INTEGRATED CIRCUITS SL1 ICS31 01 I•CODE1 Label IC (97pF) Chip Specification Product Specification Revision 1.2 Public Philips Semiconductors July 2000 Product Specification SL1 ICS31 01 Rev. 1.2 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1 2.2 Life Support Applications .................................................................................................... 4 Abbreviations ........................................................................................................................ 4 3 SCOPE 5 4 ORDERING INFORMATION 5 5 FUNCTIONAL DESCRIPTION 6 5.1 Basic Features ....................................................................................................................... 6 5.2 Block Diagram of the IC....................................................................................................... 6 5.3 Memory Organisation........................................................................................................... 7 5.3.1 Serial Number................................................................................................................... 7 5.3.2 Write Access Conditions .................................................................................................. 7 5.3.3 Special Functions (EAS/QUIET)..................................................................................... 8 5.3.4 Family Code and Application Identifier........................................................................... 8 5.3.5 Configuration of delivered ICs......................................................................................... 8 6 MECHANICAL DIE SPECIFICATIONS 7 MECHANICAL WAFER SPECIFICATIONS 7.1 7.2 8 9 10 Wafer Status ........................................................................................................................ 10 Backside Treatment ............................................................................................................ 10 DOCUMENTATION 11 8.1 Delivery Documentation..................................................................................................... 11 8.2 Fail-Die Identification......................................................................................................... 11 8.2.1 Ink Dot Specification...................................................................................................... 11 8.2.2 Wafer Mapping............................................................................................................... 11 9 QUALITY ASSURANCE 12 9.1 Electrical Acceptance Test................................................................................................. 12 9.2 Visual Inspection................................................................................................................. 12 9.2.1 After Wafer Final Test.................................................................................................... 12 9.2.2 After Sawing (Film Frame Carrier)................................................................................ 12 10 PACKING 13 10.1 Storage Recommendations ................................................................................................. 13 10.2 Possible Forms of Delivery ................................................................................................. 13 10.2.1 Packing of Unsawn Wafers............................................................................................ 13 10.2.2 Packing of Sawn Wafers ................................................................................................ 13 July 2000 Page 2 of 22 Public Product Specification 11 SL1 ICS31 01 HANDLING RECOMMENDATIONS Rev. 1.2 14 11.1 Sawing .................................................................................................................................. 14 11.2 Die Attach............................................................................................................................. 14 11.3 Wire Bonding....................................................................................................................... 14 12 COIL SPECIFICATION 14 13 ELECTRICAL SPECIFICATIONS 15 14 HINTS FOR LABEL IC ENCAPSULATION 16 14.1 Protection against Visible Light......................................................................................... 16 14.2 Protection against UV Light............................................................................................... 16 14.3 Resistance to X-Rays .......................................................................................................... 16 15 INLET/LABEL CHARACTERISATION AND TEST 17 15.1 Characterisation of the Inlet/Label ................................................................................... 17 15.2 Final Test of the Inlet/Label............................................................................................... 17 16 APPENDIX A: DIE PLAN 18 17 APPENDIX B: CLUSTER PLAN 19 18 APPENDIX C: CLUSTER MAP 20 19 APPENDIX D: WAFER MAP 21 July 2000 Page 3 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 2 Definitions Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics section of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 2.1 Life Support Applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so on their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2.2 Abbreviations ASCII CRC EAN EAS EEPROM EMI ETSI FCC FFC Hex IC ISM LSB MSB MTBF PCB PCM RF rms SNR UV July 2000 American Standard Code for Information Interchange Cyclic Redundancy Check European Article Number Electronic Article Surveillance Electrically Erasable and Programmable Read Only Memory Electromagnetic Interference European Telecommunications Standards Institute Federal Communications Commission Film Frame Carrier Value in hexadecimal notation Integrated Circuit Industrial, Scientific, Medical Least Significant Bit or Byte Most Significant Bit or Byte Mean Time Between Failure Printed Circuit Board Process Control Module Radio Frequency Root Mean Square Serial Number Ultraviolet Page 4 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 3 Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs (Cres = 97 pF) on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and processing of wafers as well as assembly of labels. Reference documents: MIL-STD 883D Method 3023 MIL-STD 883D Method 3015 SNW-FQ-627 PICTOH-QS007 General Specification for 6” Wafer General Quality Specification I•CODE Label IC, Coil Design Guide This product specification is valid for mask revision: VCOL1V0 NK: O MB: B 4 Ordering Information Following ordering options are available: Type Name SL1 ICS31 01W/N5D SL1 ICS31 01U/N5D SL1 ICS31 01U/L6D July 2000 Description Sawn wafer on foil (FFC), 150 µm, inked and mapped Unsawn wafer, 150 µm, inked and mapped Unsawn wafer, 525 µm, mapped (not inked) Page 5 of 22 Ordering Code 9352 670 53005 9352 670 50025 9352 670 59025 Public Product Specification SL1 ICS31 01 Rev. 1.2 5 Functional Description 5.1 Basic Features The I•CODE1 Label IC is a dedicated chip for intelligent label applications like logistics and retail (including EAS) as well as baggage and parcel identification in airline business and mail services. The I•CODE system offers the possibility of operating labels simultaneously in the field of the reader antenna (Anticollision). It is designed for long range applications. Whenever connected to a very simple and cheap type of antenna (as a result of the 13.56 MHz carrier frequency) made out of a few windings printed, wound, etched or punched coil the I•CODE1 Label IC can be operated without line of sight up to a distance of 1.5 m (gate width). 5.2 Block Diagram of the IC The label requires no internal power supply. Its contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the reader. The interface also demodulates data that is transmitted from the reader to the I•CODE Label and modulates the electromagnetic field for data transmission from the I•CODE Label to the reader. Data is stored in a non-volatile memory (EEPROM). The EEPROM has a memory capacity of 512 bit and is organised in 16 blocks consisting of 4 bytes each (1 block = 32 bits). The higher 12 blocks contain user data and the lowest 4 blocks contain the serial number, the write access conditions and some configuration bits. July 2000 Page 6 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 5.3 Memory Organisation The 512 bit EEPROM memory is divided into 16 blocks. A block is the smallest access unit. Each block consists of 4 bytes (1 block = 32 bits). Bit 0 in each byte represents the least significant bit (LSB) and bit 7 the most significant bit (MSB), respectively. Byte 0 SNR0 SNR4 F0 x x x x x x x x x x x x x Block 0 Block 1 Block 2 Block 3 Block 4 Block 5 Block 6 Block 7 Block 8 Block 9 Block 10 Block 11 Block 12 Block 13 Block 14 Block 15 Byte 1 SNR1 SNR5 FF x x x x x x x x x x x x x Byte 2 SNR2 SNR6 FF x x x x x x x x x x x x x Byte 3 SNR3 SNR7 FF x x x x x x x x x x x x x Serial Number (lower bytes) Serial Number (higher bytes) Write Access Conditions Special Functions (EAS/QUIET) Family Code/Application Identifier/User Data User Data : : : : : : : : : User Data The values (in hexadecimal notation) shown in the table above are stored in the EEPROM after the wafer production process. The content of blocks marked with ‘x ’ in the table is not defined at delivery. 5.3.1 Serial Number The unique 64 bit serial number is stored in blocks 0 and 1 and is programmed during the production process. SNR0 in the table represents the least significant byte and SNR7 the most significant byte, respectively. 5.3.2 Write Access Conditions The Write Access Condition bits in block 2 determine the write access conditions for each of the 16 blocks. These bits can be set only to 0 (and never be changed to 1), i.e. already write protected blocks can never be written to from this moment on. This is also true for block 2. If this block is set into write protected state by clearing of bits 4 and 5 at byte 0, no further changes in write access conditions are possible. âMSB Block 2: Write Access Conditions for Block à Byte 0 LSBâ âMSB Byte 1 LSBâ âMSB Byte 2 LSBâ âMSB Byte 3 LSBâ | | | | | | | | | | | | | | | | 1|1 1|1 0|0 0|0 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 | | | | | | | | | | | | | | | | 3 2 Special Write Funct. Access 1 0 Serial Number 7 User Data 6 5 4 11 10 9 8 15 14 13 ..... ..... ..... ..... ..... ..... ..... ..... ..... ..... 12 User Data The ones in the 16 pairs of bits have to be cleared together if the corresponding block is wanted to be write protected forever (1|1 à write access enabled, 0|0 à write access disabled). Writing of bit pairs 1|0 or 0|1 to block 2 is not allowed! It is extremely important to be particularly careful when clearing the Write Access bits in block 2, as you can lose write access to all of the blocks on the label in case of a mistake. Of course you can use this feature to put the label into a hardware write protected state! July 2000 Page 7 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 5.3.3 Special Functions (EAS/QUIET) The Special Functions block holds the two EAS bits (Electronic Article Surveillance mode active à the label answers at an EAS command) as well as the two QUIET bits (QUIET mode enabled à the label is permanently disabled but can be activated again with the ‘Reset QUIET bit’ command). The state of QUIET mode does not influence the functionality of the EAS command. The remaining 28 bits (greyed ‘x’ in the following figure) are reserved for future use. âMSB Byte 0 Byte 2 Byte 3 | | | | | | | | | | | | | | | | x|x x|x q|q e|e x|x x|x x|x x|x x|x x|x x|x x|x x|x x|x x|x x|x | | | | | | | | | | | | | | | | Block 3: Special Functions Quiet Quiet: EAS: Byte 1 LSBâ EAS q|q = 1|1 à QUIET mode enabled e|e = 1|1 à EAS mode enabled q|q = 0|0 à QUIET mode disabled e|e = 0|0 à EAS mode disabled Writing of bit pairs 1|0 or 0|1 to block 3 is not allowed! Changing of the Write Access Control or Configuration must be done in secure environment (by reading the current value of the block and masking in the new values for bit positions that may be changed). The label must not be moved out of the communication field of the antenna during writing! We recommend to put the label close to the antenna and not to remove it during operation. 5.3.4 Family Code and Application Identifier The I•CODE system offers the feature to use (independently) Family Codes and/or Application Identifiers with some reader commands (this allows for example the creation of ‘label families’). These two 8-bit values are located at the beginning of User Data (block 4) as shown in the following figure and are only evaluated if the corresponding bytes at the reader commands are unequal to zero. Only if both corresponding parameter bytes at the reader commands Anticollision/Select, EAS and Unselected Read, respectively, are set to zero, block 4 can be used for user data without restriction. âMSB Byte 0 LSBâ âMSB Byte 1 Byte 2 Byte 3 LSBâ | | | | | | | | | | | | | | | | x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x | | | | | | | | | | | | | | | | Family Code Application ID The greyed bytes are for customer usage as well as the remaining blocks (5 to 15) are. Block 4: Family Code, Application ID 5.3.5 Configuration of delivered ICs I•CODE1 Label ICs are delivered with the following configuration by Philips: • • • • • • Serial number is unique and read only Write Access Conditions allow to change all blocks (with the exception of both serial number blocks) Status of EAS mode is not defined Status of QUIET mode is not defined Family Code and Application Identifier are not defined User Data memory is not defined As the status of QUIET mode is not defined at delivery, the first command to be executed on the I•CODE1 Label IC should be the Reset QUIET Bit command! July 2000 Page 8 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 6 Mechanical Die Specifications Designation: VCOL1V0 visible on each die location see attached die plan Bond pad location: see attached die plan Bond pad size: Test pad size: LA, LB TEST, VSS 130 µm x 150 µm 90 µm x 90 µm (the test pads are electrically neutral at sawn wafers) Bond pad metallisation material: AlSiCu Metallisation thickness: 1.4 µm Die dimensions (incl. 80 µm scribe line) : Die dimensions (excl. scribe line) : Tolerances for sawn dies: 1460 µm x 1490 µm 1380 µm x 1410 µm ± 25 µm Pin identification: see attached die plan Passivation attributes: The passivation is a protection of active areas against dust (particles) and humidity and general contamination (whole surface of the chip except for the bond pads). Top side passivation material: Passivation thickness: Oxynitride 1.6 µm Due to the glass-like physical properties careful handling and processing is required. July 2000 Page 9 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 7 Mechanical Wafer Specifications For further information as described in the following chapters please refer to the following Philips documents: • Dicing Guidelines for Thin Wafers (< 200 µm) • General Specification for 6” Wafer In case of doubt or inconsistency with the following chapters the above mentioned specifications are applicable. Designation: each wafer is laser scribed with batch and wafer number Wafer diameter: 150 mm (6") ± 0.3 mm Die separation lane width: 80 µm (Scribe line) Electrical connection of substrate: VSS Geometrically complete dies per wafer: approx. 7400 Orientation of dies relat. to wafer flat: see attached cluster map Position of test structures: see attached cluster map Wafer layout: see attached cluster map Batch size: 24 wafers Process: 6C15 IDFW 7.1 Wafer Status • Tested, unsawn • Tested, sawn on FFC Minimum yield per lot: 30 % 7.2 Backside Treatment Wafers can be delivered with a thickness of 525 µm (untreated) or with 150 µm ± 15 µm (approx. 6 mil) and have a ground and etched backside. July 2000 Page 10 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 8 Documentation 8.1 Delivery Documentation Each wafer container and each larger shipment container is individually marked with the identification information as follows: • • • • • Diffusion Batch number (wafer lot number) Part designation (type) with revision number Ordering code (see chapter 4) Date code of lot acceptation Good die quantity The print out of the final test results is attached to the packing and contains the good die quantity related to every wafer number. 8.2 Fail-Die Identification Every die is electrically tested according to data sheet. Identification of chips, which do not confirm with the electrical parameters of the data sheet is done by inking and/or wafer mapping (all dies at wafer periphery are identified by ‘FAIL’). 8.2.1 Ink Dot Specification Diameter: Height: Colour: Position: Attributes: min. 0.4 mm max. 20 µm black central third of die (x, y direction) opaque, water resistant NOTE: Uncompleted dies with an area < 95 % (wafer periphery) are not inked! 8.2.2 Wafer Mapping Wafer mapping for failed die identification is available on Floppy-Disk. Format: Electroglas ESC–ASCEND on 3.5″ Floppy-Disk NOTE: The wafer map refers to unsawn wafers. At sawn wafers (on FFC) additional ICs might be inked (marked as fail) if damaged during the sawing process (compared to wafer map)! See Appendix D for an example of the wafer map. July 2000 Page 11 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 9 Quality Assurance 9.1 Electrical Acceptance Test The electrical acceptance test is performed in line (‘sampling on the fly’) according to the test specifications. Sampling plan: according General Quality Specification 9.2 Visual Inspection 9.2.1 After Wafer Final Test Performed according document SNW-FQ-627. Sampling plan: according General Quality Specification 9.2.2 After Sawing (Film Frame Carrier) Performed according document PICTOH-QS007. Sampling plan (3 wafers per lot): July 2000 accept 0/3 Page 12 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 10 Packing The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips ‘General Specification for 6” Wafer’. 10.1 Storage Recommendations Unsawn/sawn wafers should be kept in their original packing whilst in storage. Recommended storage conditions: Temperature: Climate atmosphere: Duration of storage: 15 ... 25 °C 40 ... 60 % r.h. or dried N2 (only unsawn wafers!) max. 6 months Deviating requirements have to be arranged between customer and Philips Semiconductors. 10.2 Possible Forms of Delivery 10.2.1 Packing of Unsawn Wafers Delivery form: wafer box 10.2.2 Packing of Sawn Wafers Delivery form: Foil thickness: Foil material: July 2000 Film Frame Carrier (standard Philips carrier type P7) 0.55 ... 0.85 mm sticky foil Page 13 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 11 Handling Recommendations Please refer to Philips ‘General Specification for 6” Wafer’ for the following items: 11.1 Sawing 11.2 Die Attach 11.3 Wire Bonding 12 Coil Specification The I•CODE1 Label IC has to be connected at pads LA, LB to a coil characterised by its electrical parameters according to Philips application note ‘I•CODE Label IC, Coil Design Guide’. July 2000 Page 14 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 13 Electrical Specifications ABSOLUTE MAXIMUM RATINGS 1, 2 SYMBOL Tstg Tj VESD TEST CONDITIONS PARAMETER Storage Temperature Range Junction Temperature RATING UNIT - 55 to +140 - 55 to +140 °C °C ±2 kV peak MIL-STD-883D, Method 3015.7, Human Body Model ESD Voltage Immunity 3 Imax LA-LB Maximum Input Peak Current mApeak ± 80 NOTES: 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. 2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. 3. At 13.56 MHz, including current via resonance capacitor. OPERATING CONDITIONS SYMBOL TEST CONDITIONS PARAMETER Tamb Tj op ILA-LB Operating Ambient Temperature Operating Junction Temperature 2 Input Current 3 Minimum Supply Voltage VLA-LB rd for READ/EAS 3 Minimum Supply Voltage VLA-LB w r for WRITE 3 Minimum Supply Voltage VLA-LB fm for READ/EAS/WRITE MIN TYP 1 - 25 - 25 MAX UNIT + 70 50 °C °C mArms + 85 Standard Mode ± 3.1 ± 3.7 Vpeak Standard Mode ± 3.6 ± 4.1 Vpeak Fast Mode ± 5.2 ± 6.5 Vpeak 4 fop Operating Frequency 13.553 13.560 13.567 NOTES: 1. Typical ratings are not guaranteed. These values listed are at room temperature. 2. Including current via resonance capacitor. 3. The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter ILA-LB). 4. Bandwidth limitation (±7 kHz) according to ISM band regulations. MHz ELECTRICAL CHARACTERISTICS Tamb = - 25 to +70 °C SYMBOL Cres Pmin PARAMETER 2 tD R mod tret Input Capacitance between LA - LB 3 Minimum Operating Supply Power Minimum Modulation of RF Voltage for Demodulator Response Maximum Modulation of RF Voltage for Demodulator Response Modulation Pulse Length 4 of RF Voltage Modulation Start-Pulse Length 4 of RF Voltage Demodulator Response Time Modulator ON Resistance EEPROM Data Retention nwrite EEPROM Write Endurance mmin mmax tP sm tP fm TEST CONDITIONS VLA-LB = 2 Vrms VLA-LB = 2 Vrms Vmax - Vmin m = Vmax + Vmin Vmax - Vmin m = Vmax + Vmin Standard Mode, m ≥ 10 % Fast Mode, m ≥ 10 % m ≥ 10 % Tamb ≤ 55 °C MIN TYP 92 1 MAX UNIT 97 450 102 pF µW 10 14 % 30 % 5 3.54 5.31 15.34 0.1 50 10 100 000 9.44 µs 17.11 20.06 µs 0.8 115 2.4 250 µs Ω Years 5 Cycles NOTES: 1. Typical ratings are not guaranteed. These values listed are at room temperature. 2. Measured with an HP4285A LCR meter at 13.56 MHz. 3. Including losses in resonant capacitor and rectifier. 4. The given values are derived from the 13.56 MHz system frequency. 5. Recommended values for pulse duration generated at the read/write device. July 2000 Page 15 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 14 Hints for Label IC Encapsulation 14.1 Protection against Visible Light As a result of the ultra low power design of the I•CODE1 Label IC some analogue circuits on the chip are light sensitive. This means that common sun light can impact the operation of the label if the chip is not protected against visible light radiation. Measurements have shown that a radiation of Emax = 60 W/m2 (spectrum: 400 to 1000 nm) causes a reduced operating range of the plain chip. Measurements of direct sunlight in summer deliver values up to 260 W/m2 . To ensure proper operation an expected minimum radiation reduction factor of approx. 9 (2 x 260/60 = 8.7) must be provided by the encapsulation. That means special care has to be taken to ensure a sufficient light protection of the I•CODE1 Label IC (e.g. non translucent encapsulation or underfiller, ...) according to application requirements. 14.2 Protection against UV Light An EEPROM memory, as it is also used in the I•CODE1 Label IC, has some principle sensitivity to UV light (applies to EEPROM-technology in general). Thus strong UV exposure in the production of inlets/labels has to be avoided. UV protection has to be ensured using appropriate assembly methods. 14.3 Resistance to X-Rays X-ray exposure on comparable Philips ICs (with even smaller feature size) caused neither a long term influence on the behaviour of the ICs nor on the data retention of the EEPROMs. July 2000 Page 16 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 15 Inlet/Label Characterisation and Test 15.1 Characterisation of the Inlet/Label The parameters recommended to be characterised for the inlet/label are: Parameter Symbol Threshold field strength for UNSELECTED READ command (standard mode) HTRead Threshold resonance frequency fRT Conditions UNSELECTED READ command OK Resonance frequency @ HTRead No command transmitted to the inlet/label à Label generates no response à No modulation Threshold field strength for WRITE command (standard mode) HTWrite WRITE (and Verifying READ) command OK For more detailed information on inlet /label characterisation please refer to Philips application note ‘I•CODE Label IC, Coil Design Guide’. 15.2 Final Test of the Inlet/Label Basic flow for production and test: 1. 2. 3. 4. 5. 6. 7. Production of wafer Testing of dies on wafer Writing of serial numbers and pre-configuration Sawing of wafer Assembly of inlets/labels Final test of inlets/labels Writing of customer data To detect damage of EEPROM cells during production of inlets/labels a final test of the EEPROM after assembly of the inlet/label is recommended. This is necessary to achieve lowest failure rates. July 2000 Page 17 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 16 Appendix A: Die Plan Measuring unit: µm The two test pads (TEST and VSS) are electrically neutral at sawn wafers! July 2000 Page 18 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 17 Appendix B: Cluster Plan Measuring unit: mm July 2000 Page 19 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 18 Appendix C: Cluster Map The three black lines show the position of the PCM structures on the 6 inch wafer! July 2000 Page 20 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 19 Appendix D: Wafer Map The following screenshot shows an example of a wafer map: Map file of this example: ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE COPYRIGHT ASCEND LOT 09397 DEVICE VCOL1HE2 PRODUCT VCOL\4020 WAFER 05 READER 09397-05-B6 XSTEP 575 UNITS (0.1)MIL YSTEP 587 UNITS (0.1)MIL XREF 16891 UNITS (0.1)MIL YREF -261 UNITS (0.1)MIL XDELTA 0 YDELTA 0 FLAT 0 XFRST 21 YFRST 50 PRQUAD 1 COQUAD 1 DIAM 6000 UNITS MIL DATE 2000-01-23 TIME 15:30:00 OPERATOR 4020 SETUP FILE M:\SET\VCOL1HE2.SET TEST SYSTEM SYS VCOL\4020 TEST DATA PROBE CARD PC PROBER PIWP105 July 2000 : : ### shortening of the file ### : : X40Y3 3 0 X41Y3 5 1 X42Y3 5 1 X43Y3 5 1 X44Y3 5 1 X45Y3 5 1 X46Y3 5 1 X47Y3 2 0 X48Y3 2 0 X49Y3 2 0 X50Y3 5 1 X51Y3 5 1 X52Y3 5 1 X53Y3 5 1 X54Y3 5 1 : : ### shortening of the file ### : : EDATE ETIME Page 21 of 22 Public Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, North Ryde, NSW 2113, Tel. +61 2 9805-4455, Fax. +61 9 9805-4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, P.O. Box 3409, Sunnyvale, CA 94088-3409, Tel. +800 234 7381, Fax. +800 943 0087 Malaysia : 76 Jalan Universiti, 46200 Petaling Jaya, Selangor, Tel. +60 3 757 5214, Fax. +60 3 757-4880 Uruguay: see South America Mexico: Philips Components, El Paso, Texas, Tel. +1 915 772-4020 Vietnam: see Singapore Middle East : see Italy Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Published by: Philips Semiconductors Gratkorn GmbH, Mikron-Weg 1, A-8101 Gratkorn, Austria, Fax: +43 3124 299 270 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax: +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Royal Philips Electronics N.V. 2000 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.