PHILIPS HEF4750VF

INTEGRATED CIRCUITS
DATA SHEET
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HEF4750V
LSI
Frequency synthesizer
Product specification
File under Integrated Circuits, IC04
January 1995
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
DESCRIPTION
SUPPLY VOLTAGE
The HEF4750V frequency synthesizer is one of a pair of
LOCMOS devices, primarily intended for use in
high-performance frequency synthesizers, e.g. in all
communication, instrumentation, television and broadcast
applications. A combination of analogue and digital
techniques results in an integrated circuit that enables high
performance. The complementary device is the universal
divider type HEF4751V.
Together with a standard prescaler, the two LOCMOS
integrated circuits offer low-cost single loop synthesizers
with full professional performance. Salient features offered
(in combination with HEF4751V) are:
• Wide choice of reference frequency using a single
crystal.
• High-performance phase comparator  low phase
noise  low spurii.
• System operation to > 1 GHz.
• Typical 15 MHz input at 10 V.
• Flexible programming:
frequency offsets
ROM compatible
fractional channel capability.
• Programme range 61⁄2 decades, including up to
3 decades of prescaler control.
• Division range extension by cascading.
• Built-in phase modulator.
• Fast lock feature.
• Out-of-lock indication.
• Low power dissipation and high noise immunity.
APPLICATION INFORMATION
Some examples of applications for the HEF4750V in
combination with the HEF4751V are:
• VHF/UHF mobile radios.
• HF s.s.b. transceivers.
• Airborne and marine communications and navaids.
• Broadcast transmitters.
• High quality radio and television receivers.
• High performance citizens band equipment.
• Signal generators.
January 1995
2
RATING
RECOMMENDED OPERATING
−0,5 to +15
9,5 to 10,5 V
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
PINNING
Fig.1 Pinning diagram.
HEF4750VD(F):
28-lead DIL; ceramic (cerdip)
(SOT135)
( ): Package Designator North America
January 1995
3
R
phase comparator input, reference
V
phase comparator input
STB
strobe input
TCA
timing capacitor CA pin
TCB
timing capacitor CB pin
TCC
timing capacitor CC pin
TRA
biasing pin (resistor RA)
PC1
analogue phase comparator output
PC2
digital phase comparator output
MOD
phase modulation input
OL
out-of-lock indication
OSC
reference oscillator/buffer input
XTAL
reference oscillator/buffer output
A0 to A9
programming inputs/programmable divider
NS0, NS1
programming inputs, prescaler
OUT
reference divider output
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Philips Semiconductors
Frequency synthesizer
January 1995
4
Block diagram comprising five basic functions: phase comparator 1 (PC1), phase comparator 2 (PC2), phase modulator, reference
oscillator and reference divider. These functions are described separately.
Product specification
Fig.2
HEF4750V
LSI
N.B. PC1 = analogue output; PC2 = 3-state output.
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
the ramp. Capacitor CA holds the voltage that the ramp
has attained. Via an internal sampling switch this voltage
is transferred to CC and in turn buffered and made
available at output PC1.
FUNCTIONAL DESCRIPTION
Phase comparator 1
Phase comparator 1 (PC1) is built around a SAMPLE and
HOLD circuit. A negative-going transition at the V-input
causes the hold capacitor (CA) to be discharged and after
a specified delay, caused by the Phase Modulator by
means of an internal V’ pulse, it produces a positive-going
ramp. A negative-going transition at the R-input terminates
If the ramp terminates before an R-input is present, an
internal end of ramp (EOR) signal is produced.
These actions are illustrated in Fig.3.
Fig.3 Waveforms associated with PC1.
The resultant phase characteristic is shown in Fig.4.
January 1995
5
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
Fig.4 Phase characteristic of PC1.
PC1 is designed to have a high gain, typically 3200 V/cycle
(at 12,5 kHz). This enables a low noise performance.
Phase comparator 2
This digital phase comparator has three stable states:
Phase comparator 2 (PC2) has a wide range, which
enables faster lock times to be achieved than otherwise
would be possible. It has a linear ± 360° phase range,
which corresponds to a gain of typically 5 V/cycle.
• reset state,
• V’ leads R state,
• R leads V’ state.
Conversion from one state to another takes place
according to the state diagram of Fig.5.
Fig.5 State diagram of PC2.
Output PC2 produces positive or negative-going pulses
with variable width; they depend on the phase relationship
of R and V’. The average output voltage is a linear function
of the phase difference. Output PC2 remains in the high
impedance OFF-state in the region in which PC1 operates.
The resultant phase characteristic is shown in Fig.6.
January 1995
6
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
Fig.6 Phase characteristic of PC2.
way. If no modulation is required, the MOD-input must be
connected to a fixed voltage of a certain positive value up
to VDD. Care must be taken that the V’ pulse is never
smaller than the minimum value to ensure that the external
capacitor of PC1 (CA) can be discharged during that time.
Since the V’ pulse width is directly related to the TCB ramp
duration, there is a requirement for the minimum value of
this ramp duration.
Strobe function
The strobe function is intended for applications requiring
extremely fast lock times. In normal operation the
additional strobe input (STB) can be connected to the
V-input and the circuit will function as described in the
previous sections.
In single, phase-locked-loop type frequency synthesizers,
the comparison frequency generally used is either the
nominal channel spacing or a sub-multiple. PC2 runs at
the higher frequency (a higher reference frequency must
also be used), whilst strobing takes place on the lower
frequency, thereby obtaining a decrease in lock time. In a
system using the Universal Divider HEF4751V, the output
OFS cycles on the lower frequency, the output OFF cycles
on the higher frequency.
Reference oscillator
The reference oscillator normally operates with an external
crystal as shown in Fig.2. The internal circuitry can be
used as a buffer amplifier in case an external reference
should be required.
Reference divider
The reference divider consists of a binary divider with a
programmable division ratio of 1 to 1024 and a prescaler
with selectable division ratios of 1, 2, 10 and 100,
according to the following tables:
Out-of-lock function
There are a number of situations in which the system goes
from the locked to the out-of-lock state (OL goes HIGH):
1. When V’ leads R, however out of the range of PC1.
Binary divider
2. When R leads V’.
3. When an R-pulse is missing.
N (A0 TO A9)
DIVISION RATIO
0
1024
0 ≤ N ≤ 1023
N
4. When a V-pulse is missing.
5. When two successive STB-commands occur, the first
without corresponding V-signal.
Prescaler
Phase modulator
The phase modulator only uses one external capacitor,
CB at pin TCB. A negative-going transition at the V-input
causes CB to produce a positive-going linear ramp. When
the ramp has reached a value almost equal to the
modulation input voltage (at MOD), the ramp terminates,
CB discharges and a start signal to the CA-ramp at TCA is
produced. A linear phase modulation is reached in this
January 1995
7
PROGRAMMING WORD
(NS0, NS1)
DIVISION RATIO
0
1
1
2
2
10
3
100
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
In this way suitable comparison frequencies can be
obtained from a range of crystal frequencies. The divider
can also be used as a ‘stand alone’ programmable divider
by connecting input TRA to VDD, which causes all internal
analogue currents to be switched off.
Biasing circuitry
The biasing circuitry uses an external current source or
resistor, which has to be connected between the TRA and
VSS pins. This circuitry supplies all analogue parts of the
circuit. Consequently the analogue properties of the
device, such as gain, charge currents, speed, power
dissipation, impedance levels etc., are mainly determined
by the value of the input current at TRA. The TRA input
must be decoupled to VDD, as shown in Fig.7. The value of
CD has to be chosen such that the TRA input is ‘clean’, e.g.
10 nF at RA = 68 kΩ.
Fig.7 Decoupling of input TRA.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
−0,5 to + 15 V
Supply voltage
VDD
Voltage on any input
VI
D.C. current into any input or output
±I
max.
10 mA
Ptot
max.
500 mW
P
max.
−0,5 to VDD + 0,5 V
Power dissipation per package
for Tamb = 0 to + 85 °C
Power dissipation per output
for Tamb = 0 to 85 °C
100 mW
Storage temperature
Tstg
−65 to + 150 °C
Operating ambient temperature
Tamb
−40 to + 85 °C
January 1995
8
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
DC CHARACTERISTICS
at VDD = 10 V ± 5%; voltages are referenced to VSS = 0 V, unless otherwise specified; for definitions see note 1.
Tamb (°C
PARAMETER
−40
SYMBOL
+ 25
+ 85
UNIT
NOTES
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
Quiescent device
current
IDD
−
−
100 −
−
100 −
−
750 µA
2
± IIN
−
−
300 −
−
300 −
−
1000 nA
3
Input current; logic
inputs, MOD
Output leakage current
at 1⁄2 VDD
TCA, hold-state
3,4
± IZ
−
−
20 −
0,05
20 −
−
60 nA
± IZ
−
−
20 −
0,05
20 −
−
60 nA
± IZ
−
−
50 −
−
50 −
−
500 nA
TCC, analogue
switch OFF
PC2, high impedance
OFF-state
Logic input voltage
LOW
VIL
 max. 0,3 VDD 
V
HIGH
VIH
 max. 0,7 VDD 
V
Logic output voltage
LOW; at IO < 1 µA
VOL
HIGH
VOH
−
−
50 −
−
50 −
−
50 mV
3
mV
3
 min. VDD − 50 mV 
Logic output current
LOW; at VOL = 0,5 V
3
outputs OL, PC2,
OUT
output XTAL
IOL
5,5
−
−
4,6
−
−
3,6
−
−
mA
IOL
2,8
−
−
2,4
−
−
1,9
−
−
mA
Logic output current
HIGH;
at VOH = VDD − 0,5 V
3
outputs OL, PC2,OUT
−IOH
1,5
−
−
1,3
−
−
1,0
−
−
mA
output XTAL
−IOH
1,4
−
−
1,2
−
−
0,9
−
−
mA
IO
−
−
−
−
2,1
−
−
−
−
mA
3,4,5
−IO
−
−
−
−
1,9
−
−
−
−
mA
3,4,6
Ri
−
−
−
−
0,7
−
−
−
−
kΩ
3,4
Output TCC sink
current
Output TCC source
current
Internal resistance
of TCC
output swing
≤ 200 mV
specified output range:
0,3 VDD to 0,7 VDD
January 1995
9
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
Tamb (°C
PARAMETER
−40
SYMBOL
+ 25
+ 85
UNIT
NOTES
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
Output TCC voltage
with respect to
TCA input voltage
∆V
−
0
−
−
0
−
−
0
−
V
3,4,7
IO
−
−
−
−
1,1
−
−
−
−
mA
3,4,8
−IO
−
−
−
−
1,0
−
−
−
−
mA
3,4,9
Ri
−
−
−
−
1,4
−
−
−
−
kΩ
3,4
∆V
−
0
−
−
0
−
−
0
−
V
3,4,10
VEOR
−
0,9
−
−
0,7
−
−
0,6
−
V
3,4,11
Output PC1 sink
current
Output PC1 source
current
Internal resistance
of PC1
output swing
≤ 200 mV
specified output range:
0,3 VDD to 0,7 VDD
Output PC1 voltage
with respect to
TCC input voltage
EOR generation
VEOR = VDD − VTCA
Source current; HIGH
at VOUT = 1⁄2 VDD;
output in ramp mode
3,4
TCA
IO
−
−
−
−
13
−
−
−
−
mA
TCB
IO
−
−
−
−
2,5
−
−
−
−
mA
January 1995
10
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
AC CHARACTERISTICS
General note
The dynamic specifications are given for the circuit built-up with external components as given in Fig.8, under the
following conditions; for definitions see note 1; for definitions of times see Fig.19; VDD = 10 V ± 5%; Tamb = 25 °C; input
transition times ≤ 20 ns; RA = 68 kΩ ± 30% (see also note 4); CA = 270 pF; CB = 150 pF; CC = 1 nF; CD = 10 nF; unless
otherwise specified.
SYMBOL
MIN.
TYP.
MAX.
UNIT
CONDITIONS
NOTES
Slew rate
TCA
STCA
−
52
−
V/µs
RA = minimum
12
TCA
STCA
−
28
−
V/µs
RA = maximum
12
TCB
STCB
−
20
−
V/µs
RA = minimum
12
TCB
STCB
−
10
−
V/µs
RA = maximum
12
TCA
ITCA
−
2
−
%
13
TCB
ITCB
−
2
−
%
13
Start of TCA-ramp delay
tCBCA
−
200
−
ns
Delay of TCA-hold
tRCA
−
40
−
ns
Delay of TCA-discharge
tVCA
−
60
−
ns
Start of TCB-ramp delay
tVCB
−
60
−
ns
TCB-ramp duration
trCB
−
250
−
ns
VMOD = 4 V
trCB
−
350
−
ns
VMOD = 6 V
trCB
−
450
−
ns
VMOD = 8 V
trCB
−
150
−
ns
V : LOW
tPWVL
−
20
−
ns
V : HIGH
tPWVH
−
20
−
ns
R : LOW
tPWRL
−
20
−
ns
R : HIGH
tPWRH
−
20
−
ns
STB : LOW
tPWSL
−
20
−
ns
STB : HIGH
tPWSH
−
20
−
ns
TCA
tfCA
−
50
−
ns
TCB
tfCB
−
50
−
ns
Prescaler input frequency
fPR
−
30
−
MHz
all division ratios
Binary divider frequency
fDIV
−
30
−
MHz
all division ratios
Crystal oscillator frequency
fOSC
−
10
−
MHz
with speed-up 1 : 10
IP
−
3,6
−
mA
15
without speed-up
IP
−
3,2
−
mA
16
Ramp linearity
Required TCB min.
ramp duration
14
Pulse width
Fall time
Average power supply current
January 1995
locked state
11
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
Notes
1. Definitions:
RA = external biasing resistor between pins TRA and VSS; 68 kΩ ± 30%.
CA = external timing capacitor for time/voltage converter, between pins TCA and VSS.
CB = external timing capacitor for phase modulator, between pins TCB and VSS.
CC = external hold capacitor between pins TCC and VSS.
CD = decoupling capacitor between pins TRA and VDD.
Logic inputs: V, R, STB, A0 to A9, NS0, NS1, OSC.
Logic outputs: OL, PC2, XTAL, OUT.
Analogue signals: TCA, TCB, TCC, TRA, PC1, MOD.
2. TRA at VDD; TCA, TCB, TCC and MOD at VSS; logic inputs at VSS or VDD.
3. All logic inputs at VSS or VDD.
4. RA connected; its value chosen such that ITRA = 100 µA.
5. The analogue switch is in the ON position (see Fig.9).
6. The analogue switch is in the ON position (see Fig.10).
7. See Fig.11.
This guarantees the d.c. voltage gain, combined with d.c.-offset.
Input condition: 0,3 VDD ≤ VTCA ≤ 0,7 VDD.
∆V = VTCC−VTCA.
8. See Fig.12.
9. See Fig.13.
10. See Fig.14.
This guarantees the d.c. voltage gain, combined with d.c.-offset.
Input condition: 0,3 VDD ≤ VTCC ≤ 0,7 VDD.
∆V = VPC1−VTCC.
11. Switching level at TCA, generating an EOR-signal, during increasing input voltage.
12. See Fig.15.
13. See Fig.16.
Definition of the ramp linearity at full swing.
14. The external components and modulation input voltage must be chosen such that this requirement will be fulfilled, to
ensure that CA is sufficiently discharged during that time.
15. See Fig.17.
Circuit connections for power supply current specification, with speed-up 1 : 10. V and R are in the range of PC1,
such that the output voltage at PC1 is equal to 5 V.
fOSC = 5 MHz (external clock)
fSTB = 12,5 kHz
fV = 125 kHz
16. See Fig.18.
Circuit connections for power supply current specification, without speed-up. V and R are in the range of PC1, such
that the output voltage at PC1 is equal to 5 V.
fOSC = 5 MHz (external clock)
fSTB = 12,5 kHz
fV = 12,5 kHz
January 1995
12
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
Fig.8
Test circuit for measuring a.c.
characteristics.
Fig.9 Equivalent circuit for note 5.
Fig.10 Equivalent circuit for note 6.
Fig.11 Circuit for note 7.
Fig.12 Equivalent circuit for PC1 sink current.
January 1995
13
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
Fig.13 Equivalent circuit for PC1 source current.
Fig.14 Circuit for note 10.
Fig.15 Waveform at the output.
∆V
Linearity = ---------------------- × 100 %.
1/2 V DD
Fig.16 Definition of the ramp linearity at full swing.
∆V is the maximum deviation of the ramp waveform to the straight line, which joins the 30% VDD and
70% VDD points.
January 1995
14
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
Fig.17 Circuit for note 15.
Fig.18 Circuit for note 16.
January 1995
15
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
(1) Forbidden zone in the locked state for the positive edge of V and R and both edges of STB.
Fig.19 Waveforms showing times in the locked state.
January 1995
16
Philips Semiconductors
Product specification
HEF4750V
LSI
Frequency synthesizer
APPLICATION INFORMATION
Fig.20 Application of HEF4750V as horizontal sync circuit with Phase-Locked Loop (PLL) and LC oscillator with
vari-cap control.
January 1995
17
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