INTEGRATED CIRCUITS DATA SHEET TDA1563Q 2 × 25 W high efficiency car radio power amplifier Product specification Supersedes data of 1998 Jul 14 File under Integrated Circuits, IC01 2000 Feb 09 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q FEATURES GENERAL DESCRIPTION • Low dissipation due to switching from Single-Ended (SE) to Bridge-Tied Load (BTL) mode The TDA1563Q is a monolithic power amplifier in a 17-lead DIL-bent-SIL plastic power package. It contains two identical 25 W amplifiers. The dissipation is minimized by switching from SE to BTL mode when a higher output voltage swing is needed. The device is primarily developed for car radio applications. • Differential inputs with high Common Mode Rejection Ratio (CMRR) • Mute/standby/operating (mode select pin) • Zero crossing mute circuit • Load dump protection circuit • Short-circuit safe to ground, to supply voltage and across load • Loudspeaker protection circuit • Device switches to SE operation at excessive junction temperatures • Thermal protection at high junction temperature (170°C) • Diagnostic information (clip detection and protection/temperature) • Clipping information can be selected between THD = 2.5% or 10% QUICK REFERENCE DATA SYMBOL VP PARAMETER supply voltage IORM repetitive peak output current CONDITIONS MIN. TYP. MAX. UNIT DC biased 6 14.4 18 V non-operating − − 30 V load dump − − 45 V − − 4 A Iq(tot) total quiescent current − 95 150 mA Istb standby current − 1 50 µA Zi input impedance 90 120 150 kΩ Po output power RL = 4 Ω; EIAJ − 38 − W RL = 4 Ω; THD = 10% 23 25 − W RL = 4 Ω; THD = 2.5% 18 20 − W Vselclip RL = ∞ Gv closed loop voltage gain 25 26 27 dB CMRR common mode rejection ratio f = 1 kHz; Rs = 0 Ω − 80 − dB SVRR supply voltage ripple rejection f = 1 kHz; Rs = 0 Ω 45 65 − dB − − 100 mV Rs = 0 Ω 40 70 − dB − − 1 dB ∆VO DC output offset voltage αcs channel separation ∆Gv channel unbalance ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA1563Q DBS17P 2000 Feb 09 DESCRIPTION plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) 2 VERSION SOT243-1 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q BLOCK DIAGRAM VP1 handbook, full pagewidth VP2 5 13 + SLAVE CONTROL 10 − − MUTE IN2− 16 − 17 + OUT2+ + VI IN2+ 11 IV OUT2− − VI 60 kΩ CIN 25 kΩ 3 + 60 kΩ VP 4 Vref − CSE + 60 kΩ IN1− IN1+ 60 kΩ + VI 2 + 1 − − + VI 7 IV − SLAVE CONTROL 8 + TDA1563Q CLIP AND DIAGNOSTIC STANDBY LOGIC 6 12 14 15 9 MGR173 MODE SC DIAG Fig.1 Block diagram. 2000 Feb 09 OUT1− − MUTE 3 CLIP GND OUT1+ Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q PINNING SYMBOL PIN DESCRIPTION handbook, halfpage IN1+ 1 non-inverting input 1 IN1+ 1 IN1− 2 inverting input 1 IN1− 2 CIN 3 common input CIN 3 CSE 4 VP1 5 MODE 6 OUT1− 7 OUT1+ 8 GND 9 CSE 4 electrolytic capacitor for SE mode VP1 5 supply voltage 1 MODE 6 mute/standby/operating OUT1− 7 inverting output 1 OUT1+ 8 non-inverting output 1 GND 9 ground OUT2− 10 inverting output 2 OUT2+ 11 non-inverting output 2 OUT2− 10 SC 12 selectable clip OUT2+ 11 VP2 13 supply voltage 2 DIAG 14 diagnostic: protection/temperature CLIP 15 diagnostic: clip detection IN2− 16 inverting input 2 IN2+ 17 non-inverting input 2 TDA1563Q SC 12 VP2 13 DIAG 14 CLIP 15 IN2− 16 IN2+ 17 MGR174 Fig.2 Pin configuration. 2000 Feb 09 4 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier To avoid plops during switching from ‘mute’ to ‘on’ or from ‘on’ to ‘mute/standby’ while an input signal is present, a built-in zero-crossing detector only allows switching at zero input voltage. However, when the supply voltage drops below 6 V (e.g. engine start), the circuit mutes immediately, avoiding clicks from the electronic circuit preceding the power amplifier. FUNCTIONAL DESCRIPTION The TDA1563Q contains two identical amplifiers with differential inputs. At low output power (up to output amplitudes of 3 V (RMS) at VP = 14.4 V), the device operates as a normal SE amplifier. When a larger output voltage swing is needed, the circuit switches to BTL operation. The voltage of the SE electrolytic capacitor (pin 4) is kept at 0.5VP by a voltage buffer (see Fig.1). The value of this capacitor has an important influence on the output power in SE mode. Especially at low signal frequencies, a high value is recommended to minimize dissipation. With a sine wave input signal, the dissipation of a conventional BTL amplifier up to 2 W output power is more than twice the dissipation of the TDA1563Q (see Fig.10). In normal use, when the amplifier is driven with music-like signals, the high (BTL) output power is only needed for a small percentage of the time. Assuming that a music signal has a normal (Gaussian) amplitude distribution, the dissipation of a conventional BTL amplifier with the same output power is approximately 70% higher (see Fig.11). The two diagnostic outputs (clip and diag) are open-collector outputs and require a pull-up resistor. The clip output will be LOW when the THD of the output signal is higher than the selected clip level (10% or 2.5%). The heatsink has to be designed for use with music signals. With such a heatsink, the thermal protection will disable the BTL mode when the junction temperature exceeds 150 °C. In this case, the output power is limited to 5 W per amplifier. The diagnostic output gives information: • about short circuit protection: – When a short circuit (to ground or the supply voltage) occurs at the outputs (for at least 10 µs), the output stages are switched off to prevent excessive dissipation. The outputs are switched on again approximately 50 ms after the short circuit is removed. During this short circuit condition, the protection pin is LOW. The gain of each amplifier is internally fixed at 26 dB. With the MODE pin, the device can be switched to the following modes: • Standby with low standby current (<50 µA) • Mute condition, DC adjusted – When a short circuit occurs across the load (for at least 10 µs), the output stages are switched off for approximately 50 ms. After this time, a check is made to see whether the short circuit is still present. The power dissipation in any short circuit condition is very low. • On, operation. The information on pin 12 (selectable clip) determines at which distortion figures a clip detection signal will be generated at the clip output. A logic 0 applied to pin 12 will select clip detection at THD = 10%, a logic 1 selects THD = 2.5%. A logic 0 can be realised by connecting this pin to ground. A logic 1 can be realised by connecting it to Vlogic (see Fig.7) or the pin can also be left open. Pin 12 may not be connected to VP because its maximum input voltage is 18 V (VP > 18 V under load dump conditions). • during startup/shutdown, when the device is internally muted. • temperature detection: This signal (junction temperature > 145°C) indicates that the temperature protection will become active. The temperature detection signal can be used to reduce the input signal and thus reduce the power dissipation. The device is fully protected against a short circuit of the output pins to ground and to the supply voltage. It is also protected against a short circuit of the loudspeaker and against high junction temperatures. In the event of a permanent short circuit to ground or the supply voltage, the output stage will be switched off, causing low dissipation. With a permanent short circuit of the loudspeaker, the output stage will be repeatedly switched on and off. In the ‘on’ condition, the duty cycle is low enough to prevent excessive dissipation. 2000 Feb 09 TDA1563Q 5 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP PARAMETER CONDITIONS supply voltage MIN. MAX. UNIT operating − 18 V non-operating − 30 V load dump; tr > 2.5 ms − 45 V VP(sc) short-circuit safe voltage − 18 V Vrp reverse polarity voltage − 6 V IORM repetitive peak output current − 4 A Ptot total power dissipation − 60 W Tstg storage temperature −55 +150 °C Tvj virtual junction temperature − 150 °C Tamb ambient temperature −40 − °C THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth(j-c) thermal resistance from junction to case Rth(j-a) thermal resistance from junction to ambient CONDITIONS see note 1 VALUE UNIT 1.3 K/W 40 K/W Note 1. The value of Rth(c-h) depends on the application (see Fig.3). Heatsink design There are two parameters that determine the size of the heatsink. The first is the rating for the virtual junction temperature and the second is the ambient temperature at which the amplifier must still deliver its full power in the BTL mode. handbook, halfpage OUT 1 With a conventional BTL amplifier, the maximum power dissipation with a music-like signal (at each amplifier) will be approximately two times 6.5 W. 3.6 K/W At a virtual junction temperature of 150 °C and a maximum ambient temperature of 65 °C, Rth(vj-c) = 1.3 K/W and Rth(c-h) = 0.2 K/W, the thermal resistance of the heatsink virtual junction OUT 2 OUT 1 3.6 K/W 3.6 K/W OUT 2 3.6 K/W 0.6 K/W 0.6 K/W 150 – 65 should be: ---------------------- – 1.3 – 0.2 = 5 K/W 2 × 6.5 MGC424 0.1 K/W Compared to a conventional BTL amplifier, the TDA1563Q has a higher efficiency. The thermal resistance of the 145 – 65 heatsink should be: 1.7 ---------------------- – 1.3 – 0.2 = 9 K/W 2 × 6.5 case Fig.3 Thermal equivalent resistance network. 2000 Feb 09 6 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; measured in Fig.7; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VP supply voltage note 1 6 14.4 18 V RL = ∞ Iq(tot) total quiescent current − 95 150 mA Istb standby current − 1 50 µA VC average electrolytic capacitor voltage at pin 4 − 7.1 − V ∆VO DC output offset voltage on state − − 100 mV mute state − − 100 mV Mode select switch (see Fig.4) Vms Ims voltage at mode select pin (pin 6) switch current through pin 6 standby condition 0 − 1 V mute condition 2 − 3 V operating condition 4 5 VP V Vms = 5 V − 25 40 µA − − 0.5 V Diagnostic Vdiag output voltage at diagnostic outputs (pins 14 and during any fault condition 15): protection/temperature and detection Idiag current through pin 14 or 15 during any fault condition 2 − − mA VSC input voltage at selectable clip pin (pin 12) clip detect at THD = 10% − − 0.5 V − 18 V − 145 − °C − 150 − °C clip detect at THD = 2.5% 1.5 Protection Tpre prewarning temperature Tdis(BTL) BTL disable temperature note 2 Notes 1. The circuit is DC biased at VP = 6 to 18 V and AC operating at VP = 8 to 18 V. 2. If the junction temperature exceeds 150 °C, the output power is limited to 5 W per channel. 2000 Feb 09 7 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier Vmode 18 handbook, halfpage Operating 4 3 Mute 2 1 Standby 0 MGR176 Fig.4 Switching levels of the mode select switch. 2000 Feb 09 8 TDA1563Q Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q AC CHARACTERISTICS VP = 14.4 V; RL = 4 Ω; CSE = 1000 µF; f = 1 kHz; Tamb = 25 °C; measured in Fig.7; unless otherwise specified. SYMBOL Po PARAMETER output power THD total harmonic distortion CONDITIONS MIN. TYP. MAX. UNIT THD = 0.5% 15 19 − W THD = 10% 23 25 − W EIAJ − 38 − W VP = 13.2 V; THD = 0.5% − 16 − W VP = 13.2 V; THD = 10% − 20 − W Po = 1 W; note 1 − 0.1 − % Pd dissipated power see Figs 10 and 11 W Bp power bandwidth THD = 1%; Po = −1 dB with respect to 15 W − 20 to 15 000 − Hz fro(l) low frequency roll-off −1 dB; note 2 − 25 − Hz fro(h) high frequency roll-off −1 dB 130 − − kHz Gv closed loop voltage gain Po = 1 W 25 26 27 dB SVRR supply voltage ripple rejection Rs = 0 Ω; Vripple = 2 V (p-p) 45 65 − dB on/mute − − dB − 80 − dB 90 120 150 kΩ standby; f = 100 Hz to 10 kHz 80 CMRR common mode rejection ratio Zi input impedance ∆Zi mismatch in input impedance VSE-BTL SE to BTL switch voltage level Vo(mute) output voltage mute (RMS value) Vn(o) noise output voltage αcs channel separation ∆Gv channel unbalance Rs = 0 Ω − 1 − % note 3 − 3 − V Vi = 1 V (RMS) − 100 150 µV on; Rs = 0 Ω; note 4 − 100 150 µV on; Rs = 10 kΩ; note 4 − 105 − µV mute; note 5 − 100 150 µV Rs = 0 Ω; Po = 15 W 40 70 − dB − − 1 dB Notes 1. The distortion is measured with a bandwidth of 10 Hz to 30 kHz. 2. Frequency response externally fixed (input capacitors determine low frequency roll-off). 3. The SE to BTL switch voltage level depends on VP. 4. Noise output voltage measured with a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage is independent of Rs. 2000 Feb 09 9 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q handbook, halfpage Io handbook, halfpage V o 10 µs max MGR177 t 0 short circuit removed max short circuit to ground DIAG CLIP 0 50 ms 0 t 50 ms maximum current 50 ms t short circuit to supply pins MGR178 Fig.5 Clip detection waveforms. 2000 Feb 09 Fig.6 Protection waveforms. 10 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q TEST AND APPLICATION INFORMATION handbook, full pagewidth VP1 VP2 5 13 220 nF 2200 µF TDA1563Q − 0.5Rs 100 nF 3.9 Ω 10 OUT2− IN2− 16 + 100 nF 220 nF 4Ω − 0.5Rs IN2+ 17 220 nF 3.9 Ω 11 OUT2+ + 60 kΩ 60 kΩ Vref 25 kΩ CIN 3 4 CSE 1000 µF 1 µF 0.5Rs 60 kΩ 60 kΩ IN1− 2 + 7 OUT1− 220 nF − 4Ω 0.5Rs IN1+ 1 3.9 Ω 100 nF + 8 OUT1+ 3.9 Ω 220 nF 100 nF − STANDBY LOGIC CLIP AND DIAGNOSTIC signal ground power ground 6 12 14 15 9 MODE SC DIAG CLIP GND Vms Rpu Vlogic 2.5% Rpu 10% MGR180 Connect Boucherot filter to pin 8 or pin 10 with the shortest possible connection. Fig.7 Application diagram. 2000 Feb 09 11 VP Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q 76.20 handbook, full pagewidth 35.56 + − RL-98 Out2 Out2 − − Clip − In1 + gnd + 2.5% Mode On Off In2 + 10% Clip Mute Vp GND Prot gnd TDA1563Q MGR189 Dimensions in mm. Fig.8 PCB layout (component side) for the application of Fig.7. 2000 Feb 09 12 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q 76.20 handbook, full pagewidth 35.56 2× 25 W high efficiency Out2 17 220 nF 220 nF Out1 1 1 µF 220 nF In2 In1 GND Vp MGR190 Dimensions in mm. Fig.9 PCB layout (soldering side) for the application of Fig.7. 2000 Feb 09 13 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q MBH692 25 Pd (W) MBH693 25 Pd (W) handbook, halfpage handbook, halfpage 20 20 (1) (1) 15 15 (2) 10 10 5 5 0 (2) 0 0 2 4 6 8 Po (W) 10 2.2 µF 3.3 kΩ 330 Ω 91 nF 2.2 µF 3.3 kΩ 470 nF 68 nF 10 kΩ MGC428 Fig.12 IEC-268 filter. 2000 Feb 09 6 8 Po (W) 10 Fig.11 Dissipation; pink noise through IEC-268 filter. Fig.10 Dissipation; sine wave driven. input 4 (1) For a conventional BTL amplifier. (2) For TDA1563Q. Input signal 1 kHz, sinusoidal; VP = 14.4 V. (1) For a conventional BTL amplifier. (2) For TDA1563Q. 430 Ω 2 0 14 output Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q handbook, full pagewidth VP1 VP2 5 13 220 nF 2200 µF VP TDA1563Q − 100 nF 3.9 Ω 10 OUT2− IN2− 16 + 100 nF 220 nF 4Ω − IN2+ 17 220 nF + 60 kΩ 60 kΩ Vref 25 kΩ CIN 3 4 CSE 1000 µF 1 µF IEC-268 FILTER 60 kΩ 60 kΩ IN1− 2 pink noise 3.9 Ω 11 OUT2+ + 7 OUT1− 220 nF − 3.9 Ω 4Ω IN1+ 1 100 nF + 8 OUT1+ 3.9 Ω 220 nF 100 nF − STANDBY LOGIC CLIP AND DIAGNOSTIC signal ground 6 12 14 15 9 MODE SC DIAG CLIP GND Vms power ground Rpu Vlogic Rpu MGR181 Fig.13 Test and application diagram for dissipation measurements with a music-like signal (pink noise). 2000 Feb 09 15 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier MDA845 150 TDA1563Q MDA844 250 Ip handbook, halfpage handbook, halfpage Iq (mA) (mA) 200 100 150 100 50 50 0 0 0 16 8 Vp (V) 24 0 Vms = 5 V; RI = ∞. 2 4 6 Vms (V) VP = 14.4 V; Vi = 25 mV Fig.14 Quiescent current as a function of VP. Fig.15 IP as a function of Vms (pin 3). MDA843 60 MDA842 10 handbook, halfpage handbook, halfpage Po (W) THD + N (%) (1) 40 1 (1) (2) (2) 10−1 20 (3) (3) 10−2 10−2 0 8 10 12 14 16 18 Vp (V) (1) EIAJ, 100 Hz. (2) THD = 10 %. (3) THD = 0.5 %. 1 10 Po (W) 102 (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz. Fig.16 Output power as a function of VP. 2000 Feb 09 10−1 Fig.17 THD + noise as a function of Po. 16 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q MDA841 10 MDA840 28 handbook, halfpage handbook, halfpage Gv (dB) THD + N (%) 26 (1) 1 24 (2) 10−1 22 10−2 10 102 103 104 f (Hz) 20 10 105 (1) Po = 10 W. (2) Po = 1 W. 103 104 105 f (Hz) 106 Vi = 100 mV. Fig.18 THD + noise as a function of frequency. Fig.19 Gain as a function of frequency. MDA838 −10 MDA839 0 handbook, halfpage handbook, halfpage αcs (dB) SVRR (dB) −30 −20 −50 −40 −70 102 −60 (1) (2) −90 10 102 103 104 f (Hz) −80 10 105 102 103 104 f (Hz) 105 (1) Po = 10 W. (2) Po = 1 W. Vripple(p-p) = 2 V. Fig.20 Channel separation as a function of frequency. 2000 Feb 09 Fig.21 SVRR as a function of frequency. 17 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier MDA846 0.8 handbook, halfpage Po (W) 0.6 0.4 0.2 0 0 8 16 Vp (V) 24 Vi = 70 mV. Fig.22 AC operating as a function of VP. 2000 Feb 09 18 TDA1563Q Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q handbook, full pagewidth MGL914 VP Vload 0 −VP VP Vmaster 1/2 VP 0 VP Vslave 1/2 VP 0 0 1 2 See Fig.7: Vload = V7 − V8 or V11 − V10 Vmaster = V7 or V11 Vslave = V8 or V10 Fig.23 Output waveforms. 2000 Feb 09 19 t (ms) 3 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q 5. Connect the supply decoupling capacitors of 220 nF as closely as possible to the TDA1563Qs. APPLICATION NOTES Example of the TDA1563Q in a car radio system solution 6. Place the tracks of the differential inputs as close together as possible. If disturbances are injected at the inputs, they will be amplified 20 times. Oscillation may occur if this is not done properly. The PCB shown here is used to demonstrate an audio system solution with Philips Semiconductors devices for car audio applications. The board includes the SAA7705H: a high-end CarDSP (Digital Signal Processor), the TDA3617J: a voltage regulator providing 9 V, 5 V and 3.3 V outputs, and two TDA1563Qs to provide four 25 W power outputs. A complete kit (application report, software and demo board) of this “car-audio chip-set demonstrator” is available. 7. The SE line output signal of the CarDSP here is offered as a quasi differential input signal to the amplifiers by splitting the 100 Ω unbalance series resistance into two 47 Ω balanced series resistances. The return track from the minus inputs of the amplifiers are not connected to ground (plane) but to the line out reference voltage of the CarDSP, VrefDA. The TDA1563Q is a state of the art device, which is different to conventional amplifiers in power dissipation because it switches between SE mode and conventional BTL mode, depending on the required output voltage swing. As a result, the PCB layout is more critical than with conventional amplifiers. 8. The output signal of the CarDSP needs an additional 1st order filter. This is done by the two balanced series resistances of 47 Ω (see note 7) and a ceramic capacitor of 10 nF. The best position to place these 10 nF capacitors is directly on the input pins of the amplifiers. Now, any high frequency disturbance at the inputs of the amplifiers will be rejected. NOTES AND LAYOUT DESIGN RECOMMENDATIONS 1. The TDA1563Q mutes automatically during switch-on and switch-off and suppresses biasing clicks coming from the CarDSP circuit preceding the power amplifier. Therefore, it is not necessary to use a plop reduction circuit for the CarDSP. To mute or to enlarge the mute time of the system, the voltage at the mode pin of the amplifiers should be kept between 2 V and 3 V. 9. Only the area underneath the CarDSP is a ground plane. A ground plane is necessary in PCB areas where high frequency digital noise occurs. The audio outputs are low frequency signals. For these outputs, it is better to use two tracks (feed and return) as closely as possible to each other to make the disturbances common mode. The amplifiers have differential inputs with a very high common mode rejection. 2. The input reference capacitor at pin 3 is specified as 1 µF but has been increased to 10 µF to improve the switch-on plop performance of the amplifiers. By doing this, the minimum switch-on time increases from standby, via internal mute, to operating from 150 ms to 600 ms. 10. The ground pin of the voltage regulator is the reference for the regulator outputs. This ground reference should be connected to the ground plane of the CarDSP by one single track. The ground plane of the CarDSP may not be connected to “another” ground by a second connection. 3. It is important that the copper tracks to and from the electrolytic capacitors (SE capacitors and supply capacitors) are close together. Because of the switching principle, switching currents flow here. Combining electrolytic capacitors in a 4-channel application is not recommended. 11. Prevent power currents from flowing through the ground connection between CarDSP and voltage regulator. The currents in the ground from the amplifiers are directly returned to the ground pin of the demo board. By doing this so, no ground interference between the components will occur. 4. Filters at the outputs are necessary for stability reasons. The filters at output pins 8 and 10 to ground should be connected as close as possible to the device (see layout of PCB). 2000 Feb 09 20 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q (3) handbook, full pagewidth (3) Car-audio chip-set demonstrator TDA3617J TDA1563Q + TDA1563Q + Rear − Front + FL 2.5% + VBATT + RL 10% IO-98 Error On Diag Clip Car DSP SAA7704/05/08 on bottom side Right − − Line-in Left FR + RR − 10 V to 16 V Vbattery Power ON GND Mute I2C PHILIPS Semiconductors Top copper layer (4) (5) (6) (8) Car-audio chip-set demonstrator Version 0.1 4× 25 W into 4 Ohms DSP Bottom copper layer Fig.24 PCB layout. 2000 Feb 09 21 MGS827 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q VOLTAGE REGULATOR handbook, full pagewidth Ven1 MICROCONTROLLER VBATT 6 4.7 kΩ 47 µF VBATT 220 nF 8 1 9 7 GND 5 HOLD Ven2 REG2 power on VP TDA3617J GND Ven3 power 3 2 PLANE GND REG3 5V 47 µF 47 nF 47 nF 10 kΩ GND GND 5V 4.7 kΩ GND 3.3 V DIG 3.3 V ANA BAS16/A6 A error 10 kΩ 1 MΩ BC848B/1k mute GND 4.7 kΩ B diagnostic C 4.7 kΩ 5V 3.3 V DIG clip 3.3 V ANA 100 nF PLANE 100 Ω 3.3 V ANA BLM21A10 VDACP 74 1 75 22 36 23 46 37 47 48 51 52 55 49 50 53 54 100 nF VDDA2 VSSD3V4 VSSD3V3 VSSD3V2 VSSD3V1 VDDD3V4 VDDD3V3 VDDD3V2 VDDD3V1 VSSD5V3 VDDD5V3 VSSD5V2 VSSD5V1 VDDD5V1 TP5 21 76 VDDD5V2 22 nF PLANE 22 nF PLANE 22 nF PLANE PLANE VDACN2 100 Ω VSSA1 VDDA1 100 nF PLANE 11 16 100 µF VDACN1 2 15 PLANE 330 pF CDLB 8.2 kΩ 1 µF 15 kΩ CDLI LEFT D 2.2 nF FLI E 47 Ω FRV F 73 14 72 8.2 kΩ 1 µF 15 kΩ CDRI RIGHT 1 µF CDGND CD-GND 2.2 nF FRI 6 Car DSP 71 70 SAA7704/05 / 08H 7 77 9 G H 2.2 nF RRI 12 68 69 10 PLANE BLM21A10 SCL SDA PLANE 5V 3.3 V DIG PLANE 18 pF PLANE I J 2.2 nF 18 pF PLANE 220 Ω 100 pF PLANE 100 pF PLANE 8 7 22 TSCAN SHTCB RTCB CD1CL CD1DATA CD1WS PLANE 47 Ω K VREFDA VSSA2 22 µF PLANE MGS825 220 Ω Fig.25 Car-audio chip-set demonstrator (continued in Fig.26). 2000 Feb 09 RLI 24 25 26 27 28 29 43 44 45 CD2CL 56 CD2WS 58 A0 57 220 nF X1 100 nF PLANE I2C 42 64 SDA 63 62 CD2DATA PLANE 65 SCL 3 61 DSPRESET AML 4 22 µF 47 nF OSCOUT TAPEL 67 OSCIN TAPER 8 VSS(OSC) AMAFL 78 47 Ω 47 Ω RLV 66 SELFR AMAFR VDD(OSC) 82 kΩ FML VREFAD 6 47 Ω 47 Ω RRV 1 MΩ 1 to 5 47 Ω 330 pF CDRB LINE IN 13 47 Ω FLV Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q 100 µH/6A handbook, full pagewidth V battery VBATT GND A GND clip select 2.5% PGND 5V 10% GND B C 2200 µF VBATT PGND (16 V) 220 nF VP1 VP2 MODE CLIP DIAG SC IN2+ D E 10 nF IN2− IN1+ 220 nF 220 nF G 10 nF IN1− CIN H GND 1000 µF 9 CSE 4 15 11 (16 V) OUT2+ OUT+ 14 3.9 Ω 12 17 10 16 OUT− 3.9 Ω 100 nF TDA1563Q PGND 3.9 Ω 100 nF PGND 1 8 OUT1+ OUT+ 100 nF 2 FRONT RIGHT 3.9 Ω 3 7 OUT1− OUT− 2× HIGH EFFICIENCY POWER AMPLIFIER 10 µF CIN 7 3 OUT1− OUT− J IN1+ K FRONT LEFT 100 nF OUT2− 10 µF PGND I 13 220 nF 220 nF F 5 6 3.9 Ω 1 220 nF 10 nF 220 nF 8 IN1− IN2+ 2 17 IN2− SC DIAG CLIP MODE PGND 10 OUT2− OUT− 16 100 nF 12 3.9 Ω 14 11 15 6 5 PGND 3.9 Ω 100 nF TDA1563Q 10 nF 220 nF OUT+ 3.9 Ω 100 nF 220 nF REAR RIGHT 100 nF OUT1+ 4 9 13 VP1 VP2 220 nF OUT2+ CSE 1000 µF REAR LEFT OUT+ (16 V) GND 2200 µF VBATT PGND MGS826 (16 V) Fig.26 Car-audio chip-set demonstrator (continued from Fig.25). 2000 Feb 09 23 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q Advantages of high efficiency • Power conversion improvement (power supply) Usually, the fact that the reduction of dissipation is directly related to supply current reduction is neglected. One advantage is less voltage drop in the whole supply chain. Another advantage is less stress for the coil in the supply line. Even the adapter or supply circuit remains cooler than before as a result of the reduced heat dissipation in the whole chain because more supply current will be converted to output power. Supply current reduction of 32% Same junction temperature • Power dissipation reduction This is the best known advantage of high efficiency amplifiers. • Heatsink size reduction The heatsink size of a conventional amplifier may be reduced by approximately 50% at VP = 14.4 V when the TDA1563Q is used. In this case, the maximum heatsink temperature will remain the same. Heatsink size reduction of 50% choice Power dissipation reduction of 40% at Po = 1.6 W Same heatsink size Heatsink temperature reduction of 40% MGS824 • Heatsink temperature reduction The power dissipation and the thermal resistance of the heatsink determine the heatsink temperature rise. When the same heatsink size is used as in a conventional amplifier, the maximum heatsink temperature decreases and also the maximum junction temperature, which extends the life of this semiconductor device. The maximum dissipation with music-like input signals decreases by 40%. Fig.27 Heatsink design Advantage of the concept used by the TDA1563Q The TDA1563Q is highly efficient under all conditions, because it uses a SE capacitor to create a non-dissipating half supply voltage. Other concepts rely on both input signals being the same in amplitude and phase. With the concept of an SE capacitor, it does not matter what kind of signal processing is done on the input signals. For example, amplitude difference, phase shift or delays between both input signals, or other DSP processing, have no impact on the efficiency. It is clear that the use of the TDA1563Q saves a significant amount of energy. The maximum supply current decreases by approximately 32%, which reduces the dissipation in the amplifier as well in the whole supply chain. The TDA1563Q allows a heatsink size reduction of approximately 50% or a heatsink temperature decrease of 40% when the heatsink size is not changed. 2000 Feb 09 VP = 14.4 V handbook, halfpage 24 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q INTERNAL PIN CONFIGURATIONS PIN 1, 2, 16, 17 and 3 NAME EQUIVALENT CIRCUIT IN1+, IN1−, IN2−, IN2+ and CIN VP1, VP2 VP1, VP2 1, 2, 16, 17 3 MGR182 4 CSE VP1 VP2 4 MGR183 6 MODE 6 MGR184 7, 11 OUT1−, OUT2+ VP1, VP2 7, 11 4 MGR185 2000 Feb 09 25 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier PIN 8, 10 NAME OUT1+, OUT2− TDA1563Q EQUIVALENT CIRCUIT VP1, VP2 8, 10 4 MGR186 12 SC VP2 12 MGR187 14, 15 PROT, CLIP VP2 14, 15 MGR188 2000 Feb 09 26 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q PACKAGE OUTLINE DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 17 e1 Z bp e e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 e1 e2 1.27 5.08 Eh j L L3 m Q v w x Z (1) 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.4 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-12-16 99-12-17 SOT243-1 2000 Feb 09 EUROPEAN PROJECTION 27 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier TDA1563Q The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction to soldering through-hole mount packages The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by solder wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL WAVE suitable(1) suitable Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2000 Feb 09 28 Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier NOTES 2000 Feb 09 29 TDA1563Q Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier NOTES 2000 Feb 09 30 TDA1563Q Philips Semiconductors Product specification 2 × 25 W high efficiency car radio power amplifier NOTES 2000 Feb 09 31 TDA1563Q Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753503/25/02/pp32 Date of release: 2000 Feb 09 Document order number: 9397 750 06309