INTEGRATED CIRCUITS DATA SHEET TDA8772 Triple 8-bit video digital-to-analog converter Product specification Supersedes data of 1995 Mar 09 File under Integrated Circuits, IC02 1997 Mar 06 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 FEATURES GENERAL DESCRIPTION • 8-bit resolution The TDA8772 is a triple 8-bit video Digital-to-Analog Converter (DAC). It converts the digital input signals into analog voltage outputs at a maximum conversion rate of 35 MHz (TDA8772H/3) and 85 MHz (TDA8772H/8). • Sampling rate up to: – 35 MHz for TDA8772H/3 – 85 MHz for TDA8772H/8 The DAC is based on resistor-string architecture with integrated output buffers. The output voltage range is determined by a built-in reference source. • Internal reference voltage regulator • No deglitching circuit required • SYNC, BLANK control inputs The device is fabricated in a 5 V CMOS process that ensures high functionality with low power dissipation. • 3 independent clock inputs (one per DAC) • 1 V output voltage range • 75 Ω output load • TDA8772 has BLANK control on the 3 channels • Single 5 V power supply • 44-pin QFP package. APPLICATIONS • General purpose high-speed digital-to-analog conversion • Digital TV • Graphic display • Desktop video processing. ORDERING INFORMATION TYPE NUMBER TDA8772H/3 TDA8772H/8 1997 Mar 06 PACKAGE NAME QFP44 DESCRIPTION plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm 2 VERSION SOT307-2 SAMPLING FREQUENCY 35 MHz 85 MHz Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDDA analog supply voltage 4.5 5.0 5.5 V VDDD digital supply voltage 4.5 5.0 5.5 V IDDA analog supply current 40 65 100 mA IDDD digital supply current TDA8772H/3 − 7 16 mA TDA8772H/8 − 16 27 mA fclk = 35 MHz; ramp input − ±0.5 ±1 LSB fclk = 85 MHz; ramp input − ±0.75 ±1.2 LSB fclk = 35 MHz; ramp input − ±0.25 ±0.5 LSB fclk = 85 MHz; ramp input - ±0.5 ±0.75 LSB TDA8772H/3 35 − − MHz TDA8772H/8 85 − − MHz INL integral non-linearity2 DNL differential non-linearity fclk(max) Ptot RL = 75 Ω; note 1 maximum clock frequency total power dissipation note 1 TDA8772H/3 RL = 75 Ω; fclk = 35 MHz 180 360 640 mW TDA8772H/8 RL = 75 Ω; fclk = 85 MHz 180 405 700 mW Note 1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. 1997 Mar 06 3 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 BLOCK DIAGRAM V DDA handbook, full pagewidth RED digital inputs (bits R0 to R3) V DDD 35,39,43 4 RED digital inputs (bits R4 to R7) 4 4–1 GREEN digital inputs (bits G0 to G3) 4 20–17 4 16–13 BLUE digital inputs (bits B0 to B3) 4 SYNC control input reference current input (I REFB ) LSB DECODER 21 RED clock input 4 MSB DECODER RESISTOR STRING 44 RED analog output LSB DECODER 22 GREEN clock input RESISTOR STRING 40 GREEN analog output LSB DECODER 23 BLUE clock input RESISTOR STRING 36 BLUE analog output 38 reference current input for internal reference (I REFA ) 4 GREEN digital inputs (bits G4 to G7) BLANK control input 41 4 TDA8772 BLUE digital inputs (bits B4 to B7) 10,32 8–5 4 MSB DECODER 31–28 4 4 27–24 4 MSB DECODER 12 11 CONTROL REGISTER BANDGAP REFERENCE 34 reference voltage decoupling input (V REF ) Fig.1 Block diagram. 1997 Mar 06 4 37,42 V SSA 9,33 V SSD MBB661 - 2 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 PINNING SYMBOL SYMBOL PIN RED digital input data; bit 7 (MSB) CLKB 23 BLUE clock input RED digital input data; bit 6 B7 24 BLUE digital input data; bit 7 (MSB) RED digital input data; bit 4 B6 25 BLUE digital input data; bit 6 RED digital input data; bit 3 B5 26 BLUE digital input data; bit 5 27 BLUE digital input data; bit 4 PIN DESCRIPTION R7 1 R6 2 R5 3 RED digital input data; bit 5 R4 4 R3 5 DESCRIPTION R2 6 RED digital input data; bit 2 B4 R1 7 RED digital input data; bit 1 B3 28 BLUE digital input data; bit 3 R0 8 RED digital input data; bit 0 (LSB) B2 29 BLUE digital input data; bit 2 30 BLUE digital input data; bit 1 VSSD1 9 digital supply ground 1 B1 VDDD1 10 digital supply voltage 1 B0 31 BLUE digital input data; bit 0 (LSB) SYNC 11 composite sync control input; for GREEN channel only (active LOW) VDDD2 32 digital supply voltage 2 VSSD2 33 digital supply ground 2 BLANK 12 composite blank control input (active LOW) VREF 34 decoupling input for reference voltage G7 13 GREEN digital input data; bit 7 (MSB) VDDA1 35 analog supply voltage 1 OUTB 36 BLUE analog output G6 14 GREEN digital input data; bit 6 VSSA1 37 analog supply ground 1 G5 15 GREEN digital input data; bit 5 IREFA 38 G4 16 GREEN digital input data; bit 4 reference current input for internal reference G3 17 GREEN digital input data; bit 3 VDDA2 39 analog supply voltage 2 G2 18 GREEN digital input data; bit 2 OUTG 40 GREEN analog output G1 19 GREEN digital input data; bit 1 IREFB 41 G0 20 GREEN digital input data; bit 0 (LSB) reference current input for output buffers VSSA2 42 analog supply ground 2 CLKR 21 RED clock input VDDA3 43 analog supply voltage 3 CLKG 22 GREEN clock input OUTR 44 RED analog output 1997 Mar 06 5 Philips Semiconductors Product specification OUTB V DDA1 V REF 36 35 34 37 VSSA1 38 I REFA 39 V DDA2 TDA8772 40 OUTG VSSA2 42 41 I REFB V DDA3 index corner 43 handbook, full pagewidth 44 OUTR Triple 8-bit video digital-to-analog converter R7 1 33 VSSD2 R6 2 32 VDDD2 R5 3 31 B0 R4 4 30 B1 R3 5 R2 6 R1 7 27 B4 R0 8 26 B5 V SSD1 9 25 B6 29 B2 TDA8772 28 B3 V DDD1 10 24 B7 23 CLKB CLKR 21 CLKG 22 G0 20 G1 19 G2 18 G3 17 G4 16 G5 15 G6 14 G7 13 BLANK 12 SYNC 11 MBB660 - 3 Fig.2 Pin configuration. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VDDA analog supply voltage −0.5 +6.5 V VDDD digital supply voltage −0.5 +6.5 V ∆VDD supply voltage difference between VDDA and VDDD −1.0 +1.0 V Tstg storage temperature −55 +150 °C Tamb operating ambient temperature 0 70 °C Tj junction temperature − 125 °C THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER VALUE UNIT thermal resistance from junction to ambient in free air 75 K/W HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. 1997 Mar 06 6 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 CHARACTERISTICS TDA8772H/3 operating at 35 MHz and TDA8772H/8 operating at 85 MHz unless otherwise specified. VDDA = VDDD = 4.5 V to 5.5 V; VSSA and VSSD shorted together; VDDA − VDDD = −0.5 V to +0.5 V; Tamb = 0 to +70 °C; typical values measured at VDDA = VDDD = 5 V and Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDDA analog supply voltage 4.5 5.0 5.5 V VDDD digital supply voltage IDDA analog supply current 4.5 5.0 5.5 V 40 65 100 mA IDDD digital supply current TDA8772H/3 − 7 16 mA TDA8772H/8 − 16 27 mA V RL = 75 Ω; note 1 Inputs CLOCK INPUTS (PINS 21 TO 23) VIL LOW level input voltage VSSD − 0.5 − 0.8 VIH HIGH level input voltage 2.0 − VDDD + 0.5 V BLANK, SYNC INPUTS (PINS 12 AND 11; ACTIVE LOW) VIL LOW level input voltage VSSD − 0.5 − 0.8 VIH HIGH level input voltage 2.0 − VDDD + 0.5 V V R, G, B DIGITAL INPUTS (PINS 1 TO 8, 13 TO 20 AND 24 TO 31) VIL LOW level input voltage VSSD − 0.5 − 0.8 VIH HIGH level input voltage 2.0 − VDDD + 0.5 V − 0.17 0.25 mA − 0.5 0.7 mA 35 − − MHz V IREFA INTERNAL REFERENCE SUPPLY CURRENT (PIN 38) Ii(REFA) input current IREFB OUTPUT BUFFER SUPPLY CURRENT (PIN 41) Ii(REFB) input current Timing (CL = 25 pF; RL = 75 Ω); see Fig.3 fclk(max) maximum clock frequency TDA8772H/3 85 − − MHz tCPH clock pulse width HIGH 5 − − ns tCPL clock pulse width LOW 5 − − ns tr clock rise time TDA8772H/3 − − 5 ns TDA8772H/8 − − 3 ns TDA8772H/3 − − 5 ns TDA8772H/8 − − 3 ns TDA8772H/8 tf clock fall time tSU;DAT input data set-up time 4 − − ns tHD;DAT input data hold time 2.5 − − ns 1997 Mar 06 7 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter SYMBOL PARAMETER TDA8772 CONDITIONS MIN. TYP. MAX. UNIT Voltage reference (pin 34, referenced to VSSA) Vref output reference voltage 1.180 1.242 1.305 V Outputs OUTB, OUTR, OUTG ANALOG OUTPUTS (PINS 36, 44 AND 40, REFERENCED TO VSSA) RL = 75 Ω; SEE TABLES 1 AND 2 FSR full-scale output voltage range 0.9 1.0 1.1 V Vos offset of analog voltage output 0.75 0.83 0.95 V VOUTmax maximum output voltage data inputs = logic 1; note 2 1.65 1.83 2.05 V VOUTmin minimum output voltage data inputs = logic 0; note 2 0.75 0.83 0.95 V THD total harmonic distortion fi = 4.43 MHz; fclk = 35 MHz − −45 − dB fi = 4.43 MHz; fclk = 85 MHz − −43 − dB 60 75 90 Ω ZL output load impedance Transfer function INL integral non-linearity fclk = 35 MHz; ramp input − ±0.5 ±1 LSB fclk = 85 MHz; ramp input − ±0.75 ±1.2 LSB DNL differential non-linearity fclk = 35 MHz; ramp input − ±0.25 ±0.5 LSB fclk = 85 MHz; ramp input - ±0.5 ±0.75 LSB αCT crosstalk DAC to DAC −45 − − dB m DAC to DAC matching − 1.0 2.0 % Switching characteristics (RL = 75 Ω); see Fig.4 td input to 50% output delay time full-scale change − 10 − ns ts1 settling time 10% to 90% full-scale change − 6 − ns ts2 settling time to ±1 LSB − 30 − ns − 1 − LSB.ns Output transients (glitches) Vg area for 1 LSB change Notes 1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. 2. VOUT is directly proportional to Vref. 1997 Mar 06 8 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter Table 1 Table 2 TDA8772 Input coding and DAC output voltages (typical values) BINARY INPUT DATA (SYNC = BLANK = 0) CODE DAC OUTPUT VOLTAGES (V) OUTB, OUTR, OUTG RL = 75 Ω 0000 0000 0 0.830 0000 0001 1 0.834 .... .... . . 1000 0000 128 1.330 .... .... . . 1111 1110 254 1.826 1111 1111 255 1.830 Input coding and DAC output voltages (typical values) DAC OUTPUT VOLTAGES (V) BINARY INPUT DATA SYNC (PIN 11) BLANK (PIN 12) .... .... x .... .... .... .... 1997 Mar 06 OUTG (PIN 40) OUTR/B (PINS 44, 46) 1 see Table 1 see Table 1 1 0 0.830 0.830 0 0 0.440 9 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 TIMING t SU; DAT andbook, full pagewidth t HD; DAT V IH data input 50 % stable V IL 50 % V IL clock input MBB656 - 1 t CPL t CPH Fig.3 Input timing. handbook, full pagewidth clock input input code (example of a full-scale input data transition) 50 % code 1023 code 0 1 LSB 714 mV (code 1023) 10 % td 50 % Vo(1) 90 % 54 mV (code 0) 1 LSB t s1 t s2 Fig.4 Switching timing. 1997 Mar 06 10 MBB662 - 3 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 INTERNAL CIRCUITRY handbook, full pagewidth V DDD V DDA DACs resistor string GND V SSD V SSA (a) V DDA (b) V DDA V DDA V DD V DD V DD 25 Ω V DD (typ) GND V SSA (c) GND (d) GND VSSA GND VSSA MBB663 - 2 (e) (a) Digital inputs; pins 1 to 8 and 11 to 31. (b) Vref; pin 34. (c) IREFA; pin 38. (d) OUTR, G, B; pins 44, 40 and 36. (e) IREFB; pin 41. Fig.5 Internal circuitry. 1997 Mar 06 11 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 APPLICATION INFORMATION handbook, full pagewidth V SSA 5 V V SSA 5 V OUTR OUTG 10 nF 75 Ω V SSA V DDA3 VSSA2 IREFB 44 43 42 75 Ω 8.2 kΩ 41 OUTG 40 V SSA 5 V VSSA 10 nF V SSA V DDA2 IREFA 39 38 OUTB 33 kΩ V SSA1 37 36 75 Ω 10 nF V SSA 100 nF VSSA VDDA1 V REF 35 34 V SSD2 R7 1 33 R6 2 32 R5 3 31 B0 R4 4 30 B1 R3 5 29 B2 R2 6 28 B3 R1 7 27 B4 R0 8 26 B5 V SSD1 9 25 B6 10 24 B7 11 23 CLKB V DDD2 5V V DDD1 TDA8772 5V 10 nF V SSD 10 nF V SSD SYNC 12 13 14 15 16 17 18 19 20 21 22 MBB664 - 4 BLANK G7 G6 G5 G4 G3 G2 G1 G0 Analog and digital supplies should be separated and decoupled. Supplies are not connected internally. All ground pins must be connected. One ground plane is preferred although it depends on the application. See Fig.7 for example of anti-aliasing filter. Fig.6 Application diagram. 1997 Mar 06 12 CLKR CLKG Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 handbook, full pagewidth 1 µH TDA8772 12 pF 25 Ω 1 µH 12 pF analog video output (R,G or B) 75 Ω OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36) 220 pF 1.5 nF 220 pF 1 V (p-p) MSA692 - 1 analog ground Fig.7 Example of anti-aliasing filter for 1 V output swing. Characteristics of Fig.8 • Order 5; adapted CHEBYSHEV • Ripple ρ ≥ 0.6 dB MSA691 0 handbook, halfpage α (dB) • Frequency at −3 dB = 6.5 MHz • fNOTCH = 46 MHz. 50 100 150 200 0 36 72 f (MHz) 108 Fig.8 Frequency response for filter shown in Fig.7. 1997 Mar 06 13 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 PACKAGE OUTLINE QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e Q E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp Q v w y mm 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.85 0.75 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 θ Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT307-2 1997 Mar 06 EUROPEAN PROJECTION 14 o 10 0o Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 SOLDERING Wave soldering Introduction Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. If wave soldering cannot be avoided, the following conditions must be observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • The footprint must be at an angle of 45° to the board direction and must incorporate solder thieves downstream and at the side corners. Reflow soldering Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). Reflow soldering techniques are suitable for all QFP packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our “Quality Reference Handbook” (order code 9397 750 00192). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1997 Mar 06 15 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Mar 06 16 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 NOTES 1997 Mar 06 17 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 NOTES 1997 Mar 06 18 Philips Semiconductors Product specification Triple 8-bit video digital-to-analog converter TDA8772 NOTES 1997 Mar 06 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547047/1200/06/pp20 Date of release: 1997 Mar 06 Document order number: 9397 750 01836