UBA2024 Half-bridge power IC for CFL lamps Rev. 04 — 17 September 2009 Product data sheet 1. General description The UBA2024 is a high-voltage monolithic Integrated Circuit (IC). The IC is designed for driving Compact Fluorescent Lamps (CFL) in a half-bridge configuration. The IC features a soft start function, an adjustable internal oscillator and an internal drive function with a high-voltage level shifter for driving the half-bridge. To guarantee an accurate 50 % duty cycle, the oscillator signal is passed through a divider before being fed to the output drivers. 2. Features n Integrated half-bridge power transistors u UBA2024P: 9 Ω u UBA2024AP: 6 Ω u UBA2024T: 9 Ω u UBA2024AT: 6.4 Ω n Integrated bootstrap diode n Integrated low-voltage supply n Adjustable oscillator frequency n 550 V maximum voltage n Minimum glow time control n Soft start 3. Applications n Driver for any kind of half-bridge configured load up to 23 W, provided that the maximum junction temperature is not exceeded. n Designed for electronically self-ballasted CFL lamps UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 4. Ordering information Table 1. Ordering information Type number Package Name Description Version UBA2024P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 UBA2024AP DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 UBA2024T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 UBA2024AT SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 5. Block diagram (6) 4 UBA2024T (UBA2024P) (3) 11 VDD CONTROL VDD SW FS 6 (7) HS 8 (1) SWEEP AND GLOW TIME CONTROL VDD(stop) HIGH VOLTAGE LEVEL SHIFTER HIGH SIDE DRIVER (5) 14 RC HV 7 (8) OSCILLATOR DIVIDE-BY-2 OUT LS DEAD TIME LOW SIDE DRIVER SGND 1,2,3,5,9,10,13 (2) (4) 12 PGND mdb029 Fig 1. Block diagram 6. Pinning information 6.1 Pinning UBA2024P UBA2024AP SW 1 8 RC SGND 2 7 VDD FS 3 6 HV PGND 4 5 OUT 014aaa657 Fig 2. Pinning diagram SOT97-1 1 14 OUT SGND 2 13 SGND SGND 3 12 PGND UBA2024T 11 FS UBA2024AT HV 4 SGND 5 VDD 6 9 SGND RC 7 8 SW 10 SGND 014aaa804 Fig 3. UBA2024_4 Product data sheet SGND Pinning diagram SOT108-1 © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 2 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 6.2 Pin description Table 2. Pin description Symbol Pin SOT97-1 Pin SOT108-1 Description SW 1 8 sweep timing input SGND 2 1, 2, 3, 5, 9, 10, 13 signal ground FS 3 11 high-side floating supply output PGND 4 12 power ground OUT 5 14 half-bridge output HV 6 4 high-voltage supply VDD 7 6 internal low-voltage supply output RC 8 7 internal oscillator input 7. Functional description 7.1 Supply voltage The UBA2024 does not require an external low-voltage supply as the mains supply voltage applied to pin HV powers it. The IC derives its own low supply voltage from this for its internal circuitry. 7.2 Start-up state With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the start-up state the high-side power transistor is not conducting and the low-side power transistor is switched on. The internal circuit is reset and the capacitors on the bootstrap pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to ground. The start-up state is defined until VDD = VDD(startup). 7.3 Sweep mode The IC enters the sweep mode when the voltage on pin VDD > VDD(startup). The capacitor on pin SW is charged by ISW and the half-bridge circuit starts oscillating. The circuit enters the start-up state again when the voltage on pin VDD < VDD(stop). The sweep time (tsweep) is determined by the charge current (Ich(sw)) and the external capacitor (CSW). Typical the total sweep time set by CSW is: t sweep = C SW ( nF ) × 10.3ms (1) During the sweep time the current flowing through the lamp electrodes performs some preheating of the filaments. See Figure 5. 7.4 Reset A DC reset circuit is incorporated in the high-side driver. The high-side transistor is switched off when the voltage on pin FS is below the high-side lockout voltage Vfloat(UVLO). UBA2024_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 3 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 7.5 Oscillation The oscillation is based upon the 555-timer function. A self oscillating circuit is made with the external resistor ROSC and the capacitor COSC (see Figure 4). To realize an accurate 50 % duty cycle, an internal divider is used. This reduces the bridge frequency to half the oscillator frequency. The output voltage of the bridge will change at the falling edge of the signal on pin RC. The design equation for the half-bridge frequency is: 1 f osc = -----------------------------------------k x R OSC x C OSC An overview of the oscillator signal, internal LS and HS drive signals and the output is given in Figure 4. VRC 0 time HS drive 0 time LS drive 0 time VOUT half bridge 0 time 014aaa658 Fig 4. Oscillator, drivers and output signals When entering the sweep mode (VSW = 0 V), the bridge oscillator starts at 2.5 times the nominal bridge frequency and sweeps down to the nominal frequency (bridge), set by ROSC and COSC. During the sweep mode the amplitude of the RC oscillator on pin RC, will swing between Vtrip(osc)low and VSW + 0.4Vtrip(osc)high. The amplitude of the RC oscillator will continue to increase until VSW + 0.4Vtrip(osc)high = Vtrip(osc)high, this determines the end of the sweep time. The voltage on pin SW however will continue to rise until it reaches supply voltage level. During this continuous decrease in frequency, the circuit approaches the resonance frequency of the load, and this causes a high voltage across the load, which ignites the lamp. The sweep to resonance time should be much larger than the settling time of the supply voltage on pin HV, to guarantee that the full high-voltage is present at the moment of ignition. See Figure 5. UBA2024_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 4 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps VHV time 0 VDD VDD(startup) time VSW VDD 0.6 Vtrip(osc)high 0 time fosc 2.5nom nom 0 Vlamp Vign time minimum glow time control VgloA Vnom time 0 tsweep 014aaa659 Fig 5. 7.6 Start-up frequency behavior Glow time control The inherent glow time of cold-started CFL lamps reduces the switching lifetime of the electrodes. To make this glow phase as short as possible, the maximum power is given to the lamp during the glow time via a special control. See Figure 5. 7.7 Non-overlap time The non-overlap time is defined as the time when both MOSFETs are not conducting. The non-overlap time is fixed internally. 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VHV voltage on pin HV VFS Conditions Max Unit normal operation - 373 V mains transients during 0.5 s - 550 V VHV VHV + 14 V voltage on pin FS UBA2024_4 Product data sheet Min © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 5 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps Table 3. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDD supply voltage low voltage; DC supply 0 14 V IDD supply current low voltage; peak value is internally limited; Tamb = 25 °C 0 5 mA VPGND voltage on pin PGND referenced to SGND −1 +1 V VRC voltage on pin RC IRC < 1 mA 0 VDD V VSW voltage on pin SW ISW < 1 mA 0 VDD V SR slew rate pin OUT; repetitive −4 +4 V/ns Tj junction temperature −40 +150 °C Tamb ambient temperature −40 +150 °C Tstg storage temperature −55 +150 °C VESD electrostatic discharge voltage pins HV and VDD - 1000 V pins SW, RC, FS, and OUT - 2500 V [1] human body model: machine model: [3] pin FS - 200 V pins HV, VDD, SW, RC, and OUT - 250 V [1] The maximum junction temperature must not be exceeded. [2] In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [3] In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 kΩ series resistor and a 0.75 µH inductor. UBA2024_4 Product data sheet [2] © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 6 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 9. Thermal characteristics Table 4. Symbol Rth(j-a) Thermal characteristics Parameter Conditions Typ Unit 95 K/W 95 K/W SO14 package 8 K/W DIP8 package 16 K/W thermal resistance from junction to ambient in free air thermal resistance from junction to case in free air [1] SO14 package DIP8 package Rth(j-c) [1] [1] In accordance with IEC 60747-1 10. Characteristics Table 5. Characteristics Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol Parameter Conditions Min Typ Max Unit High-voltage supply VHV voltage on pin HV mains transients during 0.5 s; IHV < 30 mA 0 - 550 V VFS voltage on pin FS mains transients during 0.5 s; IHV < 30 mA 0 - 564 V VHV = 100 V; ROSC = ∞; VSW = VDD; VRC = 0 V 11.7 12.5 13.3 V VHV = 100 V; ROSC = ∞; VSW = VDD; VRC = 0 V - - 0.39 mA Low-voltage supply VDD supply voltage Start-up state IHV current on pin HV VDD(startup) start-up supply voltage 10 11 12 V VDD(stop) stop supply voltage 8 8.5 9 V VDD(hys) hysteresis of supply voltage 2 2.5 3 V Output stage Ron on-state resistance HS transistor; VHV = 310 V; ID = 100 mA UBA2024P - 9.7 11 Ω UBA2024AP - 6.5 7.4 Ω UBA2024T - 9.7 11 Ω UBA2024AT - 7.0 8.0 Ω UBA2024P - 8.5 9.4 Ω UBA2024AP - 5.7 6.3 Ω UBA2024T - 8.5 9.4 Ω UBA2024AT - 6.2 6.9 Ω LS transistor; ID = 100 mA UBA2024_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 7 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps Table 5. Characteristics …continued Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol Parameter Conditions Min Typ Max Unit VF forward voltage HS; IF = 200 mA - - 2.2 V LS; IF = 200 mA - - 2.0 V bootstrap diode; IF = 1 mA 0.7 1.0 1.3 V IDsat drain saturation current HS; VDS = 30 V; Tj ≤ 125 °C; VHV = 310 V UBA2024P 900 - - mA UBA2024AP 1350 - - mA UBA2024T 900 - - mA UBA2024AT 1200 - - mA LS; VDS = 30 V; Tj ≤ 125 °C UBA2024P 900 - - mA UBA2024AP 1350 - - mA UBA2024T 900 - - mA UBA2024AT 1200 - - mA tno non-overlap time 1 1.35 1.7 µs Vfloat(UVLO) undervoltage lockout floating voltage 3.6 4.2 4.8 V IFS current on pin FS VHV = 310 V; VFS = 12.2 V 10 14 18 µA VSW = 0 V - 150 - kHz VSW = VDD - - 60 kHz operating; nominal; ROSC = 100 kΩ; COSC = 220 pF; VSW = VDD 40.05 41.32 42.68 kHz ROSC = 100 kΩ; COSC = 220 pF; −20 °C ≤ Tj ≤ +150 °C - 2 - % 0.382 0.395 0.408 Internal oscillator fosc oscillator frequency ∆fosc/fosc relative oscillator frequency variation kH high-level trip point factor Vtrip(osc)high high oscillator trip voltage kL low-level trip point factor Vtrip(osc)low low oscillator trip voltage Kosc oscillator constant Vtrip(osc)high = kH × VDD 4.58 4.94 5.29 0.030 0.033 0.036 V Vtrip(osc)low = kL × VDD 0.367 0.413 0.458 V ROSC = 100 kΩ; COSC = 220 pF 1.065 1.1 1.35 V Sweep function Ich(sweep) sweep charge current VSW = 0 V 215 280 345 nA tsweep sweep time CSW = 33 nF; VDD = 12.2 V 0.28 0.35 0.45 s UBA2024_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 8 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 11. Application information 1.8 mH LFILT RFUS AC mains supply (230 V) D1 D2 max. 550 V HV SW 11 W/150 mA FS VDD CHB2 47 nF CFS 10 nF CBUF 4.7 uF 33 Ω D3 D4 3.1 mH CHB1 47 nF CLA 1.5 nF LLA OUT ROSC 110 K UBA2024 CDV 100 pF PGND CVDD 10 nF RC CSW 33 nF COSC 180 pF SGND mdb033 Fig 6. Schematic of standard compact fluorescent lamp application using UBA2024 UBA2024_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 9 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 12. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.02 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Fig 7. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT97-1 050G01 MO-001 SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Package outline SOT97-1 (DIP8) UBA2024_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 10 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 8. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT108-1 (SO14) UBA2024_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 11 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 13. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes UBA2024_4 20090917 Product data sheet - UBA2024_3 Modifications: • • • UBA2024AP, UBA2024AT, and UBA2024T added to Table 1 “Ordering information”. SOT108-1 added as Figure 8. Additional information in Section 7.3 and Section 7.5. UBA2024_3 081016 Product data sheet - UBA2024_2 UBA2024_2 040203 Product data sheet - UBA2024_1 UBA2024_1 030813 Product data sheet - - UBA2024_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 12 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 14.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] UBA2024_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 September 2009 13 of 14 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 16. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 3 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Sweep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Glow time control . . . . . . . . . . . . . . . . . . . . . . . 5 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 September 2009 Document identifier: UBA2024_4