PHILIPS PCA9671DK

PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Rev. 01 — 20 December 2006
Product data sheet
1. General description
The PCA9671 provides general purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plus
(Fm+) family.
The PCA9671 is a drop in upgrade for the PCF8575 providing higher I2C-bus speeds
(1 MHz versus 400 kHz) so that the output can support PWM dimming of LEDs, higher
I2C-bus drive (30 mA versus 3 mA) so that many more devices can be on the bus without
the need for bus buffers, higher total package sink capacity (400 mA versus 100 mA) that
supports having all 25 mA LEDs on at the same time and more device addresses (64
versus 8) to allow many more devices on the bus without address conflicts.
The difference between the PCA9671 and the PCF8575 is that the interrupt output on the
PCF8575 is replaced by a RESET input on the PCA9671.
The device consists of a 16-bit quasi-bidirectional port and an I2C-bus interface. The
PCA9671 has a low current consumption and includes latched outputs with 25 mA high
current drive capability for directly driving LEDs. The internal Power-On Reset (POR),
hardware reset pin (RESET) or software reset sequence initializes the I/Os as inputs.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
n
1 MHz I2C-bus interface
Compliant with the I2C-bus Fast-mode and Standard-mode
SDA with 30 mA sink capability for 4000 pF buses
2.3 V to 5.5 V operation with 5.5 V tolerant I/Os
16-bit remote I/O pins that default to inputs at power-up
Latched outputs with 25 mA sink capability for directly driving LEDs
Total package sink capability of 400 mA
Active LOW reset input
64 programmable slave addresses using 3 address pins
Readable device ID (manufacturer, device type, and revision)
Low standby current
−40 °C to +85 °C operation
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
n Packages offered: SO24, SSOP24, QSOP24, TSSOP24, HVQFN24, DHVQFN24
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
3. Applications
n
n
n
n
n
n
n
n
LED signs and displays
Servers
Industrial control
Medical equipment
PLCs
Cellular telephones
Gaming machines
Instrumentation and test measurement
4. Ordering information
Table 1.
Ordering information
Type
number
Topside
mark
Package
Name
Description
Version
PCA9671D
PCA9671D
SO24
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
PCA9671DB
PCA9671DB
SSOP24
plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
PCA9671
SSOP24[1]
plastic shrink small outline package; 24 leads; body width 3.9 mm; SOT556-1
lead pitch 0.635 mm
PCA9671DK
PCA9671PW PCA9671PW TSSOP24
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
SOT355-1
PCA9671BQ
9671
DHVQFN24 plastic dual in-line compatible thermal enhanced very thin quad
flat package; no leads; 24 terminals; body 3.5 × 5.5 × 0.85 mm
SOT815-1
PCA9671BS
9671
HVQFN24
SOT616-1
[1]
plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 × 4 × 0.85 mm
Also known as QSOP24.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
2 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
5. Block diagram
PCA9671
AD0
AD1
AD2
SCL
SDA
I2C-BUS
CONTROL
INPUT
FILTER
SHIFT
REGISTER
P00 to P07
I/O
PORT
16 BITS
P10 to P17
RESET
VDD
VSS
write pulse
read pulse
POWER-ON
RESET
002aac244
Fig 1. Block diagram of PCA9671
write pulse
100 µA
VDD
IOH
Itrt(pu)
data from Shift Register
D
Q
P00 to P07
P10 to P17
FF
IOL
CI
S
power-on reset
VSS
D
Q
FF
read pulse
CI
S
to interrupt logic
data to Shift Register
002aab631
Fig 2. Simplified schematic diagram of P00 to P17
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
3 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
6. Pinning information
6.1 Pinning
RESET
1
1
2
24 VDD
23 SDA
RESET
AD1
AD1
2
24 VDD
23 SDA
AD2
3
22 SCL
AD2
3
22 SCL
P00
4
21 AD0
P00
4
21 AD0
P01
5
20 P17
P01
5
20 P17
P02
6
19 P16
P02
6
P03
7
18 P15
P03
7
P04
8
17 P14
P04
8
17 P14
P05
9
16 P13
P05
9
16 P13
P06 10
15 P12
P06 10
15 P12
P07 11
14 P11
P07 11
14 P11
VSS 12
13 P10
VSS 12
13 P10
PCA9671D
002aac245
Fig 3. Pin configuration for SO24
19 P16
18 P15
002aac246
Fig 4. Pin configuration for TSSOP24
RESET
1
1
24 VDD
2
24 VDD
23 SDA
RESET
AD1
AD1
2
23 SDA
AD2
3
22 SCL
AD2
3
22 SCL
P00
4
21 AD0
P00
4
21 AD0
P01
5
20 P17
P01
5
20 P17
P02
6
19 P16
P02
6
P03
7
18 P15
P03
7
P04
8
17 P14
P04
8
17 P14
P05
9
16 P13
P05
9
16 P13
P06 10
15 P12
P06 10
15 P12
P07 11
14 P11
P07 11
14 P11
VSS 12
13 P10
VSS 12
13 P10
PCA9671DK
002aac270
Fig 5. Pin configuration for SSOP24
(QSOP24)
PCA9671_1
Product data sheet
PCA9671PW
PCA9671DB
19 P16
18 P15
002aac247
Fig 6. Pin configuration for SSOP24
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
4 of 34
PCA9671
NXP Semiconductors
19 SCL
20 SDA
21 VDD
22 RESET
terminal 1
index area
23 AD1
24 AD2
1
terminal 1
index area
24 VDD
RESET
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
AD1
2
23 SDA
AD2
3
22 SCL
P00
4
21 AD0
P01
5
20 P17
P00
1
18 AD0
P02
6
P01
2
17 P17
P03
7
P02
3
16 P16
P04
8
17 P14
P03
4
15 P15
P05
9
16 P13
P04
5
14 P14
P06 10
15 P12
P05
6
13 P13
P07 11
14 P11
002aac248
P10 13
VSS 12
P12 12
9
VSS
P11 11
8
P07
P10 10
7
P06
PCA9671BS
PCA9671BQ
19 P16
18 P15
002aac271
Transparent top view
Transparent top view
Fig 7. Pin configuration for HVQFN24
Fig 8. Pin configuration for DHVQFN24
6.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
SO24, SSOP24, QSOP24, HVQFN24
TSSOP24, DHVQFN24
RESET
1
22
reset input (active LOW)
AD1
2
23
address input 1
AD2
3
24
address input 2
P00
4
1
quasi-bidirectional I/O 00
P01
5
2
quasi-bidirectional I/O 01
P02
6
3
quasi-bidirectional I/O 02
P03
7
4
quasi-bidirectional I/O 03
P04
8
5
quasi-bidirectional I/O 04
P05
9
6
quasi-bidirectional I/O 05
P06
10
7
quasi-bidirectional I/O 06
P07
11
8
quasi-bidirectional I/O 07
VSS
12[1]
9[1]
supply ground
P10
13
10
quasi-bidirectional I/O 10
P11
14
11
quasi-bidirectional I/O 11
P12
15
12
quasi-bidirectional I/O 12
P13
16
13
quasi-bidirectional I/O 13
P14
17
14
quasi-bidirectional I/O 14
P15
18
15
quasi-bidirectional I/O 15
P16
19
16
quasi-bidirectional I/O 16
P17
20
17
quasi-bidirectional I/O 17
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
5 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Table 2.
Symbol
Pin description …continued
Pin
Description
SO24, SSOP24, QSOP24, HVQFN24
TSSOP24, DHVQFN24
AD0
21
18
address input 0
SCL
22
19
serial clock line input
SDA
23
20
serial data line input/output
VDD
24
21
supply voltage
[1]
HVQFN and DHVQFN package die supply ground is connected to both the VSS pin and the exposed center
pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal,
electrical, and board-level performance, the exposed pad needs to be soldered to the board using a
corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
7. Functional description
Refer to Figure 1 “Block diagram of PCA9671”.
7.1 Device address
Following a START condition, the bus master must send the address of the slave it is
accessing and the operation it wants to perform (read or write). The address of the
PCA9671 is shown in Figure 9. Slave address pins AD2, AD1, and AD0 choose 1 of
64 slave addresses. To conserve power, no internal pull-up resistors are incorporated on
AD2, AD1, and AD0. Address values depending on AD2, AD1, and AD0 can be found in
Table 3 “PCA9671 address map”.
Remark: The General Call address (0000 0000) and the Device ID address (1111 100X)
are reserved and cannot be used as device address. Failure to follow this requirement will
cause the PCA9671 not to acknowledge.
Remark: Reserved I2C-bus addresses must be used with caution since they can interfere
with:
• “reserved for future use” I2C-bus addresses (0000 011, 1111 101, 1111 110,
1111 111)
• slave devices that use the 10-bit addressing scheme (1111 0xx)
• High speed mode (Hs-mode) master code (0000 1xx)
slave address
A6
A5
A4
A3
A2
programmable
A1
A0 R/W
002aab636
Fig 9. PCA9671 address
The last bit of the first byte defines the operation to be performed. When set to logic 1 a
read is selected, while a logic 0 selects a write operation.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
6 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
When AD2, AD1 and AD0 are held to VDD or VSS, the same address as the PCF8575 is
applied.
7.1.1 Address maps
Table 3.
PCA9671 address map
AD2
AD1
AD0
A6
A5
A4
A3
A2
A1
A0
Address (hex)
VSS
SCL
VSS
0
0
1
0
0
0
0
20h
VSS
SCL
VDD
0
0
1
0
0
0
1
22h
VSS
SDA
VSS
0
0
1
0
0
1
0
24h
VSS
SDA
VDD
0
0
1
0
0
1
1
26h
VDD
SCL
VSS
0
0
1
0
1
0
0
28h
VDD
SCL
VDD
0
0
1
0
1
0
1
2Ah
VDD
SDA
VSS
0
0
1
0
1
1
0
2Ch
VDD
SDA
VDD
0
0
1
0
1
1
1
2Eh
VSS
SCL
SCL
0
0
1
1
0
0
0
30h
VSS
SCL
SDA
0
0
1
1
0
0
1
32h
VSS
SDA
SCL
0
0
1
1
0
1
0
34h
VSS
SDA
SDA
0
0
1
1
0
1
1
36h
VDD
SCL
SCL
0
0
1
1
1
0
0
38h
VDD
SCL
SDA
0
0
1
1
1
0
1
3Ah
VDD
SDA
SCL
0
0
1
1
1
1
0
3Ch
VDD
SDA
SDA
0
0
1
1
1
1
1
3Eh
VSS
VSS
VSS
0
1
0
0
0
0
0
40h
VSS
VSS
VDD
0
1
0
0
0
0
1
42h
VSS
VDD
VSS
0
1
0
0
0
1
0
44h
VSS
VDD
VDD
0
1
0
0
0
1
1
46h
VDD
VSS
VSS
0
1
0
0
1
0
0
48h
VDD
VSS
VDD
0
1
0
0
1
0
1
4Ah
VDD
VDD
VSS
0
1
0
0
1
1
0
4Ch
VDD
VDD
VDD
0
1
0
0
1
1
1
4Eh
VSS
VSS
SCL
0
1
0
1
0
0
0
50h
VSS
VSS
SDA
0
1
0
1
0
0
1
52h
VSS
VDD
SCL
0
1
0
1
0
1
0
54h
VSS
VDD
SDA
0
1
0
1
0
1
1
56h
VDD
VSS
SCL
0
1
0
1
1
0
0
58h
VDD
VSS
SDA
0
1
0
1
1
0
1
5Ah
VDD
VDD
SCL
0
1
0
1
1
1
0
5Ch
VDD
VDD
SDA
0
1
0
1
1
1
1
5Eh
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
7 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Table 3.
PCA9671 address map …continued
AD2
AD1
AD0
A6
A5
A4
A3
A2
A1
A0
Address (hex)
SCL
SCL
VSS
1
0
1
0
0
0
0
A0h
SCL
SCL
VDD
1
0
1
0
0
0
1
A2h
SCL
SDA
VSS
1
0
1
0
0
1
0
A4h
SCL
SDA
VDD
1
0
1
0
0
1
1
A6h
SDA
SCL
VSS
1
0
1
0
1
0
0
A8h
SDA
SCL
VDD
1
0
1
0
1
0
1
AAh
SDA
SDA
VSS
1
0
1
0
1
1
0
ACh
SDA
SDA
VDD
1
0
1
0
1
1
1
AEh
SCL
SCL
SCL
1
0
1
1
0
0
0
B0h
SCL
SCL
SDA
1
0
1
1
0
0
1
B2h
SCL
SDA
SCL
1
0
1
1
0
1
0
B4h
SCL
SDA
SDA
1
0
1
1
0
1
1
B6h
SDA
SCL
SCL
1
0
1
1
1
0
0
B8h
SDA
SCL
SDA
1
0
1
1
1
0
1
BAh
SDA
SDA
SCL
1
0
1
1
1
1
0
BCh
SDA
SDA
SDA
1
0
1
1
1
1
1
BEh
SCL
VSS
VSS
1
1
0
0
0
0
0
C0h
SCL
VSS
VDD
1
1
0
0
0
0
1
C2h
SCL
VDD
VSS
1
1
0
0
0
1
0
C4h
SCL
VDD
VDD
1
1
0
0
0
1
1
C6h
SDA
VSS
VSS
1
1
0
0
1
0
0
C8h
SDA
VSS
VDD
1
1
0
0
1
0
1
CAh
SDA
VDD
VSS
1
1
0
0
1
1
0
CCh
SDA
VDD
VDD
1
1
0
0
1
1
1
CEh
SCL
VSS
SCL
1
1
1
0
0
0
0
E0h
SCL
VSS
SDA
1
1
1
0
0
0
1
E2h
SCL
VDD
SCL
1
1
1
0
0
1
0
E4h
SCL
VDD
SDA
1
1
1
0
0
1
1
E6h
SDA
VSS
SCL
1
1
1
0
1
0
0
E8h
SDA
VSS
SDA
1
1
1
0
1
0
1
EAh
SDA
VDD
SCL
1
1
1
0
1
1
0
ECh
SDA
VDD
SDA
1
1
1
0
1
1
1
EEh
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
8 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
7.2 Software Reset call, and device ID addresses
Two other different addresses can be sent to the PCA9671.
• General Call address: allows to reset the PCA9671 through the I2C-bus upon
reception of the right I2C-bus sequence. See Section 7.2.1 “Software Reset” for more
information.
• Device ID address: allows to read ID information from the device (manufacturer, part
identification, revision). See Section 7.2.2 “Device ID (PCA9671 ID field)” for more
information.
R/W
0
0
0
0
0
0
0
0
002aac155
Fig 10. General Call address
1
1
1
1
1
0
0
R/W
002aab638
Fig 11. Device ID address
7.2.1 Software Reset
The Software Reset Call allows all the devices in the I2C-bus to be reset to the power-up
state value through a specific formatted I2C-bus command. To be performed correctly, it
implies that the I2C-bus is functional and that there is no device hanging the bus.
The Software Reset sequence is defined as following:
1. A START command is sent by the I2C-bus master.
2. The reserved General Call I2C-bus address ‘0000 000’ with the R/W bit set to logic 0
(write) is sent by the I2C-bus master.
3. The PCA9671 device(s) acknowledge(s) after seeing the General Call address
‘0000 0000’ (00h) only. If the R/W bit is set to logic 1 (read), no acknowledge is
returned to the I2C-bus master.
4. Once the General Call address has been sent and acknowledged, the master sends
1 byte. The value of the byte must be equal to 06h.
a. The PCA9671 acknowledges this value only. If the byte is not equal to 06h, the
PCA9671 does not acknowledge it.
If more than 1 byte of data is sent, the PCA9671 does not acknowledge any more.
5. Once the right byte has been sent and correctly acknowledged, the master sends a
STOP command to end the Software Reset sequence: the PCA9671 then resets to
the default value (power-up value) and is ready to be addressed again within the
specified bus free time. If the master sends a Repeated START instead, no reset is
performed.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
9 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
The I2C-bus master must interpret a non-acknowledge from the PCA9671 (at any time) as
a ‘Software Reset Abort’. The PCA9671 does not initiate a reset of its registers.
The unique sequence that initiates a Software Reset is described in Figure 12.
SWRST Call I2C-bus address
S
0
0
0
0
0
START condition
0
0
SWRST data = 06h
0
A
0
R/W
acknowledge
from slave(s)
0
0
0
0
1
1
0
A
P
acknowledge
from slave(s)
PCA9671 is(are) reset.
Registers are set to default power-up values.
002aac281
Fig 12. Software Reset sequence
7.2.2 Device ID (PCA9671 ID field)
The Device ID field is a 3-byte read-only (24 bits) word giving the following information:
• 8 bits with the manufacturer name, unique per manufacturer (for example,
NXP Semiconductors).
• 13 bits with the part identification, assigned by manufacturer, the 7 MSBs with the
category ID and the 6 LSBs with the feature ID (for example, PCA9671 16-bit
quasi-output I/O expander).
• 3 bits with the die revision, assigned by manufacturer (for example, Rev X).
The Device ID is read-only, hardwired in the device and can be accessed as follows:
1. START command.
2. The master sends the Reserved Device ID I2C-bus address ‘1111 100’ with the R/W
bit set to logic 0 (write).
3. The master sends the I2C-bus slave address of the slave device it needs to identify.
The LSB is a ‘Don’t care’ value. Only one device must acknowledge this byte (the one
that has the I2C-bus slave address).
4. The master sends a Re-START command.
Remark: A STOP command followed by a START command will reset the slave state
machine and the Device ID read cannot be performed.
Remark: A STOP command or a Re-START command followed by an access to
another slave device will reset the slave state machine and the Device ID read cannot
be performed.
5. The master sends the Reserved Device ID I2C-bus address ‘1111 100’ with the R/W
bit set to logic 1 (read).
6. The device ID read can be done, starting with the 8 manufacturer bits (first byte +
4 MSB of the second byte), followed by the 13 part identification bits and then the
3 die revision bits (3 LSB of the third byte).
7. The master ends the reading sequence by NACKing the last byte, thus resetting the
slave device state machine and allowing the master to send the STOP command.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
10 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Remark: The reading of the Device ID can be stopped anytime by sending a NACK
command.
Remark: If the master continues to ACK the bytes after the third byte, the PCA9671
rolls back to the first byte and keeps sending the Device ID sequence until a NACK
has been detected.
For the PCA9671, the Device ID is as shown in Figure 13.
part identification
0
0
manufacturer
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
0
0
0
category identification
feature identification
revision
0
0
0
002aac249
Fig 13. PCA9671 ID
acknowledge from
slave to be identified
acknowledge from one
or several slave(s)
S
1
1
1
1
START condition
1
0
acknowledge from
slave to be identified
don't care
device ID address
0
0
A A6 A5 A4 A3 A2 A1 A0 X
R/W
I2C-bus slave address of
the device to be identified
acknowledge
from master
A
1
1
1
1
1
0
device ID address
acknowledge
from master
0
1
A
R/W
no acknowledge
from master
M7 M6 M5 M4 M3 M2 M1 M0 A C6 C5 C4 C3 C2 C1 C0 F5 A F4 P3 P2 P1 P0 R2 R1 R0 A
category identification
= 0000001
manufacturer name
= 00000000
P
revision = 000
feature identification
= 010100
STOP
condition
002aac335
If more than 2 bytes are read, the slave device loops back to the first byte (manufacturer byte)
and keeps sending data until the master generates a ‘no acknowledge’.
Fig 14. Device ID field reading
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
11 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
8. I/O programming
8.1 Quasi-bidirectional I/O architecture
The PCA9671’s 16 ports (see Figure 2) are entirely independent and can be used either
as input or output ports. Input data is transferred from the ports to the microcontroller in
the Read mode (see Figure 17). Output data is transmitted to the ports in the Write mode
(see Figure 16).
Every data transmission from the PCA9671 must consist of an even number of bytes, the
first byte will be referred to as P07 to P00, and the second byte as P17 to P10. The third
will be referred to as P07 to P00, and so on.
This quasi-bidirectional I/O can be used as an input or output without the use of a control
signal for data directions. At power-on the I/Os are HIGH. In this mode only a current
source (IOH) to VDD is active. An additional strong pull-up to VDD (Itrt(pu)) allows fast rising
edges into heavily loaded outputs. These devices turn on when an output is written HIGH,
and are switched off by the negative edge of SCL. The I/Os should be HIGH before being
used as inputs. After power-on, as all the I/Os are set HIGH, all of them can be used as
inputs. Any change in setting of the I/Os as either inputs or outputs can be done with the
write mode.
Remark: If a HIGH is applied to an I/O which has been written earlier to LOW, a large
current (IOL) will flow to VSS.
8.2 Writing to the port (Output mode)
To write, the master (microcontroller) first addresses the slave device. By setting the last
bit of the byte containing the slave address to logic 0 the Write mode is entered. The
PCA9671 acknowledges and the master sends the first data byte for P07 to P00. After the
first data byte is acknowledged by the PCA9671, the second data byte P17 to P10 is sent
by the master. Once again, the PCA9671 acknowledges the receipt of the data. Each 8-bit
data is presented on the port lines after it has been acknowledged by the PCA9671.
The number of data bytes that can be sent successively is not limited. After every two
bytes, the previous data is overwritten.
The first data byte in every pair refers to Port 0 (P07 to P00), whereas the second data
byte in every pair refers to Port 1 (P17 to P10). See Figure 15.
first byte
07
06
05
04
03
second byte
02
01
00
A
P07 P06 P05 P04 P03 P02 P01 P00
17
16
15
14
13
12
11
10
A
P17 P16 P15 P14 P13 P12 P11 P10
002aab634
Fig 15. Correlation between bits and ports
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
12 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SCL
1
2
3
4
5
6
7
8
slave address
data to port 0
SDA S A6 A5 A4 A3 A2 A1 A0 0
START condition
9
R/W
data to port 1
P P 1 P P P P P A P 1 P P P P P P A
A 07
06
15 14 13 12 11 10
04 03 02 01 00
17
P16
acknowledge
from slave
P05
acknowledge
from slave
acknowledge
from slave
write to port
tv(Q)
data output from port
tv(Q)
DATA A0 AND B0 VALID
data A0 and B0 valid
P05 output voltage
P05 pull-up ouput current
Itrt(pu)
IOH
P16 output voltage
Itrt(pu)
P16 pull-up ouput current
IOH
002aac250
Fig 16. Write mode (output)
8.3 Reading from a port (Input mode)
All ports programmed as input should be set to logic 1. To read, the master
(microcontroller) first addresses the slave device after it receives the interrupt. By setting
the last bit of the byte containing the slave address to logic 1 the Read mode is entered.
The data bytes that follow on the SDA are the values on the ports.
If the data on the input port changes faster than the master can read, this data may be
lost.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
13 of 34
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
1
2
3
4
5
6
7
8
9
P1x
P0x
SDA
S
0
1
0
0 A2 A1 A0 1
START condition
NXP Semiconductors
PCA9671_1
Product data sheet
SCL
A
R/W
acknowledge
from slave
DATA 00
A
acknowledge
from master
DATA 11
P0x
A
acknowledge
from master
P1x
A
DATA 00
acknowledge
from master
DATA 12
1
P
no acknowledge
from master
read from port 0
data into port 0
DATA 00
read from port 1
Rev. 01 — 20 December 2006
data into port 1
DATA 10
DATA 11
DATA12
002aac251
Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode).
PCA9671
14 of 34
© NXP B.V. 2006. All rights reserved.
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Fig 17. Read input port register, scenario 1
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
1
2
3
4
5
6
7
8
9
P1x
P0x
SDA
S
0
1
0
0 A2 A1 A0 1
START condition
NXP Semiconductors
PCA9671_1
Product data sheet
SCL
A
A
DATA 00
A
DATA 10
acknowledge
from master
R/W
acknowledge
from slave
P0x
P1x
A
DATA 03
acknowledge
from master
acknowledge
from master
DATA 12
1
P
no acknowledge
from master
read from port 0
tsu(D)
th(D)
data into port 0
DATA 00
DATA 01
DATA 02
DATA 03
th(D)
read from port 1
tsu(D)
Rev. 01 — 20 December 2006
data into port 1
DATA 10
DATA 11
DATA12
002aac252
Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode).
PCA9671
15 of 34
© NXP B.V. 2006. All rights reserved.
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Fig 18. Read input port register, scenario 2
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
8.4 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9671 in
a reset condition until VDD has reached VPOR. At that point, the reset condition is released
and the PCA9671 registers and I2C-bus/SMBus state machine will initialize to their default
states. Thereafter VDD must be lowered below 0.2 V to reset the device.
8.5 RESET input
A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The
PCA9671 registers and I2C-bus state machine will be held in their default state until the
RESET input is once again HIGH.
9. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
9.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 19).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 19. Bit transfer
9.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 20).
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
16 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SDA
SDA
SCL
SCL
S
P
START condition
STOP condition
mba608
Fig 20. Definition of START and STOP conditions
9.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 21).
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
I2C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 21. System configuration
9.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
17 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
2
S
8
9
clock pulse for
acknowledgement
START
condition
002aaa987
Fig 22. Acknowledgement on the I2C-bus
10. Application design-in information
10.1 Bidirectional I/O expander applications
In the 8-bit I/O expander application shown in Figure 23, P00 and P01 are inputs, and P02
to P07 are outputs. When used in this configuration, during a write, the input (P00 and
P01) must be written as HIGH so the external devices fully control the input ports. The
desired HIGH or LOW logic levels may be written to the I/Os used as outputs (P02 to
P07). During a read, the logic levels of the external devices driving the input ports (P00
and P01) and the previous written logic level to the output ports (P02 to P07) will be read.
The GPIO also has a reset line (RESET) that can be connected to an output pin of the
microprocessor. Since the device does not have an interrupt output, changes of the I/Os
can be monitored by reading the input registers. If both a RESET and INT are needed,
use the PCA9673.
VDD
VDD
CORE
PROCESSOR
VDD
SDA
SCL
RESET
A0
A1
A2
P00
P01
P02
P03
P04
P05
P06
P07
temperature sensor
battery status
control for latch
control for switch
control for audio
control for camera
control for MP3
002aac253
Fig 23. Bidirectional I/O expander application
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
18 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
10.2 High current-drive load applications
The GPIO has a maximum sinking current of 25 mA per bit. In applications requiring
additional drive, two port pins in the same octal may be connected together to sink up to
50 mA current. Both bits must then always be turned on or off together. Up to 8 pins (one
octal) can be connected together to drive 200 mA.
VDD
VDD
SDA
SCL
RESET
CORE
PROCESSOR
A0
A1
A2
VDD
P00
P01
P02
P03
P04
P05
P06
P07
LOAD
002aac254
Fig 24. High current-drive load application
11. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
VDD
supply voltage
Conditions
−0.5
+6
V
IDD
supply current
-
±100
mA
ISS
ground supply current
-
±600
mA
VI
input voltage
VSS − 0.5
5.5
V
II
input current
-
±20
mA
IO
output current
-
±50[1]
mA
Ptot
total power dissipation
-
600
mW
P/out
power dissipation per output
-
200
mW
Tstg
storage temperature
−65
+150
°C
Tamb
ambient temperature
−40
+85
°C
[1]
operating
Total package (maximum) output current is 600 mA.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
19 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
12. Static characteristics
Table 5.
Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VDD
supply voltage
2.3
-
5.5
V
IDD
supply current
operating mode; no load;
VI = VDD or VSS; fSCL = 400 kHz
-
200
500
µA
Istb
standby current
standby mode; no load;
VI = VDD or VSS
-
2.5
10
µA
VPOR
power-on reset voltage
-
1.8
2.0
V
−0.5
-
+0.3VDD V
[1]
Input SCL; input/output SDA
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
IOL
LOW-level output current
VOL = 0.4 V
20
-
-
mA
IL
leakage current
VI = VDD or VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
4
10
pF
VOL = 0.5 V; VDD = 2.3 V
12
27
-
mA
VOL = 0.5 V; VDD = 3.0 V
17
35
-
mA
VOL = 0.5 V; VDD = 4.5 V
25
42
-
mA
I/Os; P00 to P07 and P10 to P17
LOW-level output current[2]
IOL
current[2]
IOL(tot)
total LOW-level output
IOH
HIGH-level output current
Itrt(pu)
transient boosted pull-up current VOH = VSS; see Figure 16
Ci
Co
VOL = 0.5 V; VDD = 4.5 V
-
-
400
mA
VOH = VSS
−30
−150
−300
µA
−0.5
−1.0
-
mA
input capacitance
[3]
-
4
10
pF
output capacitance
[3]
-
4
10
pF
Input RESET
VIL
LOW-level input voltage
−0.5
-
+0.8
V
VIH
HIGH-level input voltage
2
-
5.5
V
ILI
input leakage current
−1
-
+1
µA
IOH
HIGH-level output current
−1
-
+1
µA
Ci
input capacitance
-
3
5
pF
Inputs AD0, AD1, AD2
VIL
LOW-level input voltage
−0.5
-
+0.3VDD V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
ILI
input leakage current
−1
-
+1
µA
Ci
input capacitance
-
3
5
pF
[1]
The power-on reset circuit resets the I2C-bus logic with VDD < VPOR and set all I/Os to logic 1 (with current source to VDD).
[2]
Each bit must be limited to a maximum of 25 mA and the total package limited to 400 mA due to internal busing limits.
[3]
The value is not tested, but verified on sampling basis.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
20 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
13. Dynamic characteristics
Table 6.
Dynamic characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
fSCL
SCL clock frequency
tBUF
Conditions
Standard-mode
I2C-bus
Fast-mode I2C-bus
Fast-mode
Plus I2C-bus
Unit
Min
Max
Min
Max
Min
Max
0
100
0
400
0
1000
bus free time between a
STOP and START
condition
4.7
-
1.3
-
0.5
-
µs
tHD;STA
hold time (repeated)
START condition
4.0
-
0.6
-
0.26
-
µs
tSU;STA
set-up time for a repeated
START condition
4.7
-
0.6
-
0.26
-
µs
tSU;STO
set-up time for STOP
condition
4.0
-
0.6
-
0.26
-
µs
tHD;DAT
data hold time
0
-
0
-
0
-
ns
tVD;ACK
data valid acknowledge
time [1]
0.3
3.45
0.1
0.9
0.05
0.45
µs
tVD;DAT
data valid time [2]
300
-
50
-
50
450
ns
tSU;DAT
data set-up time
250
-
100
-
50
-
ns
tLOW
LOW period of the SCL
clock
4.7
-
1.3
-
0.5
-
µs
tHIGH
HIGH period of the SCL
clock
4.0
-
0.6
-
0.26
-
µs
tf
fall time of both SDA and
SCL signals
-
300
20 + 0.1Cb [3]
300
-
120
ns
tr
rise time of both SDA and
SCL signals
-
1000
20 + 0.1Cb [3]
300
-
120
ns
tSP
pulse width of spikes that
must be suppressed by
the input filter [6]
-
50
-
50
-
50
ns
[4][5]
kHz
Port timing; CL ≤ 100 pF (see Figure 17 and Figure 16)
tv(Q)
data output valid time
-
4
-
4
-
4
µs
tsu(D)
data input set-up time
0
-
0
-
0
-
µs
th(D)
data input hold time
4
-
4
-
4
-
µs
Reset timing (see Figure 26)
tw(rst)
reset pulse width
4
-
4
-
4
-
ns
trec(rst)
reset recovery time
0
-
0
-
0
-
ns
trst
reset time
100
-
100
-
100
-
ns
[1]
tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
[2]
tVD;DAT = minimum time for SDA data out to be valid following SCL LOW.
[3]
Cb = total capacitance of one bus line in pF.
[4]
A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to
bridge the undefined region SCL’s falling edge.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
21 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
[5]
The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at
250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without
exceeding the maximum specified tf.
[6]
Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns.
protocol
START
condition
(S)
tSU;STA
bit 7
MSB
(A7)
tLOW
bit 6
(A6)
tHIGH
bit 0
(R/W)
STOP
condition
(P)
acknowledge
(A)
1/f
SCL
SCL
tBUF
tr
tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab175
Rise and fall times refer to VIL and VIH.
Fig 25. I2C-bus timing diagram
ACK or read cycle
START
SCL
SDA
30 %
trst
RESET
50 %
50 %
trec(rst)
50 %
tw(rst)
trst
50 %
P0n, P1n
output off
002aac282
Fig 26. Reset timing
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
22 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
14. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 27. Package outline SOT137-1 (SO24)
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
23 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
SOT340-1
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
0.8
0.4
8
o
0
o
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
OUTLINE
VERSION
SOT340-1
REFERENCES
IEC
JEDEC
JEITA
MO-150
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 28. Package outline SOT340-1 (SSOP24)
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
24 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm
D
E
SOT556-1
A
X
c
y
HE
v M A
Z
13
24
A2
A
(A 3)
A1
θ
Lp
L
12
1
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.73
0.25
0.10
1.55
1.40
0.25
0.31
0.20
0.25
0.18
8.8
8.6
4.0
3.8
0.635
6.2
5.8
1
0.89
0.41
0.25
0.18
0.1
1.05
0.66
8
o
0
inches
0.068
0.0098 0.061
0.0040 0.055
0.01
0.012 0.0098 0.344 0.157
0.244
0.035
0.025
0.041
0.008 0.0075 0.337 0.150
0.228
0.016
0.01
0.007 0.004
0.040
0.026
8o
o
0
o
Note
1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included.
OUTLINE
VERSION
SOT556-1
REFERENCES
IEC
JEDEC
JEITA
MO-137
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 29. Package outline SOT556-1 (SSOP24)
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
25 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
D
SOT355-1
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT355-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 30. Package outline SOT355-1 (TSSOP24)
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
26 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm
B
D
SOT815-1
A
A
E
A1
c
detail X
terminal 1
index area
C
e1
terminal 1
index area
e
y1 C
v M C A B
w M C
b
2
y
11
L
12
1
e2
Eh
24
13
23
14
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
5.6
5.4
4.25
3.95
3.6
3.4
2.25
1.95
0.5
4.5
1.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT815-1
---
---
---
EUROPEAN
PROJECTION
ISSUE DATE
03-04-29
Fig 31. Package outline SOT815-1 (DHVQFN24)
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
27 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
B
D
SOT616-1
terminal 1
index area
A
A1
E
c
detail X
e1
C
1/2 e
e
12
y
y1 C
v M C A B
w M C
b
7
L
13
6
e
e2
Eh
1/2 e
1
18
terminal 1
index area
24
19
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.5
2.5
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT616-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-22
Fig 32. Package outline SOT616-1 (HVQFN24)
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
28 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
15. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
16. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
29 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 33) than a PbSn process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 33.
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
30 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 33. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Abbreviations
Table 9.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
ESD
ElectroStatic Discharge
GPIO
General Purpose Input/Output
HBM
Human Body Model
I2C-bus
Inter-Integrated Circuit bus
I/O
Input/Output
IC
Integrated Circuit
ID
Identification
LED
Light Emitting Diode
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
PLC
Programmable Logic Controller
PWM
Pulse Width Modulation
RAID
Redundant Array of Independent Disks
SMBus
System Management Bus
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
31 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
18. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9671_1
20061220
Product data sheet
-
-
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
32 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
19.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
PCA9671_1
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 01 — 20 December 2006
33 of 34
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
21. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.1.1
7.2
7.2.1
7.2.2
8
8.1
8.2
8.3
8.4
8.5
9
9.1
9.1.1
9.2
9.3
10
10.1
10.2
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
19
19.1
19.2
19.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6
Address maps. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Software Reset call, and device ID addresses . 9
Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . 9
Device ID (PCA9671 ID field) . . . . . . . . . . . . . 10
I/O programming . . . . . . . . . . . . . . . . . . . . . . . 12
Quasi-bidirectional I/O architecture . . . . . . . . 12
Writing to the port (Output mode) . . . . . . . . . . 12
Reading from a port (Input mode) . . . . . . . . . 13
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 16
RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Characteristics of the I2C-bus. . . . . . . . . . . . . 16
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
START and STOP conditions . . . . . . . . . . . . . 16
System configuration . . . . . . . . . . . . . . . . . . . 17
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application design-in information . . . . . . . . . 18
Bidirectional I/O expander applications . . . . . 18
High current-drive load applications . . . . . . . . 19
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 19
Static characteristics. . . . . . . . . . . . . . . . . . . . 20
Dynamic characteristics . . . . . . . . . . . . . . . . . 21
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
Handling information. . . . . . . . . . . . . . . . . . . . 29
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Introduction to soldering . . . . . . . . . . . . . . . . . 29
Wave and reflow soldering . . . . . . . . . . . . . . . 29
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 29
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 30
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 32
Legal information. . . . . . . . . . . . . . . . . . . . . . . 33
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
19.4
20
21
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Contact information . . . . . . . . . . . . . . . . . . . . 33
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 20 December 2006
Document identifier: PCA9671_1