PHILIPS 74ALVC244

INTEGRATED CIRCUITS
DATA SHEET
74ALVC244
Octal buffer/line driver; 3-state
Product specification
Supersedes data of 2003 Aug 11
2003 Sep 08
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
FEATURES
DESCRIPTION
• Wide supply voltage range from 1.65 to 3.6 V
The 74ALVC244 is a high-performance, low-power,
low-voltage, Si-gate CMOS device and superior to most
advanced CMOS compatible TTL families.
• 3.6 V tolerant inputs/outputs
• CMOS low power consumption
The 74ALVC244 is an octal non-inverting buffer/line driver
with 3-state outputs. The 3-state outputs are controlled by
the output enable inputs 1OE and 2OE. A HIGH on nOE
causes the outputs to assume a high-impedance
OFF-state. Schmitt-trigger action at all inputs makes the
circuit highly tolerant for slower input rise and fall times.
• Direct interface with TTL levels (2.7 to 3.6 V)
• Power-down mode
• Latch-up performance exceeds 250 mA
• Complies with JEDEC standard:
JESD8-7 (1.65 to 1.95 V)
JESD8-5 (2.3 to 2.7 V)
JESD8B/JESD36 (2.7 to 3.6 V)
• ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C.
SYMBOL
tPHL/tPLH
PARAMETER
propagation delay nAn to nYn
CI
input capacitance
CPD
power dissipation capacitance per buffer
CONDITIONS
VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ
UNIT
2.7
ns
VCC = 2.5 V; CL = 30 pF; RL = 500 Ω 2.0
ns
VCC = 2.7 V; CL = 50 pF; RL = 500 Ω 2.3
ns
VCC = 3.3 V; CL = 50 pF; RL = 500 Ω 2.2
ns
3.5
pF
20
pF
VCC = 3.3 V; notes 1 and 2
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL × VCC2 × fo) = sum of the outputs.
2. The condition is VI = GND to VCC.
2003 Sep 08
TYPICAL
2
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
FUNCTION TABLE
See note 1.
INPUT
OUTPUT
nOE
nAn
nYn
L
L
L
L
H
H
H
X
Z
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
TEMPERATURE
RANGE
PINS
PACKAGE
MATERIAL
CODE
74ALVC244D
−40 to +85 °C
20
SO20
plastic
SOT163-1
74ALVC244PW
−40 to +85 °C
20
TSSOP20
plastic
SOT360-1
74ALVC244BQ
−40 to +85 °C
20
DHVQFN20
plastic
SOT764-1
PINNING
PIN
PIN
SYMBOL
DESCRIPTION
SYMBOL
DESCRIPTION
11
2A3
data input
1
1OE
output enable input (active LOW)
12
1Y3
bus output
2
1A0
data input
13
2A2
data input
3
2Y0
bus output
14
1Y2
bus output
4
1A1
data input
15
2A1
data input
5
2Y1
bus output
16
1Y1
bus output
6
1A2
data input
17
2A0
data input
7
2Y2
bus output
18
1Y0
bus output
8
1A3
data input
19
2OE
output enable input (active LOW)
9
2Y3
bus output
20
VCC
supply voltage
10
GND
ground (0 V)
2003 Sep 08
3
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
handbook, halfpage
handbook, halfpage
1OE
VCC
1
20
1A0
2
19
2OE
1OE 1
20 VCC
1A0 2
19 2OE
2Y0
3
18
1Y0
2Y0 3
18 1Y0
1A1
4
17
2A0
1A1 4
17 2A0
2Y1
5
16
1Y1
2Y1 5
16 1Y1
244
GND(1)
15 2A1
1A2
6
15
2A1
2Y2 7
14 1Y2
2Y2
7
14
1Y2
1A3 8
13 2A2
1A3
8
13
2A2
2Y3 9
12 1Y3
GND 10
11 2A3
2Y3
9
12
1Y3
1A2 6
10
11
GND
2A3
MNA162
Top view
MNA981
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
Fig.1 Pin configuration.
Fig.2 Logic symbol.
handbook, halfpage
handbook, halfpage
2
1A0
1Y0
18
17
2A0
2Y0
3
4
1A1
1Y1
15
2A1
2Y1
18
4
16
16
6
14
5
8
12
6
1A2
1Y2
14
2A2
2Y2
7
8
1A3
1Y3
12
11
2A3
2Y3
9
1OE
19
2OE
EN
2
13
1
1
19
MNA168
EN
11
9
13
7
15
5
17
3
MNA169
Fig.3 Logic symbol.
2003 Sep 08
Fig.4 IEE/IEC logic symbol.
4
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
handbook, halfpage
1Y0
1A0
2
18
1A1
1Y1
4
6
8
1
16
1Y2
1A2
14
1Y3
1A3
12
1OE
2Y0
2A0
17
3
2A1
2Y1
15
13
11
19
5
2Y2
2A2
7
2Y3
2A3
9
2OE
MNA170
Fig.5 Logic diagram.
2003 Sep 08
5
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage
1.65
3.6
V
VI
input voltage
0
3.6
V
VO
output voltage
VCC
V
Tamb
operating ambient temperature
tr, tf
input rise and fall times
VCC = 1.65 to 3.6 V; enable mode 0
VCC = 1.65 to 3.6 V; disable mode 0
3.6
V
VCC = 0 V; Power-down mode
0
3.6
V
−40
+85
°C
VCC = 1.65 to 2.7 V
0
20
ns/V
VCC = 2.7 to 3.6 V
0
10
ns/V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
VCC
supply voltage
IIK
input diode current
VI
input voltage
IOK
output diode current
VO
output voltage
CONDITIONS
MIN.
MAX.
UNIT
−0.5
+4.6
V
−
−50
mA
−0.5
+4.6
V
VO > VCC or VO < 0
−
±50
mA
enable mode; notes 1 and 2
−0.5
VCC + 0.5
V
disable mode
−0.5
+4.6
V
Power-down mode; note 2
−0.5
+4.6
V
VO = 0 to VCC
−
±50
mA
VI < 0
IO
output source or sink current
IGND, ICC
VCC or GND current
−
±100
mA
Tstg
storage temperature
−65
+150
°C
Ptot
power dissipation
−
500
mW
Tamb = −40 to +85 °C; note 3
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation.
3. For SO20 packages: above 70 °C derate linearly with 8 mW/K.
For TSSOP20 packages: above 60 °C derate linearly with 5.5 mW/K.
For DHVQFN20 packages: above 60 °C derate linearly with 4.5 mW/K.
2003 Sep 08
6
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
DC CHARACTERISTICS
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
OTHER
TYP.(1)
MAX.
UNIT
VCC (V)
Tamb = −40 to +85 °C
VIH
VIL
VOL
VOH
HIGH-level input
voltage
HIGH-level output
voltage
−
V
1.7
−
−
V
2
−
−
V
2.7 to 3.6
1.65 to 1.95 −
−
0.35 × VCC V
2.3 to 2.7
−
−
0.7
V
2.7 to 3.6
−
−
0.8
V
IO = 100 µA
1.65 to 3.6
−
−
0.2
V
IO = 6 mA
1.65
−
−
0.3
V
IO = 12 mA
2.3
−
−
0.4
V
IO = 18 mA
2.3
−
−
0.6
V
IO = 12 mA
2.7
−
−
0.4
V
IO = 18 mA
3.0
−
−
0.4
V
IO = 24 mA
3.0
−
−
0.55
V
IO = −100 µA
1.65 to 3.6
VCC − 0.2
−
−
V
IO = −6 mA
1.65
1.25
−
−
V
IO = −12 mA
2.3
1.8
−
−
V
IO = −18 mA
2.3
1.7
−
−
V
IO = −12 mA
2.7
2.2
−
−
V
IO = −18 mA
3.0
2.4
−
−
V
IO = −24 mA
3.0
2.2
−
−
V
LOW-level input
voltage
LOW-level output
voltage
1.65 to 1.95 0.65 × VCC −
2.3 to 2.7
VI = VIH or VIL
VI = VIH or VIL
ILI
input leakage
current
VI = 3.6 V or GND
3.6
−
±0.1
±5
µA
IOZ
3-state output
OFF-state current
VI = VIH or VIL;
VO = 3.6 V or GND; note 2
3.6
−
0.1
±10
µA
Ioff
power OFF leakage VI or VO = 3.6 V
current
0.0
−
±0.1
±10
µA
ICC
quiescent supply
current
VI = VCC or GND; IO = 0
3.6
−
0.2
20
µA
∆ICC
additional
quiescent supply
current per input
pin
VI = VCC − 0.6 V; IO = 0
3.0 to 3.6
−
5
750
µA
Notes
1. All typical values are measured at Tamb = 25 °C.
2. For transceivers, the parameters IOZ includes the input leakage current.
2003 Sep 08
7
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
AC CHARACTERISTICS
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
WAVEFORMS
TYP.(1)
MAX.
UNIT
VCC (V)
Tamb = −40 to +85 °C
tPHL/tPLH
tPZH/tPZL
tPHZ/tPLZ
propagation delay nAn to nYn
see Figs 6 and 8 1.65 to 1.95
3-state output enable time
nOE to nYn
1.0
2.7
4.4
ns
2.3 to 2.7
1.0
2.0
3.1
ns
2.7
1.0
2.3
3.1
ns
3.0 to 3.6
1.0
2.2
2.8
ns
see Figs 7 and 8 1.65 to 1.95
3-state output disable time
nOE to nYn
1.0
3.4
6.9
ns
2.3 to 2.7
1.0
2.6
5.4
ns
2.7
1.0
3.2
5.3
ns
3.0 to 3.6
1.0
2.5
4.5
ns
1.0
3.8
5.9
ns
2.3 to 2.7
1.0
2.2
4.1
ns
2.7
1.0
3.0
4.4
ns
3.0 to 3.6
1.0
2.9
4.2
ns
see Figs 7 and 8 1.65 to 1.95
Note
1. All typical values are measured at Tamb = 25 °C.
AC WAVEFORMS
handbook, halfpage VI
nAn input
VM
VM
GND
tPLH
tPHL
VOH
VM
nYn output
VOL
VM
MNA171
INPUT
VCC
VM
VI
tr = tf
0.5 × VCC
VCC
≤ 2.0 ns
2.3 to 2.7 V
0.5 × VCC
VCC
≤ 2.0 ns
2.7 V
1.5 V
2.7 V
≤ 2.5 ns
3.0 to 3.6 V
1.5 V
2.7 V
≤ 2.5 ns
1.65 to 1.95 V
Fig.6 Input nAn to output nYn propagation delay times.
2003 Sep 08
8
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
VI
handbook, full pagewidth
VM
nOE input
GND
tPLZ
output
LOW-to-OFF
OFF-to-LOW
tPZL
VCC
VM
Vx
VOL
tPHZ
tPZH
VOH
Vy
output
HIGH-to-OFF
OFF-to-HIGH
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
MNA654
INPUT
VCC
VM
VI
tr = tf
1.65 to 1.95 V 0.5 × VCC
VCC
≤ 2.0 ns
2.3 to 2.7 V
0.5 × VCC
VCC
≤ 2.0 ns
2.7 V
1.5 V
2.7 V
≤ 2.5 ns
VX = VOL + 0.3 V at VCC ≥ 2.7 V;
VX = VOL + 0.15 V at VCC < 2.7 V;
VY = VOH − 0.3 V at VCC ≥ 2.7 V;
VY = VOH − 0.15 V at VCC < 2.7 V.
3.0 to 3.6 V
1.5 V
2.7 V
≤ 2.5 ns
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.7 3-state enable and disable times.
2003 Sep 08
9
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
VEXT
handbook, full pagewidth
VCC
PULSE
GENERATOR
VI
RL
VO
D.U.T.
CL
RT
RL
MNA616
VCC
VI
CL
RL
VEXT
tPLH/tPHL
tPZH/tPHZ
tPZL/tPLZ
1.65 to 1.95 V
VCC
30 pF
1 kΩ
open
GND
2 × VCC
2.3 to 2.7 V
VCC
30 pF
500 Ω
open
GND
2 × VCC
2.7 V
2.7 V
50 pF
500 Ω
open
GND
6V
3.0 to 3.6 V
2.7 V
50 pF
500 Ω
open
GND
6V
Definitions for test circuit:
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.8 Load circuitry for switching times.
2003 Sep 08
10
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
PACKAGE OUTLINES
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.1
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
2003 Sep 08
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
11
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
2003 Sep 08
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-153
12
o
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT764-1
20 terminals; body 2.5 x 4.5 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
9
y
y1 C
v M C A B
w M C
b
L
1
10
Eh
e
20
11
19
12
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
4.6
4.4
3.15
2.85
2.6
2.4
1.15
0.85
0.5
3.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT764-1
---
MO-241
---
2003 Sep 08
13
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC244
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Sep 08
14
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA75
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R20/03/pp15
Date of release: 2003
Sep 08
Document order number:
9397 750 12018