bit (0).
If ALLCALL bit = 0, the device does not acknowledge the address programmed in register
ALLCALLADR.
7.4 Active LOW output enable input
The active LOW output enable (OE) pin, allows to enable or disable all the LED outputs at
the same time.
• When a LOW level is applied to OE pin, all the LED outputs are enabled.
• When a HIGH level is applied to OE pin, all the LED outputs are high-impedance.
The OE pin can be used as a synchronization signal to switch on/off several PCA9622
devices at the same time. This requires an external clock reference that provides blinking
period and the duty cycle.
The OE pin can also be used as an external dimming control signal. The frequency of the
external clock must be high enough not to be seen by the human eye, and the duty cycle
value determines the brightness of the LEDs.
Remark: Do not use OE as an external blinking control signal when internal global
blinking is selected (DMBLNK = 1, MODE2 register) since it will result in an undefined
blinking pattern. Do not use OE as an external dimming control signal when internal global
dimming is selected (DMBLNK = 0, MODE2 register) since it will result in an undefined
dimming pattern.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
15 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
Remark: During power-down, slow decay of voltage supplies may keep LEDs illuminated.
Consider disabling LED outputs using HIGH level applied to OE pin.
7.5 Power-on reset
When power is applied to VDD, an internal power-on reset holds the PCA9622 in a reset
condition until VDD has reached VPOR. At this point, the reset condition is released and the
PCA9622 registers and I2C-bus state machine are initialized to their default states (all
zeroes) causing all the channels to be deselected. Thereafter, VDD must be lowered below
0.2 V to reset the device.
7.6 Software reset
The Software Reset Call (SWRST Call) allows all the devices in the I2C-bus to be reset to
the power-up state value through a specific formatted I2C-bus command. To be performed
correctly, it implies that the I2C-bus is functional and that there is no device hanging the
bus.
The SWRST Call function is defined as the following:
1. A START command is sent by the I2C-bus master.
2. The reserved SWRST I2C-bus address ‘0000 011’ with the R/W bit set to ‘0’ (write) is
sent by the I2C-bus master.
3. The PCA9622 device(s) acknowledge(s) after seeing the SWRST Call address
‘0000 0110’ (06h) only. If the R/W bit is set to ‘1’ (read), no acknowledge is returned to
the I2C-bus master.
4. Once the SWRST Call address has been sent and acknowledged, the master sends
2 bytes with 2 specific values (SWRST data byte 1 and byte 2):
a. Byte 1 = A5h: the PCA9622 acknowledges this value only. If byte 1 is not equal to
A5h, the PCA9622 does not acknowledge it.
b. Byte 2 = 5Ah: the PCA9622 acknowledges this value only. If byte 2 is not equal to
5Ah, then the PCA9622 does not acknowledge it.
If more than 2 bytes of data are sent, the PCA9622 does not acknowledge any more.
5. Once the right 2 bytes (SWRST data byte 1 and byte 2 only) have been sent and
correctly acknowledged, the master sends a STOP command to end the SWRST Call:
the PCA9622 then resets to the default value (power-up value) and is ready to be
addressed again within the specified bus free time (tBUF).
The I2C-bus master must interpret a non-acknowledge from the PCA9622 (at any time) as
a ‘SWRST Call Abort’. The PCA9622 does not initiate a reset of its registers. This
happens only when the format of the SWRST Call sequence is not correct.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
16 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
7.7 Individual brightness control with group dimming/blinking
A 97 kHz fixed frequency signal with programmable duty cycle (8 bits, 256 steps) is used
to control individually the brightness for each LED.
On top of this signal, one of the following signals can be superimposed (this signal can be
applied to the 4 LED outputs):
• A lower 190 Hz fixed frequency signal with programmable duty cycle (8 bits,
256 steps) is used to provide a global brightness control.
• A programmable frequency signal from 24 Hz to 1⁄10.73 Hz (8 bits, 256 steps) with
programmable duty cycle (8 bits, 256 steps) is used to provide a global blinking
control.
1
2
3
4
5
6
7
8
9 10 11 12
507
508
509
510
511
512
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
9 10 11
Brightness Control signal (LEDn)
N × 40 ns
with N = (0 to 255)
(PWMx Register)
M × 256 × 2 × 40 ns
with M = (0 to 255)
(GRPPWM Register)
256 × 40 ns = 10.24 µs
(97.6 kHz)
Group Dimming signal
256 × 2 × 256 × 40 ns = 5.24 ms (190.7 Hz)
1
2
3
4
5
6
7
8
resulting Brightness + Group Dimming signal
002aab417
Minimum pulse width for LEDn Brightness Control is 40 ns.
Minimum pulse width for Group Dimming is 20.48 µs.
When M = 1 (GRPPWM register value), the resulting LEDn Brightness Control + Group Dimming signal will have 2 pulses of
the LED Brightness Control signal (pulse width = N × 40 ns, with ‘N’ defined in PWMx register).
This resulting Brightness + Group Dimming signal above shows a resulting Control signal with M = 4 (8 pulses).
Fig 7.
Brightness + Group Dimming signals
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
17 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
8. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
8.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 8).
SDA
SCL
data line
stable;
data valid
Fig 8.
change
of data
allowed
mba607
Bit transfer
8.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 9).
SDA
SCL
S
P
START condition
STOP condition
mba608
Fig 9.
Definition of START and STOP conditions
8.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 10).
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
18 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
I2C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 10. System configuration
8.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold
time must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
S
START
condition
2
8
9
clock pulse for
acknowledgement
002aaa987
Fig 11. Acknowledgement on the I2C-bus
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
19 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
9. Bus transactions
slave address
data for register D[4:0](1)
control register
S A6 A5 A4 A3 A2 A1 A0 0
START condition
A
X
X
X D4 D3 D2 D1 D0 A
Auto-Increment options
Auto-Increment flag
R/W
A
acknowledge
from slave
P
acknowledge
from slave
acknowledge
from slave
STOP
condition
002aac148
(1) See Table 4 for register definition.
Fig 12. Write to a specific register
slave address
control register
S A6 A5 A4 A3 A2 A1 A0 0
START condition
A
1
0
0
0
0
0
acknowledge
from slave
0
0
MODE1
register
selection
Auto-Increment
on all registers
R/W
MODE1 register
MODE2 register
A
acknowledge
from slave
A
A
acknowledge
from slave
acknowledge
from slave
(cont.)
Auto-Increment on
SUBADR3 register
ALLCALLADR register
(cont.)
A
A
acknowledge
from slave
acknowledge
from slave
P
STOP
condition
002aac149
Fig 13. Write to all registers using the Auto-Increment feature
slave address
control register
S A6 A5 A4 A3 A2 A1 A0 0
START condition
A
R/W
acknowledge
from slave
1
0
1
0
0
0
PWM0 register
1
0
PWM0
register
selection
increment
on Individual
brightness
registers only
PWM1 register
A
acknowledge
from slave
A
A
acknowledge
from slave
acknowledge
from slave
(cont.)
Auto-Increment on
PWM14 register
(cont.)
PWM15 register
PWM0 register
PWMx register
A
A
A
A
acknowledge
from slave
acknowledge
from slave
acknowledge
from slave
acknowledge
from slave
P
STOP
condition
002aac150
Fig 14. Multiple writes to Individual Brightness registers only using the Auto-Increment feature
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
20 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
slave address
ReSTART
condition
control register
S A6 A5 A4 A3 A2 A1 A0 0
START condition
A
1
0
0
0
Auto-Increment
on all registers
R/W
acknowledge
from slave
data from MODE2 register
(cont.)
0
0
0
0
MODE1
register
selection
slave address
data from MODE1 register
A Sr A6 A5 A4 A3 A2 A1 A0 1
acknowledge
from slave
acknowledge
from master
R/W
acknowledge
from slave
Auto-Increment on
data from
ALLCALLADR register
data from PWM0
A (cont.)
A
data from
MODE1 register
A
A
A
acknowledge
from master
acknowledge
from master
acknowledge
from master
A (cont.)
acknowledge
from master
data from last read byte
(cont.)
A
not acknowledge
from master
P
STOP
condition
002aac151
Fig 15. Read all registers using the Auto-Increment feature
slave address(1)
new LED All Call I2C address(2)
control register
sequence (A) S A6 A5 A4 A3 A2 A1 A0 0
START condition
A
X
X
X
1
1
0
1
1
ALLCALLADR
register selection
R/W
acknowledge
from slave
A
1
0
1
0
1
acknowledge
from slave
0
1
X
A
P
acknowledge
from slave
Auto-Increment on
STOP
condition
the 16 LEDs are on at the acknowledge(3)
LED All Call I2C address
sequence (B) S
1
0
1
0
START condition
1
0
1
control register
0
A
X
X
X
R/W
acknowledge
from the
4 devices
0
1
0
LEDOUT register (LED fully ON)
0
0
A
0
1
0
1
LEDOUT
register selection acknowledge
from the
4 devices
0
1
0
1
A
P
acknowledge
from the
4 devices
STOP
condition
002aac152
(1) In this example, several PCA9622s are used and the same sequence (A) (above) is sent to each of them.
(2) ALLCALL bit in MODE1 register is equal to 1 for this example.
(3) OCH bit in MODE2 register is equal to 1 for this example.
Fig 16. LED All Call I2C-bus address programming and LED All Call sequence example
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
21 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
10. Application design-in information
up to 40 V
up to 40 V
VDD = 2.5 V, 3.3 V or 5.0 V
I2C-BUS/SMBus
MASTER
SDA
10 kΩ
10 kΩ
10 kΩ(1)
VDD
SDA
LED0
SCL
SCL
LED1
OE
OE
LED2
LED3
PCA9622
LED4
LED5
LED6
LED7
LED light bar
up to 40 V
LED light bar
up to 40 V
LED8
LED9
LED10
A0
LED11
A1
A2
A3
LED12
A4
LED13
A5
LED14
A6
LED15
VSS
VSS
002aad532
(1) OE requires pull-up resistor if control signal from the master is open-drain.
I2C-bus address = 0010 101x.
Remark: During power-down, slow decay of voltage supplies may keep LEDs illuminated. Consider disabling LED outputs
using HIGH level applied to OE pin.
Fig 17. Typical application
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
22 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
10.1 Junction temperature calculation
A device junction temperature can be calculated when the ambient temperature or the
case temperature is known.
When the ambient temperature is known, the junction temperature is calculated using
Equation 4 and the ambient temperature, junction to ambient thermal resistance and
power dissipation.
T j = T amb + R th ( j-a ) × P tot
(4)
where:
Tj = junction temperature
Tamb = ambient temperature
Rth(j-a) = junction to ambient thermal resistance
Ptot = (device) total power dissipation
When the case temperature is known, the junction temperature is calculated using
Equation 5 and the case temperature, junction to case thermal resistance and power
dissipation.
T j = T case + R th ( j-c ) × P tot
(5)
where:
Tj = junction temperature
Tcase = case temperature
Rth(j-c) = junction to case thermal resistance
Ptot = (device) total power dissipation
Here are two examples regarding how to calculate the junction temperature using junction
to case and junction to ambient thermal resistance. In the first example (Section 10.1.1),
given the operating condition and the junction to ambient thermal resistance, the junction
temperature of PCA9622DR, in the TSSOP32 package, is calculated for a system
operating condition in 50 °C1 ambient temperature. In the second example
(Section 10.1.2), based on a specific customer application requirement where only the
case temperature is known, applying the junction to case thermal resistance equation, the
junction temperature of the PCA9626B, in the LQFP48 package, is calculated.
1.
50 °C is a typical temperature inside an enclosed system. The designers should feel free, as needed, to perform their own
calculation using the examples.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
23 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
10.1.1 Example 1: Tj calculation of PCA9622DR, in TSSOP32 package, when Tamb
is known
Rth(j-a) = 83 °C/W
Tamb = 50 °C
LED output low voltage (LED VOL) = 0.5 V
LED output current per channel = 80 mA
Number of outputs = 16
IDD(max) = 12 mA
VDD(max) = 5.5 V
I2C-bus clock (SCL) maximum sink current = 25 mA
I2C-bus data (SDA) maximum sink current = 25 mA
1. Find Ptot (device total power dissipation):
– output total power = 80 mA × 16 × 0.5 V = 640 mW
– chip core power consumption = 12 mA × 5.5 V = 66 mW
– SCL power dissipation = 25 mA × 0.4 V = 10 mW
– SDA power dissipation = 25 mA × 0.4 V = 10 mW
Ptot = (320 + 55 + 10 + 10) mW = 708 mW
2. Find Tj (junction temperature):
Tj = (Tamb + Rth(j-a) × Ptot) = (50 °C + 83 °C/W × 708 mW) = 108.8 °C
10.1.2 Example 2: Tj calculation where only Tcase is known
This example uses a customer’s specific application of the PCA9626B, 24-channel LED
controller in the LQFP48 package, where only the case temperature (Tcase) is known.
Tj = Tcase + Rth(j-c) × Ptot, where:
Rth(j-c) = 18 °C/W
Tcase (measured) = 94.6 °C
VOL of LED ~ 0.5 V
IDD(max) = 18 mA
VDD(max) = 5.5 V
LED output voltage LOW = 0.5 V
LED output current:
60 mA on 1 port = (60 mA × 1)
50 mA on 6 ports = (50 mA × 6)
40 mA on 2 ports = (40 mA × 2)
20 mA on 12 ports = (20 mA × 12)
1 mA on 3 ports = (1 mA × 3)
I2C-bus
maximum sink current on clock line = 25 mA
I2C-bus
maximum sink current on data line = 25 mA
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
24 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
1. Find Ptot (device total power dissipation)
– output current (60 mA × 1 port); output power (60 mA × 1 × 0.5 V) = 30 mW
– output current (50 mA × 6 ports); output power (50 mA × 6 × 0.5 V) = 150 mW
– output current (40 mA × 2 ports); output power (40 mA × 2 × 0.5 V) = 40 mW
– output current (20 mA × 12 ports); output power (20 mA × 12 × 0.5 V) = 120 mW
– output current (1 mA × 3 ports); output power (1 mA × 3 × 0.5 V) = 1.5 mW
Output total power = 341.5 mW
– chip core power consumption = 18 mA × 5.5 V = 99 mW
– SCL power dissipation = 25 mA × 0.4 V = 10 mW
– SDA power dissipation = 25 mA × 0.4 V = 10 mW
Ptot (device total power dissipation) = 460.5 mW
2. Find Tj (junction temperature):
Tj = Tcase + Rth(j-a) × Ptot = 94.6 °C + 18 °C/W × 460.5 mW = 102.9 °C
11. Limiting values
Table 13. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
VDD
supply voltage
Conditions
−0.5
+6.0
V
VI/O
voltage on an input/output pin
VSS − 0.5
5.5
V
Vdrv(LED)
LED driver voltage
VSS − 0.5
40
V
IO(LEDn)
output current on pin LEDn
IOL(tot)
total LOW-level output current
VOL = 0.5 V
-
100
mA
1600
-
mA
ISS
ground supply current
per VSS pin
-
800
mA
Ptot
total power dissipation
Tamb = 25 °C
-
1.8
W
P/ch
power dissipation per channel
Tamb = 85 °C
-
0.72
W
Tamb = 25 °C
-
100
mW
-
45
mW
-
125
°C
−65
+150
°C
−40
+85
°C
[1]
Tamb = 85 °C
Tj
junction temperature
Tstg
storage temperature
Tamb
ambient temperature
[2]
operating
[1]
Each bit must be limited to a maximum of 100 mA and the total package limited to 1600 mA due to internal
busing limits.
[2]
Refer to Section 10.1 for junction temperature calculation.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
25 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
Table 14.
TSSOP32 versus HVQFN32 power dissipation and output current capability
Measurement
TSSOP32
HVQFN32
maximum power dissipation
(chip + output drivers)
1200 mW
2500 mW
maximum power dissipation
(output drivers only)
1110 mW
2410 mW
Tamb = 25 °C
maximum drive current
per channel
1110 mW
< ------------------------------------ = 138.8 mA [1
16-bit × 0.5 V
2410 mW
< ------------------------------------ = 301.3 mA [1
16-bit × 0.5 V
]
]
maximum power dissipation
(chip + output drivers)
723 mW
1500 mW
maximum power dissipation
(output drivers only)
637 mW
1410 mW
Tamb = 60 °C
maximum drive current
per channel
637 mW
< ------------------------------------ = 79.6 mA
16-bit × 0.5 V
1410 mW
< ------------------------------------ = 176.3 mA [1
16-bit × 0.5 V
]
Tamb = 80 °C
maximum power dissipation
(chip + output drivers)
542 mW
1125 mW
maximum power dissipation
(output drivers only)
456 mW
1040 mW
maximum drive current
per channel
[1]
456 mW
< ------------------------------------ = 57 mA
16-bit × 0.5 V
1040 mW
< ------------------------------------ = 130 mA [1]
16-bit × 0.5 V
This value signifies package’s ability to handle more than 100 mA per output driver. The device’s maximum
current rating per output is 100 mA.
12. Thermal characteristics
Table 15.
Symbol
Rth(j-a)
Rth(j-c)
[1]
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to ambient
thermal resistance from junction to case
Unit
TSSOP32
83
°C/W
HVQFN32
[1]
40
°C/W
TSSOP32
[1]
23
°C/W
HVQFN32
[1]
14
°C/W
Calculated in accordance with JESD 51-7.
PCA9622_3
Product data sheet
Typ
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
26 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
13. Static characteristics
Table 16. Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2.3
-
5.5
V
VDD = 2.7 V
-
0.2
4
mA
VDD = 3.6 V
-
2
6
mA
VDD = 5.5 V
-
8.5
12
mA
VDD = 2.7 V
-
1.3
5
µA
VDD = 3.6 V
-
1.8
6
µA
-
3.2
7
µA
-
1.70
2.0
V
Supply
VDD
supply voltage
IDD
supply current
standby current
Istb
on pin VDD; operating mode;
no load; fSCL = 1 MHz
on pin VDD; no load; fSCL = 0 Hz;
I/O = inputs; VI = VDD
VDD = 5.5 V
VPOR
power-on reset voltage
no load; VI = VDD or VSS
[1]
Input SCL; input/output SDA
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
IOL
LOW-level output current
VOL = 0.4 V; VDD = 2.3 V
20
-
-
mA
VOL = 0.4 V; VDD = 5.0 V
30
-
-
mA
IL
leakage current
VI = VDD or VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
6
10
pF
LED driver outputs
Vdrv(LED)
LED driver voltage
IOL
LOW-level output current
VOL = 0.5 V
0
-
40
V
100
-
-
mA
ILOH
HIGH-level output leakage
current
Vdrv(LED) = 5 V
-
-
±1
µA
Vdrv(LED) = 40 V
-
±1
15
µA
Ron
ON-state resistance
Co
output capacitance
Vdrv(LED) = 40 V; VDD = 2.3 V
-
2
5
Ω
-
2.5
5
pF
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
[2]
OE input
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
ILI
input leakage current
−1
-
+1
µA
Ci
input capacitance
-
15
40
pF
Address inputs
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
ILI
input leakage current
−1
-
+1
µA
Ci
input capacitance
-
3.7
5
pF
[1]
VDD must be lowered to 0.2 V in order to reset part.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
27 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
[2]
Each bit must be limited to a maximum of 100 mA and the total package limited to 1600 mA due to internal busing limits.
002aae507
0.25
VDD = 5.5 V
4.5 V
3.0 V
2.3 V
IOL
(A)
0.15
0.05
0.05
0.15
VDD = 5.5 V
4.5 V
3.0 V
2.3 V
IOL
(A)
0.15
−0.05
−0.05
002aae508
0.25
0.35
−0.05
−0.05
0.55
0.15
VOL (V)
0.35
0.55
VOL (V)
a. Tamb = −40 °C
b. Tamb = 25 °C
002aae509
0.25
IOL
(A)
0.15
VDD = 5.5 V
4.5 V
3.0 V
2.3 V
0.05
−0.05
−0.05
0.15
0.35
0.55
VOL (V)
c. Tamb = 85 °C
Fig 18. VOL versus IOL
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
28 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
14. Dynamic characteristics
Table 17.
Dynamic characteristics
Symbol Parameter
Standard-mode Fast-mode I2C-bus
I2C-bus
Conditions
Min
Max
Min
Max
Fast-mode
Plus I2C-bus
Min
Max
Unit
fSCL
SCL clock frequency
0
100
0
400
0
1000
tBUF
bus free time between
a STOP and START
condition
4.7
-
1.3
-
0.5
-
kHz
µs
tHD;STA
hold time (repeated)
START condition
4.0
-
0.6
-
0.26
-
µs
tSU;STA
set-up time for a
repeated START
condition
4.7
-
0.6
-
0.26
-
µs
tSU;STO
set-up time for STOP
condition
4.0
-
0.6
-
0.26
-
µs
tHD;DAT
data hold time
0
-
0
-
0
-
ns
0.3
3.45
0.1
0.9
0.05
0.45
µs
0.3
3.45
0.1
0.9
0.05
0.45
µs
tVD;ACK
data valid acknowledge
time
[1]
tVD;DAT
data valid time
[2]
tSU;DAT
data set-up time
250
-
100
-
50
-
ns
tLOW
LOW period of the SCL
clock
4.7
-
1.3
-
0.5
-
µs
tHIGH
HIGH period of the
SCL clock
4.0
-
0.6
-
0.26
-
µs
tf
fall time of both SDA
and SCL signals
-
300
20 + 0.1Cb[5]
300
-
120
ns
tr
rise time of both SDA
and SCL signals
-
1000
20 + 0.1Cb[5]
300
-
120
ns
tSP
pulse width of spikes
that must be
suppressed by the
input filter
-
50
-
50
-
50
ns
[3][4]
[6]
Output propagation delay
tPLH
LOW to HIGH
propagation delay
OE to LEDn;
MODE2[1:0] = 01
-
-
-
-
-
150
ns
tPHL
HIGH to LOW
propagation delay
OE to LEDn;
MODE2[1:0] = 01
-
-
-
-
-
150
ns
td(SCL-Q) delay time from SCL
to data output
SCL to LEDn;
MODE2[3] = 1;
outputs change on
ACK
-
-
-
-
-
450
ns
td(SDA-Q) delay time from SDA
to data output
SDA to LEDn;
MODE2[3] = 0;
outputs change on
STOP condition
-
-
-
-
-
450
ns
Output port timing
[1]
tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
29 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
[2]
tVD;DAT = minimum time for SDA data out to be valid following SCL LOW.
[3]
A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to
bridge the undefined region of SCL’s falling edge.
[4]
The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time (tf) for the SDA output stage is specified at
250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without
exceeding the maximum specified tf.
[5]
Cb = total capacitance of one bus line in pF.
[6]
Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns.
SDA
tr
tBUF
tf
tHD;STA
tSP
tLOW
SCL
tHD;STA
P
tSU;STA
tHD;DAT
S
tHIGH
tSU;DAT
tSU;STO
Sr
P
002aaa986
Fig 19. Definition of timing
protocol
START
condition
(S)
tSU;STA
bit 7
MSB
(A7)
tLOW
bit 6
(A6)
tHIGH
bit 1
(D1)
bit 0
(D0)
acknowledge
(A)
STOP
condition
(P)
1 / fSCL
SCL
tBUF
tr
tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab285
Rise and fall times refer to VIL and VIH.
Fig 20. I2C-bus timing diagram
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
30 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
15. Test information
VDD
PULSE
GENERATOR
VI
VO
RL
500 Ω
VDD
open
GND
DUT
RT
CL
50 pF
002aab284
RL = Load resistor for LEDn. RL for SDA and SCL > 1 kΩ (3 mA or less current).
CL = Load capacitance includes jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generators.
Fig 21. Test circuitry for switching times
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
31 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
16. Package outline
TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm;
lead pitch 0.65 mm
SOT487-1
E
D
A
X
c
y
HE
v M A
Z
17
32
A2
(A 3)
A
A1
pin 1 index
θ
Lp
L
1
detail X
16
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
v
w
y
Z
θ
mm
1.1
0.15
0.05
0.95
0.85
0.25
0.30
0.19
0.20
0.09
11.1
10.9
6.2
6.0
0.65
8.3
7.9
1
0.75
0.50
0.2
0.1
0.1
0.78
0.48
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT487-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 22. Package outline SOT487-1 (TSSOP32)
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
32 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
A
B
D
SOT617-3
terminal 1
index area
A
A1
E
c
detail X
C
e1
e
1/2 e
9
y1 C
v M C A B
w M C
b
16
y
L
17
8
e
e2
Eh
1/2 e
24
1
terminal 1
index area
32
25
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
5.1
4.9
3.75
3.45
5.1
4.9
3.75
3.45
0.5
3.5
3.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT617-3
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
02-04-18
02-10-22
Fig 23. Package outline SOT617-3 (HVQFN32)
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
33 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
17. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
18. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
18.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
18.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
18.3 Wave soldering
Key characteristics in wave soldering are:
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
34 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
18.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 24) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18 and 19
Table 18.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 19.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 24.
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
35 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 24. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
19. Abbreviations
Table 20.
Abbreviations
Acronym
Description
CDM
Charged-Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
FET
Field-Effect Transistor
HBM
Human Body Model
I2C-bus
Inter-Integrated Circuit bus
LED
Light Emitting Diode
LCD
Liquid Crystal Display
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
NMOS
Negative-channel Metal-Oxide Semiconductor
PCB
Printed-Circuit Board
PMOS
Positive-channel Metal-Oxide Semiconductor
PWM
Pulse Width Modulation
RGB
Red/Green/Blue
RGBA
Red/Green/Blue/Amber
SMBus
System Management Bus
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
36 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
20. Revision history
Table 21.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9622_3
20090831
Product data sheet
-
PCA9622_2
Modifications:
•
Table 1 “Ordering information”: HVQFN32 package version changed from “SOT617-1” to
“SOT617-3”
•
•
•
•
•
Figure 3 “Pin configuration for HVQFN32”: adjusted size of exposed center pad
Section 7.4 “Active LOW output enable input”: added 2nd “Remark”
Figure 17 “Typical application”: added “Remark”
Added (new) Section 10.1 “Junction temperature calculation”.
Section 11 “Limiting values”:
– Table 13 “Limiting values”: added “Tj, junction temperature” specification
– Added (new) Table 14 “TSSOP32 versus HVQFN32 power dissipation and output
current capability”
•
•
•
Added (new) Table 15 “Thermal characteristics”
Table 16 “Static characteristics”, sub-section “LED driver outputs”: added ILOH specification
Figure 23: changed package outline version from “SOT617-1” to “SOT617-3”
PCA9622_2
20090611
Product data sheet
-
PCA9622_1
PCA9622_1
20090327
Product data sheet
-
-
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
37 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
21. Legal information
21.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
21.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
21.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
21.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
22. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA9622_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 31 August 2009
38 of 39
PCA9622
NXP Semiconductors
16-bit Fm+ I2C-bus 100 mA 40 V LED driver
23. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.1.1
7.1.2
7.1.3
7.1.4
7.2
7.3
7.3.1
7.3.2
7.3.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 7
Device addresses . . . . . . . . . . . . . . . . . . . . . . . 7
Regular I2C-bus slave address . . . . . . . . . . . . . 7
LED All Call I2C-bus address . . . . . . . . . . . . . . 8
LED Sub Call I2C-bus addresses . . . . . . . . . . . 8
Software Reset I2C-bus address . . . . . . . . . . . 8
Control register . . . . . . . . . . . . . . . . . . . . . . . . . 9
Register definitions . . . . . . . . . . . . . . . . . . . . . 10
Mode register 1, MODE1 . . . . . . . . . . . . . . . . 11
Mode register 2, MODE2 . . . . . . . . . . . . . . . . 12
PWM0 to PWM15, individual brightness
control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.3.4
GRPPWM, group duty cycle control . . . . . . . . 13
7.3.5
GRPFREQ, group frequency . . . . . . . . . . . . . 13
7.3.6
LEDOUT0 to LEDOUT3, LED driver
output state . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.3.7
SUBADR1 to SUBADR3, I2C-bus
subaddress 1 to 3 . . . . . . . . . . . . . . . . . . . . . . 14
7.3.8
ALLCALLADR, LED All Call I2C-bus
address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.4
Active LOW output enable input . . . . . . . . . . . 15
7.5
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 16
7.6
Software reset. . . . . . . . . . . . . . . . . . . . . . . . . 16
7.7
Individual brightness control with group
dimming/blinking . . . . . . . . . . . . . . . . . . . . . . . 17
8
Characteristics of the I2C-bus. . . . . . . . . . . . . 18
8.1
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.1.1
START and STOP conditions . . . . . . . . . . . . . 18
8.2
System configuration . . . . . . . . . . . . . . . . . . . 18
8.3
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 19
9
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 20
10
Application design-in information . . . . . . . . . 22
10.1
Junction temperature calculation . . . . . . . . . . 23
10.1.1
Example 1: Tj calculation of PCA9622DR, in
TSSOP32 package, when Tamb is known . . . . 24
10.1.2
Example 2: Tj calculation where only Tcase is
known . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 25
12
13
14
15
16
17
18
18.1
18.2
18.3
18.4
19
20
21
21.1
21.2
21.3
21.4
22
23
Thermal characteristics . . . . . . . . . . . . . . . . .
Static characteristics . . . . . . . . . . . . . . . . . . .
Dynamic characteristics . . . . . . . . . . . . . . . . .
Test information. . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Handling information . . . . . . . . . . . . . . . . . . .
Soldering of SMD packages . . . . . . . . . . . . . .
Introduction to soldering. . . . . . . . . . . . . . . . .
Wave and reflow soldering . . . . . . . . . . . . . . .
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . .
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
27
29
31
32
34
34
34
34
34
35
36
37
38
38
38
38
38
38
39
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 31 August 2009
Document identifier: PCA9622_3