INTEGRATED CIRCUITS DATA SHEET TDA5732M Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners Preliminary specification File under Integrated Circuits, IC02 Philips Semiconductors 1995 Mar 22 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M FEATURES DESCRIPTION • Balanced mixer with a common emitter input for band A The TDA5732M is a monolithic integrated circuit that performs VHF I, VHF III, hyperband and UHF mixer/oscillator functions in TV and VCR tuners. This low-power mixer/oscillator requires a power supply of 5 V and is available in a very small package. • 2-pin oscillator for band A • Balanced mixer with a common base input for band C • 4-pin oscillator for band C • Local oscillator buffer output for external prescaler The device gives the designer the capability to design an economical and physically small 2-band tuner. • SAW filter preamplifier with a low output impedance of 75 Ω The tuner development time can be drastically reduced by using this device. • Band gap voltage stabilizer for oscillator stability • Electronic band switch • External IF filter connected between the mixer output and the IF amplifier input. APPLICATIONS • 2-band TV tuners • 2-band VCR tuners. QUICK REFERENCE DATA SYMBOL PARAMETER VP supply voltage IP supply current fR frequency range N noise figure Vo Gv IF output voltage voltage gain CONDITIONS MIN. TYP. MAX. UNIT − 5.0 − V − 50 − mA band A 55.25 − 361.25 MHz band C 367.25 − 801.25 MHz band A − 9.5 − dB band C − 10 − dB band A; RL = 75 Ω; 1% cross modulation − 108 − dBµV band C; RL = 75 Ω; 1% cross modulation − 108 − dBm band A; RL = 75 Ω − 19 − dB band C; RL = 75 Ω − 29 − dB ORDERING INFORMATION TYPE NUMBER TDA5732M 1995 Mar 22 PACKAGE NAME DESCRIPTION VERSION SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 2 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M BLOCK DIAGRAM handbook, full pagewidth band A input 20 band C input 19 18 17 BAND A STAGE BAND C STAGE MIXER MIXER BAND A OSCILLATOR BAND C OSCILLATOR 1 3 2 4 RFGND 5 16 local oscillator amplifier outputs 15 14 LOCAL OSCILLATOR AMPLIFIER VP 13 IF inputs 12 11 DC STABILIZER TDA5732M 6 IF AMPLIFIER ELECTRONIC BAND SWITCH 7 8 10 MBE391 band A oscillator tuned circuit GND band switch input band C oscillator tuned circuit Fig.1 Block diagram. 1995 Mar 22 3 IF ground IF output Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M PINNING SYMBOL PIN DESCRIPTION AOSCIB 1 band A oscillator input base GND 2 ground (0 V) AOSCOC 3 band A oscillator output collector COSCIB1 4 band C oscillator input base 1 COSCOC1 5 COSCOC2 handbook, halfpage AOSCIB 1 20 AIN2 band C oscillator output collector 1 GND 2 19 AIN1 6 band C oscillator output collector 2 AOSCOC 3 18 CIN2 COSCIB2 7 band C oscillator input base 2 COSCIB1 4 17 CIN1 BS 8 electronic band switch input COSCOC1 5 IFGND 9 ground for IF inputs IFOUT 10 IF amplifier output IFIN1 11 IF amplifier input 1 IFIN2 12 IF amplifier input 2 VP 13 LOOUT1 LOOUT2 16 RFGND TDA5732M COSCOC2 6 15 LOOUT2 COSCIB2 7 14 LOOUT1 BS 8 13 VP supply voltage IFGND 9 12 IFIN2 14 local oscillator amplifier output 1 IFOUT 10 11 IFIN1 15 local oscillator amplifier output 2 RFGND 16 ground for RF inputs CIN1 17 band C input 1 CIN2 18 band C input 2 AIN1 19 band A input 1 AIN2 20 band A input 2 1995 Mar 22 MBE390 Fig.2 Pin configuration. 4 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VP supply voltage range −0.3 +7.0 V VP(op) operating supply voltage 4.5 5.5 V Vn(max) maximum voltage on each pin with a 22 kΩ resistor connected in series − 35 V VSW switching voltage 0 7.0 V Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −20 +85 °C Tj junction temperature − +150 °C THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE UNIT 120 K/W HANDLING Human body model: the IC withstands 2000 V (except pins 17 and 18 which withstand 1000 V) in accordance with UZW-BO-FQ-A302 ; R = 1.5 kΩ; C = 100 pF. Machine model: the IC withstands 200 V in accordance with UZW-BO-FQ-B302 ; R = 0 Ω; C = 200 pF. 1995 Mar 22 5 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M CHARACTERISTICS VP = 5 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage 4.5 5.0 5.5 V IP supply current IP(max) measured at VP(max) − 50 64 mA VSW switching voltage band A 0 − 2.0 V band C 3.0 − VP V ISW switching current band A; VSW = 0 V − − 2 µA band C; VSW = 5 V − 4.5 10 µA VP(max) − 6 − µA fi = 43.5 MHz; see Fig.12 − −13.1 − dB fi = 43.5 MHz; see Fig.12 − 2.9 − deg fi = 58.75 MHz; see Fig.12 − −13.1 − dB fi = 58.75 MHz; see Fig.12 − 2.2 − deg IF amplifier S22 ZO output reflection coefficient output impedance fi = 43.5 MHz; see Fig.12 − 78.4 − Ω fi = 43.5 MHz; see Fig.12 − 1.8 − Ω fi = 58.75 MHz; see Fig.12 − 78.4 − Ω fi = 58.75 MHz; see Fig.12 SLO visibility of the LO frequency at RL = 75 Ω the IF output (worst case in the frequency range of band A and band C) − −1.4 − Ω − 85 − dBµV Band A mixer (including IF amplifier) fR NA gos YI VoA(IF) frequency range noise figure optimum source conductance input admittance (GP//CP) IF output voltage 1995 Mar 22 VHFl 55.25 − 127.25 MHz VHFlll 133.25 − 361.25 MHz fi = 50 MHz; see Fig.7 − 8.5 9.5 dB fi = 150 MHz; see Fig.7 − 8.5 10.5 dB fi = 300 MHz; see Fig.7 − 9.5 12.5 dB fi = 50 MHz; see Fig.7 − 0.7 − mS fi = 150 MHz; see Fig.7 − 0.9 − mS fi = 300 MHz; see Fig.7 − 1.5 − mS GP; fi = 55.25 MHz; see Fig.9 − 0.25 − mS GP; fi = 361.25 MHz; see Fig.9 − 0.5 − mS CP; fi = 55.25 to 361.25 MHz; see Fig.9 − 1.3 − pF 1% cross modulation; in channel; fi = 55.25 to 361.25 MHz; RL = 75 Ω; wanted frequency sound carrier; unwanted frequency picture carrier; see Fig.5 105 108 − dBµV 6 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners SYMBOL PARAMETER Vi(RF) RF input voltage Gv(A) voltage gain at the channel centre TDA5732M CONDITIONS fi = 173 MHz; note 1 MIN. − TYP. 91 MAX. − UNIT dBµV fi = 407 MHz; note 1 − 83 − dBµV fIF = 43.5 MHz; RL = 75 Ω; see Fig.3 16.5 19 21.5 dB Band A oscillator fR frequency range VHFl 101 − 173 MHz VHFlll 179 − 407 MHz − 44 100 kHz fshift frequency shift (worst case in the frequency range) ∆VP = 5%; note 2 ∆VP = 10%; note 2 − 220 − kHz χripple(p-p) ripple susceptibility of the supply voltage (peak-to-peak value VP = 4.75 to 5.25 V; fi = 101 MHz; note 3 − 78 − mV VP = 4.75 to 5.25 V; fi = 173 MHz; note 3 − 34 − mV VP = 4.75 to 5.25 V; fi = 179 MHz; note 3 − 8.0 − mV VP = 4.75 to 5.25 V; fi = 407 MHz; note 3 − 10 − mV − 1800 2200 kHz fdrift frequency drift (worst case in the frequency range) ∆T = 25 °C with no compensation; NP0 capacitors; note 4 5 s to 15 min after switch on; note 5 − 630 1100 kHz ΦN phase noise, carrier-to-noise sideband (worst case in the frequency range) ±50 kHz; frequency offset; B = 3 kHz − 60 − dBc 367.25 − 801.25 MHz Band C mixer (including IF amplifier) fR frequency range, picture carrier NC noise figure (not corrected for image) fi = 367.25 MHz − 9 11 dB fi = 801.25 MHz − 10 12 dB input impedance (Rs + Ls) Rs; fi = 367.25 MHz; see Fig.10 − 30 − Ω Ls; fi = 367.25 MHz; see Fig.10 − 9 − nH Rs; fi = 801.25 MHz; see Fig.10 − 38 − Ω Ls; fi = 801.25 MHz; see Fig.10 − 6 − nH 1% cross modulation; in channel; fi = 365.25 to 801.25 MHz; RL = 75 Ω; wanted frequency sound carrier; unwanted frequency picture carrier; see Fig.6 105 108 − dBµV ZI VoC(IF) IF output voltage Vi(RF) RF input voltage fi = 847 MHz; note 1 − 66 − dBµV Gv(C) voltage gain fIF = 43.5 MHz; RL = 75 Ω; see Fig.4 26 29 32 dB 1995 Mar 22 7 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners SYMBOL PARAMETER TDA5732M CONDITIONS MIN. TYP. MAX. UNIT Band C oscillator 413 − 847 MHz ∆VP = 5%; note 2 − 46 200 kHz ∆VP = 10%; note 2 − 200 − kHz ripple susceptibility of the supply voltage (peak-to-peak value VP = 4.75 to 5.25 V; fi = 413 MHz − 203 − mV VP = 4.75 to 5.25 V; fi = 847 MHz; note 3 − 22 − mV frequency drift (worst case in the frequency range) ∆T = 25 °C with compensation; note 4 − 1100 2500 kHz 5 s to 15 min after switching on; note 5 − 300 1300 kHz phase noise, carrier-to-noise sideband (worst case in the frequency range) ±50 kHz; frequency offset; B = 3 kHz − 64 − dBc output admittance (GP//CP) GP; fi = 101 MHz; see Fig.11 − 2.4 − mS GP; fi = 847 MHz; see Fig.11 − 3.1 − mS CP; fi = 101 to 847 MHz; see Fig.11 − 0.5 − pF fR frequency range fshift frequency shift χripple(p-p) fdrift ΦN LO output YO VO output voltage RL = 50 Ω; VP = 4.5 to 5.5 V; Vt = 0 to 28 V 83 90 100 dBµV SRF spurious signal on LO output with respect to LO output signal RL = 50 Ω; note 6 − −15 −10 dB HLO LO signal harmonics w.r.t. LO signal RL = 50 Ω − −10.5 −9.5 dB Notes 1. The RF signal is modulated with 50% AM at 15 kHz: The level of the RF signal is increased until there is a 23 dB difference between the LO carrier and the sideband components. 2. The frequency shift is defined as a variation in oscillator frequency when the supply voltage varies from VP = 5 to 4.75 V or from VP = 5 to 5.75 V. 3. The ripple susceptibility is measured for a 500 kHz ripple at the LO output with the set-up as illustrated in Fig.8. The level of the ripple signal is increased until there is a 53.5 dB difference between the LO carrier and the sideband components. 4. The frequency shift is defined as a variation in oscillator frequency when the supply voltage varies from Tamb = 25°C to 0°C or from Tamb = 25°C to 50°C. 5. The switching on drift is defined as the variation in oscillator frequency between 5 seconds and 15 minutes after switching on. 6. SRF: spurious signal on LO with respect to LO output signal; a) RF voltage level = 1 V at fi = 55.25 to 225 MHz. b) RF level = 2.5 dBm at fi = 225 to 361.25 MHz. c) RF level = −10 dBm at fi = 367.25 to 801.25 MHz. 1995 Mar 22 8 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners handbook, full pagewidth TDA5732M signal source 50 Ω e Vmeas V 50 Ω spectrum analyzer Vout V'meas D.U.T. V in 25 Ω IF out A IN 50 Ω A IN RMS voltmeter MBE290 Zi >> 50 Ω ≥ Vi = 2Vmeas (Vi = 80 dBµV); Vo = V'meas × (50 + 25)/50; voltage gain for band A = 20log(Vo/Vi). Fig.3 Band A gain measurement. handbook, full pagewidth signal source 50 Ω A C IF out C IN e Vmeas V 50 Ω B RMS voltmeter D.U.T. HYBRID D C IN MBE289 Fig.4 Band C gain measurement. 1995 Mar 22 9 Vout V' meas 50 Ω spectrum analyzer 50 Ω Vi = Vmeas (Vi = 70 dBµV); Vo = V'meas × (50 + 25)/50; voltage gain for band C = 20log(Vo/Vi). 25 Ω Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M handbook, full pagewidth 50 Ω V Vmeas RMS voltmeter wanted input signal 50 Ω source 25 Ω A A IN C IF out ew unwanted input signal 50 Ω source B Vout wanted input signal HYBRID modulation analyzer (unwanted AM on the output wanted frequency) A IN D 50 Ω eu 50 Ω D.U.T. MBE288 Wanted input signal = 80 dBµV; Zi >> 50 Ω ≥ wanted input signal = 2Vmeas; unwanted input signal modulated with 30% AM; VoA(IF) = unwanted output signalVo when the output wanted signal is modulated with 0.3% AM. Fig.5 Band A 1% cross modulation. handbook, full pagewidth wanted input signal 50 Ω V RMS voltmeter wanted input signal 50 Ω source 25 Ω A C A C C IN IF out ew Vout unwanted input signal 50 Ω source HYBRID B eu D B D 50 Ω D.U.T. HYBRID modulation analyzer (unwanted AM on the output wanted frequency) C IN 50 Ω 50 Ω MBE287 Wanted input signal = 70 dBµV; unwanted input signal modulated with 30% AM; VoA(IF) = unwanted output signal Vo when the output wanted signal is modulated with 0.3% AM. Fig.6 Band C 1% cross modulation. 1995 Mar 22 10 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners I1 handbook, full pagewidth BNC TDA5732M I3 PCB C1 BNC L1 plug C2 plug I2 RIM-RIM PCB C3 RIM-RIM C4 (a) (b) (a) For fR = 50 MHz: mixer A frequency response measured = 57 MHz, loss = 0 dB image suppression = 16 dB C1 = 9 pF C2 = 15 pF L1 = 7 turns ( 5.5mm, wire diam. = 0.5 mm) l1 = rigid cable (RIM): 5 cm long (rigid cable (RIM); 33 dB/100 m; 50 Ω, 96 pF/m). MBE286 - 1 (b) For fR = 180 MHz: mixer A frequency response measured = 150.3 MHz, loss = 1.3 dB image suppression = 13 dB C3 = 5 pF C4 = 25 pF l2 = rigid cable (RIM): 30 cm long l3 = rigid cable (RIM): 5 cm long (rigid cable (RIM); 33 dB/100 m; 50 Ω; 96 pF/m). Fig.7 Input circuit for minimum noise figure. handbook, full pagewidth VP DC supply MBE376 6.8 kΩ 100 µF 100 µF ripple signal MEASUREMENT TEST CIRCUIT OF FIG. 14 to spectrum analyser 47 Ω 500 kHz Fig.8 Measurement set-up for ripple measurement, 1995 Mar 22 11 fo 500 kHz Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M 1 handbook, full pagewidth 0.5 2 0.2 5 10 +j 0.2 0 0.5 1 2 5 50 MHz ∞ –j 10 370 MHz 5 0.2 2 0.5 1 MKA987 Fig.9 S11 on VHF mixer input (Z chart; Zo = 50 Ω). 1 handbook, full pagewidth 0.5 2 810 MHz 0.2 5 350 MHz 10 +j 0.2 0 0.5 1 2 5 ∞ 10 –j 10 5 0.2 2 0.5 1 MKA986 Fig.10 S11 on UHF mixer input (Z chart; Zo = 50 Ω). 1995 Mar 22 12 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M 1 handbook, full pagewidth 0.5 2 0.2 5 10 +j 0 0.2 0.5 1 2 5 ∞ 10 100 MHz –j 10 850 MHz 5 0.2 2 0.5 1 MKA985 Fig.11 S22 on LO output (Z chart; Zo = 50 Ω). 1 handbook, full pagewidth 0.5 2 0.2 5 10 +j 0 0.2 0.5 5 MHz 1 2 5 ∞ 10 250 MHz –j 10 5 0.2 2 0.5 1 Fig.12 S22 on IFoutput (Z chart; Zo = 50 Ω). 1995 Mar 22 13 MKA984 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M INTERNAL PIN CONFIGURATION handbook, full pagewidth 20 19 18 17 16 15 Vp 14 13 12 11 RF ground IF FILTER BAND A INPUT BAND C INPUT LO OUTPUT TDA5732M BAND C OSCILLATOR STABILIZER BAND A OSCILLATOR BAND SWITCH Vs IF OUTPUT Vs Vs Vs Vs IF ground ground 1 2 3 4 5 6 7 8 9 10 MBE393 Fig.13 Internal pin configuration. Table 1 UHF/ VHF Average DC voltage on pins PINS 1 2 VHF 1.8 0 3 UHF − 0 3.6 1995 Mar 22 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 − 3.6 3.6 − 0 0 2.1 3.6 3.6 5 4.2 4.2 0 − − 1.8 1.8 1.9 2.9 2.9 1.9 5 0 2.1 3.6 3.6 5 4.2 4.2 0 1 1 − − 14 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M APPLICATION INFORMATION handbook, full pagewidth NETWORK MEASUREMENT 50 Ω 50 Ω 50 Ω 50 Ω ANZAC-183-4 HYBRID 50 Ω ANZAC-183-4 HYBRID 5V L7 R10 C24 C18 C19 20 C20 19 18 C21 17 BAND C STAGE MIXER MIXER BAND A OSCILLATOR BAND C OSCILLATOR 2 C6 3 C7 4 C11 16 C27 14 13 12 11 DC STABILIZER TDA5732M IF AMPLIFIER ELECTRONIC BAND SWITCH 5 6 C12 15 C26 C23 LOCAL OSCILLATOR AMPLIFIER BAND A STAGE 1 C22 C13 7 9 8 C14 10 C17 C29 5V R14 IF out C9 C2 D2 L2 C3 R2 L1 D1 R3 R4 C4 C10 R8 R9 L4 ΙΙΙ R1 C1 50 Ω C L3 D3 Ι A 5V NETWORK MEASUREMENT MBE392 R7 R5 C5 R6 C8 C30 Vt C28 Fig.14 Measurement test circuit. 1995 Mar 22 15 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners Application diagram components values Table 2 Table 3 Capacitors (all SMD and NP0 except C9 to C11 to C14 and C29) NUMBER TDA5732M Resistors (all SMD) NUMBER VALUE VALUE R1 10 Ω R2 12 kΩ C1 1 nF R3 2.7 kΩ C2 1 nF R4 47 kΩ C3 1 nF R5 10 Ω C4 82 pF R6 47 kΩ C5 2.2 nF R7 22 kΩ C6 2.2 nF R8 2.2 kΩ C7 1.5 pF R9 22 kΩ C8 2.2 nF R10 100 Ω C9 6 pF (N750) R14 27 Ω C10 100 pF C11 1 pF (N1500) C12 2 pF (N750) C13 2 pF (N750) C14 1 pF (N1500) C17 1 nF C18 1 nF C19 1 nF C20 1 nF C21 1 nF C22 1 nF Table 4 Diodes and coils NUMBER VALUE Diodes D1 BA792 D2 BB133 D3 BB134 Coils(1) L1 6 t (3.5 mm) L2 3 t (2.5 mm) L3 2 t (2.5 mm) L4 3 t (3 mm) C23 1 nF C24 1 nF C26 15 pF Note C27 15 pF 1. Wire size for L1 to L4 is 0.4 mm C28 2.2 nF C29 1 nF Transformer (L7 = 2 turns) C30 1 µF (40 V electrolytic capacitor) Coil type: TOKO 7kN; material: 113kN, screw core (03-0093), pot core (04-0026). 1995 Mar 22 16 Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M PACKAGE OUTLINE SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-04-05 95-02-25 SOT266-1 1995 Mar 22 EUROPEAN PROJECTION 17 o Philips Semiconductors Preliminary specification Low power VHF, UHF mixer/oscillator for TV and VCR 2-band tuners TDA5732M applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. SOLDERING Plastic small outline packages Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 °C. BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 °C. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 °C within 6 s. Typical dwell time is 4 s at 250 °C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 °C. (Pulse-heated soldering is not recommended for SO packages.) A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1995 Mar 22 18