ISP1107 Advanced Universal Serial Bus transceiver Rev. 01 — 23 February 2000 Objective specification 1. General description The ISP1107 is a Universal Serial Bus (USB) transceiver that is fully compliant with the Universal Serial Bus Specification Rev. 1.1. It is ideal for portable electronics devices such as mobile phones, digital still cameras and personal digital assistants. It allows 1.8 V, 2.5 V and 3.3 V USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) to interface with the physical layer of the Universal Serial Bus. It has an integrated 5 V to 3.3 V voltage regulator allowing direct powering from the USB supply VBUS. The ISP1107 can be used as a USB device transceiver or a USB host transceiver. It can transmit and receive serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates. The ISP1107 is compatible with the industry-standard Philips Semiconductors USB transceiver PDIUSBP11A. 2. Features c c ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Complies with Universal Serial Bus Specification Rev. 1.1 Integrated 5 V to 3.3 V voltage regulator allowing direct powering from USB VBUS Used as a USB device transceiver or a USB host transceiver Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates Slew-rate controlled differential data driver Differential input receiver with wide common-mode range and very high input sensitivity Stable RCV output during SE0 condition Two single-ended receivers with hysteresis Low-power operation Three I/O voltage levels: 1.8 V, 2.5 V and 3.3 V Backward compatible with PDIUSBP11A Higher than 8 kV ESD protection Full industrial operating temperature range −40 to +85 °C Available in small TSSOP16 and BCC16 packages. ISP1107 Philips Semiconductors Advanced USB transceiver 3. Applications ■ Portable electronic devices, such as ◆ mobile phones ◆ digital still cameras ◆ personal digital assistants (PDA) ◆ Internet appliances (IA). 4. Ordering information Table 1: Ordering information Type number Package Name Description Version ISP1107xx BCC16 [1] plastic bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm SOTxxx ISP1107DH TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 [1] In development. 5. Functional diagram handbook, full pagewidth 3.3 V V CC(I/O) VOLTAGE REGULATOR VCC(5.0) Vreg(3.3) Vpu(3.3) SOFTCON 1.5 kΩ(2) OE FSE0 D+ 33 Ω(1) (1%) D− 33 Ω(1) (1%) VO SUSPND RCV LEVEL SHIFTER VP VM ISP1107 MGS962 GND (1) Use a 39 Ω resistor (1%) for a USB v2.0 compliant output impedance range. (2) Connect to D− for low-speed operation. Fig 1. Functional diagram. © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 2 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver 6. Pinning information 6.1 Pinning fpage Vpu(3.3) 1 16 VCC(5.0) SOFTCON 2 15 Vreg(3.3) OE 3 14 FSE0 RCV 4 13 VO ISP1107DH VP 5 12 D+ VM 6 11 D− SUSPND 7 10 SPEED GND 8 9 V CC(I/O) MGS961 Fig 2. Pinning diagram BCC16 (to be added). Fig 3. Pinning diagram TSSOP16. 6.2 Pin description Table 2: Pin description Symbol Pin Type Description Vpu(3.3) 1 - pull-up supply voltage (3.3 V ± 10%); used to connect an external 1.5 kΩ resistor on D+ (full-speed) or D− (low-speed); pin function is controlled by input SOFTCON: SOFTCON = LOW — Vpu(3.3) floating (high impedance) SOFTCON = HIGH — Vpu(3.3) = 3.3 V SOFTCON 2 I software controlled USB connection input; a HIGH level applies 3.3 V to pin Vpu(3.3), which is connected to an external 1.5 kΩ pull-up resistor; this allows USB connect/disconnect signalling to be controlled by software OE 3 I output enable input (CMOS level re. VCC(I/O), active LOW); enables the transceiver to transmit data on the USB bus RCV 4 O differential data receiver output (CMOS level re. VCC(I/O)); driven LOW when input SUSPND is HIGH; the output state of RCV is preserved and stable during an SE0 condition VP 5 O single-ended D+ receiver output (CMOS level re. VCC(I/O)); used for external detection of single-ended zero (SE0), error conditions, speed of connected device; driven HIGH when VCC(5.0)/Vreg(3.3) are not connected to any voltage supply VM 6 O single-ended D− receiver output (CMOS level re. VCC(I/O)); used for external detection of single-ended zero (SE0), error conditions, speed of connected device; driven HIGH when no supply voltage is connected to VCC(5.0) or Vreg(3.3) SUSPND 7 I suspend input (CMOS level re. VCC(I/O)); a HIGH level enables low-power state while the USB bus is inactive and drives output RCV to a LOW level © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 3 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver Table 2: Pin description…continued Symbol Pin Type Description GND 8 - ground supply VCC(I/O) 9 - supply voltage for digital I/O pins (1.65 to 3.6 V). Three voltage levels are supported: 1.8 V ± 0.15 V, 2.5 V ± 0.2 V and 3.3 V ± 0.3V; when VCC(I/O) is not connected, the D+/D− pins are in three-state SPEED 10 I speed selection input (CMOS level re. VCC(I/O)); adjusts the slew rate of differential data outputs D+ and D− according to the transmission speed: LOW: low-speed (1.5 Mbit/s) HIGH: full-speed (12 Mbit/s) D− 11 AI/O negative USB data bus connection (analog, differential); for low-speed mode connect to pin Vpu(3.3) via a 1.5 kΩ resistor D+ 12 AI/O positive USB data bus connection (analog, differential); for full-speed mode connect to pin Vpu(3.3) via a 1.5 kΩ resistor VO 13 I differential driver data input (CMOS level re. VCC(I/O), Schmitt trigger); see Table 4 FSE0 14 I differential driver data input (CMOS level re. VCC(I/O), Schmitt trigger); see Table 4 Vreg(3.3) 15 - regulated supply voltage output (3.0 to 3.6 V) during 5 V operation; used as supply voltage input for 3.3 V operation (3.3 V ± 10%) VCC(5.0) 16 - supply voltage for 5 V operation (4.0 to 5.5 V); can be connected directly to USB supply VBUS; connect this pin to Vreg(3.3) during 3.3 V operation 7. Functional description 7.1 Function selection Table 3: Function table SUSPND OE D+/D− RCV VP/VM Function L L driving & receiving active active normal driving (differential receiver active) L H receiving [1] active active receiving active driving during ‘suspend’ [3] (differential receiver inactive) active low-power state [1] [2] [3] H L driving inactive [2] H H high-Z [1] inactive [2] Signal levels on D+/D− are determined by other USB devices and external pull-up/down resistors. In ‘suspend’ mode (SUSPND = HIGH) the differential receiver is inactive and output RCV is always LOW. Out-of-suspend (‘K’) signalling is detected via the single-ended receivers VP and VM. During suspend, the slew-rate control circuit of low-speed operation is disabled. The D+/D− are still driven to their intended states, without slew-rate control. This is permitted because driving during suspend is used to signal remote wakeup by driving a ‘K’ signal (one transition from idle to ‘K’ state) for a period of 1 to 15 ms. © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 4 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver 7.2 Operating functions Table 4: Driving function (OE = L) FSE0 VO Data L L differential logic 0 L H differential logic 1 H L SE0 H H SE0 Receiving function (OE = H) Table 5: [1] D+/D− RCV VP VM differential logic 0 L L H differential logic 1 H H L SE0 RCV* [1] L L RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is kept stable during the SE0 period. 7.3 Power supply configurations The ISP1107 can be used with different power supply configurations, which can be changed dynamically. An overview is given in Table 6. Normal mode — Both VCC(I/O) and VCC(5.0)/Vreg(3.3) are connected. For 5 V operation, VCC(5.0) is connected to a 5 V source (4.0 to 5.5 V). The internal voltage regulator then produces 3.3 V for the USB connections. For 3.3 V operation, both VCC(5.0) and Vreg(3.3) are connected to a 3.3 V source (3.0 - 3.6 V). VCC(I/O) is independently connected to a 1.8 V, 2.5 V or 3.3 V source, depending on the supply voltage of the external circuit. Disable mode — VCC(I/O) is not connected, VCC(5.0)/Vreg(3.3) are connected. In this mode, the ISP1107’s internal circuits ensure that the D+/D− pins are in three-state and the power consumption drops to the low-power (suspended) state level. Sharing mode — VCC(I/O) is connected, VCC(5.0)/Vreg(3.3) are not connected. In this mode, the D+/D− pins are made three-state and the ISP1107 allows external signals of up to 3.6 V to share the D+/D− lines. The ISP1107’s internal circuits ensure that virtually no current is drawn via the D+/D− lines. The power consumption through pin VCC(I/O) drops to the low-power (suspended) state level. Both the VP and VM pins are driven HIGH to indicate this mode. Table 6: Power supply configuration overview VCC(5.0)/Vreg(3.3) VCC(I/O) Configuration Special characteristics connected connected Normal mode - connected not connected Disable mode D+/D− high impedance not connected connected Sharing mode D+/D− are high impedance; VP/VM are driven HIGH © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 5 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver 8. Limiting values Table 7: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC(5.0) Conditions Min Max Unit supply voltage −0.5 +6.0 V VCC(I/O) I/O supply voltage −0.5 +4.6 V Vreg(3.3) regulated supply voltage −0.5 +4.6 V VI DC input voltage −0.5 VCC(I/O) + 0.5 V Ilatchup latchup current - 100 mA pins D+, D− - ±8000 V other pins - ±2000 V −40 +125 °C Vesd ILI < 1 µA storage temperature Tstg [1] electrostatic discharge VI = −1.8 to 5.4 V voltage [1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model). Table 8: Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit VCC(5.0) supply voltage 5 V operation 4.0 5.0 5.5 V VCC(I/O) I/O supply voltage 1.65 - 3.6 V Vreg(3.3) regulated supply voltage 3.0 3.3 3.6 V 3.3 V operation VI input voltage 0 - VCC(I/O) V VI(AI/O) input voltage on analog I/O pins (D+/D−) 0 - 3.6 V Tamb operating ambient temperature −40 - +85 °C © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 6 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver 9. Static characteristics Table 9: Static characteristics: supply pins VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Vreg(3.3) Parameter regulated supply voltage Conditions Min Typ Max Unit unloaded 3.0 [1] 3.3 3.6 V - 6 10 [2] mA ICC operating supply current full-speed transmitting and receiving at 12 Mbit/s; CL = 50 pF on D+/D− ICC(idle) supply current during full-speed idle and SE0 full-speed idle: D+ > 2.7 V, D− < 0.3 V; SE0: D+ < 0.3 V, D− < 0.3 V [3] - - 500 µA ICC(susp) suspend supply current SUSPND = HIGH [3] - - 20 µA ICC(dis) disable mode supply current VCC(I/O) not connected [3] - - 20 µA - 0.3 1 [2] mA ICC(I/O) operating I/O supply current full-speed transmitting and receiving at 12 Mbit/s ICC(I/O)(static) static I/O supply current full-speed idle, SE0 or suspend ICC(I/O)(sharing) sharing mode I/O supply current VCC(5.0)/Vreg(3.3) not connected [3] IDx(sharing) VCC(5.0)/Vreg(3.3) not connected; SOFTCON = LOW; VDx = 3.6 V [3] [1] [2] [3] sharing mode load current on pins D+ and D− - - 10 µA - - 10 µA - - 5 µA In ‘suspend’ mode, the minimum voltage is 2.7 V. Characterized only, not tested in production. Excluding Vpu(3.3) source current to 1.5 kΩ and 15 kΩ pull-up and pull-down resistors (200 µA typ.). Table 10: Static characteristics: digital pins VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC(I/O) = 1.65 to 3.6 V Input levels VIL LOW-level input voltage - - 0.3VCC(I/O) V VIH HIGH-level input voltage 0.6VCC(I/O) - - V Output levels VOL LOW-level output voltage VOH HIGH-level output voltage IOL = 100 µA - - 0.15 V IOL = 4 mA - - 0.4 V IOH = 100 µA VCC(I/O) − 0.15 - - V IOH = 4 mA VCC(I/O) − 0.4 - - V - - ±1 µA Leakage current ILI input leakage current VCC(I/O) = 1.8 V ± 0.15 V Input levels VIL LOW-level input voltage - - 0.5 V VIH HIGH-level input voltage 1.2 - - V © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 7 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver Table 10: Static characteristics: digital pins…continued VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IOL = 100 µA - - 0.15 V Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 4 mA - - 0.4 V IOH = 100 µA 1.5 - - V IOH = 4 mA 1.25 - - V VCC(I/O) = 2.5 V ± 0.2 V) Input levels VIL LOW-level input voltage - - 0.7 V VIH HIGH-level input voltage 1.7 - - V Output levels VOL LOW-level output voltage VOH HIGH-level output voltage IOL = 100 µA - - 0.15 V IOL = 4 mA - - 0.4 V IOH = 100 µA 2.15 - - V IOH = 4 mA 1.9 - - V VCC(I/O) = 3.3 V ± 0.3 V Input levels VIL LOW-level input voltage - - 0.9 V VIH HIGH-level input voltage 2.15 - - V IOL = 100 µA - - 0.2 V IOL = 4 mA - - 0.4 V IOH = 100 µA 2.85 - - V IOH = 4 mA 2.6 - - V Output levels VOL LOW-level output voltage VOH HIGH-level output voltage Table 11: Static characteristics: analog I/O pins (D+, D−) VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Input levels Differential receiver VDI differential input sensitivity |VI(D+) − VI(D−)| 0.2 - - V VCM differential common mode voltage includes VDI range 0.8 - 2.5 V Single-ended receiver VIL LOW-level input voltage - - 0.8 V VIH HIGH-level input voltage 2.0 - - V Vhys hysteresis voltage 0.4 - 0.7 V Output levels VOL LOW-level output voltage RL = 1.5 kΩ to + 3.6 V - - 0.3 V VOH HIGH-level output voltage RL = 15 kΩ to GND 2.8 - 3.6 V - - ±1 µA Leakage current ILZ OFF-state leakage current © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 8 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver Table 11: Static characteristics: analog I/O pins (D+, D−)…continued VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit transceiver capacitance pin to GND - - 20 pF driver output impedance steady-state drive [1] 34 39 44 Ω steady-state drive [2] 41 45 49 Ω Capacitance CIN Resistance ZDRV ZDRV2 driver output impedance for USB 2.0 ZINP input impedance 10 - - MΩ RSW internal switch resistance at pin Vpu(3.3) - - 10 Ω termination voltage for upstream port pull-up (RPU) 3.0 [4] - 3.6 V Termination VTERM [3] [1] [2] [3] [4] Includes external resistors of 33 Ω ±1% on both D+ and D−. Includes external resistors of 39 Ω ±1% on both D+ and D−. This range complies with Universal Serial Bus Specification Rev. 2.0. This voltage is available at pins Vreg(3.3) and Vpu(3.3). In ‘suspend’ mode the minimum voltage is 2.7 V. 10. Dynamic characteristics Table 12: Dynamic characteristics: analog I/O pins (D+, D−) [1] VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver characteristics Full-speed mode tFR rise time CL = 50 to 125 pF; 10 to 90% of |VOH − VOL|; see Figure 4 4 - 20 ns tFF fall time CL = 50 to 125 pF; 90 to 10% of |VOH − VOL|; see Figure 4 4 - 20 ns FRFM differential rise/fall time matching (tFR/tFF) excluding the first transition from Idle state 90 - 111.1 % VCRS output signal crossover voltage excluding the first transition from Idle state; see Figure 7 1.3 - 2.0 V [2] Low-speed mode tLR rise time CL = 200 to 600 pF; 10 to 90% of |VOH − VOL|; see Figure 4 75 - 300 ns tLF fall time CL = 200 to 600 pF; 90 to 10% of |VOH − VOL|; see Figure 4 75 - 300 ns LRFM differential rise/fall time matching (tLR/tLF) excluding the first transition from Idle state 80 - 125 % © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 9 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver Table 12: Dynamic characteristics: analog I/O pins (D+, D−) [1]…continued VCC = 4.0 to 5.5 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter VCRS Conditions output signal crossover voltage [2] excluding the first transition from idle state; see Figure 7 Min Typ Max Unit 1.3 - 2.0 V Driver timing Full-speed mode tPLH(drv) tPHL(drv) tPHZ tPLZ tPZH driver propagation delay (VO, FSE0 to D+,D−) LOW-to-HIGH; see Figure 7 - - 15 ns HIGH-to-LOW; see Figure 7 - - 15 ns driver disable delay (OE to D+,D−) HIGH-to-OFF; see Figure 5 - - 10 ns LOW-to-OFF; see Figure 5 - - 10 ns OFF-to-HIGH; see Figure 5 - - 15 ns OFF-to-LOW; see Figure 5 - - 15 ns driver enable delay (OE to D+,D−) tPZL Low-speed mode Not specified: low-speed delay timings are dominated by the slow rise/fall times tLR and tLF. Receiver timings (full-speed and low-speed mode) Differential receiver tPLH(rcv) tPHL(rcv) propagation delay (D+,D− to RCV) LOW-to-HIGH; see Figure 6 - - 15 ns HIGH-to-LOW; see Figure 6 - - 15 ns LOW-to-HIGH; see Figure 6 - - 15 ns HIGH-to-LOW; see Figure 6 - - 15 ns Single-ended receiver tPLH(se) tPHL(se) [1] [2] propagation delay (D+,D− to VP, VM) Test circuit: see Figure 10. Characterized only, not tested. Limits guaranteed by design. 1.65 V logic input t FR, t LR VOH t FF, t LF 90% 10% 0V VOH MGS963 VCRS VOL +0.3 V VOL MGS966 Fig 5. Timing of OE to D+, D−. 2.0 V 1.65 V VCRS VCRS logic input 0.8 V t PLH(rcv) t PLH(se) 0.9 V 0.9 V 0V t PHL(rcv) t PHL(se) t PLH(drv) VOH logic output VOH −0.3 V differential data lines Fig 4. Rise and fall times. differential data lines t PHZ t PLZ t PZH t PZL 90% 10% VOL 0.9 V 0.9 V t PHL(drv) VOH 0.9 V VOL Fig 6. Timing of D+, D− to RCV, VP, VM. differential data lines 0.9 V MGS965 VCRS VOL MGS964 Fig 7. Timing of VO, FSE0 to D+, D−. © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification VCRS Rev. 01 — 23 February 2000 10 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver 11. Test information test point handbook, halfpage 33 Ω(1) 500 Ω D.U.T. 50 pF V MBL142 V = 0 V for tPZH, tPHZ V = Vreg(/3.3) for tPZL, tPLZ (1) Complies with USB 1.1. For USB 2.0 a resistor of 39 Ω must be used. Fig 8. Load for enable and disable times. test point handbook, halfpage D.U.T. 25 pF MGS968 Fig 9. Load for VM, VP and RCV. handbook, halfpage Vpu(3.3) 1.5 kΩ (1) D.U.T. test point D+/D− 33 Ω(2) CL 15 kΩ MGS967 Load capacitance: CL = 50 pF or 125 pF (full-speed mode, minimum or maximum timing) CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing) (1) Full-speed mode: connected to D+, low-speed mode: connected to D−. (2) Complies with USB 1.1. For USB 2.0 a resistor of 39 Ω must be used. Fig 10. Load for D+, D−. © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 11 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver 12. Package outline Fig 11. BCC16 package outline (to be added). © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 12 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC SOT403-1 JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27 MO-153 Fig 12. TSSOP16 package outline. © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 13 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. 13.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. 13.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 14 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 13.5 Package related soldering information Table 13: Suitability of surface mount IC packages for wave and reflow soldering methods Package Soldering method BGA, LFBGA, SQFP, TFBGA Reflow [1] not suitable suitable suitable [2] HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC [3], SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO [1] [2] [3] [4] [5] suitable suitable not recommended [3] [4] suitable not recommended [5] suitable All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Wave Rev. 01 — 23 February 2000 15 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver 14. Revision history Table 14: Revision history Rev Date 01 CPCN 20000223 Description Objective specification; initial version. © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 16 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver 15. Data sheet status Datasheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued data sheet before initiating or completing a design. 16. Definitions 17. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. © Philips Electronics N.V. 2000 All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 17 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver Philips Semiconductors - a worldwide company Argentina: see South America Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102 Canada: Tel. +1 800 234 7381 China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044 Finland: Tel. +358 961 5800, Fax. +358 96 158 0920 France: Tel. +33 14 099 6161, Fax. +33 14 099 6427 Germany: Tel. +49 40 23 5360, Fax. +49 402 353 6300 Hungary: see Austria India: Tel. +91 22 493 8541, Fax. +91 22 493 8722 Indonesia: see Singapore Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200 Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007 Italy: Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Tel. +81 33 740 5130, Fax. +81 3 3740 5057 Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415 Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880 Mexico: Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399 New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811 Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474 Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107 Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745 Switzerland: Tel. +41 14 88 2686, Fax. +41 14 81 7730 Taiwan: Tel. +886 22 134 2865, Fax. +886 22 134 2874 Thailand: Tel. +66 27 45 4090, Fax. +66 23 98 0793 Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 272 4825 Internet: http://www.semiconductors.philips.com (SCA69) © Philips Electronics N.V. 2000. All rights reserved. 9397 750 06899 Objective specification Rev. 01 — 23 February 2000 18 of 19 ISP1107 Philips Semiconductors Advanced USB transceiver Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 8 9 10 11 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Function selection. . . . . . . . . . . . . . . . . . . . . . . 4 Operating functions. . . . . . . . . . . . . . . . . . . . . . 5 Power supply configurations. . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Test information. . . . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15 Package related soldering information . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 © Philips Electronics N.V. 2000. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 23 February 2000 Document order number: 9397 750 06899