74AUP1G04 Low-power inverter Rev. 03 — 5 November 2009 Product data sheet 1. General description The 74AUP1G04 provides the single inverting buffer. Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features n Wide supply voltage range from 0.8 V to 3.6 V n High noise immunity n Complies with JEDEC standards: u JESD8-12 (0.8 V to 1.3 V) u JESD8-11 (0.9 V to 1.65 V) u JESD8-7 (1.2 V to 1.95 V) u JESD8-5 (1.8 V to 2.7 V) u JESD8-B (2.7 V to 3.6 V) n ESD protection: u HBM JESD22-A114F Class 3A exceeds 5000 V u MM JESD22-A115-A exceeds 200 V u CDM JESD22-C101C exceeds 1000 V n Low static power consumption; ICC = 0.9 µA (maximum) n Latch-up performance exceeds 100 mA per JESD 78B Class II n Inputs accept voltages up to 3.6 V n Low noise overshoot and undershoot < 10 % of VCC n IOFF circuitry provides partial Power-down mode operation n Multiple package options n Specified from −40 °C to +85 °C and −40 °C to +125 °C 74AUP1G04 NXP Semiconductors Low-power inverter 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AUP1G04GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 74AUP1G04GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 74AUP1G04GM −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 × 1.45 × 0.5 mm 74AUP1G04GF −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; SOT891 6 terminals; body 1 × 1 × 0.5 mm 4. Marking Table 2. Marking Type number Marking code[1] 74AUP1G04GV p04 74AUP1G04GW pC 74AUP1G04GM pC 74AUP1G04GF pC [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 2 A Y 4 2 1 4 Y A mna108 Fig 1. Logic symbol mna109 Fig 2. IEC logic symbol 74AUP1G04_3 Product data sheet mna110 Fig 3. Logic diagram © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 2 of 18 74AUP1G04 NXP Semiconductors Low-power inverter 6. Pinning information 6.1 Pinning 74AUP1G04 74AUP1G04 n.c. 1 A 2 GND 3 5 VCC n.c. 1 6 VCC A 2 5 n.c. GND 4 4 3 Y Y 001aaf023 Fig 5. Pin configuration SOT886 n.c. 1 6 VCC A 2 5 n.c. GND 3 4 Y 001aaf024 Transparent top view Transparent top view 001aaf022 Fig 4. Pin configuration SOT353-1 and SOT753 74AUP1G04 Fig 6. Pin configuration SOT891 6.2 Pin description Table 3. Pin description Symbol Pin Description SOT353-1/SOT753 SOT886/SOT891 n.c. 1 1 not connected A 2 2 data input A GND 3 3 ground (0 V) Y 4 4 data output Y n.c. - 5 not connected VCC 5 6 supply voltage 7. Functional description Table 4. Function table[1] Input Output A Y L H H L [1] H = HIGH voltage level; L = LOW voltage level. 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 3 of 18 74AUP1G04 NXP Semiconductors Low-power inverter 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current output voltage VO Conditions VI < 0 V [1] Min Max Unit −0.5 +4.6 V −50 - mA −0.5 +4.6 V −50 - mA active mode [1] −0.5 VCC + 0.5 V power-down mode [1] −0.5 +4.6 V - ±20 mA VO < 0 V IO output current VO = 0 V to VCC ICC supply current - +50 mA IGND ground current −50 - mA Tstg storage temperature −65 +150 °C Ptot total power dissipation - 250 mW Tamb = −40 °C to +125 °C [2] [1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K. 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 4 of 18 74AUP1G04 NXP Semiconductors Low-power inverter 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter VCC Conditions Min Max Unit supply voltage 0.8 3.6 V VI input voltage 0 3.6 V VO output voltage Tamb ambient temperature ∆t/∆V input transition rise and fall rate active mode 0 VCC V power-down mode; VCC = 0 V 0 3.6 V −40 +125 °C 0 200 ns/V Typ Max Unit VCC = 0.8 V to 3.6 V 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 0.8 V 0.70 × VCC - - V VCC = 0.9 V to 1.95 V 0.65 × VCC - - V Tamb = 25 °C VIH VIL VOH VOL HIGH-state input voltage LOW-state input voltage HIGH-state output voltage LOW-state output voltage VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.30 × VCC V VCC = 0.9 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V IO = −20 µA; VCC = 0.8 V to 3.6 V VCC − 0.1 - - V VI = VIH or VIL IO = −1.1 mA; VCC = 1.1 V 0.75 × VCC - - V IO = −1.7 mA; VCC = 1.4 V 1.11 - - V IO = −1.9 mA; VCC = 1.65 V 1.32 - - V IO = −2.3 mA; VCC = 2.3 V 2.05 - - V IO = −3.1 mA; VCC = 2.3 V 1.9 - - V IO = −2.7 mA; VCC = 3.0 V 2.72 - - V IO = −4.0 mA; VCC = 3.0 V 2.6 - - V VI = VIH or VIL IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.1 V IO = 1.1 mA; VCC = 1.1 V - - 0.3 × VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.31 V IO = 1.9 mA; VCC = 1.65 V - - 0.31 V IO = 2.3 mA; VCC = 2.3 V - - 0.31 V IO = 3.1 mA; VCC = 2.3 V - - 0.44 V IO = 2.7 mA; VCC = 3.0 V - - 0.31 V IO = 4.0 mA; VCC = 3.0 V - - 0.44 V 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 5 of 18 74AUP1G04 NXP Semiconductors Low-power inverter Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - ±0.1 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.2 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.2 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.5 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 40 µA CI input capacitance VCC = 0 V to 3.6 V; VI = GND or VCC - 0.8 - pF CO output capacitance VO = GND; VCC = 0 V - 1.7 - pF VCC = 0.8 V 0.70 × VCC - - V VCC = 0.9 V to 1.95 V 0.65 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - - V V Tamb = −40 °C to +85 °C VIH VIL VOH VOL HIGH-state input voltage LOW-state input voltage HIGH-state output voltage LOW-state output voltage VCC = 3.0 V to 3.6 V 2.0 - - VCC = 0.8 V - - 0.30 × VCC V VCC = 0.9 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V IO = −20 µA; VCC = 0.8 V to 3.6 V VCC − 0.1 - - V IO = −1.1 mA; VCC = 1.1 V 0.7 × VCC - - V IO = −1.7 mA; VCC = 1.4 V 1.03 - - V IO = −1.9 mA; VCC = 1.65 V 1.30 - - V IO = −2.3 mA; VCC = 2.3 V 1.97 - - V IO = −3.1 mA; VCC = 2.3 V 1.85 - - V IO = −2.7 mA; VCC = 3.0 V 2.67 - - V IO = −4.0 mA; VCC = 3.0 V 2.55 - - V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.1 V VI = VIH or VIL VI = VIH or VIL IO = 1.1 mA; VCC = 1.1 V - - 0.3 × VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.37 V IO = 1.9 mA; VCC = 1.65 V - - 0.35 V IO = 2.3 mA; VCC = 2.3 V - - 0.33 V IO = 3.1 mA; VCC = 2.3 V - - 0.45 V IO = 2.7 mA; VCC = 3.0 V - - 0.33 V IO = 4.0 mA; VCC = 3.0 V - - 0.45 V VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - ±0.5 µA II input leakage current IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.5 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.6 µA 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 6 of 18 74AUP1G04 NXP Semiconductors Low-power inverter Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.9 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 50 µA VCC = 0.8 V 0.75 × VCC - - V VCC = 0.9 V to 1.95 V 0.70 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.25 × VCC V VCC = 0.9 V to 1.95 V - - 0.30 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V Tamb = −40 °C to +125 °C VIH VIL VOH VOL HIGH-state input voltage LOW-state input voltage HIGH-state output voltage LOW-state output voltage VI = VIH or VIL IO = −20 µA; VCC = 0.8 V to 3.6 V VCC − 0.11 - - V IO = −1.1 mA; VCC = 1.1 V 0.6 × VCC - - V IO = −1.7 mA; VCC = 1.4 V 0.93 - - V IO = −1.9 mA; VCC = 1.65 V 1.17 - - V IO = −2.3 mA; VCC = 2.3 V 1.77 - - V IO = −3.1 mA; VCC = 2.3 V 1.67 - - V IO = −2.7 mA; VCC = 3.0 V 2.40 - - V IO = −4.0 mA; VCC = 3.0 V 2.30 - - V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.11 V IO = 1.1 mA; VCC = 1.1 V - - 0.33 × VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.41 VI = VIH or VIL V IO = 1.9 mA; VCC = 1.65 V - - 0.39 V IO = 2.3 mA; VCC = 2.3 V - - 0.36 V IO = 3.1 mA; VCC = 2.3 V - - 0.50 V IO = 2.7 mA; VCC = 3.0 V - - 0.36 V - - 0.50 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V IO = 4.0 mA; VCC = 3.0 V - - ±0.75 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.75 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.75 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 1.4 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 75 µA 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 7 of 18 74AUP1G04 NXP Semiconductors Low-power inverter 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8 Symbol Parameter Min Typ [1] Max Unit VCC = 0.8 V - 16.0 - ns VCC = 1.1 V to 1.3 V 2.4 5.0 10.3 ns VCC = 1.4 V to 1.6 V 1.8 3.6 6.4 ns Conditions Tamb = 25 °C; CL = 5 pF tPHL, tPLH HIGH-to-LOW and LOW-to-HIGH propagation delay A to Y see Figure 7 VCC = 1.65 V to 1.95 V 1.5 2.9 5.0 ns VCC = 2.3 V to 2.7 V 1.2 2.4 3.9 ns VCC = 3.0 V to 3.6 V 1.1 2.1 3.2 ns VCC = 0.8 V - 19.8 - ns VCC = 1.1 V to 1.3 V 2.8 5.9 12.2 ns VCC = 1.4 V to 1.6 V 2.3 4.2 7.5 ns Tamb = 25 °C; CL = 10 pF tPHL, tPLH HIGH-to-LOW and LOW-to-HIGH propagation delay A to Y see Figure 7 VCC = 1.65 V to 1.95 V 2.0 3.5 5.9 ns VCC = 2.3 V to 2.7 V 1.7 2.9 4.6 ns VCC = 3.0 V to 3.6 V 1.6 2.7 3.8 ns VCC = 0.8 V - 23.3 - ns VCC = 1.1 V to 1.3 V 3.2 6.7 13.0 ns VCC = 1.4 V to 1.6 V 2.6 4.7 8.6 ns Tamb = 25 °C; CL = 15 pF tPHL, tPLH HIGH-to-LOW and LOW-to-HIGH propagation delay A to Y see Figure 7 VCC = 1.65 V to 1.95 V 2.3 4.0 6.7 ns VCC = 2.3 V to 2.7 V 2.1 3.3 5.1 ns VCC = 3.0 V to 3.6 V 2.0 3.1 4.2 ns VCC = 0.8 V - 33.6 - ns VCC = 1.1 V to 1.3 V 4.4 8.9 16.0 ns VCC = 1.4 V to 1.6 V 3.6 6.3 10.8 ns Tamb = 25 °C; CL = 30 pF tPHL, tPLH HIGH-to-LOW and LOW-to-HIGH propagation delay A to Y see Figure 7 VCC = 1.65 V to 1.95 V 3.2 5.3 9.0 ns VCC = 2.3 V to 2.7 V 2.9 4.5 6.5 ns VCC = 3.0 V to 3.6 V 2.9 4.2 5.4 ns 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 8 of 18 74AUP1G04 NXP Semiconductors Low-power inverter Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8 Symbol Parameter Min Typ [1] Max Unit VCC = 0.8 V - 2.5 - pF VCC = 1.1 V to 1.3 V - 2.7 - pF VCC = 1.4 V to 1.6 V - 2.8 - pF VCC = 1.65 V to 1.95 V - 3.0 - pF VCC = 2.3 V to 2.7 V - 3.5 - pF VCC = 3.0 V to 3.6 V - 4.0 - pF Conditions Tamb = 25 °C power dissipation capacitance f = 1 MHz; VI = GND to VCC CPD [1] All typical values are measured at nominal VCC. [2] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. [2] Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8 Symbol Parameter −40 °C to +85 °C Conditions −40 °C to +125 °C Min Max Min Max Unit CL = 5 pF tPHL, tPLH HIGH-to-LOW and LOW-to-HIGH propagation delay A to Y see Figure 7 VCC = 1.1 V to 1.3 V 2.1 11.4 2.1 12.6 ns VCC = 1.4 V to 1.6 V 1.6 7.4 1.6 8.2 ns VCC = 1.65 V to 1.95 V 1.4 5.9 1.4 6.5 ns VCC = 2.3 V to 2.7 V 1.1 4.5 1.1 5.0 ns VCC = 3.0 V to 3.6 V 1.0 3.9 1.0 4.3 ns VCC = 1.1 V to 1.3 V 2.6 13.7 2.6 15.1 ns VCC = 1.4 V to 1.6 V 2.1 8.7 2.1 9.6 ns VCC = 1.65 V to 1.95 V 1.8 7.0 1.8 7.7 ns VCC = 2.3 V to 2.7 V 1.5 5.4 1.5 6.0 ns VCC = 3.0 V to 3.6 V 1.4 4.5 1.4 5.0 ns CL = 10 pF tPHL, tPLH HIGH-to-LOW and LOW-to-HIGH propagation delay A to Y see Figure 7 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 9 of 18 74AUP1G04 NXP Semiconductors Low-power inverter Table 9. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8 Symbol Parameter −40 °C to +85 °C Conditions −40 °C to +125 °C Unit Min Max Min Max VCC = 1.1 V to 1.3 V 3.0 15.8 3.0 17.4 ns VCC = 1.4 V to 1.6 V 2.4 10.0 2.4 11.0 ns VCC = 1.65 V to 1.95 V 2.1 8.0 2.1 8.8 ns VCC = 2.3 V to 2.7 V 1.8 6.1 1.8 6.8 ns VCC = 3.0 V to 3.6 V 1.8 5.0 1.8 5.5 ns CL = 15 pF tPHL, tPLH HIGH-to-LOW and LOW-to-HIGH propagation delay A to Y see Figure 7 CL = 30 pF tPHL, tPLH HIGH-to-LOW and LOW-to-HIGH propagation delay A to Y see Figure 7 VCC = 1.1 V to 1.3 V 4.0 19.0 4.0 20.9 ns VCC = 1.4 V to 1.6 V 3.2 12.9 3.2 14.2 ns VCC = 1.65 V to 1.95 V 2.9 10.5 2.9 11.6 ns VCC = 2.3 V to 2.7 V 2.6 7.6 2.6 8.4 ns VCC = 3.0 V to 3.6 V 2.6 6.2 2.6 6.9 ns 12. Waveforms VI VM A input GND t PHL t PLH VOH VM Y output VOL mna640 Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage drop that occur with the output load. Fig 7. The data input (A) to output (Y) propagation delays Table 10. Measurement points Supply voltage Output Input VCC VM VM VI tr = tf 0.8 V to 3.6 V 0.5 × VCC 0.5 × VCC VCC ≤ 3.0 ns 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 10 of 18 74AUP1G04 NXP Semiconductors Low-power inverter VCC VEXT 5 kΩ G VI VO DUT RT CL RL 001aac521 Test data is given in Table 11. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance RT = Termination resistance should be equal to the output impedance Zo of the pulse generator VEXT = External voltage for measuring switching times. Fig 8. Load circuitry for switching times Table 11. Test data Supply voltage Load VEXT [1] VCC CL RL 0.8 V to 3.6 V 5 pF, 10 pF, 15 pF and 30 pF 5 kΩ or 1 MΩ [1] tPLH, tPHL tPZH, tPHZ tPZL, tPLZ open GND 2 × VCC For measuring enable and disable times RL = 5 kΩ, for measuring propagation delays, setup and hold times and pulse width RL = 1 MΩ. 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 11 of 18 74AUP1G04 NXP Semiconductors Low-power inverter 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 9. Package outline SOT353-1 (TSSOP5) 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 12 of 18 74AUP1G04 NXP Semiconductors Low-power inverter Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT753 JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 10. Package outline SOT753 (SC-74A) 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 13 of 18 74AUP1G04 NXP Semiconductors Low-power inverter XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× (2) L L1 e 6 5 e1 4 e1 6× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 1.5 1.4 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 MO-252 Fig 11. Package outline SOT886 (XSON6) 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 14 of 18 74AUP1G04 NXP Semiconductors Low-power inverter XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm 1 SOT891 b 3 2 4× (1) L L1 e 6 5 4 e1 e1 6× A (1) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 max b D E e e1 L L1 mm 0.5 0.04 0.20 0.12 1.05 0.95 1.05 0.95 0.55 0.35 0.35 0.27 0.40 0.32 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15 SOT891 Fig 12. Package outline SOT891 (XSON6) 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 15 of 18 74AUP1G04 NXP Semiconductors Low-power inverter 14. Abbreviations Table 12. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 15. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AUP1G04_3 20091105 Product data sheet - 74AUP1G04_2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Added type number 74AUP1G04GV (SC-74A) package. 74AUP1G04_2 20060628 Product data sheet - 74AUP1G04_1 74AUP1G04_1 20050718 Product data sheet - - 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 16 of 18 74AUP1G04 NXP Semiconductors Low-power inverter 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AUP1G04_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 5 November 2009 17 of 18 74AUP1G04 NXP Semiconductors Low-power inverter 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 5 November 2009 Document identifier: 74AUP1G04_3