INTEGRATED CIRCUITS
DATA SHEET
UBA2021
630 V driver IC for CFL and TL
lamps
Product specification
Supersedes data of 2000 Jul 24
File under Integrated Circuits, IC11
2001 Jan 30
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
FEATURES
GENERAL DESCRIPTION
• Adjustable preheat and ignition time
The UBA2021 is a high-voltage IC intended to drive and
control Compact Fluorescent Lamps (CFL) or fluorescent
TL-lamps. It contains a driver circuit for an external
half-bridge, an oscillator and a control circuit for starting
up, preheating, ignition, lamp burning and protection.
• Adjustable preheat current
• Adjustable lamp power
• Lamp temperature stress protection at higher mains
voltages
• Capacitive mode protection
• Protection against a too-low drive voltage for the power
MOSFETs.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
High voltage supply
VFS
IFS < 15 µA; t < 0.5 s −
high side supply voltage
−
630
V
Start-up state
VVS(start)
oscillator start voltage
−
11.95
−
V
VVS(stop)
oscillator stop voltage
−
10.15
−
V
IVS(standby)
standby current
−
200
−
µA
−
108
−
kHz
−
666
−
ms
−
−600
−
mV
VVS = 11 V
Preheat mode
fstart
start frequency
tph
preheat time
VRS(ctrl)
control voltage at pin RS
CCP = 100 nF
Frequency sweep to ignition
fB
bottom frequency
−
42.9
−
kHz
tign
ignition time
−
625
−
ms
Normal operation
fB
bottom frequency
−
42.9
−
kHz
tno
non-overlap time
−
1.4
−
µs
Itot
total supply current
−
1
−
mA
RG1(on), RG2(on) high and low side on resistance
−
126
−
Ω
RG1(off), RG2(off) high and low side off resistance
−
75
−
Ω
IRHV = 0.75 mA
−
63.6
−
kHz
IRHV = 1.0 mA
−
84.5
−
kHz
0
−
1000
µA
fB = 43 kHz
Feed-forward
fff
Ii(RHV)
2001 Jan 30
feed-forward frequency
operating range of input current at pin RHV
2
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
UBA2021T
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
UBA2021P
DIP14
plastic dual in-line package; 14 leads (300 mil)
SOT27-1
BLOCK DIAGRAM
VS
handbook, full pagewidth
RHV
5
13
RREF CF
10
12
CI
14
bootstrap
charging circuit
SB
SUPPLY
n.c.
4
1
OSCILLATOR
LEVEL
SHIFTER
HIGH SIDE
DRIVER
BAND GAP
REFERENCE
CP
RS
8
9
TIMING
RS
MONITOR
NON
OVERLAP
CONTROL
LOW SIDE
DRIVER
2
3
6
7
UBA2021
11
MGS988
SGND
Fig.1 Block diagram.
2001 Jan 30
3
FS
G1
S1
G2
PGND
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
PINNING
SYMBOL
PIN
FS
G1
S1
n.c.
VS
G2
PGND
DESCRIPTION
1
2
3
high side floating supply voltage
4
5
6
7
high-voltage spacer, not to be connected
gate high transistor (T1)
source high transistor (T1)
low voltage supply
gate low transistor (T2)
power ground
timing/averaging capacitor
RREF
8
9
10
SGND
11
signal ground
CF
12
13
14
oscillator capacitor
CP
RS
RHV
CI
current monitoring input
reference resistor
start-up resistor/feed-forward resistor
integrating capacitor
handbook, halfpage
handbook, halfpage
FS
1
14 CI
FS
1
14 CI
G1
2
13 RHV
G1
2
13 RHV
S1
3
12 CF
S1
3
12 CF
n.c.
4
UBA2021T 11 SGND
n.c.
4
UBA2021P 11 SGND
VS
5
10 RREF
VS
5
10 RREF
G2
6
9
RS
G2
6
9
PGND
7
8 CP
PGND
7
8 CP
MGS989
MGS990
Fig.2 Pin configuration (SO14).
2001 Jan 30
RS
Fig.3 Pin configuration (DIP14).
4
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
FUNCTIONAL DESCRIPTION
Introduction
MGS991
handbook, halfpage
The UBA2021 is an integrated circuit for electronically
ballasted compact fluorescent lamps and their derivatives
operating with mains voltages up to 240 V (RMS). It
provides all the necessary functions for preheat, ignition
and on-state operation of the lamp. In addition to the
control function, the IC provides level shift and drive
functions for the two discrete power MOSFETs, T1 and T2
(see Fig.7).
start-up
VCF
0
internal
clock
0
V(G1-S1)
0
Initial start-up
V(G2)
Initial start-up is achieved by charging capacitor CS9 with
the current applied to pin RHV. At start-up, MOSFET T2
conducts and T1 is non-conducting, ensuring Cboot
becomes charged. This start-up state is reached for a
supply voltage VVS(reset) (this is the voltage level at pin VS
at which the circuit will be reset to the initial state) and
maintained until the low voltage supply (VVS) reaches a
value of VVS(start). The circuit is reset in the start-up state.
t no
t no
0
time
Fig.4 Oscillator timing.
Operation in the preheat mode
Oscillation
The circuit starts oscillating at approximately 2.5 × fB
(108 kHz). The frequency gradually decreases until a
defined value of current Ishunt is reached (see Fig.5). The
slope of the decrease in frequency is determined by
capacitor CCI. The frequency during preheating is
approximately 90 kHz. This frequency is well above the
resonant frequency of the load, which means that the lamp
is off; the load consists of L2, C5 and the electrode
resistance only. The preheat time is determined by
capacitor CCP. The circuit can be locked in the preheat
state by connecting pin CP to ground. During preheating,
the circuit monitors the load current by measuring the
voltage drop over external resistor Rshunt at the end of
conduction of T2 with decision level VRS(ctrl). The
frequency is decreased as long as VRS > VRS(ctrl). The
frequency is increased for VRS < VRS(ctrl).
When the low voltage supply (VVS) has reached the value
of VVS(start) the circuit starts oscillating in the preheat state.
The internal oscillator is a current-controlled circuit which
generates a sawtooth waveform. The frequency of the
sawtooth is determined by the capacitor CCF and the
current out of pin CF (mainly set by RRREF). The sawtooth
frequency is twice the frequency of the signal across the
load. The IC brings MOSFETs T1 and T2 alternately into
conduction with a duty factor of approximately 50%.
Figure 4 represents the timing of the IC. The circuit block
'non-overlap' generates a non-overlap time tno that
ensures conduction periods of exclusively T1 or T2. Time
tno is dependent on the reference current IRREF.
2001 Jan 30
5
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
Feed-forward frequency
handbook, halfpage
Above a defined voltage level the oscillation frequency
also depends on the supply voltage of the half-bridge
(see Fig.6). The current for the current-controlled oscillator
is in the feed-forward range derived from the current
through RRHV. The feed-forward frequency is proportional
to the average value of the current through RRHV within the
operating range of Ii(RHV), given the lower limit set by fB.
For currents beyond the operating range (i.e. between
1.0 and 1.6 mA) the feed-forward frequency is clamped. In
order to prevent feed-forward of ripple on Vin, the ripple is
filtered out. The capacitor connected to pin CP is used for
this purpose. This pin is also used in the preheat state and
the ignition state for timing (tph and tign).
MGS992
fstart
fB
preheat state
ignition
state
burn state
time
For calculations refer to Chapter “Design equations”.
Fig.5 Operation in the preheat mode.
MGS993
handbook, halfpage
f
(kHz)
Ignition state
feed-forward
range
The RS monitoring function changes from VRS(ctrl)
regulation to capacitive mode protection at the end of the
preheat time. Normally this results in a further frequency
decrease down to the bottom frequency fB (approximately
43 kHz). The rate of change of frequency in the ignition
state is less than that in the preheat mode. During the
downward frequency sweep, the circuit sweeps through
the resonant frequency of the load. A high voltage then
appears across the lamp. This voltage normally ignites the
lamp.
bottom
frequency
IRHV (mA)
For calculations refer to Chapter “Design equations”.
Fig.6 Feed-forward frequency.
Failure to ignite
Excessive current levels may occur if the lamp fails to
ignite. The IC does not limit these currents in any manner.
Capacitive mode protection
Transition to the burn state
When the preheat mode is completed, the IC will protect
the power circuit against losing the zero voltage switching
condition and getting too close to the capacitive mode of
operation. This is detected by monitoring voltage VRS at
pin RS. If the voltage is below VRS(cap) at the time of
turn-on of T2, then capacitive mode operation is assumed.
Consequently the frequency increases as long as the
capacitive mode is detected. The frequency decreases
down to the feed-forward frequency if no capacitive mode
is detected. Frequency modulation is achieved via pin CI.
Assuming that the lamp has ignited during the downward
frequency sweep, the frequency normally decreases to the
bottom frequency. The IC can transit to the burn state in
two ways:
1. In the event that the bottom frequency is not reached,
transition is made after reaching the ignition time tign.
2. As soon as the bottom frequency is reached.
The bottom frequency is determined by RRREF and CCF.
2001 Jan 30
6
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
IC supply
Ground pins
Initially, the IC is supplied from Vin by the current through
RRHV. This current charges the supply capacitor CS9 via
an internal diode. As soon as VVS exceeds VVS(start), the
circuit starts oscillating. After the preheat phase is finished,
pin RHV is connected to an internal resistor Ri(RHV); prior
to this, pin RHV is internally connected to pin VS. The
voltage level at pin RHV thus drops from VVS + Vdiode to
IRHV × Ri(RHV). The capacitor CS9 at pin VS will now be
charged via the snubber capacitor CS7. Excess charge is
drained by an internal clamp that turns on at voltage
VVS(clamp).
Pin PGND is the ground reference of the IC with respect to
the application. As an exception, pin SGND provides a
local ground reference for the components connected to
pins CP, CI, RREF and CF. For this purpose pins PGND
and SGND are short-circuited internally. External
connection of pins PGND and SGND is not preferred. The
sum of currents flowing out of the pins CP, CI, RREF, CF
and SGND must remain zero at any time.
Charge coupling
Due to parasitic capacitive coupling to the high voltage
circuitry, all pins are burdened with a repetitive charge
injection. Given the typical application in Fig.7, pins RREF
and CF are sensitive to this charge injection. For the rating
Qcouple a safe functional operation of the IC is guaranteed,
independent of the current level. Charge coupling at
current levels below 50 µA will not interfere with the
accuracy of the VRS(cap) and VRS(ctrl) levels. Charge
coupling at current levels below 20 µA will not interfere
with the accuracy of any parameter.
Minimum gate-source voltage of T1 and T2
The high side driver is supplied via capacitor Cboot.
Capacitor Cboot is charged via the bootstrap switch during
the on-periods of T2. The IC stops oscillating at a voltage
level VVS(stop). Given a maximum charge consumption on
the load at pin G1 of 1 nC/V, this safeguards the minimum
drive voltages V(G1−S1) for the high side driver; see
Table 1.
Table 1
Minimum gate-source voltages
FREQUENCY
VOLTAGE
<75 kHz
8 V (min.)
75 kHz to 85 kHz
7 V (min.)
≥85 kHz
6 V (min.)
The drive voltage at G2 will exceed the drive voltage of the
high side driver.
Frequency and change in frequency
At any point in time during oscillation, the circuit will
operate between fB and fstart. Any change in frequency will
be gradual, no steps in frequency will occur. Changes in
frequency caused by a change in voltage at pin CI show a
rather-constant df/dt over the entire frequency range. The
following rates are realised (at a frequency of 85 kHz and
with a 100 nF capacitor connected to pin CI):
• For any increase in frequency: df/dt is between
15 and 37.5 kHz/ms
• During preheat and normal operation: df/dt for a
decrease in frequency is between −6 and −15 kHz/ms
• During the ignition phase: df/dt for a decrease in
frequency is between −150 and −375 Hz/ms.
2001 Jan 30
7
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages referenced to ground.
SYMBOL
VFS
PARAMETER
high side floating supply voltage
IVS(clamp)
clamp current
VRS
input voltage pin RS
CONDITIONS
MIN.
MAX.
UNIT
operating
−
570
V
t ≤ 0.5 s
−
630
V
t ≤ 0.5 s
−
35
mA
−2.5
+2.5
V
−15.0
+2.5
V
transient of 50 ns
SR
slew rate at pins S1, G1 and FS
(with respect to ground)
−4
+4
V/ns
P
power dissipation
−
500
mW
Tamb
ambient temperature
−40
+150
°C
Tj
junction temperature
−40
+150
°C
Tstg
storage temperature
−55
+150
°C
Qcouple
charge coupling at pins RREF and CF
operating
−8
+8
pC
Ves
electrostatic handling voltage
human body model; note 1 −
3000
V
300
V
machine model; note 2
−
Notes
1. Human body model: all pins are 3000 V maximum, except pins FS, G1, S1 and VS which are 1500 V maximum and
pin G2 which is 1000 V maximum.
2. Machine model: all pins are 300 V maximum, except pin G2 which is 125 V maximum.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
Rth(j-pin)
PARAMETER
VALUE
UNIT
SO14
100
K/W
DIP14
60
K/W
SO14
50
K/W
DIP14
30
K/W
thermal resistance from junction to ambient
thermal resistance from junction to pcb
CONDITIONS
in free air
in free air
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611-E”.
2001 Jan 30
8
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
CHARACTERISTICS
VVS = 11 V; VFS − VS1 = 11 V; Tamb = 25 °C; all voltages referenced to ground; see Fig.7; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
leakage current on high voltage pins
VFS, VG1 and VS1 = 630 V
−
−
15
µA
VVS(reset)
reset voltage
T1 off; T2 on
4.0
5.5
6.5
V
VVS(start)
oscillator start voltage
11.35
11.95
12.55
V
VVS(stop)
oscillator stop voltage
9.55
10.15
10.75
V
VVS(hys)
supply voltage hysteresis
1.5
1.8
2.0
V
IVS(standby)
standby supply current at pin VS
150
200
250
µA
∆V(RHV−VS)
voltage difference between pins RHV IRHV = 1.0 mA
and VS
0.7
0.8
1.0
V
VVS(clamp-start)
clamp margin VVS(clamp) to VVS(start)
note 2
0.2
0.3
0.4
V
IVS(clamp)
clamp current
VVS < 17 V
−
14
35
mA
fstart
starting frequency
VCI = 0 V
98
108
118
kHz
tg
conducting time T1 and T2
fstart = 108 kHz
−
3.2
−
µs
High voltage supply
IL
Start-up state
VVS = 11 V; note 1
Preheat mode
ICI(charge)
charge current at pin CI
VCI = 1.5 V; VRS = −0.3 V
38
44
50
µA
ICI(discharge)
discharge current at pin CI
VCI = 1.5 V; VRS = −0.9 V
79
93
107
µA
tph
preheat time
599
666
733
ms
ICP(charge)
charge current at pin CP
VCP = 1 V
−
6.0
−
µA
ICP(discharge)
discharge current at pin CP
VCP = 1 V
−
5.95
−
µA
∆VCP(pk)
peak voltage difference at pin CP
when timing
−
2.5
−
V
VRS(ctrl)
control voltage at pin RS
note 3
−636
−600
−564
mV
0.8
1.0
1.2
µA
Frequency sweep to ignition
ICI(charge)
charge current at pin CI
VCI = 1.5 V; f ≈ 85 kHz
fB
bottom frequency
VCI at clamp level
tign
ignition time
−
42.9
−
kHz
−
625
−
ms
42.21
42.90
44.59
kHz
fB = 43 kHz
−
10.2
−
µs
Normal operation
fB
bottom frequency
tg
conducting time T1 and T2
tno
non-overlap conductance time
1.05
1.4
1.75
µs
Itot
total supply current
fB = 43 kHz; note 4
0.85
1.0
1.1
mA
VRS(cap)
capacitive mode control voltage
note 5
0
20
40
mV
VRREF
reference voltage
note 6
2.425
2.5
2.575
V
VG1(on)
on voltage at pin G1
IG1 = 1 mA
10.5
−
−
V
VG1(off)
off voltage at pin G1
IG1 = 1 mA
−
−
0.3
V
VG2(on)
on voltage at pin G2
IG2 = 1 mA
10.5
−
−
V
VG2(off)
off voltage at pin G2
IG2 = 1 mA
−
−
0.3
V
RG1(on)
high side driver on resistance
V(G1 − S1) = 3 V; note 7
100
126
152
Ω
2001 Jan 30
9
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
SYMBOL
PARAMETER
UBA2021
CONDITIONS
MIN.
RG1(off)
high side driver off resistance
V(G1 − S1) = 3 V; note 7
60
TYP.
75
MAX.
UNIT
90
Ω
RG2(on)
low side driver on resistance
VG2 = 3 V; note 7
100
126
152
Ω
RG2(off)
low side driver off resistance
VG2 = 3 V; note 7
60
75
90
Ω
Vdrop
voltage drop at bootstrap switch
IFS = 5 mA
0.6
1.0
1.4
V
1.54
2.2
2.86
kΩ
0
−
1000
µA
Feed-forward
Ri(RHV)
input resistance at pin RHV
Ii(RHV)
operating range of input current at
pin RHV
fff
feed-forward frequency
note 8
IRHV = 0.75 mA
60.4
63.6
66.15
kHz
IRHV = 1 mA
80.3
84.5
88.2
kHz
SYMff
symmetry
IRHV = 1 mA; note 9
0.9
1.0
1.1
RR
ripple rejection
fVin = 100 Hz
−
6
−
dB
RCP(sw)
CP switch series resistance
ICP = 100 µA
0.75
1.5
2.25
kΩ
RAV
averaging resistor
ICP = 10 µA
22.4
32
41.6
kΩ
Notes
1. The start-up supply current is specified in a temperature (Tvj) range of 0 to 125 °C. For Tvj <0 and Tvj >125 °C the
start-up supply current is <350 µA.
2. The clamp margin is defined as the voltage difference between turn-on of the clamp and start of oscillation. The
clamp is in the off-state at start of oscillation.
3. Data sampling of VRS(ctrl) is performed at the end of conduction of T2.
4. The total supply current is specified in a temperature (Tvj) range of −20 to +125 °C. For Tvj < −20 and Tvj >125 °C the
total supply current is <1.5 mA.
5. Data sampling of VRS(cap) is performed at the start of conduction of T2.
6. Within the allowed range of RRREF, defined as 30 kΩ +10%.
7. Typical values for the on and off resistances at Tvj = 87.5 °C are: RG2(on) and RG1(on) = 164 Ω, RG2(off) and
RG1(off) = 100 Ω.
8. The input current at pin RHV may increase to 1600 µA during voltage transient at Vin. Only for currents IRHV beyond
approximately 550 µA is the oscillator frequency proportional to IRHV.
9. The symmetry SYMff is calculated from the quotient SYMff = T1tot/T2tot, with T1tot the time between turn-off of G2 and
turn-off of G1, and T2tot the time between turn-off of G1 and turn-off of G2.
2001 Jan 30
10
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
DESIGN EQUATIONS
1
• Bottom frequency: f B = --------------------------------------------------------------------------------------------------------------------------2 × { [ ( C CF + C par ) × ( X1 × R RREF – R int ) ] + τ }
1
• Feed-forward frequency: f ff = ---------------------------------------------------------------------------------------------------------------------------× V RREF
X2
2 × ( C CF + C par ) × -----------------------------– R int + τ
I i ( RHV )
Where:
– X1 = 3.68
– X2 = 22.28
– τ = 0.4 µs
– Rint = 3 kΩ
– Cpar = 4.7 pF
• Operating frequency is the maximum of fB, fff or fcm
Where:
– fB = bottom frequency
– fff = feed-forward frequency
– fcm = frequency due to capacitive mode detection
C CP
R RREF
• Preheat time: t ph = ------------------ × ----------------150 nF 30 kΩ
15
• Ignition time: t ign = ------ × t ph
16
R RREF
• Non-overlap time: t no = 1.4 µs × ----------------30kΩ
2001 Jan 30
11
UBA2021
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
APPLICATION INFORMATION
RRHV
Vin
L1
handbook, full pagewidth
490 kΩ
DS1
T1
DS2
C3
G1
lamp
CCI
100 nF
S1
R1
8
3
FS
1
Cboot
CS7
C2
C5
T2
G2
CCP
CP
100 nF
L2
mains
supply
RHV
CI
13
14
2
UBA2021 12 CF
100 nF
CCF
100 pF
6
10
RREF
RRREF
30 kΩ
DS7
DS3
DS4
VS
C4
CS4
Rshunt
DS6
CS9
5
7
PGND
9 11
SGND
RS
MGS994
Fig.7 Application diagram.
2001 Jan 30
12
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
PACKAGE OUTLINES
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.010 0.057
0.004 0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.050
0.028
0.024
0.01
0.01
0.004
0.028
0.012
inches 0.069
0.244
0.039
0.041
0.228
0.016
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
2001 Jan 30
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
99-12-27
13
o
8
0o
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
MH
8
14
pin 1 index
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.2
inches
0.17
0.020
0.13
0.068
0.044
0.021
0.015
0.014
0.009
0.77
0.73
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
EIAJ
SOT27-1
050G04
MO-001
SC-501-14
2001 Jan 30
14
EUROPEAN
PROJECTION
ISSUE DATE
95-03-11
99-12-27
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
• For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages
REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
2001 Jan 30
UBA2021
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
15
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
MOUNTING
PACKAGE
WAVE
suitable(2)
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
REFLOW(1) DIPPING
−
suitable
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
−
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS
not suitable(3)
suitable
−
PLCC(4), SO, SOJ
suitable
suitable
−
suitable
−
suitable
−
recommended(4)(5)
LQFP, QFP, TQFP
not
SSOP, TSSOP, VSO
not recommended(6)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Jan 30
16
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
UBA2021
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2001 Jan 30
17
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
NOTES
2001 Jan 30
18
UBA2021
Philips Semiconductors
Product specification
630 V driver IC for CFL and TL lamps
NOTES
2001 Jan 30
19
UBA2021
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SCA 71
© Philips Electronics N.V. 2001
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Printed in The Netherlands
613502/02/pp20
Date of release: 2001
Jan 30
Document order number:
9397 750 07752