PHILIPS HEF4049BT-652

HEF4049B
Hex inverting buffers
Rev. 9 — 18 November 2011
Product data sheet
1. General description
The HEF4049B provides six inverting buffers with high current output capability suitable
for driving TTL or high capacitive loads. Since input voltages in excess of the buffers’
supply voltage are permitted, the buffers may also be used to convert logic levels of up to
15 V to standard TTL levels. Their guaranteed fan-out into common bipolar logic elements
is shown in Table 3.
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.
2. Features and benefits






Accepts input voltages in excess of the supply voltage
Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Specified from 40 C to +85 C
Complies with JEDEC standard JESD 13-B
3. Applications
 LOCMOS (Local Oxidation CMOS) to DTL/TTL converter
 HIGH sink current for driving two TTL loads
 HIGH-to-LOW level logic conversion
4. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +85 C.
Type number
Package
Name
Description
Version
HEF4049BP
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
HEF4049BT
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
HEF4049B
NXP Semiconductors
Hex inverting buffers
5. Functional diagram
1A
2A
3A
4A
5A
6A
3
2
5
4
7
6
9
10
11
12
14
15
1Y
2Y
3Y
4Y
5Y
input
6Y
Y
A
001aai331
Fig 1.
Logic symbol
VSS
001aae604
mna341
Fig 2.
Logic diagram for one gate
Fig 3.
Input protection circuit
6. Pinning information
6.1 Pinning
HEF4049B
VDD
1
16 n.c.
1Y
2
15 6Y
1A
3
14 6A
2Y
4
13 n.c.
2A
5
12 5Y
3Y
6
11 5A
3A
7
10 4Y
VSS
8
9
4A
001aae602
Fig 4.
Pin configuration
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
VDD
1
supply voltage
1Y to 6Y
2, 4, 6, 10, 12, 15
output
HEF4049B
Product data sheet
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Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
2 of 12
HEF4049B
NXP Semiconductors
Hex inverting buffers
Table 2.
Pin description …continued
Symbol
Pin
Description
1A to 6A
3, 5, 7, 9, 11, 14
input
VSS
8
ground supply voltage
n.c.
13, 16
not connected
7. Functional description
Table 3.
Guaranteed fan-out
Driven element
Guaranteed fan-out
Standard TTL
2
74 LS
9
74 L
16
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
supply voltage
IIK
input clamping current
VI
input voltage
IOK
output clamping current
Conditions
VI < 0.5 V or VI > VDD + 0.5 V
VO < 0.5 V or VO > VDD + 0.5 V
Min
Max
Unit
0.5
+18
V
-
10
mA
0.5
VDD + 0.5
V
-
10
mA
II/O
input/output current
-
10
mA
IDD
supply current
-
50
mA
Tstg
storage temperature
65
+150
C
Tamb
ambient temperature
40
+85
C
Ptot
total power dissipation
P
power dissipation
Tamb 40 C to +85 C
DIP16 package
[1]
-
750
mW
SO16 package
[2]
-
500
mW
-
100
mW
per output
[1]
For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.
[2]
For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VDD
Min
Typ
Max
Unit
supply voltage
3
-
15
V
VI
input voltage
0
-
VDD
V
Tamb
ambient temperature
40
-
+85
C
HEF4049B
Product data sheet
Conditions
in free air
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Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
3 of 12
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Hex inverting buffers
Table 5.
Recommended operating conditions …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
t/V
input transition rise and fall rate
VDD = 5 V
-
-
3.75
s/V
VDD = 10 V
-
-
0.5
s/V
VDD = 15 V
-
-
0.08
s/V
10. Static characteristics
Table 6.
Static characteristics
VSS = 0 V; VI = VSS or VDD unless otherwise specified.
Symbol Parameter
VIH
VIL
VOH
VOL
IOH
IOL
HIGH-level input voltage
LOW-level input voltage
HIGH-level output voltage
LOW-level output voltage
HIGH-level output current
LOW-level output current
Conditions
IO < 1 A
IO < 1 A
IO < 1 A
Tamb = 25 C
Tamb = 85 C
Min
Max
Min
Max
Min
Max
5V
3.5
-
3.5
-
3.5
-
V
10 V
7.0
-
7.0
-
7.0
-
V
15 V
11.0
-
11.0
-
11.0
-
V
5V
-
1.5
-
1.5
-
1.5
V
10 V
-
3.0
-
3.0
-
3.0
V
15 V
-
4.0
-
4.0
-
4.0
V
VDD
Tamb = 40 C
Unit
5V
4.95
-
4.95
-
4.95
-
V
10 V
9.95
-
9.95
-
9.95
-
V
15 V
14.95
-
14.95
-
14.95
-
V
5V
-
0.05
-
0.05
-
0.05
V
10 V
-
0.05
-
0.05
-
0.05
V
15 V
-
0.05
-
0.05
-
0.05
V
VO = 2.5 V
5V
-
1.7
-
1.4
-
1.1
mA
VO = 4.6 V
5V
-
0.52
-
0.44
-
0.36 mA
VO = 9.5 V
10 V
-
1.3
-
1.1
-
0.9
mA
VO = 13.5 V
15 V
-
3.6
-
3.0
-
2.4
mA
3.5
-
2.9
-
2.3
-
mA
10 V
12.0
-
10.0
-
8.0
-
mA
IO < 1 A
VO = 0.4 V
VO = 0.5 V
4.75 V
VO = 1.5 V
15 V
24.0
-
20.0
-
16.0
-
mA
II
input leakage current
VDD = 15 V
15 V
-
0.3
-
0.3
-
1.0
A
IDD
supply current
IO = 0 A
5V
-
4.0
-
4.0
-
30
A
10 V
-
8.0
-
8.0
-
60
A
15 V
-
16.0
-
16.0
-
120
A
-
-
-
7.5
-
-
pF
CI
input capacitance
HEF4049B
Product data sheet
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Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
4 of 12
HEF4049B
NXP Semiconductors
Hex inverting buffers
11. Dynamic characteristics
Table 7.
Dynamic characteristics
VSS = 0 V; CL = 50 pF; tr = tf  20 ns; Tamb = 25 C; unless otherwise specified.
Symbol
Parameter
Conditions
HIGH to LOW
propagation delay
tPHL
tPLH
nA to nY;
see Figure 5
LOW to HIGH
propagation delay
nA to nY;
see Figure 5
HIGH to LOW output
transition time
see Figure 5
VDD
Extrapolation formula
Min
Typ
Max
Unit
26 ns + (0.18 ns/pF)CL
-
35
70
ns
10 V
11 ns + (0.08 ns/pF)CL
-
15
30
ns
15 V
9 ns + (0.05 ns/pF)CL
-
12
25
ns
23 ns + (0.55 ns/pF)CL
-
50
100
ns
14 ns + (0.23 ns/pF)CL
-
25
50
ns
12 ns + (0.16 ns/pF)CL
-
20
40
ns
3 ns + (0.35 ns/pF)CL
-
20
40
ns
3 ns + (0.14 ns/pF)CL
-
10
20
ns
2 ns + (0.09 ns/pF)CL
-
7
14
ns
5V
5V
[1]
[1]
10 V
15 V
tTHL
5V
[1]
10 V
15 V
LOW to HIGH output
transition time
tTLH
[1]
see Figure 5
5V
[1]
10 ns + (1.00 ns/pF)CL
-
60
120
ns
10 V
9 ns + (0.42 ns/pF)CL
-
30
60
ns
15 V
6 ns + (0.28 ns/pF)CL
-
20
40
ns
The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).
Table 8.
Dynamic power dissipation PD
PD can be calculated from the formulas shown. VSS = 0 V; tr = tf  20 ns; Tamb = 25 C.
Symbol
PD
Parameter
dynamic power
dissipation
VDD
5V
Typical formula for PD (W)
PD = 2500  fi + (fo  CL)  VDD
where:
2
10 V
PD = 11000  fi + (fo  CL)  VDD2
15 V
PD = 35000  fi + (fo  CL)  VDD2
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VDD = supply voltage in V;
(fo  CL) = sum of the outputs.
HEF4049B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
5 of 12
HEF4049B
NXP Semiconductors
Hex inverting buffers
12. Waveforms
tr
VI
tf
90 %
input
VM
0V
10 %
tPHL
VOH
tPLH
90 %
VM
output
10 %
VOL
tTHL
tTLH
001aai336
Measurement points are given in Table 9.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 5.
Input (nA) to output (nY) propagation delays and transition times
Table 9.
Measurement points
Input
Output
VM
VI
VM
VX
VY
0.5VDD
0 V to VDD
0.5VDD
0.1VDD
0.9VDD
VDD
VI
VO
G
DUT
RT
CL
001aag182
Test data is given in Table 10.
Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
Fig 6.
Load circuitry for switching times
Table 10.
Test data
Supply voltage
5 V to 15 V
HEF4049B
Product data sheet
Input
Load
VI
VM
tr, tf
CL
VDD
0.5VI
 20 ns
50 pF
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
6 of 12
HEF4049B
NXP Semiconductors
Hex inverting buffers
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
b2
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches
0.17
0.02
0.13
0.068
0.051
0.021
0.015
0.049
0.033
0.014
0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
95-01-14
03-02-13
SOT38-4
Fig 7.
EUROPEAN
PROJECTION
Package outline SOT38-4 (DIP16)
HEF4049B
Product data sheet
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Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
7 of 12
HEF4049B
NXP Semiconductors
Hex inverting buffers
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
Fig 8.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Package outline SOT109-1 (SO16)
HEF4049B
Product data sheet
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Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
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NXP Semiconductors
Hex inverting buffers
14. Abbreviations
Table 11.
Abbreviations
Acronym
Description
DTL
Diode Transistor Logic
DUT
Device Under Test
LOCMOS
Local Oxidation CMOS
TTL
Transistor Transistor Logic
15. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
HEF4049B v.9
20111118
Product data sheet
-
HEF4049B v.8
Modifications:
•
•
Table 6: IOH minimum values changed to maximum
Table 11: Added DUT
HEF4049B v.8
20091202
Product data sheet
-
HEF4049B v.7
HEF4049B v.7
20090721
Product data sheet
-
HEF4049B v.6
HEF4049B v.6
20090325
Product data sheet
-
HEF4049B v.5
HEF4049B v.5
20081111
Product data sheet
-
HEF4049B v.4
HEF4049B v.4
20080704
Product data sheet
-
HEF4049B_CNV v.3
HEF4049B_CNV v.3
19950101
Product specification
-
HEF4049B_CNV v.2
HEF4049B_CNV v.2
19950101
Product specification
-
-
HEF4049B
Product data sheet
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Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
9 of 12
HEF4049B
NXP Semiconductors
Hex inverting buffers
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
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Notwithstanding any damages that customer might incur for any reason
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customer for the products described herein shall be limited in accordance
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malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
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therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
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NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
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Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
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Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
HEF4049B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
10 of 12
HEF4049B
NXP Semiconductors
Hex inverting buffers
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
HEF4049B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
11 of 12
HEF4049B
NXP Semiconductors
Hex inverting buffers
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 November 2011
Document identifier: HEF4049B