INTEGRATED CIRCUITS DATA SHEET TDA4864J; TDA4864AJ Vertical deflection booster Product specification 2003 Oct 31 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ FEATURES GENERAL DESCRIPTION • Power amplifier with differential inputs The TDA4864J and TDA4864AJ are deflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz. • Output current up to 2.5 A (p-p) • High vertical deflection frequency up to 200 Hz The TDA4864J needs a separate flyback supply voltage, so the supply voltages are independently adjustable to optimize power consumption and flyback time. • High linear sawtooth signal amplification • Flyback generator: – TDA4864J: separate adjustable flyback supply voltage up to 60 V For the TDA4864AJ the flyback supply voltage will be generated internally by doubling the supply voltage and therefore a separate flyback supply voltage is not needed. – TDA4864AJ: internally doubled supply voltage (two supply voltages only for DC-coupled outputs). Both circuits provide differential input stages. QUICK REFERENCE DATA Measurements referenced to pin GND. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP1 supply voltage 1 9 − 30 V VP2 supply voltage 2 for vertical output VP1 − 1 − 60 V VFB flyback supply voltage of TDA4864J VP1 − 1 − 60 V VP3 flyback generator output voltage of TDA4864AJ 0 − VP1 + 2.2 V Vi input voltage on 1.6 − VP1 − 0.5 V IV-OUT = −1.25 A pin INN 1.6 − VP1 − 0.5 V IP1 supply current 1 during scan − 6 10 mA IP2 quiescent supply current 2 IV-OUT = 0 − 25 60 mA IV-OUT(p-p) vertical deflection output current (peak-to-peak value) − − 2.5 A Tamb ambient temperature −20 − +75 °C pin INP ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA4864J TDA4864AJ 2003 Oct 31 DBS7P DESCRIPTION plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad 2 VERSION SOT524-1 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ BLOCK DIAGRAM handbook, full pagewidth THERMAL PROTECTION DIFFERENTIAL INPUT STAGE TDA4864J FLYBACK GENERATOR VERTICAL OUTPUT REFERENCE CIRCUIT 7 6 5 4 3 2 1 INP INN V-OUT GND VP2 VFB VP1 D1 RS1 CS1 C1 RP R3 C4 C2 deflection coil R4 from deflection controller R2 R1 VN Fig.1 Block diagram of TDA4864J. 2003 Oct 31 3 VF VP Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ handbook, full pagewidth THERMAL PROTECTION DIFFERENTIAL INPUT STAGE TDA4864AJ VERTICAL OUTPUT FLYBACK GENERATOR REFERENCE CIRCUIT 7 6 5 4 3 2 1 INP INN V-OUT GND VP2 VP3 VP1 CF RS1 CS1 D1 RP R3 from deflection controller deflection coil C1 R6 R2 R1 VN Fig.2 Block diagram of TDA4864AJ. 2003 Oct 31 C2 R5 4 VP Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ PINNING PIN SYMBOL DESCRIPTION TDA4864J TDA4864AJ VP1 1 1 positive supply voltage 1 VFB 2 − flyback supply voltage VP3 − 2 flyback generator output VP2 3 3 supply voltage 2 for vertical output GND 4 4 ground or negative supply voltage V-OUT 5 5 vertical output INN 6 6 inverted input of differential input stage INP 7 7 non-inverted input of differential input stage handbook, halfpage handbook, halfpage VP1 1 VP1 1 VFB 2 VP3 2 VP2 3 VP2 3 GND 4 GND 4 V-OUT 5 V-OUT 5 INN 6 INN 6 INP 7 INP 7 TDA4864J XXXxxx XXXxxx Fig.3 Pin configuration of TDA4864J. 2003 Oct 31 TDA4864AJ Fig.4 Pin configuration of TDA4864AJ. 5 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ FUNCTIONAL DESCRIPTION Flyback generator Both the TDA4864J and TDA4864AJ consist of a differential input stage, a vertical output stage, a flyback generator, a reference circuit and a thermal protection circuit. The flyback generator supplies the vertical output stage during flyback. The TDA4864J is used with separate flyback supply voltage to achieve a short flyback time with minimized power dissipation. The TDA4864J operates with a separate flyback supply voltage (see Fig.1) while the TDA4864AJ generates the flyback voltage internally by doubling the supply voltage (see Fig.2). The TDA4864AJ needs a capacitor CF between pins VP3 and VP2 (see Fig.2). Capacitor CF is charged during scan, using the external diode D1 and resistor R5. During flyback the cathode of capacitor CF is connected to the positive supply voltage and the flyback voltage is then twice the supply voltage. For the TDA4864AJ the resistor R6 in the positive supply line can be used to reduce the power consumption. Differential input stage The differential sawtooth input current signal (coming from the deflection controller) is connected to the inputs (inverted signal to pin INN and non-inverted signal to pin INP). The vertical feedback signal is superimposed on the inverted signal on pin INN. In parallel with the deflection coil a damping resistor RP and an RC combination (RS1 = 5.6 Ω and CS1 = 100 nF) are needed. Furthermore, another additional RC combination (RS2 = 5.6 Ω and CS2 = 47 to 150 nF) can be used to minimize the noise effect and the flyback time (see Figs 9 and 10). Vertical output and thermal protection The vertical output stage is a quasi-complementary class-B amplifier with a high linearity. The output stage is protected against thermal overshoots. For a junction temperature Tj > 150 °C this protection will be activated and will reduce then the deflection current (IV-OUT). 2003 Oct 31 6 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to pin GND; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP1 supply voltage 1 − 40 V VP2 supply voltage 2 − 60 V VFB flyback supply voltage of TDA4864J − 60 V VP3 flyback generator output voltage of TDA4864AJ 0 VP1 + 3 V Vi input voltage on pin INN − VP1 V pin INP − VP1 V Vo(V-OUT) output voltage on pin V-OUT − 62 V IP2 supply current 2 − ±1.5 A Io(V-OUT) output current on pin V-OUT − ±1.5 A IVFB current during flyback of TDA4864J − ±1.5 A IVP3 current during flyback of TDA4864AJ − ±1.5 A Tstg storage temperature −25 +150 °C Tamb ambient temperature −20 +75 °C Tj junction temperature note 1 − 150 °C Ves electrostatic discharge voltage on all pins note 2 −300 +300 V note 1 Notes 1. Internally limited by thermal protection; will be activated for Tj ≥ 150 °C. 2. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-mb) PARAMETER CONDITIONS thermal resistance from junction to mounting base note 1 VALUE UNIT 6 K/W Note 1. To minimize the thermal resistance from mounting base to heatsink [Rth(mb-h)] follow the recommended mounting instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases Rth(mb-h). 2003 Oct 31 7 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ CHARACTERISTICS VP1 = 25 V; Tamb = 25 °C; voltages referenced to pin GND; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VP1 supply voltage 1 9 − 30 V VP2 supply voltage 2 VP1 − 1 − 60 V VFB flyback supply voltage of TDA4864J VP1 − 1 − 60 V VP3 flyback generator output voltage of TDA4864AJ IV-OUT = −1.25 A 0 − VP1 + 2.2 V IP1 supply current 1 during scan − 6 10 mA IP2 quiescent supply current 2 IV-OUT = 0 − 25 60 mA pin INN 1.6 − VP1 − 0.5 V pin INP 1.6 − VP1 − 0.5 V pin INN − −100 −500 nA pin INP − −100 −500 nA Differential input stage Vi Iq input voltage on input quiescent current on Flyback generator IVFB current during flyback of TDA4864J − − ±1.5 A IVP3 current during flyback of TDA4864AJ − − ±1.5 A VVP2-VFB voltage drop during flyback of TDA4864J − −1.5 − V IV-OUT = −1.25 A − −2 − V IV-OUT = −1 A reverse forward VVP3-VP1 IV-OUT = 1 A − 2.2 − V IV-OUT = 1.25 A − 2.5 − V IV-OUT = −1 A − voltage drop during flyback of TDA4864AJ reverse forward −1.5 − V IV-OUT = −1.25 A − −2 − V IV-OUT = 1 A − 2.2 − V IV-OUT = 1.25 A − 2.5 − V Vertical output stage; see Fig.5 IV-OUT vertical deflection output current − − ±1.25 A IV-OUT(p-p) vertical deflection output current (peak-to-peak value) − − 2.5 A Vo(sat)n output saturation voltage to ground IV-OUT = 1 A − 1.4 1.7 V IV-OUT = 1.25 A − 1.8 2.3 V IV-OUT = 1 A −2.3 −2 − V IV-OUT = 1.25 A −2.8 −2.3 − V note 1 − − 1 % Vo(sat)p LIN output saturation voltage to VP2 non-linearity of output signal Note 1. Deviation of the output slope at a constant input slope. 2003 Oct 31 8 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ handbook, full pagewidth input signal on pin INN t input signal on pin INP t VFB(1) output voltage on pin V-OUT V P1 GND t deflection current through the coil t MHB718 (1) VFB for TDA4864J; 2VP1 for TDA4864AJ. Fig.5 Timing diagram. 2003 Oct 31 9 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ INTERNAL PIN CONFIGURATION handbook, full pagewidth INP INN 7 6 V-OUT GND 5 VP2 VFB VP1 3 2 1 VP2 VP3 VP1 3 2 1 4 TDA4864J Fig.6 Internal circuits of TDA4864J. handbook, full pagewidth INP INN 7 6 V-OUT GND 5 4 TDA4864AJ Fig.7 Internal circuits of TDA4864AJ. 2003 Oct 31 10 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ APPLICATION INFORMATION VF handbook, full pagewidth VP 2 > 1 kΩ 1N4448 TDA4864J 2.2 Ω 5 guard output HIGH = error 3.3 kΩ BC548 BC556 22 µF 220 kΩ vertical output signal Fig.8 Application circuit with TDA4864J for external guard signal generation. handbook, full pagewidth THERMAL PROTECTION DIFFERENTIAL INPUT STAGE TDA4864J FLYBACK GENERATOR VERTICAL OUTPUT REFERENCE CIRCUIT 7 6 5 4 3 2 1 INP INN V-OUT GND VP2 VFB VP1 D1 RS1 CS1 CS2 R3 from deflection controller (1) RS2 5.6 Ω RP 270 Ω 5.6 Ω 100 nF deflection coil 1.8 kΩ R2 R1 1Ω (1 W) BYV27 470 µF 470 µF VN −8 V 470 µF 4.3 Ω VF +50 V 1.8 kΩ Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin GND). (1) With CS2 (typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized. Fig.9 Application circuit with TDA4864J. 2003 Oct 31 11 VP +9 V Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ handbook, full pagewidth THERMAL PROTECTION DIFFERENTIAL INPUT STAGE FLYBACK GENERATOR VERTICAL OUTPUT REFERENCE CIRCUIT 7 6 5 4 3 2 1 INP INN V-OUT GND VP2 VP3 VP1 CS2 R3 from deflection controller TDA4864AJ (1) RS2 5.6 Ω RP 270 Ω RS1 CS1 CF 5.6 Ω 100 nF 100 µF deflection coil R1 1Ω (1 W) D1 BYV27 470 µF 240 Ω (2 W) 470 µF 1.8 kΩ R2 R5 (2) VN −12.5 V 3.9 Ω (2 W) R6 (3) VP +12.5 V 1.8 kΩ Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin GND). (1) With CS2 (typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized. (2) With R5 capacitor CF will be charged during scan and the value (typical value between 150 and 270 Ω) depends on Idefl, tflb and CF. (3) R6 reduces the power dissipation of the IC. The maximum possible value depends on the application. Fig.10 Application circuit with TDA4864AJ. 2003 Oct 31 12 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ Example for both TDA4864J and TDA4864AJ Calculation formulae for power consumption: Table 1 P IC = P tot – P defl Values given from application SYMBOL VALUE UNIT Idefl(max) 0.71 Ldeflcoil 6 mH Rdeflcoil 6 Ω RP 270 Ω R1 1 Ω R2 1.8 kΩ 1.8 kΩ R3 (1) I defl(max) I defl(max) P tot = ( V P1 – U D1 ) × ------------------- + V N × -------------------4 4 A + ( V P1 – V N ) × 0.01 A + 0.2 W R deflcoil + R1 2 P defl = -------------------------------- × I defl(max) 3 where 50 V PIC = power dissipation of the IC Tamb 60 °C Ptot = total power dissipation Tdeflcoil 75 °C Pdefl = power dissipation of the deflection coil. Rth(j-mb) 6 K/W Rth(mb-amb) 8 K/W VFB Calculation formulae for maximum required thermal resistance for the heatsink at Tj(max) = 110 °C: Note 1. For TDA4864J only. T j(max) – T amb R th(mb-amb) = ----------------------------------- – R th(j-mb) = 19 K/W (max.) P IC Table 2 Table 3 Calculated values VALUE SYMBOL UNIT TDA4864J TDA4864AJ VP1 9 12.5 V VN −8 −12.5 V Ptot 3.2 4.4 W Pdefl 1.2 1.2 W PIC 2 3.2 W Rth(tot) 14 14 Tj(max) 88 105 tflb (µs) VFB (V) 350 30 250 40 210 50 Table 4 tflb as a function of VP1 and VN for TDA4864AJ tflb (µs) VP1 (V) VN (V) PIC (W) R6 (Ω) K/W 360 10 −10 2.5 1 °C 290 12.5 −12.5 3.2 3.9 240 15 −15 3.9 6.8 VP1, VN and VFB are referenced to ground of application; voltages are calculated with +10% tolerances. Calculation formulae for supply voltages: VP1 = −Vo(sat)p + (R1 + Rdeflcoil) × Idefl(max) − U’L + UD1 VN = Vo(sat)n + (R1 + Rdeflcoil) × Idefl(max) + U’L where U’L = Ldeflcoil × 2Idefl(max) × fv fv = vertical deflection frequency UD1 = forward voltage drop across D1. 2003 Oct 31 tflb as a function of VFB for TDA4864J 13 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ PACKAGE OUTLINE DBS7P: plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q w M bp 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT A2(2) bp mm c D(1) D1(2) Dh E(1) Eh 2.7 0.80 0.58 13.2 6.2 2.3 0.65 0.48 12.8 5.8 3.5 10 mm v M c e2 m e e1 e2 14.7 3.5 2.54 1.27 5.08 14.3 L k 3 2 L1 L2 L3 m 12.4 11.4 6.7 11.0 10.0 5.5 4.5 3.7 2.8 P Q q q1 q2 3.4 1.15 17.5 4.85 3.8 3.1 0.85 16.3 3.6 v w x 0.8 0.3 0.02 Z(1) 2.92 2.37 Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 00-07-03 03-03-12 SOT524-1 2003 Oct 31 EUROPEAN PROJECTION 14 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction to soldering through-hole mount packages The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING WAVE DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable(1) PMFP(2) − not suitable Notes 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable. 2003 Oct 31 15 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Oct 31 16