74ALVC574 Octal D-type flip-flop; positive edge-trigger; 3-state Rev. 02 — 8 November 2007 Product data sheet 1. General description The 74ALVC574 is an octal D-type flip-flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus-oriented applications. A clock input (CP) and an outputs enable input (OE) are common to all flip-flops. The eight flip-flops will store the state of their individual D-inputs that meet the set-up and hold times requirements on the LOW to HIGH CP transition. When pin OE is LOW, the contents of the eight flip-flops is available at the outputs. When pin OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops. The 74ALVC574 is functionally identical to the 74ALVC374, but has a different pin arrangement. 2. Features ■ ■ ■ ■ ■ ■ ■ Wide supply voltage range from 1.65 V to 3.6 V 3.6 V tolerant inputs/outputs CMOS low power consumption Direct interface with TTL levels (2.7 V to 3.6 V) Power-down mode Latch-up performance exceeds 250 mA Complies with JEDEC standards: ◆ JESD8-7 (1.65 V to 1.95 V) ◆ JESD8-5 (2.3 V to 2.7 V) ◆ JESD8B/JESD36 (2.7 V to 3.6 V) ■ ESD protection: ◆ HBM JESD22-A114E exceeds 2000 V ◆ MM JESD22-A115A exceeds 200 V 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state 3. Ordering information Table 1. Ordering information Type number 74ALVC574D Package Temperature range Name Description Version −40 °C to +85 °C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 74ALVC574PW −40 °C to +85 °C 74ALVC574BQ −40 °C to +85 °C DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 × 4.5 × 0.85 mm SOT764-1 4. Functional diagram 11 1 C1 EN 11 2 3 4 5 6 7 8 9 2 CP D0 Q0 D1 Q1 D2 Q2 D3 Q3 D4 Q4 D5 Q5 D6 Q6 D7 Q7 19 3 18 17 4 17 16 5 16 15 6 15 7 14 8 13 9 12 18 14 13 12 OE 1 19 1D mna446 mna798 Fig 1. Logic symbol Fig 2. IEC logic symbol 2 D0 Q0 19 3 D1 Q1 18 4 D2 5 D3 6 D4 7 D5 Q5 14 8 D6 Q6 13 9 D7 Q7 12 Q2 17 FF1 to FF8 Q3 16 3-STATE OUTPUTS Q4 15 11 CP 1 OE mna800 Fig 3. Functional diagram 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 2 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state D0 D1 D Q D2 D CP Q D CP FF1 D3 Q D CP FF2 D4 Q D CP FF3 D5 Q D CP FF4 Q D CP FF5 D7 D6 Q D CP FF6 Q CP FF7 FF8 CP OE Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 mna801 Fig 4. Logic diagram 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 3 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state 5. Pinning information 5.1 Pinning 1 OE terminal 1 index area 74ALVC574 20 VCC 74ALVC574 D0 2 19 Q0 D1 3 18 Q1 D2 4 17 Q2 OE 1 D0 2 20 VCC 19 Q0 D1 3 18 Q1 D3 5 16 Q3 D2 4 17 Q2 D4 6 15 Q4 D3 5 16 Q3 D5 7 14 Q5 D4 6 15 Q4 D6 8 D5 7 14 Q5 D6 8 13 Q6 D7 9 D7 9 12 Q7 GND 10 11 CP GND(1) 13 Q6 CP 11 GND 10 12 Q7 001aad096 Transparent top view 001aad095 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig 5. Pin configuration SO20 and TSSOP20 Fig 6. Pin configuration DHVQFN20 5.2 Pin description Table 2. Pin description Symbol Pin Description D[0:7] 2, 3, 4, 5, 6, 7, 8, 9 data input CP 11 clock input (LOW to HIGH, edge-triggered) OE 1 output enable input (active LOW) Q[0:7] 19, 18, 17, 16, 15, 14, 13, 12 3-state flip-flop output VCC 20 supply voltage GND 10 ground (0 V) 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 4 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state 6. Functional description Table 3. Function table[1] Operating mode Input Internal flip-flop Output OE CP Dn Load and read register L ↑ l L ↑ h H H Load register and disable outputs H ↑ l L Z H ↑ h H Z [1] Qn L L H = HIGH voltage level h = HIGH voltage level one set-up time prior to the LOW to HIGH CP transition L = LOW voltage level l = LOW voltage level one set-up time prior to the LOW to HIGH CP transition Z = high-impedance OFF-state ↑ = LOW to HIGH clock transition 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current output voltage VO Conditions Min −0.5 +4.6 V VI < 0 V −50 - mA −0.5 +4.6 V - ±50 mA VO > VCC or VO < 0 V output HIGH or LOW state [1] [2] output 3-state power-down mode, VCC = 0 V [2] Unit −0.5 VCC + 0.5 V −0.5 +4.6 V −0.5 +4.6 V - ±50 mA IO output current ICC supply current - 100 mA IGND ground current −100 - mA Tstg storage temperature −65 +150 °C - 500 mW total power dissipation Ptot VO = 0 V to VCC Max Tamb = −40 °C to +85 °C [3] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] When VCC = 0 V (power-down mode), the output voltage can be 3.6 V in normal operation. [3] For SO20 packages: above 70 °C derate linearly with 8 mW/K. For TSSOP20 packages: above 60 °C derate linearly with 5.5 mW/K. For DHVQFN20 packages: above 60 °C derate linearly with 4.5 mW/K. 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 5 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter VCC Conditions Min Max Unit supply voltage 1.65 3.6 V VI input voltage 0 3.6 V VO output voltage Tamb ambient temperature ∆t/∆V input transition rise and fall rate output HIGH or LOW state 0 VCC V output 3-state 0 3.6 V power-down mode; VCC = 0 V 0 3.6 V in free air −40 +85 °C VCC = 1.65 V to 2.7 V 0 20 ns/V VCC = 2.7 V to 3.6 V 0 10 ns/V 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter −40 °C to +85 °C Conditions Min VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage input leakage current - - V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 1.65 V to 1.95 V - - VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC − 0.2 - - V 0.35 × VCC V VI = VIH or VIL IO = −6 mA; VCC = 1.65 V 1.25 1.51 - V IO = −12 mA; VCC = 2.3 V 1.8 2.10 - V IO = −18 mA; VCC = 2.3 V 1.7 2.01 - V IO = −12 mA; VCC = 2.7 V 2.2 2.53 - V IO = −18 mA; VCC = 3.0 V 2.4 2.76 - V IO = −24 mA; VCC = 3.0 V 2.2 2.68 - V - - 0.2 V VI = VIH or VIL IO = 6 mA; VCC = 1.65 V - 0.11 0.3 V IO = 12 mA; VCC = 2.3 V - 0.17 0.4 V IO = 18 mA; VCC = 2.3 V - 0.25 0.6 V IO = 12 mA; VCC = 2.7 V - 0.16 0.4 V IO = 18 mA; VCC = 3.0 V - 0.23 0.4 V IO = 24 mA; VCC = 3.0 V - 0.30 0.55 V - ±0.1 ±5 µA VCC = 3.6 V; VI = 3.6 V or GND 74ALVC574_2 Product data sheet Max 0.65 × VCC IO = 100 µA; VCC = 1.65 V to 3.6 V II Unit VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V IO = −100 µA; VCC = 1.65 V to 3.6 V VOL Typ[1] © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 6 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state Table 6. Static characteristics …continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter −40 °C to +85 °C Conditions Unit Min Typ[1] Max IOZ OFF-state output current VI = VIH or VIL; VCC = 1.65 V to 3.6 V; VO = 3.6 V or GND; - ±0.1 ±10 µA IOFF power-off leakage current VCC = 0 V; VI or VO = 0 V to 3.6 V - ±0.1 ±10 µA ICC supply current VCC = 3.6 V; VI = VCC or GND; IO = 0 A - 0.2 10 µA ∆ICC additional supply current per input pin; VCC = 3.0 V to 3.6 V; VI = VCC − 0.6 V; IO = 0 A - 5 750 µA CI input capacitance - 3.5 - pF [1] All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb = 25 °C. 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 10. Symbol tpd ten Parameter propagation delay enable time −40 °C to +85 °C Conditions Min Max VCC = 1.65 V to 1.95 V 1.0 3.1 6.4 ns VCC = 2.3 V to 2.7 V 1.0 2.3 3.9 ns VCC = 2.7 V 1.0 2.5 3.6 ns VCC = 3.0 V to 3.6 V 1.0 2.5 3.6 ns 1.0 3.2 6.4 ns CP to Qn; see Figure 7 OE to Qn; see Figure 8 [2] [2] VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V 1.0 2.6 4.5 ns VCC = 2.7 V 1.0 3.2 4.6 ns 1.0 2.4 4.0 ns VCC = 3.0 V to 3.6 V tdis tW disable time pulse width OE to Qn; see Figure 8 [2] VCC = 1.65 V to 1.95 V 1.5 3.6 7.0 ns VCC = 2.3 V to 2.7 V 1.0 2.3 4.4 ns VCC = 2.7 V 1.5 2.9 4.4 ns VCC = 3.0 V to 3.6 V 1.0 2.8 4.4 ns VCC = 1.65 V to 1.95 V 3.8 1.1 - ns VCC = 2.3 V to 2.7 V 3.3 0.9 - ns VCC = 2.7 V 3.3 0.8 - ns VCC = 3.0 V to 3.6 V 3.3 1.2 - ns clock HIGH or LOW; see Figure 7 74ALVC574_2 Product data sheet Unit Typ[1] © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 7 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 10. Symbol tsu Parameter set-up time hold time th maximum frequency fmax −40 °C to +85 °C Conditions Min VCC = 1.65 V to 1.95 V 0.8 −0.1 - ns VCC = 2.3 V to 2.7 V 0.8 0.1 - ns VCC = 2.7 V 0.8 0.3 - ns VCC = 3.0 V to 3.6 V 0.8 0.0 - ns VCC = 1.65 V to 1.95 V 0.8 −0.1 - ns VCC = 2.3 V to 2.7 V 0.8 0.1 - ns VCC = 2.7 V 0.8 0.4 - ns VCC = 3.0 V to 3.6 V 0.7 −0.1 - ns VCC = 2.3 V to 2.7 V 100 200 - MHz VCC = 2.7 V 100 200 - MHz 150 300 - MHz outputs HIGH or LOW state - 21 - pF outputs 3-state - 13 - pF Dn to CP; see Figure 9 see Figure 7 per flip-flop; VI = GND to VCC; VCC = 3.3 V [1] Typical values are measured at Tamb = 25 °C [2] tpd is the same as tPHL and tPLH. ten is the same as tPZH and tPZL. tdis is the same as tPHZ and tPLZ. [3] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz CL = output load capacitance in pF VCC = supply voltage in Volts N = number of inputs switching Σ(CL × VCC2 × fo) = sum of the outputs 74ALVC574_2 Product data sheet Max Dn to CP; see Figure 9 VCC = 3.0 V to 3.6 V power dissipation capacitance CPD Unit Typ[1] [3] © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 8 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state 11. Waveforms 1/f max VI CP input VM GND tW t PHL t PLH VOH VM Qn output VOL mna894 Measurement points are given in Table 8. VOL and VOH are the typical output voltage levels that occur with the output load. Fig 7. Clock (CP) to output (Qn) propagation delays, the clock pulse width, and the maximum frequency Table 8. Measurement points Supply voltage Input Output VCC VM VM VX VY 1.65 V to 1.95 V 0.5VCC 0.5VCC VOL + 0.15 V VOH − 0.15 V 2.3 V to 2.7 V 0.5VCC 0.5VCC VOL + 0.15 V VOH − 0.15 V 2.7 V 1.5 V 1.5 V VOL + 0.3 V VOH − 0.3 V 3.0 V to 3.6 V 1.5 V 1.5 V VOL + 0.3 V VOH − 0.3 V VI OE input VM GND tPLZ tPZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL tPHZ VOH tPZH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs disabled outputs enabled mna644 Measurement points are given in Table 8. VOL and VOH are the typical output voltage levels that occur with the output load. Fig 8. Enable and disable times 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 9 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state VI VM CP input GND tsu tsu th th VI VM Dn input GND VOH VM Qn output VOL mna202 Measurement points are given in Table 8. VOL and VOH are the typical output voltage levels that occur with the output load. The shaded areas indicate when the input is permitted to change for predicable output performance. Fig 9. Data set-up and hold times for the Dn input to the CP input 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 10 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VEXT VCC VI RL VO G DUT RT CL RL 001aae331 Test data is given in Table 9. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 10. Test circuit for switching times Table 9. Test data Supply voltage Input Load VEXT VI tr, tf CL RL tPLH, tPHL tPLZ, tPZL tPHZ, tPZH 1.65 V to 1.95 V VCC ≤ 2.0 ns 30 pF 1 kΩ open 2VCC GND 2.3 V to 2.7 V VCC ≤ 2.0 ns 30 pF 500 Ω open 2VCC GND 2.7 V 2.7 V ≤ 2.5 ns 50 pF 500 Ω open 6V GND 3.0 V to 3.6 V 2.7 V ≤ 2.5 ns 50 pF 500 Ω open 6V GND 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 11 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state 12. Package outline SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT163-1 (SO20) 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 12 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 12. Package outline SOT360-1 (TSSOP20) 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 13 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 13. Package outline SOT764-1 (DHVQFN20) 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 14 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state 13. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74ALVC574_2 20071108 Product data sheet - 74ALVC574_1 Modifications: 74ALVC574_1 • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • Legal texts have been adapted to the new company name where appropriate. Section 3: DHVQFN20 package added. Section 8: derating values added for DHVQFN20 package. Section 12: outline drawing added for DHVQFN20 package. 20020304 Product specification - 74ALVC574_2 Product data sheet - © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 15 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 74ALVC574_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 8 November 2007 16 of 17 74ALVC574 NXP Semiconductors Octal D-type flip-flop; positive edge-trigger; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 November 2007 Document identifier: 74ALVC574_2