74LVC1G74 Single D-type flip-flop with set and reset; positive edge trigger Rev. 9 — 5 August 2010 Product data sheet 1. General description The 74LVC1G74 is a single positive edge triggered D-type flip-flop with individual data (D) inputs, clock (CP) inputs, set (SD) and reset (RD) inputs, and complementary Q and Q outputs. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing damaging backflow current through the device when it is powered down. The set and reset are asynchronous active LOW inputs and operate independently of the clock input. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The D inputs must be stable one set-up time prior to the LOW-to-HIGH clock transition for predictable operation. Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times. 2. Features and benefits Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant inputs for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8-B/JESD36 (2.7 V to 3.6 V) ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V ±24 mA output drive (VCC = 3.0 V) CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5 V Multiple package options Specified from −40 °C to +85 °C and −40 °C to +125 °C 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G74DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74LVC1G74DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 74LVC1G74GT −40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; 8 SOT833-1 terminals; body 1 × 1.95 × 0.5 mm 74LVC1G74GF −40 °C to +125 °C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.35 × 1 × 0.5 mm 74LVC1G74GD −40 °C to +125 °C XSON8U plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 × 2 × 0.5 mm SOT996-2 74LVC1G74GM −40 °C to +125 °C XQFN8U plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm SOT902-1 74LVC1G74GN −40 °C to +125 °C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.2 × 1.0 × 0.35 mm SOT1116 74LVC1G74GS −40 °C to +125 °C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.35 × 1.0 × 0.35 mm SOT1203 SOT1089 4. Marking Table 2. Marking codes Type number Marking code[1] 74LVC1G74DP V74 74LVC1G74DC V74 74LVC1G74GT V74 74LVC1G74GF Y4 74LVC1G74GD V74 74LVC1G74GM V74 74LVC1G74GN Y4 74LVC1G74GS Y4 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 2 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 5. Functional diagram SD D CP SD Q D Q S CP FF Q C1 Q 1D RD R RD 001aah757 Fig 1. 001aah758 Logic symbol Fig 2. IEC logic symbol Q C C C C C C D Q C C RD SD CP mna421 C C Fig 3. Logic diagram 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 3 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 6. Pinning information 6.1 Pinning 74LVC1G74 CP 1 8 VCC D 2 7 SD Q 3 6 RD GND 4 5 Q 74LVC1G74 CP 1 8 VCC D 2 7 SD Q 3 6 RD GND 4 5 Q 001aab658 Transparent top view 001aab659 Fig 4. Pin configuration SOT505-2 and SOT765-1 Fig 5. Pin configuration SOT833-1, SOT1089, SOT1116 and SOT1203 74LVC1G74 CP 1 8 VCC D 2 7 SD Q 3 6 RD GND 4 5 Q SD 1 RD Q 8 VCC terminal 1 index area 7 CP 2 6 D 3 5 Q GND 4 74LVC1G74 001aah948 Transparent top view Transparent top view Fig 6. Pin configuration SOT996-2 74LVC1G74 Product data sheet 001aaf641 Fig 7. Pin configuration SOT902-1 All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 4 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 6.2 Pin description Table 3. Symbol Pin description Pin Description SOT505-2, SOT765-1, SOT833-1, SOT1089, SOT902-1 SOT996-2, SOT1116 and SOT1203 CP 1 7 clock input (LOW-to-HIGH, edge-triggered) D 2 6 data input Q 3 5 complement output GND 4 4 ground (0 V) Q 5 3 true output RD 6 2 asynchronous reset-direct input (active LOW) SD 7 1 asynchronous set-direct input (active LOW) VCC 8 8 supply voltage 7. Functional description Table 4. Function table for asynchronous operation[1] Input Output SD RD CP D Q Q L H X X H L H L X X L H L L X X H H [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care. Table 5. Function table for synchronous operation[1] Input Output SD RD CP D Qn+1 Qn+1 H H ↑ L L H H H ↑ H H L [1] H = HIGH voltage level; L = LOW voltage level; ↑ = LOW-to-HIGH CP transition; Qn+1 = state after the next LOW-to-HIGH CP transition. 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 5 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current Conditions VI < 0 V [1] output current ICC supply current IGND ground current Ptot total power dissipation Tstg storage temperature Unit −0.5 +6.5 V −50 - mA −0.5 +6.5 V - ±50 mA −0.5 VCC + 0.5 V [1][2] −0.5 +6.5 V - ±50 mA - 100 mA −100 - mA Active mode Power-down mode IO Max [1] VO > VCC or VO < 0 V output voltage VO Min VO = 0 V to VCC Tamb = −40 °C to +125 °C [3] - 300 mW −65 +150 °C [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. [3] For TSSOP8 packages: above 55 °C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 packages: above 110 °C the value of Ptot derates linearly with 8.0 mW/K. For XSON8, XSON8U and XQFN8U packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K. 9. Recommended operating conditions Table 7. Operating conditions Symbol Parameter VCC Conditions Min Max Unit supply voltage 1.65 5.5 V VI input voltage 0 5.5 V VO output voltage Active mode 0 VCC V Power-down mode; VCC = 0 V 0 5.5 V −40 +125 °C VCC = 1.65 V to 2.7 V - 20 ns/V VCC = 2.7 V to 5.5 V - 10 ns/V Tamb ambient temperature Δt/ΔV input transition rise and fall rate 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 6 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 10. Static characteristics Table 8. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V Typ[1] Max Unit 0.65 × VCC - - V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7 × VCC - - V VCC = 1.65 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 × VCC V IO = −100 μA; VCC = 1.65 V to 5.5 V VCC − 0.1 - - V IO = −4 mA; VCC = 1.65 V 1.2 1.54 - V IO = −8 mA; VCC = 2.3 V 1.9 2.15 - V IO = −12 mA; VCC = 2.7 V 2.2 2.50 - V IO = −24 mA; VCC = 3.0 V 2.3 2.62 - V IO = −32 mA; VCC = 4.5 V 3.8 4.11 - V Tamb = −40 °C to +85 °C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL LOW-level output voltage VI = VIH or VIL IO = 100 μA; VCC = 1.65 V to 5.5 V - - 0.10 V IO = 4 mA; VCC = 1.65 V - 0.07 0.45 V IO = 8 mA; VCC = 2.3 V - 0.12 0.30 V IO = 12 mA; VCC = 2.7 V - 0.17 0.40 V IO = 24 mA; VCC = 3.0 V - 0.33 0.55 V IO = 32 mA; VCC = 4.5 V - 0.39 0.55 V - ±0.1 ±5 μA II input leakage current IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V - ±0.1 ±10 μA ICC supply current VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A - 0.1 10 μA ΔICC additional supply current per pin; VI = VCC − 0.6 V; IO = 0 A; VCC = 2.3 V to 5.5 V - 5 500 μA CI input capacitance - 4.0 - pF 74LVC1G74 Product data sheet VI = 5.5 V or GND; VCC = 0 V to 5.5 V All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 7 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger Table 8. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 1.65 V to 1.95 V Typ[1] Max Unit 0.65 × VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7 × VCC - - V VCC = 1.65 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 × VCC V Tamb = −40 °C to +125 °C HIGH-level input voltage VIH LOW-level input voltage VIL VOH HIGH-level output voltage VI = VIH or VIL LOW-level output voltage VOL IO = −100 μA; VCC = 1.65 V to 5.5 V VCC − 0.1 - - V IO = −4 mA; VCC = 1.65 V 0.95 - - V IO = −8 mA; VCC = 2.3 V 1.7 - - V IO = −12 mA; VCC = 2.7 V 1.9 - - V IO = −24 mA; VCC = 3.0 V 2.0 - - V IO = −32 mA; VCC = 4.5 V 3.4 - - V IO = 100 μA; VCC = 1.65 V to 5.5 V - - 0.10 V IO = 4 mA; VCC = 1.65 V - - 0.70 V IO = 8 mA; VCC = 2.3 V - - 0.45 V IO = 12 mA; VCC = 2.7 V - - 0.60 V IO = 24 mA; VCC = 3.0 V - - 0.80 V IO = 32 mA; VCC = 4.5 V - - 0.80 V - - ±20 μA VI = VIH or VIL II input leakage current IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V - - ±20 μA ICC supply current VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A - - 40 μA ΔICC additional supply current per pin; VI = VCC − 0.6 V; IO = 0 A; VCC = 2.3 V to 5.5 V - - 5000 μA [1] VI = 5.5 V or GND; VCC = 0 V to 5.5 V All typical values are measured at Tamb = 25 °C. 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 8 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 11. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter tpd −40 °C to +85 °C Conditions Max Min Max VCC = 1.65 V to 1.95 V 1.5 6.0 13.4 1.5 13.4 ns VCC = 2.3 V to 2.7 V 1.0 3.5 7.1 1.0 7.1 ns VCC = 2.7 V 1.0 3.5 7.1 1.0 7.1 ns VCC = 3.0 V to 3.6 V 1.0 3.5 5.9 1.0 5.9 ns VCC = 4.5 V to 5.5 V 1.0 2.5 4.1 1.0 4.1 ns 1.5 6.0 12.9 1.5 12.9 ns propagation delay CP to Q, Q; see Figure 8 [2] [2] VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V 1.0 3.5 7.0 1.0 7.0 ns VCC = 2.7 V 1.0 3.5 7.0 1.0 7.0 ns VCC = 3.0 V to 3.6 V 1.0 3.0 5.9 1.0 5.9 ns 1.0 2.5 4.1 1.0 4.1 ns VCC = 1.65 V to 1.95 V 1.5 5.0 12.9 1.5 12.9 ns VCC = 2.3 V to 2.7 V 1.0 3.5 7.0 1.0 7.0 ns VCC = 2.7 V 1.0 3.5 7.0 1.0 7.0 ns VCC = 3.0 V to 3.6 V 1.0 3.0 5.9 1.0 5.9 ns VCC = 4.5 V to 5.5 V 1.0 2.5 4.1 1.0 4.1 ns VCC = 4.5 V to 5.5 V RD to Q, Q; see Figure 9 pulse width Unit Min SD to Q, Q; see Figure 9 tW −40 °C to +125 °C Typ[1] [2] CP HIGH or LOW; see Figure 8 VCC = 1.65 V to 1.95 V 6.2 - - 6.2 - ns VCC = 2.3 V to 2.7 V 2.7 - - 2.7 - ns VCC = 2.7 V 2.7 - - 2.7 - ns VCC = 3.0 V to 3.6 V 2.7 1.3 - 2.7 - ns VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - ns 6.2 - - 6.2 - ns SD and RD LOW; see Figure 9 VCC = 1.65 V to 1.95 V 74LVC1G74 Product data sheet VCC = 2.3 V to 2.7 V 2.7 - - 2.7 - ns VCC = 2.7 V 2.7 - - 2.7 - ns VCC = 3.0 V to 3.6 V 2.7 1.6 - 2.7 - ns VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - ns All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 9 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger Table 9. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter trec recovery time set-up time tsu hold time th maximum frequency fmax −40 °C to +85 °C Conditions power dissipation capacitance Min Max Min Max VCC = 1.65 V to 1.95 V 1.9 - - 1.9 - ns VCC = 2.3 V to 2.7 V 1.4 - - 1.4 - ns VCC = 2.7 V 1.3 - - 1.3 - ns VCC = 3.0 V to 3.6 V +1.2 −3.0 - +1.2 - ns VCC = 4.5 V to 5.5 V 1.0 - - 1.0 - ns VCC = 1.65 V to 1.95 V 2.9 - - 2.9 - ns VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - ns VCC = 2.7 V 1.7 - - 1.7 - ns VCC = 3.0 V to 3.6 V 1.3 0.5 - 1.3 - ns VCC = 4.5 V to 5.5 V 1.1 - - 1.1 - ns D to CP; see Figure 8 D to CP; see Figure 8 VCC = 1.65 V to 1.95 V 1.5 - - 1.5 - ns VCC = 2.3 V to 2.7 V 1.0 - - 1.0 - ns VCC = 2.7 V 1.0 - - 1.0 - ns VCC = 3.0 V to 3.6 V 1.0 0.6 - 1.0 - ns VCC = 4.5 V to 5.5 V 1.0 - - 1.0 - ns VCC = 1.65 V to 1.95 V 80 - - 80 - MHz VCC = 2.3 V to 2.7 V 175 - - 175 - MHz VCC = 2.7 V 175 - - 175 - MHz VCC = 3.0 V to 3.6 V 175 280 - 175 - MHz 200 - - 200 - MHz - 15 - - - pF CP; see Figure 8 VI = GND to VCC; VCC = 3.3 V [3] [1] Typical values are measured at Tamb = 25 °C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively. [2] tpd is the same as tPLH and tPHL. [3] Unit SD or RD; see Figure 9 VCC = 4.5 V to 5.5 V CPD −40 °C to +125 °C Typ[1] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 10 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 12. Waveforms tW VI VM CP input GND 1/fmax VI VM D input GND th th t su t su t PHL t PLH VOH VM Q output VOL VOH Q output VM VOL t PLH t PHL mnb141 Measurement points are given in Table 10. The shaded areas indicate when the input is permitted to change for predictable output performance. VOL and VOH are typical output voltage levels that occur with the output load. Fig 8. Table 10. The clock input (CP) to output (Q, Q) propagation delays, the clock pulse width, the D to CP set-up, the CP to D hold times and the maximum frequency Measurement points Supply voltage Input Output VCC VM VM 1.65 V to 1.95 V 0.5 × VCC 0.5 × VCC 2.3 V to 2.7 V 0.5 × VCC 0.5 × VCC 2.7 V 1.5 V 1.5 V 3.0 V to 3.6 V 1.5 V 1.5 V 4.5 V to 5.5 V 0.5 × VCC 0.5 × VCC 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 11 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger VI VM CP input GND t rec VI VM SD input t rec GND tW tW VI VM RD input GND t PLH t PHL VOH Q output VM VOL VOH VM Q output VOL t PHL t PLH mnb142 Measurement points are given in Table 10. VOL and VOH are typical output voltage levels that occur with the output load. Fig 9. The set (SD) and reset (RD) input to output (Q, Q) propagation delays, the set and reset pulse widths and the RD to CP recovery time 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 12 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 11. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 10. Test circuit for measuring switching times Table 11. Test data Supply voltage Input VCC VI tr, tf CL RL tPLH, tPHL tPZH, tPHZ tPZL, tPLZ 1.65 V to 1.95 V VCC ≤ 2.0 ns 30 pF 1 kΩ open GND 2VCC 2.3 V to 2.7 V VCC ≤ 2.0 ns 30 pF 500 Ω open GND 2VCC 2.7 V 2.7 V ≤ 2.5 ns 50 pF 500 Ω open GND 6V 3.0 V to 3.6 V 2.7 V ≤ 2.5 ns 50 pF 500 Ω open GND 6V 4.5 V to 5.5 V VCC ≤ 2.5 ns 50 pF 500 Ω open GND 2VCC 74LVC1G74 Product data sheet Load VEXT All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 13 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Fig 11. Package outline SOT505-2 (TSSOP8) 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 14 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 12. Package outline SOT765-1 (VSSOP8) 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 15 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 13. Package outline SOT833-1 (XSON8) 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 16 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm SOT1089 E terminal 1 index area A D A1 detail X (4×)(2) e L (8×)(2) b 4 5 e1 1 terminal 1 index area 8 L1 X 0 0.5 scale Dimensions Unit mm max nom min 1 mm A(1) 0.5 A1 b D E e e1 L L1 0.04 0.20 1.40 1.05 0.35 0.40 0.15 1.35 1.00 0.55 0.35 0.30 0.35 0.27 0.32 0.12 1.30 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version SOT1089 sot1089_po References IEC JEDEC JEITA European projection Issue date 10-04-09 10-04-12 MO-252 Fig 14. Package outline SOT1089 (XSON8) 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 17 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm B D SOT996-2 A A E A1 detail X terminal 1 index area e1 v w b e L1 1 4 8 5 C C A B C M M y y1 C L2 L X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 L2 v w y y1 mm 0.5 0.05 0.00 0.35 0.15 2.1 1.9 3.1 2.9 0.5 1.5 0.5 0.3 0.15 0.05 0.6 0.4 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT996-2 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 15. Package outline SOT996-2 (XSON8U) 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 18 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm B D SOT902-1 A terminal 1 index area A E A1 detail X L1 e e C ∅v M C A B ∅w M C L 4 y1 C y 5 3 metal area not for soldering e1 b 2 6 e1 7 1 terminal 1 index area 8 X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 v w y y1 mm 0.5 0.05 0.00 0.25 0.15 1.65 1.55 1.65 1.55 0.55 0.5 0.35 0.25 0.15 0.05 0.1 0.05 0.05 0.05 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT902-1 --- MO-255 --- EUROPEAN PROJECTION ISSUE DATE 05-11-25 07-11-14 Fig 16. Package outline SOT902-1 (XQFN8U) 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 19 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1.0 x 0.35 mm 1 2 SOT1116 b 4 3 (4×)(2) L L1 e 8 7 e1 6 e1 5 e1 (8×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 max 0.35 0.04 0.20 1.25 1.05 nom 0.15 1.20 1.00 0.55 min 0.12 1.15 0.95 0.3 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1116_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-07 SOT1116 Fig 17. Package outline SOT1116 (XSON8) 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 20 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.0 x 0.35 mm SOT1203 b 2 1 3 (4×)(2) 4 L L1 e 8 7 6 e1 e1 5 e1 (8×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 L L1 max 0.35 0.04 0.20 1.40 1.05 0.35 0.40 nom 0.15 1.35 1.00 0.55 0.35 0.30 0.35 min 0.12 1.30 0.95 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1203_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-06 SOT1203 Fig 18. Package outline SOT1203 (XSON8) 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 21 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 14. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor HBM Human Body Model ESD ElectroStatic Discharge MM Machine Model DUT Device Under Test TTL Transistor-Transistor Logic 15. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC1G74 v.9 20100805 Product data sheet - 74LVC1G74 v.8 Modifications: • • Added type number 74LVC1G74GN (SOT1116/XSON8 package). Added type number 74LVC1G74GS (SOT1203/XSON8 package). 74LVC1G74 v.8 20091203 Product data sheet - 74LVC1G74 v.7 74LVC1G74 v.7 20080626 Product data sheet - 74LVC1G74 v.6 74LVC1G74 v.6 20080219 Product data sheet - 74LVC1G74 v.5 74LVC1G74 v.5 20070809 Product data sheet - 74LVC1G74 v.4 74LVC1G74 v.4 20061207 Product data sheet - 74LVC1G74 v.3 74LVC1G74 v.3 20050201 Product specification - 74LVC1G74 v.2 74LVC1G74 v.2 20040909 Product specification - 74LVC1G74 v.1 74LVC1G74 v.1 20040202 Product specification - - 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 22 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be 74LVC1G74 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 23 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74LVC1G74 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 5 August 2010 © NXP B.V. 2010. All rights reserved. 24 of 25 74LVC1G74 NXP Semiconductors Single D-type flip-flop with set and reset; positive edge trigger 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Legal information. . . . . . . . . . . . . . . . . . . . . . . 23 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Contact information. . . . . . . . . . . . . . . . . . . . . 24 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 5 August 2010 Document identifier: 74LVC1G74