Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYQ30E, BYQ30EB, BYQ30ED series FEATURES SYMBOL • Low forward volt drop • Fast switching • Soft recovery characteristic • Reverse surge capability • High thermal cycling performance • Low thermal resistance QUICK REFERENCE DATA VR = 150 V/ 200 V VF ≤ 0.95 V a2 3 a1 1 IO(AV) = 16 A IRRM = 0.2 A k 2 trr ≤ 25 ns GENERAL DESCRIPTION Dual, ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode power supplies. The BYQ30E series is supplied in the SOT78 conventional leaded package. The BYQ30EB series is supplied in the SOT404 surface mounting package. The BYQ30ED series is supplied in the SOT428 surface mounting package. PINNING PIN SOT78 (TO220AB) SOT404 SOT428 DESCRIPTION 1 anode 1 2 cathode 1 3 anode 2 tab cathode tab tab tab 2 1 1 23 2 3 1 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. BYQ30E/ BYQ30EB/ BYQ30ED VRRM VRWM VR IO(AV) IFRM IFSM IRRM IRSM Tj Tstg Peak repetitive reverse voltage Working peak reverse voltage Continuous reverse voltage Average rectified output current (both diodes conducting) Repetitive peak forward current per diode Non-repetitive peak forward current per diode Peak repetitive reverse surge current per diode Peak non-repetitive reverse surge current per diode Operating junction temperature Storage temperature MAX. UNIT - -150 150 -200 200 V - 150 200 V - 150 200 V square wave; δ = 0.5; Tmb ≤ 104 ˚C - 16 A square wave; δ = 0.5; Tmb ≤ 104 ˚C - 16 A t = 10 ms t = 8.3 ms sinusoidal; with reapplied VRRM(max) tp = 2 µs; δ = 0.001 - 80 88 A A - 0.2 A tp = 100 µs - 0.2 A - 150 ˚C - 40 150 ˚C 1. It is not possible to make connection to pin 2 of the SOT428 or SOT404 packages. October 1998 1 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYQ30E, BYQ30EB, BYQ30ED series ESD LIMITING VALUE SYMBOL PARAMETER CONDITIONS VC Electrostatic discharge capacitor voltage Human body model; C = 250 pF; R = 1.5 kΩ MIN. MAX. UNIT - 8 kV THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-mb per diode both diodes SOT78 package, in free air SOT404 and SOT428 packages, pcb mounted, minimum footprint, FR4 board Rth j-a Thermal resistance junction to mounting base Thermal resistance junction to ambient MIN. - TYP. MAX. UNIT 60 50 3 2.5 - K/W K/W K/W K/W ELECTRICAL CHARACTERISTICS All characteristics are per diode at Tj = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS VF Forward voltage IR Reverse current Qrr trr1 trr2 Vfr Reverse recovered charge Reverse recovery time Reverse recovery time Forward recovery voltage IF = 8 A; Tj = 150˚C IF = 16 A; Tj = 150˚C IF = 16 A VR = VRWM VR = VRWM; Tj = 100˚C IF = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/µs IF = 1 A; VR ≥ 30 V; -dIF/dt = 100 A/µs IF = 0.5 A to IR = 1 A; Irec = 0.25 A IF = 1 A; dIF/dt = 10 A/µs October 1998 MIN. 2 - TYP. MAX. UNIT 0.84 1 1.12 4 0.3 4 20 12 1 0.95 1.15 1.25 30 0.6 11 25 22 - V V V µA mA nC ns ns V Rev 1.200 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged I dI F BYQ30E, BYQ30EB, BYQ30ED series R F dt t rr D.U.T. Voltage Pulse Source time Q I I R Current shunt 100% 10% s rrm Fig.4. Circuit schematic for trr2 Fig.1. Definition of trr1, Qs and Irrm I to ’scope F 0.5A IF 0A time I rec = 0.25A VF IR V fr trr2 VF I = 1A R time Fig.2. Definition of Vfr 12 10 Fig.5. Definition of trr2 Forward dissipation, PF (W) BYQ30 Tmb(max) / C Vo = 0.75 V Rs = 0.025 Ohms D = 1.0 120 0.5 8 I tp D= 2 0 2 4 6 8 Average forward current, IF(AV) (A) tp T t T 0 114 120 10 1.9 8 126 2.2 2.8 132 6 138 4 138 144 2 144 150 12 0 Fig.3. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x √D. October 1998 Tmb(max) / C Vo = 0.75 V Rs 0.025 Ohms 10 126 0.1 4 Forward dissipation, PF (W) BYQ30 a = 1.57 0.2 6 12 114 132 4 0 1 2 3 4 5 6 Average forward current, IF(AV) (A) 7 150 8 Fig.6. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). 3 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYQ30E, BYQ30EB, BYQ30ED series trr / ns 100 Qs / nC 1000 IF=10A 5A 2A 1A IF=10A 100 10 IF=1A 10 1 1.0 1 10 dIF/dt (A/us) 100 Fig.7. Maximum trr at Tj = 25 ˚C; per diode 10 1.0 10 -dIF/dt (A/us) 100 Fig.10. Maximum Qs at Tj = 25 ˚C; per diode Irrm / A 10 IF=10A Transient thermal impedance, Zth j-mb (K/W) 1 1 IF=1A 0.1 0.1 PD 0.01 0.001 1us 0.01 10 -dIF/dt (A/us) 1 100 Fig.8. Maximum Irrm at Tj = 25 ˚C; per diode 20 Forward current, IF (A) tp D= T 10us tp T t 100us 1ms 10ms 100ms 1s pulse width, tp (s) BYQ30E 10s Fig.11. Transient thermal impedance; per diode; Zth j-mb = f(tp). BYQ30 Tj = 25 C Tj = 150 C 15 10 typ max 5 0 0 0.5 1 1.5 Forward voltage, VF (V) 2 Fig.9. Typical and maximum forward characteristic IF = f(VF); parameter Tj October 1998 4 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYQ30E, BYQ30EB, BYQ30ED series MECHANICAL DATA Dimensions in mm 4,5 max Net Mass: 2 g 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 0,9 max (3x) 2,54 2,54 0,6 2,4 Fig.12. SOT78 (TO220AB); pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for SOT78 (TO220) envelopes. 2. Epoxy meets UL94 V0 at 1/8". October 1998 5 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYQ30E, BYQ30EB, BYQ30ED series MECHANICAL DATA Dimensions in mm 4.5 max 1.4 max 10.3 max Net Mass: 1.4 g 11 max 15.4 2.5 0.85 max (x2) 0.5 2.54 (x2) Fig.13. SOT404 : centre pin connected to mounting base. MOUNTING INSTRUCTIONS Dimensions in mm 11.5 9.0 17.5 2.0 3.8 5.08 Fig.14. SOT404 : soldering pattern for surface mounting. Notes 1. Epoxy meets UL94 V0 at 1/8". October 1998 6 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYQ30E, BYQ30EB, BYQ30ED series MECHANICAL DATA Dimensions in mm seating plane Net Mass: 1.1 g 6.73 max 1.1 tab 2.38 max 0.93 max 5.4 4 min 6.22 max 10.4 max 4.6 2 1 0.5 0.5 min 3 0.3 0.5 0.8 max (x2) 2.285 (x2) Fig.15. SOT428 : centre pin connected to tab. MOUNTING INSTRUCTIONS Dimensions in mm 7.0 7.0 2.15 1.5 2.5 4.57 Fig.16. SOT428 : minimum pad sizes for surface mounting. Notes 1. Plastic meets UL94 V0 at 1/8". October 1998 7 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYQ30E, BYQ30EB, BYQ30ED series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. October 1998 8 Rev 1.200