PMEG3020EH; PMEG3020EJ 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers Rev. 03 — 31 May 2005 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection encapsulated in small SMD plastic packages. Table 1: Product overview Type number Package Configuration Philips JEITA PMEG3020EH SOD123F - single isolated diodes PMEG3020EJ SOD323F SC-90 single isolated diodes 1.2 Features ■ ■ ■ ■ Forward current: 2 A Reverse voltage: 30 V Ultra low forward voltage Small and flat lead SMD package 1.3 Applications ■ ■ ■ ■ ■ Low voltage rectification High efficiency DC-to-DC conversion Switched-mode power supply Inverse polarity protection Low power consumption applications 1.4 Quick reference data Table 2: Quick reference data Symbol Parameter Conditions Min Typ Max Unit IF forward current Tsp ≤ 55 °C - - 2 A VR reverse voltage - - 30 V - 510 620 mV VF [1] forward voltage Pulse test: tp ≤ 300 µs; δ ≤ 0.02. IF = 2000 mA [1] PMEG3020EH; PMEG3020EJ Philips Semiconductors 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers 2. Pinning information Table 3: Pinning Pin Description 1 cathode 2 anode Simplified outline Symbol [1] 1 1 2 2 sym001 001aab540 [1] The marking bar indicates the cathode. 3. Ordering information Table 4: Ordering information Type number Package Name Description Version PMEG3020EH - plastic surface mounted package; 2 leads SOD123F PMEG3020EJ SC-90 plastic surface mounted package; 2 leads SOD323F 4. Marking Table 5: Marking codes Type number Marking code PMEG3020EH A7 PMEG3020EJ E9 9397 750 15077 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 31 May 2005 2 of 9 PMEG3020EH; PMEG3020EJ Philips Semiconductors 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers 5. Limiting values Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR reverse voltage Conditions Min Max Unit - 30 V IF forward current Tsp ≤ 55 °C - 2 A IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25 - 4.5 A IFSM non-repetitive peak forward current t = 8 ms; square wave [1] - 9 A Ptot total power dissipation Tamb ≤ 25 °C [1] - 375 mW [2] - 830 mW [1] - 360 mW [2] - 830 mW PMEG3020EH PMEG3020EJ Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. 6. Thermal characteristics Table 7: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1] [2] - - 330 K/W [2] [3] - - 150 K/W [1] [2] - - 350 K/W [2] [3] - - 150 K/W PMEG3020EH - - 60 K/W PMEG3020EJ - - 55 K/W PMEG3020EH PMEG3020EJ Rth(j-sp) thermal resistance from junction to solder point [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and IF(AV) rating will be available on request. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. 9397 750 15077 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 31 May 2005 3 of 9 PMEG3020EH; PMEG3020EJ Philips Semiconductors 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers 7. Characteristics Table 8: Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Min Typ Max Unit IF = 1 mA - 125 160 mV IF = 10 mA - 185 220 mV IF = 100 mA - 255 290 mV IF = 500 mA - 330 380 mV IF = 1000 mA - 400 480 mV IF = 2000 mA - 510 620 mV VR = 10 V - 60 150 µA VR = 30 V - 400 1000 µA VR = 1 V; f = 1 MHz - 60 72 pF [1] forward voltage VF reverse current IR diode capacitance Cd [1] Conditions Pulse test: tp ≤ 300 µs; δ ≤ 0.02. 006aaa293 104 006aaa294 106 IR (µA) 105 IF (mA) (1) 103 (2) 104 (3) (1) 102 (2) (3) (4) 103 (5) 102 10 (4) 10 1 1 (5) 10−1 10−1 10−2 0 0.1 0.2 0.3 0.4 0.5 VF (V) 0.6 0 5 10 (1) Tamb = 150 °C (1) Tamb = 150 °C (2) Tamb = 125 °C (2) Tamb = 125 °C (3) Tamb = 85 °C (3) Tamb = 85 °C (4) Tamb = 25 °C (4) Tamb = 25 °C (5) Tamb = −40 °C (5) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values 20 25 30 VR (V) 35 Fig 2. Reverse current as a function of reverse voltage; typical values 9397 750 15077 Product data sheet 15 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 31 May 2005 4 of 9 PMEG3020EH; PMEG3020EJ Philips Semiconductors 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers 006aaa295 140 Cd (pF) 120 100 80 60 40 20 0 0 5 10 15 20 25 30 VR (V) Tamb = 25 °C; f = 1 MHz Fig 3. Diode capacitance as a function of reverse voltage; typical values 8. Package outline 1.7 1.5 1.2 1.0 1.35 1.15 1 0.80 0.65 0.5 0.3 1 0.55 0.35 3.6 3.4 2.7 2.3 2.7 2.5 1.8 1.6 2 2 0.70 0.55 0.40 0.25 0.25 0.10 Dimensions in mm 04-11-29 Fig 4. Package outline SOD123F 0.25 0.10 Dimensions in mm 04-09-13 Fig 5. Package outline SOD323F (SC-90) 9. Packing information Table 9: Packing methods The -xxx numbers are the last three digits of the 12NC ordering code. [1] Type number Package Description Packing quantity 3000 10000 PMEG3020EH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135 PMEG3020EJ SOD323F 4 mm pitch, 8 mm tape and reel -115 -135 [1] For further information and the availability of packing methods, see Section 16. 9397 750 15077 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 31 May 2005 5 of 9 PMEG3020EH; PMEG3020EJ Philips Semiconductors 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers 10. Soldering 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD123F 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD323F (SC-90) 9397 750 15077 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 31 May 2005 6 of 9 Philips Semiconductors PMEG3020EH; PMEG3020EJ 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers 11. Revision history Table 10: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes PMEG3020EH_EJ_3 20050531 Product data sheet - 9397 750 15077 PMEG3020EH_EJ_2 Modifications: • Table 6 “Limiting values” IFSM value changed to 9 A PMEG3020EH_EJ_2 20050404 Product data sheet - 9397 750 14883 PMEG3020EJ_1 PMEG3020EJ_1 20050125 Product data sheet - 9397 750 13917 - 9397 750 15077 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 31 May 2005 7 of 9 PMEG3020EH; PMEG3020EJ Philips Semiconductors 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers 12. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 13. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 15. Trademarks 14. Disclaimers Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 16. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 15077 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 31 May 2005 8 of 9 Philips Semiconductors PMEG3020EH; PMEG3020EJ 30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers 17. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 3 3 4 5 5 6 7 8 8 8 8 8 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 31 May 2005 Document number: 9397 750 15077 Published in The Netherlands