PHILIPS 74ALVCH16600

INTEGRATED CIRCUITS
74ALVCH16600
18-bit universal bus transceiver (3-State)
Product specification
Supersedes data of 1998 Aug
IC24 Data Handbook
1998 Sep 24
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
FEATURES
74ALVCH16600
DESCRIPTION
• Complies with JEDEC standard no. 8-1A.
• CMOS low power consumption
• Direct interface with TTL levels
• Current drive ± 24 mA at 3.0 V
• All inputs have bus hold circuitry
• Output drive capability 50Ω transmission lines @ 85°C
• MULTIBYTETM flow-through standard pin-out architecture
• Low inductance multiple VCC and ground pins for minimum noise
The 74ALVCH16600 is an 18-bit universal transceiver featuring
non-inverting 3-State bus compatible outputs in both send and
receive directions. Data flow in each direction is controlled by output
enable (OEAB and OEBA), latch enable (LEAB and LEBA), and clock
(CPAB and CPBA) inputs. For A-to-B data flow, the device operates
in the transparent mode when LEAB is High. When LEAB is Low, the
A data is latched if CPAB is held at a High or Low logic level. If LEAB
is Low, the A-bus data is stored in the latch/flip-flop on the
High-to-Low transition of CPAB. When OEAB is Low, the outputs are
active. When OEAB is High, the outputs are in the high-impedance
state. The High clock can be controlled with the clock-enable inputs
(CEBA/CEAB).
and ground bounce
Data flow for B-to-A is similar to that of A-to-B but uses OEBA, LEBA
and CPBA.
To ensure the high impedance state during power up or power
down, OEBA and OEAB should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the
current-sinking/current-sourcing capability of the driver.
Active bus hold circuitry is provided to hold unused or floating data
inputs at a valid logic level.
QUICK REFERENCE DATA
GND = 0V; Tamb = 25°C; tr = tf = 2.5ns
PARAMETER
SYMBOL
tPHL/tPLH
Propagation delay
An, Bn to Bn, An
CI/O
Input/Output capacitance
CI
Input capacitance
CPD
CONDITIONS
VCC = 2.5V, CL = 30pF
VCC = 3.3V, CL = 50pF
Power dissipation capacitance per latch
VI = GND to VCC1
TYPICAL
UNIT
3.1
2.8
ns
8.0
pF
4.0
pF
Outputs enabled
21
Outputs disabled
3
pF
NOTES:
1. CPD is used to determine the dynamic power dissipation (PD in W):
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where:
fi = input frequency in MHz; CL = output load capacitance in pF;
fo = output frequency in MHz; VCC = supply voltage in V;
(CL × VCC2 × fo) = sum of outputs.
ORDERING INFORMATION
PACKAGES
56-Pin Plastic TSSOP Type II
1998 Sep 24
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
DWG NUMBER
–40°C to +85°C
74ALVCH16600 DGG
SOT364-1
2
853-2123 20077
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
PIN CONFIGURATION
PIN DESCRIPTION
PIN NUMBER
SYMBOL
1
OEAB
Output enable A-to-B
2
LEAB
Latch enable A-to-B
3, 5, 6, 8, 9,
10, 12, 13, 14,
15, 16, 17, 19,
20, 21, 23, 24,
26
A0 to A17
Data inputs/outputs
B4
4, 11, 18, 25,
32, 39, 46, 53
GND
Ground (0V)
7, 22, 35, 50
VCC
Positive supply voltage
27
OEBA
Output enable B-to-A
28
LEBA
Latch enable B-to-A
OEAB
1
56
CEAB
LEAB
2
55
CPAB
A0
3
54
B0
GND
4
53
GND
A1
5
52
B1
A2
6
51
B2
VCC
7
50
VCC
A3
8
49
B3
A4
9
48
A5
10
47
B5
GND
11
46
GND
A6
12
45
B6
13
44
B7
A8
14
43
B8
29
CEBA
Clock enable B-to-A
30
CPBA
Clock input B-to-A
54, 52, 51, 49,
48, 47, 45, 44,
43, 42, 41, 40,
38, 37, 36, 34,
33, 31
B0 to B17
Data inputs/outputs
55
CPAB
Clock input A-to-B
56
CEAB
Clock enable A-to-B
A9
15
42
B9
A10
16
41
B10
A11
17
40
B11
GND
18
39
GND
A12
19
38
B12
A13
20
37
B13
A14
21
36
B14
VCC
22
35
VCC
A15
23
34
B15
A16
24
33
B16
GND
25
32
GND
A17
26
31
B17
OEBA
27
30
CPBA
LEBA
28
29
CEBA
LOGIC SYMBOL
55
56
3
5
A0
A1
B0
B1
54
52
6
8
9
10
A2
A3
A4
A5
B2
B3
B4
B5
51
49
48
47
12
13
14
15
A6
A7
A8
A9
B6
B7
B8
B9
45
44
43
42
16
17
19
20
A10
A11
A12
A13
B10
B11
B12
B13
41
40
38
37
21
23
24
26
A14
A15
A16
A17
B14
B15
B16
B17
36
34
33
31
OEAB
OEBA
LEAB
CPAB
CEAB
LEBA
27
28
CPBA
CEBA
30
29
SW00125
1998 Sep 24
NAME AND FUNCTION
A7
SW00124
1
2
74ALVCH16600
3
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
74ALVCH16600
LOGIC DIAGRAM (one section)
OEAB
CEAB
LEAB
CPAB
CPBA
LEBA
CEBA
OEBA
CE
C1
CP
1D
A1
B1
CE
C1
CP
1D
18 IDENTICAL CHANNELS
SW00131
FUNCTION TABLE
INPUTS
XX
H
L
h
l
X
↓
NC
Z
OUTPUTS
STATUS
CEXX
OEXX
LEXX
CPXX
DATA
X
H
X
X
X
Z
Disabled
X
X
L
L
H
H
X
X
H
L
H
L
Transparent
H
L
L
X
X
NC
L
L
L
L
L
L
↓
↓
h
l
H
L
L
L
L
L
L
L
H
L
X
X
NC
=
=
=
=
=
=
=
=
=
AB for A-to-B direction, BA for B-to-A direction
HIGH voltage level
LOW voltage level
HIGH state must be present one setup time before the LOW-to-HIGH transition of CPXX
LOW state must be present one setup time before the LOW-to-HIGH transition of CPXX
Don’t care
HIGH-to-LOW level transition
No change
High impedance “off” state
1998 Sep 24
4
Hold
Clock + display
Hold
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
LOGIC SYMBOL (IEEE/IEC)
OEAB
CEAB
CPAB
LEAB
1
56
BUSHOLD CIRCUIT
VCC
EN1
G2
55
2
74ALVCH16600
2C3
C3
G2
OEBA
CEBA
CPBA
LEBA
27
EN4
29
G5
30
28
Data Input
To internal circuit
5C6
C6
G5
A0
3
3D
4
1
54
B0
6D
A1
5
52
B1
A2
6
51
B2
A3
8
49
B3
A4
9
48
B4
A5
10
47
B5
A6
12
45
B6
A7
13
44
B7
A8
14
43
B8
A9
15
42
B9
A10
16
41
B10
A11
17
40
B11
A12
19
38
B12
A13
20
37
B13
A14
21
36
B14
A15
23
34
B15
A16
24
33
B16
A17
26
31
B17
SW00050
SW00126
1998 Sep 24
5
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
74ALVCH16600
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
VCC
PARAMETER
CONDITIONS
UNIT
MIN
MAX
DC supply voltage 2.5V range (for max. speed
performance @ 30 pF output load)
2.3
2.7
DC supply voltage 3.3V range (for max. speed
performance @ 50 pF output load)
3.0
3.6
V
VI
DC Input voltage range
0
VCC
V
VO
DC output voltage range
0
VCC
V
–40
+85
°C
0
0
20
10
ns/V
Tamb
Operating free-air temperature range
tr, tf
Input rise and fall times
VCC = 2.3 to 3.0V
VCC = 3.0 to 3.6V
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to GND (ground = 0V)
SYMBOL
VCC
IIK
PARAMETER
CONDITIONS
DC supply voltage
DC input diode current
VI 0
DC output diode current
VO VCC or VO 0
DC output voltage
Note 1
IO
DC output source or sink current
VO = 0 to VCC
DC VCC or GND current
Storage temperature range
For temperature range: –40 to +125 °C
above +55°C derate linearly with 8 mW/K
NOTE:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Sep 24
–50
mA
–0.5 to VCC +0.5
VO
Power dissipation per package
–plastic thin-medium-shrink (TSSOP)
V
For data inputs1
IOK
PTOT
–0.5 to +4.6
–0.5 to +4.6
DC in
input
ut voltage
Tstg
UNIT
For control pins1
VI
IGND, ICC
RATING
6
V
50
mA
–0.5 to VCC +0.5
V
50
mA
100
mA
–65 to +150
°C
600
mW
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
74ALVCH16600
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V).
LIMITS
SYMBOL
PARAMETER
VIH
HIGH level Input voltage
VIL
LOW level Input voltage
VOH
O
HIGH level output voltage
TEST CONDITIONS
Temp = -40°C to +85°C
MIN
TYP1
VCC = 2.3 to 2.7V
1.7
1.2
VCC = 2.7 to 3.6V
2.0
1.5
UNIT
MAX
V
VCC = 2.3 to 2.7V
1.2
0.7
VCC = 2.7 to 3.6V
1.5
0.8
V
3 to 3
6V; VI = VIH or VIL; IO = –100µA
100µA
VCC = 2
2.3
3.6V;
02
VCC0.2
VCC
VCC = 2.3V; VI = VIH or VIL; IO = –6mA
VCC0.3
VCC0.08
VCC = 2.3V; VI = VIH or VIL; IO = –12mA
VCC0.6
VCC0.26
VCC = 2.7V; VI = VIH or VIL; IO = –12mA
VCC0.5
VCC0.14
VCC = 3.0V; VI = VIH or VIL; IO = –12mA
VCC0.6
VCC0.09
VCC = 3.0V; VI = VIH or VIL; IO = –24mA
VCC1.0
VCC0.28
V
VCC = 2
2.3
3 to 3
3.6V;
6V; VI = VIH or VIL; IO = 100µA
GND
0 20
0.20
V
VCC = 2.3V; VI = VIH or VIL; IO = 6mA
0.07
0.40
V
VCC = 2.3V; VI = VIH or VIL; IO = 12mA
0.15
0.70
VCC = 2.7V; VI = VIH or VIL; IO = 12mA
0.14
0.40
VCC = 3.0V; VI = VIH or VIL; IO = 24mA
0.27
0.55
Input leakage
g current
VCC = 2
2.3
3 to 3
3.6V;
6V;
VI = VCC or GND
0.1
5
µA
µ
IOZ
3-State output OFF-state current
VCC = 2.7 to 3.6V; VI = VIH or VIL;
VO = VCC or GND
0.1
10
µA
ICC
Quiescent supply current
VCC = 2.3 to 3.6V; VI = VCC or GND; IO = 0
0.2
40
µA
∆ICC
Additional quiescent supply current
VCC = 2.3V to 3.6V; VI = VCC – 0.6V; IO = 0
150
750
µA
IBHL
Bus hold LOW sustaining current
IBHH
Bus hold HIGH sustaining current
IBHLO
Bus hold LOW overdrive current
VCC = 3.6V2
500
µA
IBHHO
Bus hold HIGH overdrive current
VCC = 3.6V2
–500
µA
VOL
II
LOW level output voltage
VCC = 2.3V; VI = 0.7V2
45
–
0.8V2
75
150
VCC = 2.3V; VI = 1.7V2
–45
2.0V2
–75
VCC = 3.0V; VI =
VCC = 3.0V; VI =
NOTES:
1. All typical values are at Tamb = 25°C.
2. Valid for data inputs of bus hold parts.
1998 Sep 24
7
–175
V
µA
µA
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
74ALVCH16600
AC CHARACTERISTICS FOR VCC = 2.3V TO 2.7V RANGE
GND = 0V; tr = tf ≤ 2.0ns; CL = 30pF
LIMITS
SYMBOL
PARAMETER
Propagation delay
An, Bn to Bn, An
tPHL/tPLH
Propagation delay
LEAB, LEBA to Bn, An
VCC = 2.5V ± 0.2V
WAVEFORM
1, 2
Propagation delay
CPAB, CPBA to Bn, An
UNIT
MIN
TYP1
MAX
1.0
3.1
5.2
1.0
3.6
6.2
1.0
3.8
7.3
ns
tPZH/tPZL
3-State output enable time
OEBA, OEAB to An, Bn
3
1.0
3.1
6.5
ns
tPHZ/tPLZ
3-State output enable time
OEBA, OEAB to An, Bn
3
1.0
2.8
5.1
ns
3.3
1.6
–
3.3
2.0
–
tW
tSU
Pulse width HIGH
LEAB, LEBA
2
Pulse width HIGH or LOW
CPAB, CPBA
Set-up time
An, Bn to CPAB, CPBA
4
1.3
–0.1
–
Set-up time
An, Bn to LEAB, LEBA
4
1.2
0.1
–
Set-up time
CEAB, CEBA to CPAB, CPBA
4
0.7
–0.4
–
1.5
0.6
–
1.2
0.6
–
1.4
2.0
–
150
335
–
Hold time
An, Bn to CPAB, CPBA
th
Hold time
An, Bn to LEAB, LEBA
4
Maximum clock frequency
NOTE:
1. All typical values are at VCC = 2.5V and Tamb = 25°C.
1998 Sep 24
ns
4
Hold time
CEAB, CEBA to CPAB, CPBA
fMAX
ns
8
ns
MHz
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
74ALVCH16600
AC CHARACTERISTICS FOR VCC = 3.0V TO 3.6V RANGE AND VCC = 2.7V
GND = 0V; tr = tf = 2.5ns; CL = 50pF
LIMITS
SYMBOL
PARAMETER
WAVEFORM
Propagation delay
An, Bn to Bn, An
tPHL/tPLH
Propagation delay
LEAB, LEBA to Bn, An
1, 2
Propagation delay
CPAB, CPBA to Bn, An
VCC = 3.3V ±0.3V
MIN
TYP1
MAX
1.0
2.8
1.0
VCC = 2.7V
MIN
UNIT
TYP
MAX
4.2
3.1
4.7
3.1
4.9
3.4
5.5
1.3
2.9
5.7
3.8
6.8
ns
tPZH/tPZL
3-State output enable time
OEBA to An
3
1.1
2.8
5.2
3.3
6.3
ns
tPHZ/tPLZ
3-State output disable time
OEBA to An
3
1.2
3.2
4.4
3.3
4.7
ns
3.3
1.0
3.3
1.0
3.3
1.1
3.3
1.4
tW
tSU
LE pulse width
LEAB, LEBA to CPAB, CPBA
Set-up time
An, Bn to CPAB, CPBA
4
1.2
–0.1
1.3
–0.4
Set-up time
An, Bn to LEAB, LEBA
4
1.1
0.3
1.1
–0.2
Set-up time
CEAB, CEBA to CPAB, CPBA
4
0.8
–0.2
0.7
–0.7
1.5
0.4
1.8
0.4
1.3
0.1
1.6
0.1
1.4
0.4
1.7
0.6
150
362
150
350
4
Maximum clock frequency
NOTE:
1. All typical values are at VCC = 3.3V and Tamb = 25°C.
1998 Sep 24
ns
4
Hold time
An, Bn to LEAB, LEBA
Hold time
CEAB, CEBA to CPAB, CPBA
fMAX
ns
LE pulse width HIGH or LOW
CPAB, CPBA
Hold time
An, Bn to CPAB, CPBA
th
2
9
ns
MHz
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
74ALVCH16600
AC WAVEFORMS
VCC = 2.3 TO 2.7 V RANGE
1. VM = 0.5 V
2. VX = VOL + 0.15V
3. VY = VOH – 0.15V
4. VI = VCC
5. VOL and VOH are the typical output voltage drop that occur with
the output load.
VCC = 3.0 TO 3.6 V RANGE AND VCC = 2.7 V
1. VM = 1.5 V
2. VX = VOL + 0.3V
3. VY = VOH – 0.3V
4. VI = 2.7 V
5. VOL and VOH are the typical output voltage drop that occur with
the output load.
VI
OEXX INPUT
VM
GND
tPLZ
tPZL
VCC
OUTPUT
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
tPHZ
tPZH
VOH
VI
An, Bn
INPUT
VY
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
VM
VM
GND
outputs
enabled
GND
tPHL
tPLH
outputs
disabled
outputs
enabled
VOH
SW00127
Bn, An
OUTPUT
Waveform 3. 3-State enable and disable times
ÉÉÉ ÉÉÉÉÉÉÉÉ
ÉÉÉ
ÉÉÉ ÉÉÉÉÉÉÉÉ
ÉÉÉ
ÉÉÉ ÉÉÉÉÉÉÉÉ
ÉÉÉ
VM
VOL
VI
SW00083
An, Bn
INPUT
Waveform 1. Input (An, Bn) to output (Bn, An) propagation
delay times
VM
GND
th
tSU
th
tSU
VI
CPXX
INPUT
VI
CPXX, LEXX
INPUT
GND
VM
LEXX
INPUT
GND
VOH
An, Bn
OUTPUT
NOTE: The unshaded areas indicate when the input is permitted to change for
predictable output performance.
tW
tPHL
SW00093
tPLH
Waveform 4. Data set-up and hold times for the An and Bn
inputs to the LEAB, LEBA, CPAB and CPBA inputs
VM
VOL
SW00084
Waveform 2. Latch enable input (LEAB, LEBA) and clock pulse
input (CPAB, CPBA) to output (An, Bn) propagation delays and
latch enable pulse width
1998 Sep 24
VM
10
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
TEST CIRCUIT
S1
VCC
2VCC
Open
GND
RL=500 Ω
VIN
VOUT
PULSE
GENERATOR
D.U.T.
RT
RL=500 Ω
CL
Test Circuit for 3-State Outputs
SWITCH POSITION
TEST
SWITCH
VCC
VIN
tPLH/tPHL
Open
tPLZ/tPZL
2VCC
2.7V
2.7 – 3.6V
VCC
2.7V
tPHZ/tPZH
GND
DEFINITIONS
RL = Load resistor
CL = Load capacitance includes jig and probe capacitance
RT = Termination resistance should be equal to ZOUT
of pulse generators.
SW00047
Load circuitry for switching times
1998 Sep 24
11
74ALVCH16600
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm
1998 Sep 24
12
74ALVCH16600
SOT364-1
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
NOTES
1998 Sep 24
13
74ALVCH16600
Philips Semiconductors
Product specification
18-bit universal bus transceiver (3-State)
74ALVCH16600
DEFINITIONS
Data Sheet Identification
Product Status
Definition
Objective Specification
Formative or in Design
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
Preliminary Specification
Preproduction Product
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Product Specification
Full Production
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 06-98
Document order number:
1998 Sep 24
14
9397–750–04799