SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection HF RoHS Pb GREEN SP3010 Lead-Free/Green Series Description The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features 5 7 4 8 3 9 2 10 t -PXMFBLBHFDVSSFOUPG ç"5:1 BU7 t &'5*&$" (5/50ns) t 4NBMMGPSNGBDUPSV%'/ package saves board space t -JHIUOJOH*&$ "UP=8/20μs) 1 t -PXDBQBDJUBODFPG Q'5:1 QFS*0 *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. Functional Block Diagram Pin 1 Pin 2 Pin 4 Pin 5 t &4%*&$ ±8kV contact, ±15kV air Applications GND (Pins 3,8) t-$%1%157T t4FU5PQ#PYFT t%7%1MBZFST t.PCJMF1IPOFT t%FTLUPQT t/PUFCPPLT t.11.1 t%JHJUBM$BNFSBT -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 67 Revised: February 25, 2010 SP3010 Lead-Free/Green Series Lead-Free/Green SP3010 6 SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection Absolute Maximum Ratings Symbol Parameter Value Units 3.0 " 0QFSBUJOH5FNQFSBUVSF -40 to 85 °C Storage Temperature -60 to 150 °C IPP Peak Current (tp=8/20μs) T01 T4503 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions 3FWFSTF4UBOEPGG7PMUBHF Parameter V38. I3õ" 3FWFSTF-FBLBHF$VSSFOU I-&", V37"OZ*0UP(/% 0.1 IPP"UpT'XE 10.8 V IPP"UpT'XE 12.3 V (VC2 - VC1) / (IPP2 - IPP1) 1.5 Ω Clamp Voltage1 VC %ZOBNJD3FTJTUBODF 3%:/ &4%8JUITUBOE7PMUBHF1 VESD 1 Diode Capacitance C*0(/% Min Typ Max Units 6.0 V 0.5 " IEC61000-4-2 (Contact) ±8 kV *&$"JS ±15 kV 3FWFSTF#JBT7 0.45 Q' /PUFT1 Parameter is guaranteed by design and/or device characterization. SP3010 Lead-Free/Green Series 68 Revised: February 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection Insertion Loss (S21) I/O to GND 0.6 0 0.5 -5 Attenuation (dB) I/O Capacitance (pF) Capacitance vs. Bias Voltage 0.4 0.3 0.2 0.1 -10 -15 -20 -25 0.0 -30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 100 1000 10000 Frequency (MHz) I/O Bias Voltage (V) Clamping Voltage vs. IPP Pulse Waveform 16.0 110% 100% 14.0 90% 80% 70% 10.0 Clamp Voltage (VC) 12.0 8.0 6.0 60% 50% 40% 30% 4.0 20% 2.0 10% 1.0 1.5 2.0 2.5 0.0 3.0 Peak Pulse Current-IPP (A) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 5.0 10.0 15.0 20.0 25.0 30.0 69 Revised: February 25, 2010 SP3010 Lead-Free/Green Series Lead-Free/Green SP3010 0% 0.0 SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection Soldering Parameters 1Co'SFFBTTFNCMZ Reflow Condition - Temperature Min (Ts(min)) Pre Heat 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Product Characteristics Part Numbering System SP 3010 – 0x U T G Silicon Protection Array G= Green T= Tape & Reel Series Package Number of Channels UDFN-10 (2.5x1.0mm) -04 = 4 Channel Lead Plating 1SF1MBUFE'SBNF Lead Material $PQQFS"MMPZ Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 /PUFT "MMEJNFOTJPOTBSFJONJMMJNFUFST Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. QH 4 "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Number of Product Series Channels Q = SP3010 Assembly Site 6. Package surface matte finish VDI 11-13. Ordering Information Part Number Package Marking Min. Order Qty. 4165( V%'/ QH4 3000 SP3010 Lead-Free/Green Series 70 Revised: February 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection Embossed Carrier Tape & Reel Specification – UDFN-10 Package P0 0 P1 P2 Millimeters A0 1.30 +/- 0.10 B0 F W E D T D1 uDFN-10 (2.5x1.0x0.5mm) Symbol 5º Max A0 B0 2.83 +/- 0.10 D0 Ø 1.50 + 0.10 D1 Ø 1.00 + 0.25 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 0.65 +/- 0.10 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.254 +/- 0.02 W 8.00 + 0.30 /- 0.10 K0 5º Max Package Dimensions - uDFN-10 (2.5x1.0x0.5mm) Top View uDFN-10 (2.5x1.0x0.5mm) D Symbol E Millimeters Nom Max Min Nom Max A 0.48 0.515 0.55 0.019 0.020 0.021 A1 0.00 -- 0.05 0.000 3FG A3 B Side View 0.05 C A1 A3 A Seating Plane C 0.022 3FG b 0.15 0.20 0.25 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.018 D 2.40 2.50 2.60 0.094 0.098 0.102 E 0.90 1.00 1.10 0.035 0.039 0.043 0.43 0.012 e 0.05 C b1 Inches Min L 0.50 BSC 0.30 0.365 0.020 BSC 0.014 0.016 b 0.10 M C A B 0.05 M C Bottom View R0.125 L 2xR0.075mm (7x) e Soldering Pad Layout Dimensions Inch Millimeter C (0.034) (0.875) G 0.008 0.20 P 0.020 0.50 P1 0.039 1.00 X 0.008 0.20 Soldering Pad Layout P1 P Y (Y1) Z (C) G X X1 0.016 0.40 Y 0.027 0.675 Y1 (0.061) (1.55) Z 0.061 1.55 X1 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 71 Revised: February 25, 2010 SP3010 Lead-Free/Green Series Lead-Free/Green SP3010 A