PHILIPS 74HC3G06GD

74HC3G06; 74HCT3G06
Triple inverter with open-drain outputs
Rev. 03 — 11 May 2009
Product data sheet
1. General description
The 74HC3G06 and 74HCT3G06 are high-speed Si-gate CMOS devices. They provide
three inverting buffers with open-drain outputs.
The outputs of the 74HC3G06 and 74HCT3G06 devices are open drains and can be
connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH
wired-AND functions. For digital operation this device must have a pull-up resistor to
establish a logic HIGH-level.
The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.
The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
2. Features
n
n
n
n
n
Wide supply voltage range from 2.0 V to 6.0 V
High noise immunity
Low power dissipation
Multiple package options
ESD protection:
u HBM JESD22-A114E exceeds 2000 V
u MM JESD22-A115-A exceeds 200 V
n Specified from −40 °C to +85 °C and −40 °C to +125 °C
3. Ordering information
Table 1.
Ordering information
Type number
74HC3G06DP
Package
Temperature range Name
Description
Version
−40 °C to +125 °C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
−40 °C to +125 °C
VSSOP8
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
−40 °C to +125 °C
XSON8U
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3 × 2 × 0.5 mm
74HCT3G06DP
74HC3G06DC
74HCT3G06DC
74HC3G06GD
74HCT3G06GD
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
4. Marking
Table 2.
Marking code
Type number
Marking code
74HC3G06DP
H06
74HCT3G06DP
T06
74HC3G06DC
H06
74HCT3G06DC
T06
74HC3G06GD
H06
74HCT3G06GD
T06
5. Functional diagram
1
1A
1Y
2A
2Y
3A
3Y
1
Y
1
A
GND mna586
001aah900
001aah899
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram (one inverter)
6. Pinning information
6.1 Pinning
74HC3G06
74HCT3G06
74HC3G06
74HCT3G06
1A
1
8
VCC
3Y
2
7
1Y
2A
3
6
3A
GND
4
5
2Y
8
VCC
3Y
2
7
1Y
2A
3
6
3A
GND
4
5
2Y
001aak030
Pin configuration SOT505-2 (TSSOP8) and
SOT765-1 (VSSOP8)
Fig 5.
Pin configuration SOT996-2 (XSON8U)
74HC_HCT3G06_3
Product data sheet
1
Transparent top view
001aak028
Fig 4.
1A
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
2 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
1A, 2A, 3A
1, 3, 6
data input
GND
4
ground (0 V)
1Y, 2Y, 3Y
7, 5, 2
data output
VCC
8
supply voltage
7. Functional description
Table 4.
Function table[1]
Input nA
Output nY
L
Z
H
L
[1]
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Min
Max
Unit
−0.5
7.0
V
IIK
input clamping current
VI < −0.5 V or VI > VCC + 0.5 V
[1]
-
±20
mA
VO < −0.5 V
[1]
output clamping current
−20
-
mA
active mode
[1]
−0.5
VCC + 0.5
V
high-impedance mode
[1]
−0.5
7.0
V
VO = −0.5 V to 7.0 V
[1]
-
25
mA
supply current
[1]
-
50
mA
IGND
ground current
[1]
Tstg
storage temperature
IOK
output voltage
VO
output current
IO
ICC
dynamic power dissipation
PD
Conditions
Tamb = −40 °C to +125 °C
[2]
−50
-
mA
−65
+150
°C
-
300
mW
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 package: above 110 °C the value of Ptot derates linearly with 8 mW/K.
For XSON8U package: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.
74HC_HCT3G06_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
3 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
74HC3G06
Min
Typ
74HCT3G06
Max
Min
Typ
Unit
Max
VCC
supply voltage
2.0
5.0
6.0
4.5
5.0
5.5
V
VI
input voltage
0
-
6.0
0
-
5.5
V
VO
output voltage
0
-
VCC
0
-
VCC
V
Tamb
ambient temperature
−40
+25
+125
−40
+25
+125
°C
∆t/∆V
input transition rise
and fall rate
VCC = 2.0 V
-
-
625
-
-
-
ns/V
VCC = 4.5 V
-
1.67
139
-
1.67
139
ns/V
VCC = 6.0 V
-
-
83
-
-
-
ns/V
10. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 °C.
Symbol Parameter
−40 °C to +85 °C
Conditions
−40 °C to +125 °C
Min
Typ[1]
Max
Min
Max
Unit
74HC3G06
VIH
VIL
VOL
HIGH-level input
voltage
VCC = 2.0 V
1.5
1.2
-
1.5
-
V
VCC = 4.5 V
3.15
2.4
-
3.15
-
V
VCC = 6.0 V
4.2
3.2
-
4.2
-
V
LOW-level input
voltage
VCC = 2.0 V
-
0.8
0.5
-
0.5
V
VCC = 4.5 V
-
2.1
1.35
-
1.35
V
VCC = 6.0 V
-
2.8
1.8
-
1.8
V
IO = 20 µA; VCC = 2.0 V
-
0
0.1
-
0.1
V
IO = 20 µA; VCC = 4.5 V
-
0
0.1
-
0.1
V
IO = 20 µA; VCC = 6.0 V
-
0
0.1
-
0.1
V
IO = 4.0 mA; VCC = 4.5 V
-
0.15
0.33
-
0.4
V
IO = 5.2 mA; VCC = 6.0 V
-
0.16
0.33
-
0.4
V
LOW-level output
voltage
VI = VIH or VIL
II
input leakage
current
VI = VCC or GND; VCC = 6.0 V
-
-
±0.1
-
±1.0
µA
ILO
output leakage
current
VI = VIL; VO = VCC or GND
-
-
±5.0
-
±10
µA
ICC
supply current
per input pin; VCC = 6.0 V;
VI = VCC or GND; IO = 0 A;
-
-
10
-
20
µA
CI
input capacitance
-
1.5
-
-
-
pF
74HC_HCT3G06_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
4 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
Table 7.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 °C.
Symbol Parameter
−40 °C to +85 °C
Conditions
−40 °C to +125 °C
Min
Typ[1]
Max
Min
Max
Unit
74HCT3G06
VIH
HIGH-level input
voltage
VCC = 4.5 V to 5.5 V
2.0
1.6
-
2.0
-
V
VIL
LOW-level input
voltage
VCC = 4.5 V to 5.5 V
-
1.2
0.8
-
0.8
V
VOL
LOW-level output
voltage
VI = VIH or VIL
IO = 20 µA; VCC = 4.5 V
-
0
0.1
-
0.1
V
IO = 4.0 mA; VCC = 4.5 V
-
0.15
0.33
-
0.4
V
II
input leakage
current
VI = VCC or GND; VCC = 5.5 V
-
-
±1.0
-
±1.0
µA
ILO
output leakage
current
VI = VIL; VO = VCC or GND
-
-
±5.0
-
±10
µA
ICC
supply current
per input pin; VCC = 5.5 V;
VI = VCC or GND; IO = 0 A;
-
-
10
-
20
µA
∆ICC
additional supply
current
per input; VCC = 4.5 V to 5.5 V;
VI = VCC − 2.1 V; IO = 0 A
-
-
375
-
410
µA
CI
input capacitance
-
1.5
-
-
-
pF
[1]
Typical values are measured at Tamb = 25 °C.
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); all typical values are measured at Tamb = 25 °C; for test circuit see Figure 7.
Symbol Parameter
−40 °C to +85 °C
Conditions
−40 °C to +125 °C
Unit
Min
Typ
Max
Min
Max
VCC = 2.0 V
-
22
95
-
125
ns
VCC = 4.5 V
-
9
18
-
25
ns
VCC = 6.0 V
-
8
16
-
20
ns
VCC = 2.0 V
-
24
95
-
125
ns
VCC = 4.5 V
-
11
20
-
27
ns
VCC = 6.0 V
-
10
19
-
23
ns
-
18
95
-
125
ns
-
6
19
-
25
ns
-
5
16
-
20
ns
-
4
-
-
-
pF
74HC3G06
tPZL
tPLZ
tTHL
OFF-state to LOW
propagation delay
LOW to OFF-state
propagation delay
nA to nY; see Figure 6
nA to nY; see Figure 6
HIGH to LOW output nY; see Figure 6
transition time
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
CPD
power dissipation
capacitance
VI = GND to VCC
[1]
74HC_HCT3G06_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
5 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
Table 8.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); all typical values are measured at Tamb = 25 °C; for test circuit see Figure 7.
Symbol Parameter
−40 °C to +85 °C
Conditions
−40 °C to +125 °C
Unit
Min
Typ
Max
Min
Max
-
9
24
-
29
ns
-
12
27
-
32
ns
-
6
19
-
22
ns
-
4
-
-
pF
74HCT3G06
tPZL
tPLZ
OFF-state to LOW
propagation delay
nA to nY; see Figure 6
LOW to OFF-state
propagation delay
nA to nY; see Figure 6
VCC = 4.5 V
VCC = 4.5 V
tTHL
HIGH to LOW output VCC = 4.5 V; see Figure 6
transition time
CPD
power dissipation
capacitance
[1]
VI = GND to VCC − 1.5 V
[1]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of outputs.
12. Waveforms
VI
VM
nA input
GND
tPLZ
tPZL
VCC
VM
nY output
VOL
VX
tTHL
001aak031
Measurement points are given in Table 9.
VOL is the typical output voltage level that occurs with the output load.
Fig 6. The input (nA) to output (nY) propagation delays
Table 9.
Measurement points
Type
Input
Output
VM
VM
VX
74HC3G06
0.5 × VCC
0.5 × VCC
0.1 × VCC
74HCT3G06
1.3 V
1.3 V
0.1 × VCC
74HC_HCT3G06_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
6 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
VI
tW
90 %
negative
pulse
VM
0V
VI
tf
tr
tr
tf
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VCC
VCC
G
VI
VO
RL
S1
open
DUT
RT
CL
001aad983
Test data is given in Table 10.
Definitions for test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 7.
Test circuit for measuring switching times
Table 10.
Test data
Type
Input
Load
VI
tr, tf
CL
RL
tPZL, tPLZ
74HC3G06
GND to VCC
≤ 6 ns
50 pF
1 kΩ
VCC
74HCT3G06
GND to 3 V
≤ 6 ns
50 pF
1 kΩ
VCC
74HC_HCT3G06_3
Product data sheet
S1 position
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
7 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
13. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
D
E
A
SOT505-2
X
c
HE
y
v M A
Z
5
8
A
A2
(A3)
A1
pin 1 index
θ
Lp
L
1
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.00
0.95
0.75
0.25
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.5
0.47
0.33
0.2
0.13
0.1
0.70
0.35
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT505-2
Fig 8.
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-01-16
---
Package outline SOT505-2 (TSSOP8)
74HC_HCT3G06_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
8 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
D
E
SOT765-1
A
X
c
y
HE
v M A
Z
5
8
Q
A
A2
A1
pin 1 index
(A3)
θ
Lp
1
4
e
L
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
Q
v
w
y
Z(1)
θ
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
0.4
0.40
0.15
0.21
0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT765-1
Fig 9.
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
MO-187
Package outline SOT765-1 (VSSOP8)
74HC_HCT3G06_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
9 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
XSON8U: plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 x 2 x 0.5 mm
B
D
SOT996-2
A
A
E
A1
detail X
terminal 1
index area
e1
v
w
b
e
L1
1
4
8
5
C
C A B
C
M
M
y
y1 C
L2
L
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
E
e
e1
L
L1
L2
v
w
y
y1
mm
0.5
0.05
0.00
0.35
0.15
2.1
1.9
3.1
2.9
0.5
1.5
0.5
0.3
0.15
0.05
0.6
0.4
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
SOT996-2
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-12-18
07-12-21
Fig 10. Package outline SOT996-2 (XSON8U)
74HC_HCT3G06_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
10 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
14. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74HC_HCT3G06_3
20090511
Product data sheet
-
74HC_HCT3G06_2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Added type number 74HC3G06GD and 74HCT3G06GD (XSON8U package)
74HC_HCT3G06_2
20031202
Product specification
-
74HC_HCT3G06_1
74HC_HCT3G06_1
20030515
Product specification
-
-
74HC_HCT3G06_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
11 of 13
74HC3G06; 74HCT3G06
NXP Semiconductors
Triple inverter with open-drain outputs
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74HC_HCT3G06_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 11 May 2009
12 of 13
NXP Semiconductors
74HC3G06; 74HCT3G06
Triple inverter with open-drain outputs
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 11 May 2009
Document identifier: 74HC_HCT3G06_3