BZX100A Single Zener diode Rev. 01 — 30 May 2007 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diode in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features n Non-repetitive peak reverse power dissipation: ≤ 60 W n Small plastic package suitable for surface-mounted design 1.3 Applications n General regulation functions n Overvoltage protection for ElectroLuminescent (EL) driver circuits n AEC-Q101 qualified 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VZ working voltage IZ = 1 mA 95 - 105 V IZSM non-repetitive peak reverse current - - 0.5 A [1] [1] tp = 100 µs; square wave; Tj = 25 °C prior to surge 2. Pinning information Table 2. Pin Pinning Description 1 cathode 2 anode Simplified outline Symbol [1] 1 2 1 2 006aaa152 [1] The marking bar indicates the cathode. BZX100A NXP Semiconductors Single Zener diode 3. Ordering information Table 3. Ordering information Type number BZX100A Package Name Description Version SC-90 plastic surface-mounted package; 2 leads SOD323F 4. Marking Table 4. Marking codes Type number Marking code BZX100A AS 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions IF forward current - 0.2 A IZSM non-repetitive peak reverse current [1] - 0.5 A PZSM non-repetitive peak reverse power dissipation [1] - 60 W Ptot total power dissipation [2] - 310 mW [3] - 550 mW [4] - 1 W Tamb ≤ 25 °C Max Unit Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] tp = 100 µs; square wave; Tj = 25 °C prior to surge [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [4] Device mounted on a ceramic PCB, Al2O3, standard footprint. BZX100A_1 Product data sheet Min © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 May 2007 2 of 10 BZX100A NXP Semiconductors Single Zener diode 006aab047 1.2 (1) Ptot (W) 0.8 (2) 0.4 0 −75 (3) −25 25 75 125 175 Tamb (°C) (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for cathode 1 cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6. Symbol Rth(j-a) Rth(j-sp) Thermal characteristics Parameter Conditions thermal resistance from junction to ambient in free air thermal resistance from junction to solder point Typ Max Unit - - 400 K/W [2] - - 230 K/W [3] - - 125 K/W [4] - - 55 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. [4] Soldering point of cathode tab. BZX100A_1 Product data sheet Min [1] © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 May 2007 3 of 10 BZX100A NXP Semiconductors Single Zener diode 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IF = 10 mA - - 0.9 V IF = 100 mA - - 1.1 V [1] forward voltage VF VZ working voltage IZ = 1 mA 95 - 105 V rdif differential resistance IZ = 1 mA - - 700 Ω IR reverse current VR = 76 V - - 0.2 µA SZ temperature coefficient IZ = 1 mA - 138 - mV/K Cd diode capacitance f = 1 MHz; VR = 0 V - - 70 pF [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. 006aab048 103 006aab049 300 PZSM (W) IF (mA) 102 200 10 100 1 10−5 10−4 10−3 10−2 0 0.6 tp (s) 0.8 0.9 1.0 VF (V) Tj = 25 °C (prior to surge) Tj = 25 °C Fig 2. Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values Fig 3. Forward current as a function of forward voltage; typical values BZX100A_1 Product data sheet 0.7 © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 May 2007 4 of 10 BZX100A NXP Semiconductors Single Zener diode 006aab050 150 006aab051 10−3 IZ (A) 10−4 SZ (mV/K) 140 10−5 130 10−6 120 10−7 110 10−8 10−9 100 0 1 2 3 4 5 80 90 100 110 IZ (mA) 120 VZ (V) Tj = 25 °C to 150 °C Tj = 25 °C Fig 4. Temperature coefficient as a function of working current; typical values Fig 5. Working current as a function of working voltage; typical values 8. Application information High-voltage Zener diodes can be used as overvoltage protection diodes for Integrated Circuits (IC) due to their ability to cut off the applied voltage at a well-defined value. One important application is the protection of EL driver circuits where a driver IC is connected to an EL foil. Since both the foil as well as the IC are sensitive against voltage overstress, it is necessary to install an additional protection device in the circuit. Commonly, a peak-to-peak voltage of 220 V should not be exceeded, such that two 100 V diodes in back-to-back configuration are used. CHF CHF CLF CLF Renable ENABLE E n.c. GND 1 10 2 9 3 DRIVER IC 8 4 7 5 6 V+ VBAT L+ VO L L− n.c. BZX100A BZX100A EL LAMP 006aab052 Fig 6. Application diagram BZX100A_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 May 2007 5 of 10 BZX100A NXP Semiconductors Single Zener diode 9. Test information 9.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 (Stress qualification for discrete semiconductors) and is suitable for use in automotive critical applications. 10. Package outline 1.35 1.15 0.80 0.65 0.5 0.3 1 2.7 2.3 1.8 1.6 2 0.40 0.25 Dimensions in mm 0.25 0.10 04-09-13 Fig 7. Package outline SOD323F (SC-90) 11. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BZX100A [1] Package Description SOD323F 4 mm pitch, 8 mm tape and reel 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 15. BZX100A_1 Product data sheet Packing quantity © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 May 2007 6 of 10 BZX100A NXP Semiconductors Single Zener diode 12. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 8. Reflow soldering footprint SOD323F (SC-90) BZX100A_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 May 2007 7 of 10 BZX100A NXP Semiconductors Single Zener diode 13. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BZX100A_1 20070530 Product data sheet - - BZX100A_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 May 2007 8 of 10 BZX100A NXP Semiconductors Single Zener diode 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 14.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] BZX100A_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 May 2007 9 of 10 BZX100A NXP Semiconductors Single Zener diode 16. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 30 May 2007 Document identifier: BZX100A_1