XS ON 9 IP4285CZ9-TBB ESD protection for high-speed interfaces Rev. 1 — 27 May 2011 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as High-Definition Multimedia Interface (HDMI), DisplayPort, USB, external Serial Advanced Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces against ElectroStatic Discharge (ESD). The device includes high-level ESD protection diodes for high-speed signal lines in a 4-channel 0.4 mm pitch XSON9 package. The extremely small package dimensions make this product ideally suitable for portable devices. The pinout is designed for convenient flow-through routing of high-speed signal lines. All signal lines are protected by a special diode configuration offering ultra low line capacitance of 0.85 pF maximum. These diodes provide protection to downstream components from ESD voltages up to 12 kV contact according to IEC 61000-4-2, level 4. 1.2 Features and benefits Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) System ESD protection for USB 2.0, HDMI 1.3 and HDMI 1.4, DisplayPort, eSATA and LVDS All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of 12 kV according to IEC 61000-4-2, level 4 Matched 0.4 mm trace spacing Signal lines with 0.05 pF matching capacitance between signal pairs Line capacitance of 0.85 pF maximum for each channel 4-channel, XSON9 Pb-free package Design-friendly ’flow-through’ signal routing 1.3 Applications The device is designed for high-speed receiver and transmitter port protection: Portable devices Mobile handsets TVs, monitors DVD recorders and players Notebooks, mother boards, graphic cards and ports Set-top boxes and game consoles IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 2. Pinning information Table 1. Pinning Pin Symbol Description Simplified outline 1 CH1 channel 1 ESD protection 2 CH2 channel 2 ESD protection 9 8 3 GND ground 1 2 4 CH3 channel 3 ESD protection 5 CH4 channel 4 ESD protection 6 n.c. not connected 7 n.c. not connected 8 n.c. not connected 9 n.c. not connected Graphic symbol 7 6 4 5 1 2 4 5 3 Transparent top view 3 018aaa116 3. Ordering information Table 2. Ordering information Type number IP4285CZ9-TBB Package Name Description Version XSON9 plastic extremely thin small outline package; no leads; 9 terminals; body 1 2.1 0.5 mm SOT1178-1 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VI input voltage VESD electrostatic discharge voltage Product data sheet Min Max Unit 0.5 +5.5 V 12 kV IEC 61000-4-2, level 4 contact discharge [1] - air discharge [1] - 18 kV Tamb ambient temperature 40 +85 C Tstg storage temperature 55 +125 C [1] IP4285CZ9-TBB Conditions All pins to ground. All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 © NXP B.V. 2011. All rights reserved. 2 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 5. Characteristics Table 4. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VBRzd Zener diode breakdown voltage Itest = 1 mA 6 - 9 V ILRzd Zener diode reverse leakage current per TMDS channel; VI = 5.0 V - - 1 A VF forward voltage - 0.7 - V - - 0.85 pF Cch(TMDS) TMDS channel capacitance f = 1 MHz [1] Vbias = 0 V Vbias = 2.5 V - - 0.75 pF - - 0.1 pF - - 0.25 pF positive transient - 0.42 - negative transient - 0.33 - - 4.2 - V Cch(TMDS) TMDS channel capacitance difference f = 1 MHz; Vbias = 2.5 V [1] Cch(mutual) mutual channel capacitance f = 1 MHz; Vbias = 2.5 V [1][2] Rdyn dynamic resistance IPP = 1 A VCL(ch)trt(pos) positive transient channel IPP = 4 A clamping voltage IP4285CZ9-TBB Product data sheet [1] This parameter is guaranteed by design. [2] Between signal pin and pin n.c. [3] According to IEC 61000-4-5 and IEC 61000-4-9. All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 [3] [3] © NXP B.V. 2011. All rights reserved. 3 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 018aaa117 1 S21 (dB) S21 (dB) (1) (2) 018aaa118 0 –1 –20 –3 –40 (1) (2) (3) –5 –60 (4) (3) (4) –7 10–1 1 102 10 103 104 f (MHz) –80 10–1 1 (1) Pin 1 (1) Pin 1 to 2 (2) Pin 2 (2) Pin 2 to 4 (3) Pin 4 (3) Pin 2 to 5 (4) Pin 5 (4) Pin 1 to 5 Fig 1. Insertion loss Fig 2. 018aaa119 1.1 10 102 103 104 f (MHz) Crosstalk 018aaa120 5 a VCL (V) 1.0 4 0.9 3 0.8 2 0.7 1 0.6 0 0 1 2 3 4 5 0 1 2 3 Vbias (V) 4 5 I (A) IEC 61000-4-5; tp = 8/20 s C ch TMDS a = ------------------------------------------C ch TMDS 0V bias Fig 3. Line capacitance as a function of bias voltage; typical values IP4285CZ9-TBB Product data sheet Fig 4. Dynamic resistance with negative clamping All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 © NXP B.V. 2011. All rights reserved. 4 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 018aaa121 100 018aaa122 150 VCL (V) VCL (V) 50 50 (1) (1) (2) (2) 0 –50 –50 –100 –50 0 50 100 150 200 250 t (ns) 300 –150 –50 0 (1) +8 kV (1) +12 kV (2) 8 kV (2) 12 kV Fig 5. Clamped 8 kV ESD pulse waveform (IEC 61000-4-2 network) IP4285CZ9-TBB Product data sheet Fig 6. 100 150 200 250 t (ns) 300 Clamped 12 kV ESD pulse waveform (IEC 61000-4-2 network) All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 50 © NXP B.V. 2011. All rights reserved. 5 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 001aao035 HDMI input signal 1280 720p; pixel clock = 74.25 MHz Vertical scale = 200 mV/div Horizontal scale = 270 ps/div Fig 7. HDMI eye diagram with IP4285CZ9-TBB (720p) 001aao034 HDMI input signal 1920 1080p; pixel clock = 222.75 MHz Vertical scale = 200 mV/div Horizontal scale = 90 ps/div Fig 8. IP4285CZ9-TBB Product data sheet HDMI eye diagram with IP4285CZ9-TBB (1080p) All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 © NXP B.V. 2011. All rights reserved. 6 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 6. Application information The device is designed to provide high-level ESD protection for high-speed serial data buses such as HDMI, DisplayPort, eSATA and LVDS data lines. When designing the Printed-Circuit Board (PCB), careful consideration should be given to basic high-speed routing guidelines, impedance matching, and signal coupling. Signal pins 1 and 2 (4 and 5) can be laid out through not connected pins 9 and 8 (6 and 7) respectively to avoid the need for vias and stubs. Basic application diagrams for the ESD protection of an HDMI interface are shown in Figure 9. IP4285CZ9-TBB TMDS_D2+ 5 4 TMDS_CH2+ TMDS_GND TMDS_CH2– TMDS_D2– GND 3 TMDS_D1+ 2 1 TMDS_CH1+ TMDS_GND TMDS_CH1– TMDS_D1– IP4285CZ9-TBB TMDS_D0+ 5 TMDS_CH2+ TMDS_GND 4 TMDS_CH2– TMDS_D0– GND 3 TMDS_CLK+ 2 1 TMDS_CH1+ HDMI CONNECTOR TMDS_GND TMDS_CH1– TMDS_CLK– CEC n.c. DDC_CLK DDC_DAT GND +5 V HOT PLUG DETECTION 6 5 4 IP4221CZ6 1 Fig 9. IP4285CZ9-TBB Product data sheet 2 100 nF 3 018aaa123 Application diagram of HDMI ESD protection using IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 © NXP B.V. 2011. All rights reserved. 7 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 7. Package outline XSON9: plastic extremely thin small outline package; no leads 9 terminals; body 1 x 2.1 x 0.5 mm SOT1178-1 X A B D A E A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 3 5 C C A B C v w b y1 C y L k 9 6 0 0.5 scale Dimensions Unit(1) max nom min mm 1 mm A 0.5 A1 b c D 0.05 0.25 2.2 0.20 0.127 2.1 0.00 0.15 2.0 E e 1.1 1.0 0.9 e1 0.4 k L v 0.1 0.2 0.43 0.38 0.33 1.6 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1178-1 --- --- --- sot1178-1_po European projection Issue date 10-06-02 10-06-03 Fig 10. Package outline SOT1178-1 (XSON9) IP4285CZ9-TBB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 © NXP B.V. 2011. All rights reserved. 8 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 8. Abbreviations Table 5. IP4285CZ9-TBB Product data sheet Abbreviations Acronym Description TMDS Transition Minimized Differential Signaling All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 © NXP B.V. 2011. All rights reserved. 9 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 9. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4285CZ9-TBB v.1 20110527 Product data sheet - - IP4285CZ9-TBB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 © NXP B.V. 2011. All rights reserved. 10 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 10.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. IP4285CZ9-TBB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 © NXP B.V. 2011. All rights reserved. 11 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP4285CZ9-TBB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 27 May 2011 © NXP B.V. 2011. All rights reserved. 12 of 13 IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 May 2011 Document identifier: IP4285CZ9-TBB