PHILIPS HEF40174BD

INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
• The IC04 LOCMOS HE4000B Logic
Family Specifications HEF, HEC
• The IC04 LOCMOS HE4000B Logic
Package Outlines/Information HEF, HEC
HEF40174B
MSI
Hex D-type flip-flop
Product specification
File under Integrated Circuits, IC04
January 1995
Philips Semiconductors
Product specification
HEF40174B
MSI
Hex D-type flip-flop
buffered outputs (O0 to O5). Information on D0 to D5 is
transferred to O0 to O5 on the LOW to HIGH transition of
CP if MR is HIGH. When LOW, MR resets all flip-flops
(O0 to O5 = LOW) independent of CP and D0 to D5.
DESCRIPTION
The HEF40174B is a hex edge-triggered D-type flip-flop
with six data inputs (D0 to D5), a clock input (CP), an
overriding asynchronous master reset input (MR), and six
Fig.1 Functional diagram.
PINNING
D0 to D5
data inputs
CP
clock input (LOW to HIGH; edge-triggered)
MR
master reset input (active LOW)
O0 to O5
buffered outputs
FUNCTION TABLE
Fig.2 Pinning diagram.
INPUTS
CP
HEF40174BP(N): 16-lead DIL; plastic
(SOT38-1)
HEF40174BD(F): 16-lead DIL; ceramic (cerdip)
(SOT74)
X
OUTPUT
D
MR
O
H
H
H
L
H
L
X
H
no change
X
L
L
HEF40174BT(D): 16-lead SO; plastic
Notes
(SOT109-1)
1. H = HIGH state (the more positive voltage)
L = LOW state (the less positive voltage)
X = state is immaterial
( ): Package Designator North America
FAMILY DATA, IDD LIMITS category MSI
= positive-going transition
See Family Specifications
January 1995
= negative-going transition
2
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Philips Semiconductors
Hex D-type flip-flop
January 1995
3
Product specification
HEF40174B
MSI
Fig.3 Logic diagram.
Philips Semiconductors
Product specification
HEF40174B
MSI
Hex D-type flip-flop
AC CHARACTERISTICS
VSS = 0 V; Tamb = 25 °C; CL = 50 pF; input transition times ≤ 20 ns
VDD
V
SYMBOL
TYPICAL EXTRAPOLATION
FORMULA
MIN. TYP. MAX.
Propagation delays
CP → On
HIGH to LOW
5
10
tPHL
15
5
LOW to HIGH
10
tPLH
15
MR → On
HIGH to LOW
5
10
tPHL
15
Output transition times
HIGH to LOW
5
10
Dn → CP
Hold time
Dn → CP
Minimum clock
pulse width; LOW
Minimum MR pulse
width; LOW
Recovery time
for MR
Maximum clock
pulse frequency
10
12 ns + (0,16 ns/pF) CL
75
155 ns
48 ns + (0,55 ns/pF) CL
30
65 ns
19 ns + (0,23 ns/pF) CL
20
45 ns
12 ns + (0,16 ns/pF) CL
85
175 ns
58 ns + (0,55 ns/pF) CL
35
70 ns
24 ns + (0,23 ns/pF) CL
25
50 ns
17 ns + (0,16 ns/pF) CL
20
40 ns
6 ns + (0,28 ns/pF) CL
60
120 ns
30
60 ns
9 ns + (0,42 ns/pF) CL
20
40 ns
6 ns + (0,28 ns/pF) CL
20
10
ns
5
ns
10
5
ns
5
10
0
ns
5
0
ns
15
5
0
ns
5
70
35
ns
30
15
ns
15
20
10
ns
5
70
35
ns
10
10
thold
tWCPL
tWMRL
35
15
ns
15
25
10
ns
5
45
25
ns
10
20
10
ns
15
15
5
ns
5
5
11
MHz
15
30
MHz
20
45
MHz
10
tRMR
fmax
10 ns +
9 ns + (0,42 ns/pF) CL
10
15
January 1995
45 ns
15
10
tsu
20
60 ns
tTLH
5
19 ns + (0,23 ns/pF) CL
120 ns
15
Set-up time
48 ns + (0,55 ns/pF) CL
65 ns
60
5
10
155 ns
30
30
tTHL
15
LOW to HIGH
75
4
10 ns +
(1,0 ns/pF) CL
(1,0 ns/pF) CL
see also waveforms
Fig.4
Philips Semiconductors
Product specification
HEF40174B
MSI
Hex D-type flip-flop
VDD
V
Dynamic power
dissipation per
package (P)
5
TYPICAL FORMULA FOR P(µW)
3500 fi + ∑ (foCL) × VDD2
10
16 000 fi + ∑ (foCL) × VDD
2
15
42 000 fi + ∑ (foCL) × VDD
2
where
fi = input freq. (MHz)
fo = output freq. (MHz)
CL = load capacitance (pF)
∑ (foCL) = sum of outputs
VDD = supply voltage (V)
Fig.4
Waveforms showing minimum pulse widths for CP and MR, MR to CP recovery time, and set-up time and
hold time for Dn to CP. Set-up and hold times are shown as positive values but may be specified as
negative values.
APPLICATION INFORMATION
Some examples of applications for the HEF40174B are:
• Shift registers
• Buffer/storage register
• Pattern generator
January 1995
5