DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D373 BGY241 UHF amplifier module Product specification Supersedes data of 1999 May 01 1999 Sep 09 Philips Semiconductors Product specification UHF amplifier module BGY241 FEATURES PINNING - SOT482C • 3.5 V nominal supply voltage PIN DESCRIPTION • 35 dBm output power 1 RF input • Easy output power control by DC voltage. 2 VC 3 VS APPLICATIONS 4 RF output • Digital cellular radio systems with Time Division Multiple Access (TDMA) operation (GSM systems) in the 880 to 915 MHz frequency range. 5 ground handbook, halfpage DESCRIPTION 5 The BGY241 is a three-stage UHF amplifier module in a SOT482C leadless package with a plastic cover. The module consists of one NPN silicon planar transistor die and one bipolar monolithic integrated circuit mounted together with matching and bias circuit components on a metallized ceramic substrate. 4 3 2 Bottom view 1 MBK201 Fig.1 Simplified outline. QUICK REFERENCE DATA RF performance at Tmb = 25 °C. MODE OF OPERATION Pulsed; δ = 1 : 8 f (MHz) VS (V) VC (V) PL (dBm) Gp (dB) η (%) ZS; ZL (Ω) 880 to 915 3.5 ≤2.2 35.2 ≥35.2 typ. 43 50 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VS PARAMETER DC supply voltage CONDITIONS MIN. MAX. UNIT VC = 0; PD = 0 mW − 7 V VC ≥ 0.2 V − 5.5 V VC DC control voltage − 2.7 V PD input drive power − 10 dBm PL load power − 36 dBm Tstg storage temperature −40 +100 °C Tmb operating mounting base temperature −30 +100 °C CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B. 1999 Sep 09 2 Philips Semiconductors Product specification UHF amplifier module BGY241 CHARACTERISTICS ZS = ZL = 50 Ω; PD = 0 dBm; VS = 3.5 V; VC ≤ 2.2 V; f = 880 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; unless otherwise specified. SYMBOL IQ PARAMETER leakage current CONDITIONS MIN. TYP. MAX. UNIT VC = 0.2 V; PD = 0 mW − − 10 µA VS = 7 V; VC = 0; PD = 0 mW − 6 20 mA − − 3 mA ICM peak control current PL = 35.2 dBm PL load power VC = 2.2 V 35.2 35.5 − dBm VS = 3 V; VC = 2.2 V; Tmb = −20 to +85 °C 33.6 − − dBm power gain PL = 35.2 dBm − 35.2 − dB η efficiency PL = 34 dBm 35 42 − % H2 second harmonic PL = 35.2 dBm − −50 −38 dBc H3 third harmonic PL = 35.2 dBm − −53 −40 dBc VSWRin input VSWR PL = 5 to 35 dBm − − 3:1 stability VS = 3 to 5 V; PD = −3 to +3 dBm; VC = 0 to 2.2 V; PL ≤ 35.2 dBm; VSWR ≤ 6 : 1 through all phases − − −60 dBc isolation VC = 0.5 V; PD = 3 dBm − −43 −37 dBm 1.5 − − MHz control slope PL = −5 to +5 dBm − 240 − dB/V noise power PL = 5 to 35.2 dBm; bandwidth = 100 kHz; 20 MHz above transmitter band − −76 −75 dBm AM/AM conversion PD = 3% AM; f = 100 kHz; PL = 5 to 35.2 dBm − 12 14 % AM/PM conversion PD = −0.5 to +0.5 dBm; PL = 5 to 35.2 dBm − − 2 deg TX/RX conversion PL = 35.2 dBm; f = 915 MHz; PL (925 MHz)/PD (905 MHz) − 25 30 dB tr carrier rise time PL = 6 to 34 dBm; time to settle within − −0.5 dB of final PL 1.5 2 µs tf carrier fall time PL = 6 to 34 dBm; time to settle within − −0.5 dB of final PL 1.5 2 µs ruggedness VS = 5 V; PL = 34.8 dBm; VSWR ≤ 12 : 1 through all phases no degradation VS = 4.5 V; VC = 2.3 V; VSWR ≤ 5 : 1 through all phases no degradation Gp control bandwidth Pn 1999 Sep 09 3 Philips Semiconductors Product specification UHF amplifier module BGY241 MGS649 MGS648 4 handbook, halfpage 8 handbook, halfpage 880 MHz 915 MHz PL (W) 880 MHz PL (W) 3 6 2 4 1 2 0 915 MHz 0 1 1.5 2 VC (V) 2.5 2 3 4 ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs. ZS = ZL = 50 Ω; VC = 2.2 V; PD = 1 mW; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs. Fig.2 Fig.3 Load power as a function of control voltage; typical values. 5 VS (V) Load power as a function of supply voltage; typical values. MGS650 MGS651 5 50 η (%) handbook, halfpage handbook, halfpage PL (W) 915 MHz 880 MHz 40 4 30 3 20 2 10 1 0 880 0 1 0 2 3 4 PL (W) 5 890 900 910 920 f (MHz) ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs. ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; VC = 2.2 V; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs. Fig.4 Fig.5 Efficiency as a function of load power; typical values. 1999 Sep 09 6 4 Load power as a function of frequency; typical values. Philips Semiconductors Product specification UHF amplifier module BGY241 MGS652 MGS653 4 0 handbook, halfpage handbook, halfpage H2, H3 VSWRin (dBc) −20 3 −40 H3 2 −60 880 MHz H2 915 MHz −80 880 1 0 1 2 3 PL (W) 4 890 900 910 920 f (MHz) ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; PL = 2.5 W; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs. Fig.6 Fig.7 Input VSWR as a function of load power; typical values. MGS654 Harmonics as a function of frequency; typical values. MGS655 12 output AM (%) 10 5 handbook, halfpage handbook, halfpage PL (W) 4 (1) (2) 3 880 MHz 915 MHz 8 (3) (4) 6 2 4 1 2 0 0 20 0 40 60 80 100 Tmb (°C) 0 10 20 30 40 PL (dBm) ZS = ZL = 50 Ω; PD = 1 mW; VC = 2.2 V; δ = 1 : 8; tp = 575 µs. (1) VS = 3.5 V; f = 880 MHz. (2) VS = 3.5 V; f = 915 MHz. (3) VS = 3.1 V; f = 880 MHz. (4) VS = 3.1 V; f = 915 MHz. ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C; ∆f = 100 kHz; input amplitude modulation = 3%; δ = 1 : 8; tp = 575 µs. Fig.8 Fig.9 Load power as a function of mounting base temperature; typical values. 1999 Sep 09 5 Output amplitude modulation as a function of load power; typical values. Philips Semiconductors Product specification UHF amplifier module BGY241 handbook, full pagewidth C2 C1 Z1 R1 RF input Z2 C3 C4 VC VS RF output MGS656 Fig.10 Test circuit. List of components (see Fig.10) COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE NO. C1,C2 multilayer ceramic chip capacitor 680 pF 2222 851 11681 C3 tantalum capacitor 2.2 µF; 35 V − C4 electrolytic capacitor 47 µF; 40 V 2222 030 37479 Z1,Z2 stripline; note 1 50 Ω R1 metal film resistor 100 Ω; 0.6 W width 2.33 mm − 2322 156 11001 Note 1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr = 2.2); thickness 1⁄32 inch. 1999 Sep 09 6 Philips Semiconductors Product specification UHF amplifier module BGY241 SOLDERING The indicated temperatures are those at the solder interfaces. MGM159 300 handbook, halfpage Advised solder types are types with a liquidus less than or equal to 210 °C. T (°C) Solder dots or solder prints must be large enough to wet the contact areas. 200 Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. A double reflow process is permitted. 100 Hand soldering is not recommended because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. In case hand soldering is needed, recommendations can be found in RNR-45-98-A-0485. 0 0 The maximum allowed temperature is 250 °C for a maximum of 5 seconds. The maximum ramp-up is 10 °C per second. 2 3 4 t (min) 5 Fig.11 Recommended reflow temperature profile. The maximum cool-down is 5 °C per second. Cleaning The following fluids may be used for cleaning: • Alcohol • Bio-Act (Terpene Hydrocarbon) • Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product. 1999 Sep 09 1 7 Philips Semiconductors Product specification UHF amplifier module BGY241 4.400 handbook, full pagewidth 4.000 4.000 0 2.5 mm 2.800 3.200 scale 1.800 0.500 0.600 1.400 2.500 1.000 1.800 1.300 14.300 13.500 12.900 10.700 2.250 1.350 (2×) 2.500 4.800 (2×) 1.900 0.800 1.950 0.900 3.200 5.650 (2×) 5.900 (2×) 6.700 (2×) 2.400 13.500 2.250 1.700 1.200 1.300 1.000 0.050 MGS345 0.900 0.900 1.200 1.000 0.600 1.300 Solder land 2.300 3.150 3.700 3.900 Solder paste Green tape area, max. height 0.03 mm Dimensions in mm. Fig.12 Footprint SOT482C. 1999 Sep 09 0.450 8 Philips Semiconductors Product specification UHF amplifier module BGY241 PACKAGE OUTLINE Leadless surface mounted package; plastic cap; 4 terminations e b (4×) e1 e d b1 b2 b2 b3 SOT482C b3 1 2 3 L 4 L1 L2 D D1 A c 5 E1 E pin 1 index 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 b2 b3 c D D1 d E E1 e e1 L L1 L2 mm 1.90 1.59 1.9 1.7 1.4 1.2 0.8 0.6 0.6 0.4 0.70 0.57 13.7 13.3 13.35 13.05 2.0 8.2 7.8 7.85 7.55 2.6 2.4 4.6 4.4 1.15 0.85 2.65 2.35 3.85 3.55 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 99-05-18 99-08-16 SOT482C 1999 Sep 09 EUROPEAN PROJECTION 9 Philips Semiconductors Product specification UHF amplifier module BGY241 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Sep 09 10 Philips Semiconductors Product specification UHF amplifier module BGY241 NOTES 1999 Sep 09 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 125002/06/pp12 Date of release: 1999 Sep 09 Document order number: 9397 750 06002