BAS101; BAS101S High-voltage switching diodes Rev. 01 — 8 September 2006 Product data sheet 1. Product profile 1.1 General description High-voltage switching diodes, encapsulated in a SOT23 small Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Type number Package Configuration Philips JEITA BAS101 SOT23 - single BAS101S SOT23 - dual series 1.2 Features n High switching speed: trr ≤ 50 ns n Low leakage current n Repetitive peak reverse voltage: VRRM ≤ 300 V n Low capacitance: Cd ≤ 2 pF n Reverse voltage: VR ≤ 300 V n Small SMD plastic package 1.3 Applications n High-speed switching n High-voltage switching n Voltage clamping n Reverse polarity protection 1.4 Quick reference data Table 2. Symbol Quick reference data Parameter Conditions Min Typ Max Unit - - 200 mA - - 150 nA - - 300 V - - 50 ns Per diode IF forward current IR reverse current VR reverse voltage trr reverse recovery time [1] VR = 250 V [1] When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA. BAS101; BAS101S Philips Semiconductors High-voltage switching diodes 2. Pinning information Table 3. Pinning Pin Description Simplified outline Symbol BAS101 1 anode 2 not connected 3 cathode 3 3 1 1 2 006aaa764 2 BAS101S 1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1), anode (diode 2) 3 3 1 1 2 2 006aaa763 3. Ordering information Table 4. Ordering information Type number BAS101 Package Name Description Version - plastic surface-mounted package; 3 leads SOT23 BAS101S 4. Marking Table 5. Marking codes Type number Marking code[1] BAS101 *HQ BAS101S *HR [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BAS101_BAS101S_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 8 September 2006 2 of 11 BAS101; BAS101S Philips Semiconductors High-voltage switching diodes 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit repetitive peak reverse voltage - 300 V series connection - 600 V - 300 V series connection - 600 V - 200 mA series connection - 100 mA - 1 A Per diode VRRM reverse voltage VR forward current IF IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25 IFSM non-repetitive peak forward current square wave; tp ≤ 1 µs [1] - 9 A Ptot total power dissipation Tamb ≤ 25 °C [2] - 250 mW Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C Per device [1] Tj = 25 °C prior to surge. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol Thermal characteristics Parameter Conditions thermal resistance from junction to ambient in free air Min Typ Max Unit - - 500 K/W Per device Rth(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. BAS101_BAS101S_1 Product data sheet [1] © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 8 September 2006 3 of 11 BAS101; BAS101S Philips Semiconductors High-voltage switching diodes 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per diode forward voltage IF = 100 mA - - 1.1 V IR reverse current VR = 250 V - - 150 nA VR = 250 V; Tj = 150 °C - - 100 µA - - 2 pF - - 50 ns Cd trr diode capacitance VR = 0 V; f = 1 MHz reverse recovery time [2] [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. [2] When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA. BAS101_BAS101S_1 Product data sheet [1] VF © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 8 September 2006 4 of 11 BAS101; BAS101S Philips Semiconductors High-voltage switching diodes mhc618 500 IF (mA) mbg703 102 IFSM (A) 400 10 300 200 1 (1) (2) 100 (3) 10−1 0 0 0.5 1 VF (V) 1 1.5 10 102 103 104 tp (µs) (1) Tamb = 150 °C Based on square wave currents. (2) Tamb = 75 °C Tj = 25 °C; prior to surge (3) Tamb = 25 °C Fig 1. Forward current as a function of forward voltage; typical values mhc619 102 IR (µA) Fig 2. Non-repetitive peak forward current as a function of pulse duration; maximum values mhc621 0.42 Cd (pF) 10 0.38 1 0.34 10−1 10−2 0 40 80 120 160 200 Tj (°C) 0.3 0 20 30 40 VR (V) f = 1 MHz; Tamb = 25 °C VR = 300 V Fig 3. Reverse current as a function of junction temperature; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values BAS101_BAS101S_1 Product data sheet 10 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 8 September 2006 5 of 11 BAS101; BAS101S Philips Semiconductors High-voltage switching diodes 8. Test information tr tp t D.U.T. 10 % + IF IF RS = 50 Ω SAMPLING OSCILLOSCOPE V = VR + IF × RS trr t Ri = 50 Ω VR (1) 90 % mga881 input signal output signal (1) IR = 3 mA Fig 5. Reverse recovery time test circuit and waveforms 9. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 0.48 0.38 Dimensions in mm 0.15 0.09 04-11-04 Fig 6. Package outline SOT23 (TO-236AB) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description BAS101 4 mm pitch, 8 mm tape and reel SOT23 Packing quantity 3000 10000 -215 -235 BAS101S [1] For further information and the availability of packing methods, see Section 15. BAS101_BAS101S_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 8 September 2006 6 of 11 BAS101; BAS101S Philips Semiconductors High-voltage switching diodes 11. Soldering 2.90 2.50 solder lands solder resist 2 0.85 1 2.70 1.30 3.00 0.85 3 occupied area solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.00 1.20 3 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BAS101_BAS101S_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 8 September 2006 7 of 11 BAS101; BAS101S Philips Semiconductors High-voltage switching diodes 12. Mounting 43.4 0.6 0.7 40 0.6 0.7 0.5 Dimensions in mm 006aaa527 PCB thickness = 1.6 mm Fig 9. FR4 PCB, standard footprint SOT23 (TO-236AB) BAS101_BAS101S_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 8 September 2006 8 of 11 BAS101; BAS101S Philips Semiconductors High-voltage switching diodes 13. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BAS101_BAS101S_1 20060908 Product data sheet - - BAS101_BAS101S_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 8 September 2006 9 of 11 BAS101; BAS101S Philips Semiconductors High-voltage switching diodes 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 14.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] BAS101_BAS101S_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 8 September 2006 10 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 16. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Koninklijke Philips Electronics N.V. 2006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: [email protected]. Date of release: 8 September 2006 Document identifier: BAS101_BAS101S_1