PHILIPS TDA18250HN

TDA18250HN
Cable Silicon Tuner
Rev. 1 — 12 August 2010
Objective data sheet
1. General description
The TDA18250HN is a Silicon Tuner IC designed specifically for high definition cable Set
Top Boxes (STB) supporting single streaming.
Used in conjunction with the TDA10024HN (digital channel demodulator), the
TDA18250HN covers all worldwide digital cable standards.
• The TDA18250HN ensures a low system cost as:
– Costly components such as low-noise amplifiers, Surface Acoustic Wave (SAW)
filters are eliminated from the system BOM
• The TDA18250HN high-performance Silicon Tuner meets today’s digital cable TV
reception needs with:
– Low power consumption
– High linearity
– Low noise figure
• The TDA18250HN ensures ease of use with:
– Easy on-board integration
– Efficient and effective PCB design
– Reduced external components
2. Features and benefits
„
„
„
„
„
„
„
„
„
„
„
RF frequency coverage up to 860 MHz
Integrated wideband gain control
LOW IF (LIF) output
Single 3.3 V power supply
Low power consumption
Multistandard cable receptions
Fully integrated IF selectivity, eliminating the need for external SAW filters
RF Loop-Through (LT)
Enhanced RF and IF filters to increase selectivity and adjacent channels filtering
Alignment free
Fully integrated oscillators:
‹ No external oscillator components for reduced cost
‹ 16 MHz crystal oscillator output buffer for single crystal applications
„ I2C-bus provides:
‹ 3.3 V microcontroller compatibility
TDA18250HN
NXP Semiconductors
Cable Silicon Tuner
‹ Received Signal Strength Indicator (RSSI) data access
‹ Die temperature sensor data access
„ Lead-free (Pb) manufacturing
3. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fRF
RF frequency
edge
42
-
862
MHz
Pi(max)
maximum input
power
-
106
-
dBμV
NFtun
tuner noise figure
maximum gain
-
5.5
-
dB
ϕn
phase noise
worst case in the RF
frequency range
10 kHz
-
−85
-
dBc/Hz
100 kHz
-
−105
-
dBc/Hz
P
power dissipation
-
0.91
-
W
αimage
image rejection
52
62
-
dB
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
TDA18250HN/C1
TDA18250HN_SDS
Objective data sheet
Description
Version
HVQFN48 plastic thermal enhanced very thin quad flat package; SOT619-1
no leads; 48 terminals; body 7 × 7 × 0.85 mm
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 August 2010
© NXP B.V. 2010. All rights reserved.
2 of 8
TDA18250HN
NXP Semiconductors
Cable Silicon Tuner
5. Block diagram
AGC1
RF_IN
LT
RF
SELECTIVITY
AGC2
mixer
IF
SELECTIVITY
IF
AGC
31
IFO_P
3
30
IFO_N
32
46
VIFAGC
LEVEL
CONTROL
TDA18250HN
19
I2C-BUS
INTERFACE
35
22
AS
Fig 1.
36
SCL
CRYSTAL
OSCILLATOR
SYNTHESIZER
SDA
14
15
VTLO
CPLO
16
XTO_P
20
XTO_N
17
XTAL_P XTAL_N
001aam176
Block diagram
6. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
VCC
supply voltage
VI
input voltage
Conditions
Min
Max
Unit
−0.3
+3.60
V
VCC < 3.3 V
−0.3
VCC + 0.3 V
VCC > 3.3 V
−0.3
+3.6
V
Tstg
storage temperature
−40
+150
°C
Tj
junction temperature
-
115
°C
VESD
electrostatic discharge
voltage
2
-
kV
1.5
-
kV
[1]
EIA/JESD22-A114 (HBM)
EIA/JESD22-C101-C (FCDM)
[1]
It withstands class IV of JEDEC standard.
7. Abbreviations
Table 4.
TDA18250HN_SDS
Objective data sheet
Abbreviations
Acronym
Description
AGC
Automatic Gain Control
BOM
Bill Of Materials
FCDM
Field Charge Device Model
HBM
Human Body Model
IC
Integrated Circuit
IF
Intermediate Frequency
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 August 2010
© NXP B.V. 2010. All rights reserved.
3 of 8
TDA18250HN
NXP Semiconductors
Cable Silicon Tuner
Table 4.
Abbreviations …continued
Acronym
Description
JEDEC
Joint Electron Device Engineering Council
LIF
LOW IF
PCB
Printed Circuit Board
RF
Radio Frequency
RSSI
Received Signal Strength Indicator
SAW
Surface Acoustic Wave
SCL
Serial CLock
SDA
Serial DAta
STB
Set Top Box
8. Revision history
Table 5.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TDA18250HN_SDS v.1
20100812
Objective data sheet
-
-
TDA18250HN_SDS
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 August 2010
© NXP B.V. 2010. All rights reserved.
4 of 8
TDA18250HN
NXP Semiconductors
Cable Silicon Tuner
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
TDA18250HN_SDS
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 August 2010
© NXP B.V. 2010. All rights reserved.
5 of 8
TDA18250HN
NXP Semiconductors
Cable Silicon Tuner
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
Silicon Tuner — is a trademark of NXP B.V.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TDA18250HN_SDS
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 August 2010
© NXP B.V. 2010. All rights reserved.
6 of 8
TDA18250HN
NXP Semiconductors
Cable Silicon Tuner
11. Tables
Table 1.
Table 2.
Table 3.
Quick reference data . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .3
Table 4.
Table 5.
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 4
12. Figures
Fig 1.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
TDA18250HN_SDS
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 August 2010
© NXP B.V. 2010. All rights reserved.
7 of 8
TDA18250HN
NXP Semiconductors
Cable Silicon Tuner
13. Contents
1
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
10
11
12
13
General description . . . . . . . . . . . . . . . . . . . . . .
Features and benefits . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
2
2
3
3
3
4
5
5
5
5
6
6
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 12 August 2010
Document identifier: TDA18250HN_SDS