BUK71/7905-40ATE TrenchPLUS standard level FET Rev. 01 — 20 August 2003 Product data 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS™ technology, featuring both very low on-state resistance and TrenchPLUS diodes for temperature sensing and ESD protection. Product availability: BUK7105-40ATE in SOT426 (D2-PAK) BUK7905-40ATE in SOT263B (TO-220). 1.2 Features ■ Integrated temperature sensor ■ Electrostatic discharge protection ■ Q101 compliant ■ Standard level compatible. 1.3 Applications ■ Variable Valve Timing for engines ■ Electrical Power Assisted Steering. 1.4 Quick reference data ■ VDS ≤ 40 V ■ RDSon = 4.5 mΩ (typ) ■ VF = 658 mV (typ) ■ SF = −1.54 mV/K (typ). 2. Pinning information Table 1: Pinning - SOT426 and SOT263B, simplified outline and symbol Pin Description 1 gate (g) 2 anode (a) 3 drain (d) 4 cathode (k) 5 source (s) mb mounting base; connected to drain (d) Simplified outline Symbol mb d a s k mb g 1 2 3 4 5 MBL317 Front view SOT426 (D2-PAK) MBK127 1 5 MBL263 SOT263B (TO-220) BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 3. Limiting values Table 2: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS Conditions Min Max Unit drain-source voltage (DC) - 40 V VDGS drain-gate voltage (DC) - 40 V VGS gate-source voltage (DC) ID drain current (DC) - ±20 V Tmb = 25 °C; VGS = 10 V; Figure 2 and 3 [1] - 155 A [2] - 75 A Tmb = 100 °C; VGS = 10 V; Figure 2 [2] - 75 A IDM peak drain current Tmb = 25 °C; pulsed; tp ≤ 10 µs; Figure 3 - 620 A Ptot total power dissipation Tmb = 25 °C; Figure 1 - 272 W IGS(CL) gate-source clamping current continuous - 10 mA tp = 5 ms; δ = 0.01 - 50 mA Tstg storage temperature −55 +175 °C Tj junction temperature −55 +175 °C - ±100 V [1] - 155 A [2] - 75 A Tmb = 25 °C; pulsed; tp ≤ 10 µs - 620 A unclamped inductive load; ID = 75 A; VDS ≤ 40 V; VGS = 10 V; RGS = 50 Ω; starting Tj = 25 °C - 1.46 J - 6 kV Visol(FET-TSD) FET to temperature sense diode isolation voltage Source-drain diode IDR reverse drain current (DC) IDRM peak reverse drain current Tmb = 25 °C Avalanche ruggedness EDS(AL)S non-repetitive avalanche energy Electrostatic discharge Vesd [1] [2] electrostatic discharge voltage, pins Human Body Model; C = 100 pF; 1,3,5 R = 1.5 kΩ Current is limited by power dissipation chip rating Continuous current is limited by package. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 2 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 03na19 120 03ng16 160 ID (A) Pder (%) 120 80 80 40 Capped at 75A due to package 40 0 0 0 50 100 150 0 200 Tmb (°C) 50 100 150 Tmb (ºC) 200 VGS ≥ 10 V P tot P der = ----------------------- × 100% P ° tot ( 25 C ) Fig 1. Normalized total power dissipation as a function of mounting base temperature. Fig 2. Continuous drain current as a function of mounting base temperature. 103 03ng17 ID (A) Limit RDSon = VDS/ID tp = 10 µs 100 µs 102 Capped at 75 A due to package 1 ms DC 10 ms 10 100 ms 1 1 10 VDS (V) 102 Tmb = 25 °C; IDM single pulse. Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 3 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 4. Thermal characteristics Table 3: Thermal characteristics Symbol Parameter Rth(j-a) thermal resistance from junction to ambient Rth(j-mb) Conditions Min Typ Max Unit SOT263B vertical in still air - 60 - K/W SOT426 mounted on printed circuit board; minimum footprint - 50 - K/W thermal resistance from junction to mounting base Figure 4 - - 0.55 K/W 4.1 Transient thermal impedance 03ni64 1 Z th(j-mb) (K/W) 10-1 δ = 0.5 0.2 0.1 0.05 0.02 10-2 δ= P tp T single shot t tp T 10-3 10-6 10-5 10-4 10-3 10-2 10-1 1 tp (s) 10 Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 4 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 5. Characteristics Table 4: Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Static characteristics V(BR)DSS VGS(th) IDSS drain-source breakdown voltage ID = 0.25 mA; VGS = 0 V Tj = 25 °C 40 - - V Tj = −55 °C 36 - - V gate-source threshold voltage ID = 1 mA; VDS = VGS; Figure 9 drain-source leakage current Tj = 25 °C 2 3 4 V Tj = 175 °C 1 - - V Tj = −55 °C - - 4.4 V Tj = 25 °C - 0.1 10 µA Tj = 175 °C - - 250 µA 20 22 - V Tj = 25 °C - 22 1000 nA Tj = 175 °C - - 10 µA Tj = 25 °C - 4.5 5 mΩ Tj = 175 °C - - 9.5 mΩ VDS = 40 V; VGS = 0 V V(BR)GSS gate-source breakdown voltage IG = ±1 mA; −55 °C < Tj < 175 °C IGSS gate-source leakage current VGS = ±10 V; VDS = 0 V RDSon drain-source on-state resistance VGS = 10 V; ID = 50 A; Figure 7 and 8 VF forward voltage, temperature sense diode IF = 250 µA 648 658 668 mV SF temperature coefficient temperature sense diode IF = 250 µA; −55 °C < Tj < 175 °C −1.4 −1.54 −1.68 mV/K Vhys temperature sense diode forward voltage hysteresis 125 µA < IF < 250 µA 25 32 50 mV VGS = 10V; VDS = 32 V; ID = 25 A; Figure 14 - 118 - nC - 16 - nC - 57 - nC VGS = 0 V; VDS = 25 V; f = 1 MHz; Figure 12 - 4500 - pF - 1500 - pF - 960 - pF VDS = 30 V; RL = 1.2 Ω; VGS = 10 V; RG = 10 Ω - 35 - nS - 115 - nS Dynamic characteristics Qg(tot) total gate charge Qgs gate-source charge Qgd gate-drain (Miller) charge Ciss input capacitance Coss output capacitance Crss reverse transfer capacitance td(on) turn-on delay time tr rise time td(off) turn-off delay time - 155 - nS tf fall time - 110 - nS © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 5 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET Table 4: Characteristics…continued Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Ld internal drain inductance measured from upper edge of drain mounting base to centre of die - 2.5 - nH Ls internal source inductance measured from source lead to source bond pad - 7.5 - nH Source-drain diode VSD source-drain (diode forward) voltage IS = 40 A; VGS = 0 V; Figure 17 - 0.85 1.2 V trr reverse recovery time - 96 - ns Qr recovered charge IS = 20 A; dIS/dt = −100 A/µs VGS = −10 V; VDS = 30 V - 224 - nC © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 6 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 03ni86 400 ID (A) Label is VGS (V) 10 8 RDSon (mΩ) 7.5 20 300 03ni88 12 7 8 6.5 200 6 5.5 100 4 5 4.5 4 0 0 0 2 4 6 8 10 VDS (V) Tj = 25 °C; tp = 300 µs 4 12 16 VGS (V) 20 Tj = 25 °C; ID = 50 A Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values. Fig 6. Drain-source on-state resistance as a function of gate-source voltage; typical values. 03ni30 2 03ni87 20 VGS = 5.5 V 6 V RDSon (mΩ) 8 a 6.5 V 7V 1.6 15 1.2 10 0.8 8V 10 V 5 0.4 20 V 0 0 0 100 200 300 I (A) 400 D Tj = 25 °C; tp = 300µs -60 60 120 Tj (°C) 180 R DSon a = ---------------------------R DSon ( 25 °C ) Fig 7. Drain-source on-state resistance as a function of drain current; typical values. Fig 8. Normalized drain-source on-state resistance factor as a function of junction temperature. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data 0 Rev. 01 — 20 August 2003 7 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 03aa32 5 ID (A) VGS(th) (V) 4 max 10-2 3 typ 10-3 2 min 10-4 1 10-5 0 10-6 -60 03aa35 10-1 0 60 120 180 Tj (°C) min 0 2 typ max 4 6 VGS (V) Tj = 25 °C; VDS = VGS ID = 1 mA; VDS = VGS Fig 9. Gate-source threshold voltage as a function of junction temperature. 03ni89 90 Fig 10. Sub-threshold drain current as a function of gate-source voltage. 03ne67 8 C (nF) gfs (S) 6 60 Ciss 4 30 2 Coss Crss 0 0 0 25 50 75 100 ID (A) Tj = 25 °C; VDS = 25 V 10-1 10 VDS (V) 102 VGS = 0 V; f = 1 MHz Fig 11. Forward transconductance as a function of drain current; typical values. Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data 1 Rev. 01 — 20 August 2003 8 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 03ni26 10 VGS 03ni90 100 ID (A) (V) 8 VDS = 14 V 75 32 V 6 50 4 175 °C 25 2 Tj = 25 °C 0 0 0 2 4 VGS (V) 0 6 20 40 60 80 100 120 QG (nC) Tj = 25 °C; ID = 25 A VDS = 25 V Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values. 03ne84 700 VF (mV) Fig 14. Gate-source voltage as a function of turn-on gate charge; typical values. 03ne85 1.70 -SF (mV/K) 1.65 max 1.60 600 typ 1.55 500 1.50 1.45 400 min 1.40 0 50 100 150 Tj (ºC) 200 IF = 250 µA 645 655 660 665 670 675 VF (mV) VF at Tj = 25 C; IF = 250 µA Fig 15. Forward voltage of temperature sense diode as a function of junction temperature; typical values. Fig 16. Temperature coefficient of temperature sense diode as a function of forward voltage; typical values. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data 650 Rev. 01 — 20 August 2003 9 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 03ni91 100 ID (A) 80 60 40 175 °C 20 Tj = 25 °C 0 0.0 0.4 0.8 1.2 VSD (V) 1.6 VGS = 0 V Fig 17. Reverse diode current as a function of reverse diode voltage; typical values. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 10 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 6. Package outline Plastic single-ended surface mounted package (Philips version of D2-PAK); 5 leads (one lead cropped) SOT426 A A1 E D1 mounting base D HD 3 1 2 4 e e Lp 5 b e c e Q 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D max. D1 E e Lp HD Q mm 4.50 4.10 1.40 1.27 0.85 0.60 0.64 0.46 11 1.60 1.20 10.30 9.70 1.70 2.90 2.10 15.80 14.80 2.60 2.20 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 98-12-14 99-06-25 SOT426 Fig 18. SOT426 (D2-PAK). © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 11 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 SOT263B E p1 A ∅p A1 q D1 mounting base D L1 Q L2 m L 1 5 e b c w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D D1 E e L mm 4.5 4.1 1.39 1.27 0.85 0.70 0.7 0.4 15.8 15.2 6.4 5.9 10.3 9.7 1.7 15.0 13.5 L1 (1) 2.4 1.6 (2) L2 0.5 m ∅p p1 q Q w 0.8 0.6 3.8 3.6 4.3 4.1 3.0 2.7 2.6 2.2 0.4 Notes 1. Terminal dimensions are uncontrolled in this zone. 2. Positional accuracy of the terminals is controlled in this zone. OUTLINE VERSION REFERENCES IEC SOT263B JEDEC EIAJ 5-lead TO-220 EUROPEAN PROJECTION ISSUE DATE 01-01-11 Fig 19. SOT263B (TO-220). © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 12 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 7. Soldering 10.85 10.60 10.50 handbook, full pagewidth 1.50 7.50 7.40 1.70 2.25 2.15 8.15 8.275 8.35 1.50 4.60 0.30 4.85 5.40 7.95 8.075 3.00 0.20 solder lands 1.70 (2×) solder resist 3.40 0.90 1.00 8.15 MSD058 occupied area solder paste Dimensions in mm. Fig 20. Reflow soldering footprint for SOT426. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 13 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 8. Revision history Table 5: Revision history Rev Date 01 20030820 CPCN Description - Product data; initial version (9397 750 11694) © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Product data Rev. 01 — 20 August 2003 14 of 16 BUK71/7905-40ATE Philips Semiconductors TrenchPLUS standard level FET 9. Data sheet status Level Data sheet status[1] Product status[2][3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 10. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 12. Trademarks — TrenchMOS is a trademark of Koninklijke Philips Electronics N.V. 11. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Product data Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11694 Rev. 01 — 20 August 2003 15 of 16 Philips Semiconductors BUK71/7905-40ATE TrenchPLUS standard level FET Contents 1 1.1 1.2 1.3 1.4 2 3 4 4.1 5 6 7 8 9 10 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Transient thermal impedance . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 © Koninklijke Philips Electronics N.V. 2003. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 20 August 2003 Document order number: 9397 750 11694