Data Sheet, V2.0, January 2010 BGF117 High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter RF & Protection Devices Edition 2010-01-15 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2010. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF117 BGF117 Revision History: 2010-01-15, V2.0 Previous Version:2009-09-28, V1.2 Page Subjects (major changes since last revision) All Target status removed Data Sheet 3 V2.0, 2010-01-15 BGF117 High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter Features • Bidirectional ESD protection and EMI filter for High-Speed Mini-/Micro-SD card interface • ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on all external IOs • ESD protection according to IEC61000-4-2 for ±2 kV contact discharge on all internal IOs • Very good EMI filtering and very low cross talk due to small package parasitics • Suitable for high speed applications due to low line capacitance of typical 8 pF • Very low voltage dependency of line capacitance • Very low leakage currents • Integrated pull up resistors to enable proper line biasing • Application requires very low PCB area using an optimized I/O arrangement • 400 µm solder ball pitch • RoHS and WEEE compliant package • Complies with following standards: SD Card Specification V2.0, MicroSD Card Specification V1.0 WLP-16-4-N R7, 25kΩ R8, 25kΩ R9, 25kΩ R10, 25kΩ Ext. IOs R11, 25kΩ V CC B2 B1 clk R1, 40Ω SDclk B4 C1 cmd R2, 40Ω SDcmd C4 A1 dat0 R3, 40Ω SDdat0 A4 A2 dat1 R4, 40Ω SDdat1 A3 D2 dat2 R5, 40Ω SDdat2 D3 D1 dat3/CD R6, 40Ω SDdat3/CD D4 B3, C2, C3 Figure 1 GND CARD HOST Int. IOs BGF117 _schematic_mini_ micro_ SD.vsd Schematic Description BGF117 is an ESD protection and EMI filter circuit for a high speed multi media card and mini-/micro-SD interface with integrated pull up resistors. External pins are protected for ±15 kV contact discharge according to IEC610004-2. Due to the low electrical capacitance of each line BGF117 is well suited for high speed applications. The wafer level package is a green lead-free and halogen-free package with a size of only 1.55 mm x 1.55 mm and a total height of 0.6 mm. Type Package Marking Chip BGF117 WLP-16-4 17 N0740 Data Sheet 4 V2.0, 2010-01-15 BGF117 High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter Table 1 Maximum Ratings Parameter Symbol Values Min. VP TOP TSTG Voltage at all pins to GND Operating temperature range Storage temperature range Typ. Unit Max. Note / Test Condition 0 5.5 V -40 +85 °C -65 +150 °C -15 15 kV Contact discharge -2 2 kV Contact discharge Unit Note / Test Condition Electrostatic Discharge According to IEC61000-4-2 External IOs: A3, A4, B2, B4, C4, D3, D4 Internal IOs: A1, A2, B1, C1, D1, D2 Table 2 VE VI Electrical Characteristics1) Parameter Symbol Resistors R1...R6 Resistors R7...R11 Reverse current of ESD protection diodes Breakdown voltage of ESD diodes 2) Line capacitance3) Capacitance of each line to GND 1) at TA = 25 °C R1...6 R7...11 IR V(BR) Values Min. Typ. Max. 36 40 44 Ω 20 25 30 kΩ 5 100 nA 18.5 -12.5 – V 8 9.5 pF – CT VR = 3 V I(BR) = 1 mA I(BR) = -1 mA VR = 0 V 2) After snap-back 3) B2 is connected to GND for measurement Data Sheet 5 V2.0, 2010-01-15 BGF117 High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter Typical electrical characteristics Typical forward transmission of line B1 - B4 0 -5 -10 S21 [dB] -15 -20 -25 -30 -35 -40 -45 -50 100E+3 1E+6 10E+6 100E+6 1E+9 10E+9 f [Hz] Figure 2 Typical filter characteristics of one filter channel (ZS = ZL= 50 Ohm, VR=0V) Cline [pF] Typical line capacitance to GND 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 Vline [V] Figure 3 Data Sheet Typical line capacitance versus bias voltage 6 V2.0, 2010-01-15 BGF117 High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter Application & signal routing Top layer Second layer DAT3 dat 2 dat 3 CMD cmd clk dat 0 dat 1 Vcc CLK GND µSD card contacts face down µSD-Host BGF117 solder balls face down DAT2 Vcc DAT0 DAT1 µSD Card contact spring Figure 4 Application example with signal routing Pull-up resistors for the data and command lines are integrated in BGF117 (R7 to R11) to prevent bus floating in case no card is inserted or all card drivers are in high impedance mode. Package outline 1.55 ±0.05 3 x 0.4 = 1.2 0.6 ±0.05 (0.175 ±0.05) (0.175 ±0.05) A C2 D4 C3 B1 B2 C4 B3 A1 A2 B4 A3 1.55 ±0.05 D2 C1 (0.175 ±0.05) D3 (0.175 ±0.05) 0.4 D1 3 x 0.4 = 1.2 SEATING PLANE 3) Pin 1 Corner Index Area 2) 0.4 0.1 C 0.2 ±0.05 STANDOFF B A4 C 0.25 ±0.04 0.08 C 16x COPLANARITY 1) 16x ø0.05 M A B 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) Pin 1 corner identified by marking 3) Primary datum C and seating plane are defined by the spherical crowns of the balls WLP-16-4-N-PO V01 Figure 5 Data Sheet Package outline for WLP-16-4 (dimensions in mm) 7 V2.0, 2010-01-15 BGF117 High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter Footprint 1.2 1.2 0.4 0.4 0.25 WLP-16-4-N-FP V01 Figure 6 Recommended PCB pad design for reflow soldering (dimensions in mm) Tape 0.23 1.8 Pin 1 Corner Index Area Figure 7 Data Sheet 8 4 1.8 0.8 WLP-16-4-N-TP V01 Tape for BGF117 / WLP-16-4 (dimensions in mm) 8 V2.0, 2010-01-15