74LVC3G07 Triple buffer with open-drain output Rev. 06 — 16 June 2008 Product data sheet 1. General description The 74LVC3G07 provides three non-inverting buffers. The output of the device is an open-drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. Input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall time. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features n n n n n n n n n n n n Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant input/output for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: u JESD8-7 (1.65 V to 1.95 V) u JESD8-5 (2.3 V to 2.7 V) u JESD8-B/JESD36 (2.7 V to 3.6 V). ESD protection: u HBM JESD22-A114E exceeds 2000 V u MM JESD22-A115-A exceeds 200 V −24 mA output drive (VCC = 3.0 V) CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5 V Multiple package options Specified from −40 °C to +85 °C and −40 °C to +125 °C. 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC3G07DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74LVC3G07DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 74LVC3G07GT −40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 1 × 1.95 × 0.5 mm SOT833-1 74LVC3G07GD −40 °C to +125 °C XSON8U plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 × 2 × 0.5 mm SOT996-2 74LVC3G07GM −40 °C to +125 °C XQFN8U plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm SOT902-1 4. Marking Table 2. Marking codes Type number Marking code 74LVC3G07DP V07 74LVC3G07DC V07 74LVC3G07GT V07 74LVC3G07GD V07 74LVC3G07GM V07 5. Functional diagram 1 1A 1Y 2A 2Y 3A 3Y 1Y 1A 1 2Y 2A Y 1 3Y 3A 001aah762 Fig 1. Logic symbol Fig 2. IEC logic symbol 74LVC3G07_6 Product data sheet A GND 001aah763 Fig 3. mna591 Logic diagram (one driver) © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 2 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output 6. Pinning information 6.1 Pinning 74LVC3G07 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 74LVC3G07 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 001aac022 Transparent top view 001aab022 Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) Fig 5. Pin configuration SOT833-1 (XSON8) 74LVC3G07 74LVC3G07 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 1 3A 2Y 8 1Y 7 1A 2 6 3Y 3 5 2A GND 4 1A VCC terminal 1 index area 001aai252 Transparent top view Transparent top view Fig 6. 001aag243 Pin configuration SOT996-2 (XSON8U) Fig 7. Pin configuration SOT902-1 (XQFN8U) 6.2 Pin description Table 3. Pin description Symbol Pin Description SOT505-2, SOT765-1, SOT833-1 and SOT996-2 SOT902-1 1A, 2A, 3A 1, 3, 6 7, 5, 2 data input GND 4 4 ground (0 V) 1Y, 2Y, 3Y 7, 5, 2 1, 3, 6 data output VCC 8 8 supply voltage 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 3 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output 7. Functional description Table 4. Function table[1] Input nA Output nY L L H Z [1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current Conditions input voltage IOK output clamping current VO < 0 V VO output voltage Active mode Power-down mode Max Unit −0.5 +6.5 V −50 - mA [1] −0.5 +6.5 V −50 - mA [1] −0.5 +6.5 V [1][2] −0.5 +6.5 V - 50 mA VI < 0 V VI Min IO output current ICC supply current - 100 mA IGND ground current −100 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot VO = 0 V to 6.5 V Tamb = −40 °C to +125 °C [3] [1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. [3] For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 package: above 110 °C the value of Ptot derates linearly with 8 mW/K. For XSON8, XSON8U and XQFN8U packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K. 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter Conditions Min Max Unit VCC supply voltage 1.65 5.5 V VI input voltage 0 5.5 V VO output voltage Active mode 0 5.5 V Power-down mode; VCC = 0 V 0 5.5 V Tamb ambient temperature ∆t/∆V input transition rise and fall rate −40 +125 °C VCC = 1.65 V to 2.7 V - 20 ns/V VCC = 2.7 V to 5.5 V - 10 ns/V 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 4 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = −40 °C to +85 VIH VIL VOL Conditions Min Typ Max Unit °C[1] HIGH-level input voltage LOW-level input voltage LOW-level output voltage VCC = 1.65 V to 1.95 V 0.65 × VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7 × VCC - - V VCC = 1.65 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 × VCC V IO = 100 µA; VCC = 1.65 V to 5.5 V - - 0.1 V IO = 4 mA; VCC = 1.65 V - - 0.45 V VI = VIH or VIL IO = 8 mA; VCC = 2.3 V - - 0.3 V IO = 12 mA; VCC = 2.7 V - - 0.4 V IO = 24 mA; VCC = 3.0 V - - 0.55 V - - 0.55 V - ±0.1 ±5 µA IO = 32 mA; VCC = 4.5 V [2] II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V IOZ OFF-state output current VI = VIH or VIL; VO = VCC or GND; VCC = 5.5 V - ±0.1 ±10 µA IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V - ±0.1 ±10 µA ICC supply current VI = 5.5 V or GND; IO = 0 A; VCC = 1.65 V to 5.5 V - 0.1 10 µA ∆ICC additional supply current per pin; VCC = 2.3 V to 5.5 V; VI = VCC − 0.6 V; IO = 0 A - 5 500 µA CI input capacitance - 2.5 - pF 74LVC3G07_6 Product data sheet [2] © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 5 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 1.65 V to 1.95 V Typ Max Unit 0.65 × VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7 × VCC - - V VCC = 1.65 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 × VCC V IO = 100 µA; VCC = 1.65 V to 5.5 V - - 0.1 V IO = 4 mA; VCC = 1.65 V - - 0.70 V IO = 8 mA; VCC = 2.3 V - - 0.45 V Tamb = −40 °C to +125 °C HIGH-level input voltage VIH LOW-level input voltage VIL LOW-level output voltage VOL VI = VIH or VIL IO = 12 mA; VCC = 2.7 V - - 0.60 V IO = 24 mA; VCC = 3.0 V - - 0.80 V IO = 32 mA; VCC = 4.5 V - - 0.80 V II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - ±20 µA IOZ OFF-state output current VI = VIH or VIL; VO = VCC or GND; VCC = 5.5 V - - ±10 µA IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V - - ±20 µA ICC supply current VI = 5.5 V or GND; IO = 0 A; VCC = 1.65 V to 5.5 V - - 40 µA ∆ICC additional supply current per pin; VCC = 2.3 V to 5.5 V; VI = VCC − 0.6 V; IO = 0 A - - 5000 µA [1] All typical values are measured at Tamb = 25 °C. [2] These typical values are measured at VCC = 3.3 V. 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 6 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9. Symbol Parameter −40 °C to +85 °C Conditions power dissipation capacitance CPD Unit Min Max Min Max VCC = 1.65 V to 1.95 V 1.0 2.9 6.7 1.0 8.4 ns VCC = 2.3 V to 2.7 V 0.5 1.7 4.3 0.5 5.5 ns VCC = 2.7 V 1.0 2.3 4.2 1.0 5.3 ns VCC = 3.0 V to 3.6 V 0.5 2.1 3.7 0.5 4.7 ns VCC = 4.5 V to 5.5 V 0.5 1.5 2.9 0.5 3.7 ns - 6.5 - - - pF [2] propagation delay nA to nY; see Figure 8 tpd −40 °C to +125 °C Typ[1] [3] VI = GND to VCC; VCC = 3.3 V [1] Typical values are measured at Tamb = 25 °C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively. [2] tpd is the same as tPLZ and tPZL. [3] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. 12. Waveforms VI VM nA input VM GND t PLZ t PZL VCC nY output VM VOL VX mna528 Measurement points are given in Table 9. VOL is the typical output voltage drop that occur with the output load. Fig 8. The input (nA) to output (nY) propagation delays 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 7 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output Table 9. Measurement points Supply voltage Input Output VCC VM VM VX 1.65 V to 1.95 V 0.5 × VCC 0.5 × VCC VOL + 0.15 V 2.3 V to 2.7 V 0.5 × VCC 0.5 × VCC VOL + 0.15 V 2.7 V 1.5 V 1.5 V VOL + 0.3 V 3.0 V to 3.6 V 1.5 V 1.5 V VOL + 0.3 V 4.5 V to 5.5 V 0.5 × VCC 0.5 × VCC VOL + 0.3 V VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 9. Table 10. Load circuit for measuring switching times Test data Supply voltage Input Load VCC VI tr = tf CL RL tPZL, tPLZ 1.65 V to 1.95 V VCC ≤ 2.0 ns 30 pF 1 kΩ 2 × VCC 2.3 V to 2.7 V VCC ≤ 2.0 ns 30 pF 500 Ω 2 × VCC 2.7 V 2.7 V ≤ 2.5 ns 50 pF 500 Ω 6V 3.0 V to 3.6 V 2.7 V ≤ 2.5 ns 50 pF 500 Ω 6V 4.5 V to 5.5 V VCC ≤ 2.5 ns 50 pF 500 Ω 2 × VCC 74LVC3G07_6 Product data sheet VEXT © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 8 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Fig 10. Package outline SOT505-2 (TSSOP8) 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 9 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 11. Package outline SOT765-1 (VSSOP8) 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 10 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 12. Package outline SOT833-1 (XSON8) 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 11 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm B D SOT996-2 A A E A1 detail X terminal 1 index area e1 v w b e L1 1 4 8 5 C C A B C M M y y1 C L2 L X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 L2 v w y y1 mm 0.5 0.05 0.00 0.35 0.15 2.1 1.9 3.1 2.9 0.5 1.5 0.5 0.3 0.15 0.05 0.6 0.4 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT996-2 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 13. Package outline SOT996-2 (XSON8U) 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 12 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm B D SOT902-1 A terminal 1 index area E A A1 detail X L1 e e C ∅v M C A B ∅w M C L 4 y1 C y 5 3 metal area not for soldering e1 b 2 6 e1 7 1 terminal 1 index area 8 X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 v w y y1 mm 0.5 0.05 0.00 0.25 0.15 1.65 1.55 1.65 1.55 0.55 0.5 0.35 0.25 0.15 0.05 0.1 0.05 0.05 0.05 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT902-1 --- MO-255 --- EUROPEAN PROJECTION ISSUE DATE 05-11-25 07-11-14 Fig 14. Package outline SOT902-1 (XQFN8U) 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 13 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC3G07_6 20080616 Product data sheet - 74LVC3G07_5 Modifications: • Added type number 74LVC3G07GD (XSON8U package) 74LVC3G07_5 20080219 Product data sheet - 74LVC3G07_4 74LVC3G07_4 20070521 Product data sheet - 74LVC3G07_3 74LVC3G07_3 20050201 Product data sheet - 74LVC3G07_2 74LVC3G07_2 20041027 Product data sheet - 74LVC3G07_1 74LVC3G07_1 20040608 Product data sheet - - 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 14 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74LVC3G07_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 — 16 June 2008 15 of 16 74LVC3G07 NXP Semiconductors Triple buffer with open-drain output 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 16 June 2008 Document identifier: 74LVC3G07_6