IP4352CX24 9-channel SD memory card interface filter with ESD protection to IEC 61000-4-2 level 4 Rev. 02 — 3 May 2010 Product data sheet 1. Product profile 1.1 General description The IP4352CX24 is a diode array designed to provide protection to downstream components against ElectroStatic Discharge (ESD) voltages as high as 15 kV. The IP4352CX24 integrates 9 pairs of rail-to-rail diodes, 15 resistors and 12 Zener diodes in a single Wafer-Level Chip-Scale Package (WLCSP) using monolithic silicon semiconductor technology. These features make the IP4352CX24 ideal for applications requiring miniaturized components, such as mobile phone handsets, cordless telephones and personal digital devices. 1.2 Features and benefits Pb-free, RoHS compliant, free of halogen and antimony (Dark Green compliant) All SD memory card channels have integrated ESD protection EMI and RF filters ESD protection up to 15 kV at output terminals on 9 channels Integrated EMI and RF filters with pull-up resistors on 5 channels Integrated EMI and RF filters on 4 channels SD card power supply protection WLCSP with 0.4 mm pitch Write protection with integrated card detect biasing resistor Supports electrical card detection Also available with different filter behavior and the same footprint as IP4350CX24 1.3 Applications SD memory card interfaces in cellular and PCS mobile handsets DECT handsets Digital still and video cameras Media players Card readers IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection 2. Pinning information 2.1 Pinning bump A1 index area 1 2 3 4 5 A B C D E 001aaj785 transparent top view, solder balls facing down Fig 1. Table 1. IP4352CX24_2 Product data sheet Pin configuration IP4352CX24 Pinning Pin Description A1 DATA2: data line 2 A2 DATA3: data line 3 A3 GND_H: ground 1 A4 SDDATA2: secure digital data 2 A5 SDDATA3: secure digital data 3 B1 CD: card detect B2 CMD: command B3 not connected B4 SDCD: secure digital card detect B5 SDCMD: secure digital command C1 DAT3_PD: data 3 pull-down C2 WP: write protect C3 DAT3_PU: data 3 pull-up C4 SDWP: secure digital write protect C5 VSD: supply voltage D1 WP+CD: write protect and card detect D2 CLK: clock D3 GND_C: ground 2 D4 SDWP+CD: secure digital write protect and card detect D5 SDCLK: secure digital clock E1 DATA1: data line 1 All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 2 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection Table 1. Pinning …continued Pin Description E2 DATA0: data line 0 E3 GND_C: ground 3 E4 SDDATA1: secure digital data 1 E5 SDDATA0: secure digital data 0 3. Ordering information Table 2. Ordering information Type number IP4352CX24/LF Package Name Description Version WLCSP24 wafer level chip-size package; 24 bumps (5 × 5 - B3) IP4352CX24 4. Functional diagram VSD DAT3_PU R11 R12 R13 R14 R15 R1 CLK SDCLK R2 CMD SDCMD R3 DATA0 SDDATA0 R4 DATA1 SDDATA1 R5 DATA2 SDDATA2 R6 DATA3 SDDATA3 R7 CD SDCD R8 WP SDWP R9 WP+CD SDWP+CD R21 DAT3_PD GND_H GND_C 001aaj750 Fig 2. Schematic diagram IP4352CX24 IP4352CX24_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 3 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection 5. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VI input voltage VESD electrostatic discharge voltage Min Max Unit −0.5 +5.0 V −8 +8 kV −15 +15 kV −2 +2 kV IEC 61000-4-2 level 4; output pins A4, A5, B4, B5, C4, C5, D4, D5, E4, E5; pins A3, D3 and E3 connected to ground [1] contact discharge air discharge IEC 61000-4-2 level 1; all other pins; pins A3, D3 and E3 connected to ground contact discharge −2 +2 kV Pch channel power dissipation continuous power; Tamb = 70 °C - 25 mW Ptot total power dissipation continuous power; Tamb = 70 °C - 100 mW Tstg storage temperature −55 +150 °C Treflow(peak) peak reflow temperature - 260 °C Tamb ambient temperature −30 +85 °C air discharge [1] 10 s maximum Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). 6. Characteristics Table 4. Channel characteristics Tamb = 25 °C; unless otherwise specified. Symbol Parameter Rs(ch) channel series resistance channel capacitance Cch Conditions Min Typ Max Unit R1 to R9 ± 20 % 32 40 48 Ω R11 to R14 ± 30 % 35 50 65 kΩ R15 ± 30 % 10.5 15 19.5 kΩ R21 ± 30 % 329 470 611 kΩ Vbias(DC) = 0 V; f = 1 MHz; pin DAT3_PU = 0 V; pin DAT3_PD = 0 V; pin VSD = 0 V SD card to I/O interface [1] - - 20 pF pins DAT3_PD, DAT3_PU and VSD [1] - 30 - pF VBR breakdown voltage II = 1 mA 6 - - V ILR reverse leakage current per channel; VI = 3 V - - 100 nA [1] Guaranteed by design. IP4352CX24_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 4 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection Table 5. Frequency response Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions αil all channels; Rgen = 50 Ω; RL = 50 Ω insertion loss Min Typ Max Unit f < 400 MHz - - 9 dB 400 MHz < f < 800 MHz 9 - - dB 800 MHz < f < 2.5 GHz 13 - - dB 2.5 GHz < f < 6 GHz 28 32 - dB Table 6. Time domain response Measured using source with 0 V to 3 V steps and 20 % to 70 % LOW-to-HIGH limits; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit RL = 20 pF || 100 kΩ - 3.2 3.7 ns RL = 40 pF || 100 kΩ - 4.4 6 ns RL = 20 pF || 100 kΩ - 3.3 4.3 ns RL = 40 pF || 100 kΩ - 5.5 7.5 ns High speed Rgen = 50 Ω; tr = tf = 2 ns[1] tr rise time fall time tf [1] Performed on all high speed lines (channels including R1 to R9, see Figure 2). 7. Application information 7.1 Insertion loss The insertion loss was measured with a test PCB utilizing laser-drilled micro-via holes which connect the PCB ground plane to the ground pins. The configuration for measuring insertion loss in a 50 Ω system is shown in Figure 3. IN DUT OUT 50 Ω 50 Ω TEST BOARD Vgen 001aai755 Fig 3. Frequency response measurement configuration The frequency response curves measured on pins A1 and A4, E1 and E4 and C2 and C4 at frequencies up to 3 GHz are shown in Figure 4. IP4352CX24_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 5 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection 001aaj787 0 S21 (dB) −20 (1) (2) −40 (3) −60 −80 1 102 10 103 104 f (MHz) (1) Pin A1 to A4. (2) Pin E1 to E4. (3) Pin C2 to C4. Fig 4. Measured insertion loss magnitudes 7.2 Crosstalk The crosstalk between adjacent channels within the IP4352CX24 for different channel pairs was measured in a 50 Ω NetWork Analyzer (NWA) system. The configuration for measuring crosstalk in a 50 Ω system is shown in Figure 5. IN_1 50 Ω DUT IN_2 50 Ω OUT_2 OUT_1 TEST BOARD 50 Ω 50 Ω Vgen 001aai756 Fig 5. Crosstalk measurement configuration The crosstalk measured for five different pairs of channels is shown in Figure 6. In all cases, all unused connections are terminated with 50 Ω to ground. IP4352CX24_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 6 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection 001aaj788 −10 αct (dB) −30 −50 −70 (1) (2) (3) 1 10 102 103 104 f (MHz) (1) Pins A1 and B4. (2) Pins A1 and E4. (3) Pins A2 and B5. Fig 6. IP4352CX24_2 Product data sheet Measured crosstalk between different channels All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 7 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection 8. Package outline WLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - B3) D bump A1 index area A2 E A A1 detail X e1 e b E e D e1 C B A European projection 1 2 3 4 X 5 wlcsp24_5x5-b3_po Fig 7. Table 7. Package outline IP4352CX24 (WLCSP24) Dimensions for Figure 7 Symbol Min Typ Max Unit A 0.56 0.61 0.66 mm A1 0.18 0.20 0.22 mm A2 0.38 0.41 0.44 mm b 0.21 0.26 0.31 mm D 1.96 2.01 2.06 mm E 1.97 2.02 2.07 mm e 0.35 0.40 0.45 mm e1 - 1.6 - mm IP4352CX24_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 8 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection 9. Design and assembly recommendations 9.1 PCB design guidelines For optimum performance it is recommended to use a Non-Solder Mask PCB Design (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. For this case, refer to Table 8 for the recommended PCB design parameters. Table 8. Recommended PCB design parameters Parameter Value or specification PCB pad diameter 200 μm Micro-via diameter 100 μm (0.004 inch) Solder mask aperture diameter 370 μm Copper thickness 20 μm to 40 μm Copper finish AuNi PCB material FR4 9.2 PCB assembly guidelines for Pb-free soldering Table 9. Assembly recommendations Parameter Value or specification Solder screen aperture diameter 330 μm Solder screen thickness 100 μm (0.004 inch) Solder paste: Pb-free SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %) Solder to flux ratio 50 : 50 Solder reflow profile see Figure 8 T (°C) Treflow(peak) 250 230 cooling rate 217 pre-heat t1 t2 t3 t4 t (s) t5 001aai943 The device is capable of withstanding at least three reflows of this profile. Fig 8. IP4352CX24_2 Product data sheet Pb-free solder reflow profile All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 9 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection Table 10. Symbol Characteristics Parameter Conditions Treflow(peak) peak reflow temperature Min Typ Max Unit 230 - 260 °C t1 time 1 soak time 60 - 180 s t2 time 2 time during T ≥ 250 °C - - 30 s t3 time 3 time during T ≥ 230 °C 10 - 50 s t4 time 4 time during T > 217 °C 30 - 150 s - - 540 s cooling rate - - −6 °C/s pre-heat 2.5 - 4.0 °C/s t5 time 5 dT/dt rate of change of temperature 10. Abbreviations Table 11. Abbreviations Acronym Description DECT Digital Enhanced Cordless Telecommunications DUT Device Under Test EMI ElectroMagnetic Interference ESD ElectroStatic Discharge FR4 Flame Retard 4 NSMD Non-Solder Mask PCB Design PCB Printed-Circuit Board PCS Personal Communication System RoHS Restriction of Hazardous Substances WLCSP Wafer-Level Chip-Scale Package 11. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4352CX24_2 20100503 Product data sheet - IP4352CX24_1 Modifications: IP4352CX24_1 IP4352CX24_2 Product data sheet • • • • • Features, Applications and Legal information updated. Figure 2: Zener diode symbol added. Figure 7: Package outline changed. Table 6: updated. Section 9: Soldering information changed. 20090813 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 - © NXP B.V. 2010. All rights reserved. 10 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. IP4352CX24_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 11 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP4352CX24_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 3 May 2010 © NXP B.V. 2010. All rights reserved. 12 of 13 IP4352CX24 NXP Semiconductors 9-channel SD memory card interface filter with ESD protection 14. Contents 1 1.1 1.2 1.3 2 2.1 3 4 5 6 7 7.1 7.2 8 9 9.1 9.2 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Design and assembly recommendations . . . . 9 PCB design guidelines . . . . . . . . . . . . . . . . . . . 9 PCB assembly guidelines for Pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 3 May 2010 Document identifier: IP4352CX24_2