INFINEON BGF108C

Data Sheet, V2.0, December 2008
BGF108C
7 Channel LCD Filter Array with ESD Protection
Small Signal Discretes
Edition 2008-12-12
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2008.
All Rights Reserved.
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disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
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BGF108C
BGF108C
Revision History: 2008-12-12, V2.0
Previous Version:2008-10-14, V1.0
Page
Subjects (major changes since last revision)
All
Preliminary status removed
Data Sheet
3
V2.0, 2008-12-12
BGF108C
7 Channel LCD Filter Array with ESD Protection
7 Channel LCD Filter Array with ESD Protection
Feature
• 7 channel integrated RC filter array
• ESD protection according to IEC61000-4-2
of 15 kV contact discharge on all IOs
• Wafer Level Package with SnAgCu solder balls
• 400 µm solder ball pitch
• RoHS and WEEE compliant package
• Improved package for increased drop test reliability
A4
A1
R1, 70Ω
A5
A2
R2, 70Ω
B5
B1
R3, 70Ω
C4
C1
R4, 70Ω
C5
C2
R5, 70Ω
D4
D1
R6, 70Ω
D5
D2
R7, 70Ω
A3
Figure 1
B3
C3 D3
Bgf108_schematic.vsd
Schematic
Description
BGF108C is a 7 channel RC filter array to provide attenuation of undesired signals in the 800 - 2000 MHz range.
All pins are protected against ESD of 15 kV according to IEC61000-4-2 (contact discharge). The wafer level
package is a green package with a size of only 1.95 mm x 2.07 mm and a total height of 0.60 mm. The package
has been improved for increased drop test reliability.
Type
Package
Marking
Chip
BGF108C
WLP-18-4
GF108C
N0715
Data Sheet
4
V2.0, 2008-12-12
BGF108C
7 Channel LCD Filter Array with ESD Protection
Table 1
Maximum Ratings
Parameter
Symbol
Values
Min.
VP
Operating temperature range
TOP
Storage temperature range
TSTG
Summed up input power for all pins
PIN
Electrostatic discharge according to IEC61000- VE
Voltage at all pins to GND
Typ.
Unit
Max.
0
5
V
-40
+85
°C
-65
+150
°C
60
mW
15
kV
-15
Note /
Test Condition
TS < 70 °C
4-21) at all pins
1) Contact discharge
Table 2
Electrical Characteristics1)
Parameter
Symbol
Series Resistors R1... R10
Leakage current of each line to GND
Breakdown Voltage of each line to GND
Line capacitance of each line to GND
Values
Unit
Min.
Typ.
Max.
R
IR
56
70
84
Ω
1
2
100
1000
nA
V(BR)
CT
7
8.2
V
27
17
30
pF
Note /
Test Condition
VR = 3 V
VR = 5 V
I(BR) = 1 mA
VR = 0 V
VR = 3 V
1) at TA = 25 °C
Line capacitance BGF108C
30
Line Capacitance [pF]
25
20
15
10
5
0
0
1
2
3
4
5
6
7
Voltage [V]
Figure 2
Data Sheet
Capacitance of one line to GND versus DC voltage
5
V2.0, 2008-12-12
BGF108C
7 Channel LCD Filter Array with ESD Protection
Insertion Loss BGF108C
0
-10
dB
-20
-30
-40
-50
0,1
1
10
100
1000
10000
frequency [MHz]
Typical filter characteristics of one filter channel (ZS = ZL = 50 Ω, VR = 0 V)
Figure 3
Cross talk BGF108C
0
-20
S21 [dB ]
-40
-60
-80
-100
-120
0,1
1
10
100
1000
10000
Frequency [MHz]
Figure 4
Data Sheet
Typical cross talk between two filter channels (ZS = ZL = 50 Ω, VR = 0 V)
6
V2.0, 2008-12-12
BGF108C
7 Channel LCD Filter Array with ESD Protection
Package Outline
2.02 ±0.05
B
(0.21±0.05)
4 x 0.4 = 1.6
Pin A1
Corner Index Area 2)
D2
D3
D4
D5
C1
C2
C3
C4
C5
B1
B3
A1
A2
A4
A5
18x
ø0.05 M A B
0.25 ±0.04 1)
C
A3
B5
0.08 C
18x
COPLANARITY
A
1.68 ±0.05
D1
0.4
0.4
0.1 C
3 x 0.4 = 1.2
SEATING PLANE 3)
0.2 ±0.05
STANDOFF
(0.24 ±0.05)
0.6 ±0.05
(0.24 ±0.05)
(0.21±0.05)
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
2) Pin A1 corner identified by marking
3) Primary datum C and seating plane are defined by the spherical crowns of the balls
WLP-18-1-N-PO V01
Figure 5
Package WLP-18-4 (dimensions in mm)
Tape and reel specification
4 ±0.1
Pin 1
Corner Index Area
Figure 6
Data Sheet
1.78 ±0.05
3˚±2˚
8 ±0.1
2.14 ±0.05
0.25
0.71±0.05
WLP-18-1-N-TP V01
Tape for WLP-18-4 (dimensions in mm)
7
V2.0, 2008-12-12