PHILIPS UBA1702

INTEGRATED CIRCUITS
DATA SHEET
UBA1702; UBA1702A
Line interrupter driver and ringer
Product specification
Supersedes data of 1996 Jan 09
File under Integrated Circuits, IC03
1997 Sep 29
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
FEATURES
Miscellaneous
Speech part
• Separated ground pins for transmission circuit interface
and control signals (e.g. for TEA1064A)
• Driver for the line interrupter that can be either a PMOST
when UBA1702 is used or a PNP when UBA1702A is
used
• Possibility to supply the microcontroller with an external
voltage source.
• Adjustable over-current protection
• Adjustable over-voltage protection for transmission
circuit
APPLICATIONS
• Adjustable mute (dialling mode voltage; DMO or NSA)
• Telephone sets with electronic hook switch.
• Telephone sets with software controlled ringer function
• Adjustable current loop detection (hook switch status)
• Microcontroller supply
GENERAL DESCRIPTION
• Provision for electronic hook switch.
The UBA1702; UBA1702A performs the high voltage
interface and ringer functions of the corded analog
telephone set in close cooperation with a microcontroller
and transmission circuit.
Ringer part
• Over-voltage protection
• Ringer frequency output for frequency discrimination
The UBA1702; UBA1702A incorporates several
protections, a driver for the line interrupter and a ringer.
Because of the practical division of functions between the
microcontroller, the transmission circuit and the UBA1702;
UBA1702A, it is possible to have a higher integration level
thereby reducing significantly the number of discrete
components in a telephone set.
• Adjustable ringer threshold for piezo-driver enable
• Three bits ringer volume control
• Bridge-tied-load (BTL) output stage for piezo transducer
• Fast start-up microcontroller supply.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
UBA1702
DIP28
plastic dual in-line package; 28 leads (600 mil)
UBA1702A
DIP28
plastic dual in-line package; 28 leads (600 mil)
SOT117-1
UBA1702T
SO28
plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
UBA1702AT
SO28
plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
1997 Sep 29
2
SOT117-1
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
QUICK REFERENCE DATA
Speech part: lline = 20 mA; DPI = LOW; Tamb = 25 °C; VEE = 0 V; unless otherwise specified.
Ringer part: Vline(rms) = 45 V; f = 25 Hz; using an RC combination of 2.2 kΩ and 820 nF and a diode bridge between the
line and the RPI input.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Speech part
SWITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702A ONLY
RSDO
−
resistance between pins SDO and VEE
2.2
−
kΩ
SWITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702 AND UBA1702A
RSDI-SDO
resistance between pins SDI and SDO VSDI − VSDO < 12 V
−
1.1
−
MΩ
RSDI
resistance between pins SDI and VEE
5
−
−
MΩ
−
2.7
3
V
11
12
13
V
VSDI = 240 V; DPI = HIGH
MUTE SWITCH AND ADJUSTABLE PROTECTION ZENER VOLTAGE (PINS MSI, MSA AND ZPA)
VSPO(M)
adjustable mute voltage referenced to
VEE
VSPO(Z)
adjustable zener voltage referenced to MSI = LOW;
VEE
ZPA open-circuit
MSI = HIGH;
MSA open-circuit
CURRENT MANAGEMENT (PINS SPI, SPO, CDA, CLA AND CDO)
lSPI(lim)
current limitation (pin SPI)
CLA shorted to VEE
−
120
−
mA
ISPI(det)
current detection (pin SPI)
CDA open-circuit
2
3
4
mA
VBB > 3.7 V; IDD = −1 mA
3.0
3.3
3.6
V
70
−
−
mA
RTA open-circuit
−
11
−
V
MICROCONTROLLER SUPPLY (VDD AND VBB)
VDD
supply output voltage referenced to
VSS
Ringer part
PROTECTION (PIN RPI)
IRPI(max)
maximum input current
RINGER THRESHOLD AND FREQUENCY DETECTION (PINS VRR, RTA AND RFO)
VRR(th)
ringer supply threshold voltage
referenced to VSS
VOLUME CONTROL (PINS RV0, RV1 AND RV2)
∆Gs
step resolution
(RV2, RV1, RV0) from
(0, 0, 0) to (1, 1, 0); note 1
−
6
−
dB
∆Gls
last step resolution
(RV2, RV1, RV0) from
(1, 1, 0) to (1, 1, 1); note 2
−
9.5
12
dB
28.7
32
V
RINGER MELODY INPUT AND PIEZO DRIVER (PINS RMI, ROA AND ROB)
Vo(max p−p) maximum output voltage between pins RV2 = 1; RV1 = 1; RV0 = 1 −
ROA and ROB (peak-to-peak value)
Notes
1. Independent of VRR if greater than 10 V.
2. Without piezo transducer, dependent on VRR.
1997 Sep 29
3
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
BLOCK DIAGRAM
SDO
handbook, full pagewidth
CDO
SDI
SPI
CLA
1
2
CDA
25
24
SPO
26
5
6
SPEECH
ZENER PROTECTION
9
VSS VDD
14 V
ZPA
SENSE
DPI
S ref
4
10
MSA
Sref
EHI
28
Sref
R ref
VDD
8
VSS
SWITCH
DRIVER
V BB
VDD
LINE CURRENT MANAGEMENT
17
Sref
SUPPLY
19
MUTE SWITCH
UBA1702; UBA1702A
UBA1702T; UBA1702AT
SPO
Vref
18
7
V SS
VRR
Rref
22
VRR
RINGER
RINGER FREQUENCY
DETECTION
VDD
RFO
V EE
V SS
VDD
ROA
VDD
V SS
1/2 VDD
V SS
RPI
V SS
REFERENCES
V SS
12
MSI
VSS
20
ROB
VDD
RINGER MELODY INPUT AND PIEZO DRIVER
V RR
23
VDD
13
RV0
V SS
DIGITAL
-TOANALOG
CONVERTER
R ref
VSS
R ref
RINGER
PROTECTION
21
11
VOLUME
CONTROL
14
15
V SS
16
MBE184
RTA
RMI
VRR
Fig.1 Block diagram.
1997 Sep 29
4
RV1
V SS
VDD
VDD
RINGER
THRESHOLD
VDD
RV2
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
PINNING
SYMBOL
PIN
DESCRIPTION
SDI
1
switch driver input
SDO
2
switch driver output
n.c.
3
not connected
DPI
4
dialling pulse input
SPI
5
speech part input
SPO
6
speech part output
VEE
7
ground for transmission circuit
MSI
8
mute switch input
ZPA
9
Zener protection adjustment input
MSA
10
mute switch adjustment input
RTA
11
ringer threshold adjustment input
RFO
12
ringer frequency output
RV0
13
ringer volume input; bit 0
handbook, halfpage
SDI
1
28 EHI
SDO
2
27 n.c.
n.c.
3
26 CDA
DPI
4
25 CLA
SPI
5
24 CDO
SPO
6
23 RPI
UBA1702
UBA1702T
UBA1702A
UBA1702AT
RV1
14
ringer volume input; bit 1
VEE
RV2
15
ringer volume input; bit 2
MSI
8
RMI
16
ringer melody input
ZPA
9
20 ROB
VSS
17
ground for microcontroller and
ringer
MSA
10
19 V BB
VDD
18
microcontroller supply voltage
RTA
11
18 V DD
VBB
19
supply voltage from transmission
circuit
RFO
12
17 V SS
RV0
13
16 RMI
RV1
14
15 RV2
ROB
20
ringer output B
VRR
21
ringer supply voltage
ROA
22
ringer output A
RPI
23
ringer part input
CDO
24
current detection output
CLA
25
current limitation adjustment input
CDA
26
current detection adjustment input
n.c.
27
not connected
EHI
28
electronic hook switch input
1997 Sep 29
7
22 ROA
21 V RR
MBE183
Fig.2 Pin configuration.
5
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
voltage applied at pin DPI is LOW, the switch driver block
turns on the external PMOST interrupter.
FUNCTIONAL DESCRIPTION
The values given in this functional description are typical
values except when otherwise specified.
The external PMOST interrupter is controlled by the
voltage between the switch driver input and output
(pins SDI and SDO).
Speech part
The speech part consists of three blocks, the switch driver,
the line current management and the mute switch (DMO or
NSA) combined with an adjustable over-voltage (zener)
protection circuit. The reference block, which generates
reference voltages and currents, is also used in the speech
part (see Fig.1) by the mute switch block.
When the voltage applied at pin EHI is HIGH and the
voltage applied at pin DPI is LOW, the voltage at SDO is
pulled down to a value less than 0.2 V in order to create a
high source-gate voltage (VSG) for the external PMOST.
However, in order to avoid break-down of the external
PMOST, the voltage difference between SDI and SDO is
internally limited to 14 V.
SWITCH DRIVER (PINS SDI, SDO, EHI AND DPI)
When the voltage applied at pin EHI and the one applied
at pin DPI are both HIGH, pin SDO can be considered as
being connected to pin SDI via a 1.1 MΩ pull-up resistor
while the impedance between SDI and VEE becomes very
high (a few MΩ).
UBA1702
The UBA1702 switch driver block is intended to generate
the appropriate signal to drive an external PMOST
interrupter. The source and gate of this PMOST are
respectively connected to SDI and SDO. The electronic
hook switch input (EHI) and the dialling pulse input (DPI)
signals control the state of this PMOST.
When the voltage applied at pin EHI is LOW, whatever the
one applied at DPI is, pin SDO can be considered as being
connected to pin SDI via a 1.1 MΩ pull-up resistor while
the impedance between SDI and VEE becomes almost
infinite.
The EHI pin is provided with high voltage capability. When
the voltage applied at pin EHI is HIGH, the switch driver
block will start and generate the proper signals to switch on
the external PMOST interrupter.
MGD178
When the telephone set is equipped with a mechanical
hook switch, pin EHI can be connected directly to the
switch driver input (pin SDI). For electronic hook switch
applications, the EHI pin can be driven by the
microcontroller output.
80
handbook, halfpage
IEHI
(µA)
60
In some special applications, the EHI pin can be current
driven. In such a case, the current available at SDO to turn
on the PMOST interrupter is approximately 10 times the
EHI input current (providing IEHI < 2 µA).
40
The EHI pin presents an impedance of 250 kΩ at low input
voltage. When the applied voltage at EHI goes above
approximately 30 V, the EHI input current remains
constant (see Fig.3) so that the EHI impedance increases.
20
0
The DPI is designed to switch on or off the external
PMOST interrupter (providing EHI is HIGH). When the
voltage applied at pin DPI is HIGH, the switch driver block
turns off the external PMOST interrupter. When the
1997 Sep 29
0
100
200
300
400
VEHI (V)
Fig.3 EHI input characteristics.
6
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
UBA1702A
LINE CURRENT MANAGEMENT
(PINS SPI, SPO, CDA, CLA AND CDO)
The UBA1702A switch driver block is intended to generate
the appropriate signal to drive an external PNP interrupter.
The emitter and base of this PNP are respectively
connected to SDI and SDO. The EHI and DPI signals
control the state of this PNP.
The line current is measured by an internal 2 Ω resistor
and a sense circuit connected between the speech part
input and output (pins SPI and SPO). The circuit delivers
information about the hook switch status at the current
detection output (pin CDO) and controls the line current
limitation.
The EHI pin is provided with high voltage capability. When
the voltage applied at pin EHI is HIGH, the switch driver
block will start and generate the appropriate signals to
switch on the external PNP interrupter.
When the SPI current exceeds a certain level (3 mA), the
sense circuit injects some image of the SPI current into an
internal resistor (see Fig.1). The created voltage becomes
higher than an internal reference (approximately 0.3 V)
and CDO goes HIGH. This current detection level can be
increased by connecting a resistor between pins CDA
(current detection adjustment) and VEE. It is also possible
to connect a capacitor between pins CDA and VEE to filter
unwanted AC components of the line current signal. Line
current interruption during pulse dialling influences the
CDO output.
When the telephone set is equipped with a mechanical
hook switch, pin EHI can be connected directly to pin SDI.
For electronic hook switch applications, the EHI pin can be
driven by the microcontroller output.
The EHI pin presents an impedance of 250 kΩ at low input
voltage. When the applied voltage at EHI goes above
approximately 30 V, the EHI input current remains
constant (see Fig.3) so that the EHI impedance increases.
The DPI is designed to switch on or off the external PNP
interrupter (providing EHI is HIGH). When the voltage
applied at pin DPI is HIGH, the switch driver block turns off
the external PNP interrupter. When the voltage applied at
pin DPI is LOW, the switch driver block turns on the
external PNP interrupter.
When the SPI current exceeds another current level
(45 mA), the sense circuit injects some image of the SPI
current into an internal resistor (see Fig.1). The created
voltage becomes higher than an internal reference
(approximately 0.4 V) and an internal signal is generated
in order to limit the current in the external interrupter thus
resulting in a line current limitation. This line current
limitation level can be increased up to a maximum value of
120 mA by connecting a resistor between pins CLA
(current limitation adjustment) and VEE.
The external PNP interrupter is controlled by the current
flowing into pin SDO.
When the voltage applied at pin EHI is HIGH and the
voltage applied at pin DPI is LOW, pin SDO can be
considered as being connected to pin VEE via a 2.2 kΩ
resistor in order to create a base current for the external
PNP.
When a PMOST (UBA1702) is used as an interrupter, the
SPI current equals the drain or source current of the
PMOST and thus also equals the line current.
When a PNP (UBA1702A) is used as an interrupter, the
SPI current equals the collector current of the PNP and
thus differs from the line current (the PNP base current
does not flow into the SPI pin).
When the voltage applied at pin EHI and the one applied
at pin DPI are both HIGH, pin SDO can be considered as
being connected to pin SDI via a 1.1 MΩ pull-up resistor
while the impedance between SDI and VEE becomes very
high (a few MΩ).
When the voltage applied at pin EHI is LOW, whatever the
one applied at DPI is, pin SDO can be considered as being
connected to pin SDI via a 1.1 MΩ pull-up resistor while
the impedance between SDI and VEE becomes almost
infinite.
1997 Sep 29
7
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
In the DMO or NSA mode (i.e. MSI is HIGH), the voltage
across RPI and VEE is limited to 2.1 V. With this feature
and in electronic hook switch applications, several
additional ringers can be placed in parallel without tinkling
during pulse dialling phase.
MUTE SWITCH AND ZENER PROTECTION
(PINS MSI, MSA AND ZPA)
The mute switch is, in fact, a switchable and electronic
zener diode connected between the speech part output
(pin SPO) and VEE.
RINGER THRESHOLD (PIN RTA)
When the voltage applied at the mute switch input
(pin MSI) is LOW, the switch is in over-voltage protection
mode and the maximum SPO voltage is limited to 12 V.
This level can be increased or decreased by connecting a
resistor between pins ZPA (zener protection adjustment)
and VEE or ZPA and SPO respectively.
The piezo driver is internally enabled when the voltage at
pin VRR exceeds a threshold level of 11 V. This threshold
level can be increased or decreased by connecting a
resistor between pins RTA (ringer threshold adjustment)
and VSS or RTA and VRR respectively.
When the voltage applied at pin MSI is HIGH, the switch is
in mute mode (DMO or NSA) resulting in a SPO voltage
below 3 V. This level can be decreased by connecting a
resistor between pins MSA (mute switch adjustment) and
SPO. It should be noted that the mute switch stage is
supplied from VDD thus a minimum voltage of
approximately 2.1 V is required on VDD.
Because of the built-in 6.5 V hysteresis, a voltage change
at pin VRR (coming from current consumption increase
when the piezo output is driven with a melody) will have no
influence on this internal enabling signal.
RINGER FREQUENCY DETECTION (PIN RFO)
The ringer frequency detection block generates a square
wave signal at the ringer frequency output (pin RFO) with
twice the ringer signal frequency. This RFO signal can be
used by the microcontroller for frequency discrimination.
REFERENCE
The bias currents and voltages for the various speech
blocks are generated by the reference block which is, in
most cases, supplied from pin SPO. This block guarantees
a high AC impedance at the SPO pin operating down to a
low SPO voltage. Therefore, most speech part blocks
operate independently from VDD.
When the voltage at pin RPI drops below the voltage at
pin VDD, RFO goes LOW. Pin RFO goes HIGH when the
voltage at pin RPI exceeds the voltage at pin VRR.
This VRR − VDD hysteresis allows the frequency detection
circuit to ignore parasitic signals superimposed on the
ringing signal.
Ringer part
The voltage at pin EHI must be LOW to get a square wave
at pin RFO. When the voltage at pin EHI is LOW, the
voltage at pin RFO is always HIGH whatever the one at pin
RPI is.
The ringer part consists of five blocks, the ringer
protection, the ringer threshold, the ringer frequency
detection, the volume control and the piezo driver.
The reference block which generates reference voltages
and currents is also used in the ringer part (see Fig.1).
VOLUME CONTROL (PINS RV0, RV1 AND RV2)
RINGER PROTECTION (PINS RPI AND VRR)
The volume control input has three bits RV2, RV1 and RV0
to realize eight volume levels. The volume is controlled by
regulating the supply voltage of the piezo output stage.
The first six steps have a fixed value of 6 dB, the value of
the last step (maximum volume) is dependent on the
available voltage at pin VRR.
The ringer protection block converts the ringing current
into a limited voltage between the ringer part input
(pin RPI) and VEE. This voltage is used (via an internal
diode) to generate the ringer supply voltage VRR which is
mainly used for all ringer parts. The voltage at pin VRR
must be filtered with a 22 µF capacitor connected between
pins VRR and VSS.
Default setting during start-up is (RV2 = 0, RV1 = 0,
RV0 = 0) which corresponds to minimum volume. In order
not to damage the piezo transducer, the differential output
ROA − ROB is internally limited to a value less than
32 V (p-p).
In electronic hook switch applications and also in speech
mode (see Fig.8), pin RPI is always connected to the
telephone line (through a series RC network and a diode
bridge). In order not to disturb normal speech operation, a
high AC impedance is present at pin RPI (providing the
speech level is less than 1.5 V (RMS) i.e. 5.7 dBm).
1997 Sep 29
8
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
Supply part (pins VBB and VDD)
RINGER MELODY INPUT AND PIEZO DRIVER
(PINS RMI, ROA AND ROB)
The supply block regulates the voltage at pin VDD,
referenced to VSS, to a typical value of 3.3 V and can
deliver a minimum of 2 mA. This is sufficient to supply
most normal microcontrollers. The voltage at pin VDD must
be filtered with a 22 µF capacitor connected between
pins VDD and VSS.
The input signal at the ringer melody input (pin RMI) may
be a square wave or a sine wave which is generated by the
microcontroller. The input stage incorporates a small
hysteresis (between 0.48VDD and 0.52VDD) and is
referenced to 1⁄2VDD which is also the DC level of the signal
coming from the microcontroller. Nevertheless, when a
sine wave is used, a coupling capacitor of 10 nF
(connected between pin RMI and the output of the
microcontroller) is required. This 10 nF capacitor value is
enough since the RMI input impedance is approximately
250 kΩ.
In speech mode, this block is supplied from the
transmission circuit using pin VBB. The voltage drop
between VBB and VDD has been minimized (100 mV at
1 mA, providing 2.5 V < VBB < 3.0 V) in order to allow low
voltage operation of the transmission circuit.
In ringer mode, this block is supplied from the ringer part
using pin VRR and pin VBB which are tied together through
an internal diode (see Fig.1).
The piezo driver is an output stage for a piezo transducer
which has to be connected between ringer output A and
ringer output B (pins ROA and ROB) as a Bridged Tied
Load (BTL) or between ROA and VSS as a Single-Ended
Load (SEL). The ROA and ROB output signals are square
wave and in opposite phase driven by the ringer melody
input stage. The minimum output current capability of the
ROA and ROB outputs is greater than 80 mA at maximum
volume setting (RV2 = 1, RV1 = 1, RV0 = 1) and becomes
even greater during output switching. This gives fast rise
and fall times resulting in a lot of harmonics.
When an external (mains or battery) supply is connected
to VBB and no speech or ringer signal is applied, VDD
(3.3 V) is still present.
During on-hook phase, and when a small current is derived
from the line to the microcontroller supply, the circuit stays
in a kind of stand-by mode to provide sufficient voltage at
pin VDD. This is done to ensure memory retention in the
microcontroller.
To obtain maximum efficiency, the piezo driver stage is
supplied in series with the VDD supply.
REFERENCE
The bias current for the various ringer blocks is generated
by the reference block while this block is supplied from pin
VRR or VDD.
1997 Sep 29
9
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
maximum input/output switch driver voltage
(pins SDI or SDO)
DC; note 1
−
240
V
pulsed; note 2
−
400
V
VEHI
maximum hook switch input voltage (pin EHI)
DC; note 1
−
240
V
pulsed; note 2
−
400
V
Vi(max)
maximum voltage at all logic inputs
(pins DPI, MSI, RV0, RV1, RV2 and RMI)
VSS − 0.4
VDD + 0.4
V
Vn(max)
maximum voltage at all other pins
−
24
V
ISPI(max)
maximum speech part input current (pin SPI)
−
150
mA
IRPI(max)
maximum ringer part input current (pin RPI)
−
70
mA
Ptot
total power dissipation
UBA1702
−
1
W
UBA1702T
VSDI, VSDO
Tamb = 75 °C
−
0.625
W
Tstg
IC storage temperature
−40
+150
°C
Tamb
operating ambient temperature
−25
+75
°C
Notes
1. Continuous.
2. 2 kV surge:
a) according to IEC 805-1 part 5. Test generator 10 µs/700 µs according to CCITT (Rm1 = 15 Ω and Rm2 = 25 Ω).
b) pulse sequence > 60 s.
c) number of surges: 10.
d) polarity change after 5 surges.
e) test circuit in combination with 150 V Voltage Dependent Resistor (VDR) and a 3.9 Ω resistor connected in series
with the source of the PMOST interrupter (UBA1702).
THERMAL CHARACTERISTICS
SYMBOL
Rth j−a
1997 Sep 29
PARAMETER
VALUE
UNIT
UBA1702, UBA1702A
45
K/W
UBA1702T, UBA1702AT
70
K/W
thermal resistance from junction to ambient in free air
10
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
CHARACTERISTICS
Speech part: lline = 20 mA; DPI = LOW; Tamb = 25 °C; VEE = 0 V; unless otherwise specified.
Ringer part: Vline(rms) = 45 V; f = 25 Hz; using an RC combination of 2.2 kΩ and 820 nF and a diode bridge between the
line and the RPI input.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Speech Part
SWITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702 ONLY
IEE
VEE current consumption
VSPO = 4.2 V
−
−330
−
µA
VSDO
switch driver output voltage
VSDI < 12 V
−
−
0.2
V
−510
−
µA
SWITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702A ONLY
IEE
VEE current consumption; excluding PNP VSDO = 4.2 V
interrupter base current
−
RSDO
resistance between pins SDO and VEE
−
2.2
−
kΩ
ISDO(max)
maximum input current (pin SDO)
7.0
−
−
mA
SWITCH DRIVER AND REFERENCES (PINS SDI, SDO, EHI AND DPI); UBA1702 AND UBA1702A
ISS
VSS current consumption
VSDI−SDO
internal voltage limitation between
pins SDI and SDO
RSDI-SDO
resistance between pins SDI and SDO
RSDI
resistance between pins SDI and VEE
REHI
resistance between pins EHI and VEE
−
−280
−
µA
−
14
−
V
VSDI − VSDO < 12 V
−
1.1
−
MΩ
VSDI = VEHI = 48 V;
DPI = HIGH
−
4
−
MΩ
VSDI = VEHI = 240 V;
DPI = HIGH
5
20
−
MΩ
VEHI = 4.2 V
170
420
−
kΩ
VEHI = 48 V
−
740
−
kΩ
VEHI = 240 V
−
3.5
−
MΩ
−
kΩ
VSPO = 4.2 V; note 1
ZSPO
impedance between pins SPO and VEE
f = 0.3 to 3.4 kHz
20
−
ZVSS
impedance between pins VSS and VEE
f = 0.3 to 3.4 kHz
10
−
VIH
HIGH-level input voltage (pin EHI)
VSS + 1.5 −
VIL
LOW-level input voltage (pin EHI)
VSS
−
−
kΩ
240
V
VSS + 0.3 V
IIH
HIGH-level input current (pin EHI)
VEHI = 4.2 V
0
10
20
µA
IIL
LOW-level input current (pin EHI)
VEHI = LOW
−
0
−
µA
VIH
HIGH-level input voltage (pin DPI)
VSS + 1.5 −
VDD
V
VIL
LOW-level input voltage (pin DPI)
VSS
IIH
HIGH-level input current (pin DPI)
VDPI = HIGH
IIL
LOW-level input current (pin DPI)
VDPI = LOW
1997 Sep 29
11
−
VSS + 0.3 V
0
−
10
µA
−
0
−
µA
Philips Semiconductors
Product specification
Line interrupter driver and ringer
SYMBOL
PARAMETER
UBA1702; UBA1702A
CONDITIONS
MIN.
TYP.
MAX.
UNIT
MUTE SWITCH AND ZENER PROTECTION (PINS MSI, MSA AND ZPA)
VSPO(M)
VSPO(Z)
adjustable mute voltage referenced to
VEE
adjustable zener voltage referenced to
VEE
MSI = HIGH;
MSA open-circuit
−
2.7
3
V
MSI = HIGH;
MSA shorted to SPO
−
1.7
−
V
MSI = LOW;
ZPA open-circuit
11.0
12.0
13.0
V
MSI = LOW;
ZPA shorted to SPO
8.3
9.0
9.7
V
MSI = LOW;
ZPA shorted to VEE
16.4
18.0
19.6
V
ISPI
current capability (pin SPI)
150
−
−
mA
VIH
HIGH-level input voltage (pin MSI)
0.7VDD
−
VDD
V
VIL
LOW-level input voltage (pin MSI)
VSS
−
VSS + 0.3 V
IIH
HIGH-level input current (pin MSI)
VMSI = HIGH
0
−
10
µA
IIL
LOW-level input current (pin MSI)
VMSI = LOW
−
0
−
µA
CLA open-circuit
−
45
−
mA
CLA shorted to VEE
−
120
−
mA
CDA open-circuit
2
3
4
mA
−
2
−
Ω
CURRENT MANAGEMENT (PINS SPI, SPO, CDA, CLA AND CDO)
ISPI(lim)
current limitation (pin SPI)
ISPI(det)
current detection (pin SPI)
RSPI-SPO
series resistance between pins SPI and
SPO
IOH
HIGH level output current (pin CDO)
VCDO = VDD − 0.5 V
−
−
−100
µA
IOL
LOW level output current (pin CDO)
VCDO = VSS + 0.5 V
100
−
−
µA
VBB > 3.7 V;
IDD = −1 mA
3.0
3.3
3.6
V
−
−0.2
−
mV/K
MICROCONTROLLER SUPPLY (PINS VDD AND VBB)
VDD
supply output voltage referenced to VSS
∆VDD/∆T
supply output voltage temperature
gradient
IDD
supply output current capability
VBB > 3.7 V
−
−
−2
mA
VBB−VDD
voltage drop between VBB and VDD
IDD = −1 mA;
2.5 V < VBB < 3.0 V
−
100
−
mV
VDDM
voltage at pin VDD when neither speech
nor ringer signal is applied
IDD = 9 µA
−
1.4
−
V
1997 Sep 29
12
Philips Semiconductors
Product specification
Line interrupter driver and ringer
SYMBOL
PARAMETER
UBA1702; UBA1702A
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Ringer part
PROTECTION (PIN RPI)
−
−850
−
µA
maximum input current
70
−
−
mA
voltage limit referenced to VEE
−
21
−
V
IRPI = 30 mA;
MSI = HIGH
−
2.1
−
V
f = 0.3 to 3.4 kHz;
VRPI < 1.5 V (RMS)
100
220
−
kΩ
RTA open-circuit;
−
11
−
V
ISS
current consumption
IRPI(max)
VRPI
VRPId
voltage limit in DMO or NSA mode
referenced to VEE
ZRPI
AC input impedance referenced to VEE
RV2 = 0; RV1 = 0;
RV0 = 0
RINGER THRESHOLD AND FREQUENCY DETECTION (PINS VRR, RTA AND RFO)
VRRth
ringer supply threshold voltage
referenced to VSS
VRRhys
ringer threshold hysteresis voltage
−
6.5
−
V
VRPIhys
ringer frequency detection hysteresis
voltage referenced to VEE
RFO = HIGH
−
VRR
−
V
RFO = LOW
−
VDD
−
V
IOH
HIGH-level output current (pin RFO)
VRFO = VDD − 0.5 V
−
−
−100
µA
IOL
LOW-level output current (pin RFO)
VRFO = VSS + 0.5 V
100
−
−
µA
VOLUME CONTROL (PINS RV0, RV1 AND RV2)
∆G
gain adjustment range
(RV2, RV1, RV0) from
(0, 0, 0) to (1 ,1, 0);
note 2
−
36
−
dB
∆Gs
step resolution
(RV2, RV1, RV0) from
(0, 0, 0) to (1, 1, 0);
note 2
−
6
−
dB
∆Gls
last step resolution
(RV2, RV1, RV0) from
(1, 1, 0) to (1, 1, 1);
note 3
−
9.5
12
dB
VIH
HIGH-level input voltage (pins RVx)
0.7VDD
−
VDD
V
VIL
LOW-level input voltage (pins RVx)
VSS
−
0.3VDD
V
IIH
HIGH-level input current (pins RVx)
VRVx = HIGH
0
−
5
µA
IIL
LOW-level input current (pins RVx)
VRVx = LOW
0
−
5
µA
1997 Sep 29
13
Philips Semiconductors
Product specification
Line interrupter driver and ringer
SYMBOL
PARAMETER
UBA1702; UBA1702A
CONDITIONS
MIN.
TYP.
MAX.
UNIT
RINGER MELODY INPUT AND PIEZO DRIVER (PINS RMI, ROA AND ROB)
VIH
HIGH-level input voltage (pin RMI)
0.52VDD
−
VDD
V
VIL
LOW-level input voltage (pin RMI)
VSS
−
0.48VDD
V
IIH
HIGH-level input current (pin RMI)
VRMI = HIGH
0
−
10
µA
IIL
LOW-level input current (pin RMI)
VRMI = LOW
−10
−
0
µA
Vo(min p-p)
minimum output voltage between pins
ROA and ROB (peak-to-peak value)
RV2 = 0; RV1 = 0;
RV0 = 0
−
0.15
−
V
Vo(p-p)
output voltage between pins ROA and
ROB (peak-to-peak value)
RV2 = 1; RV1 = 1;
RV0 = 0
−
9.6
−
V
Vo(max p-p) maximum output voltage between pins
ROA and ROB (peak-to-peak value)
RV2 = 1; RV1 = 1;
RV0 = 1
−
28.7
32
V
|IRO|
sink and source;
RV2 = 1; RV1 = 1;
RV0 = 1
80
−
−
mA
IDD = −1 mA
3.0
3.35
3.6
V
ROA or ROB output current capability
REGULATED MICROCONTROLLER SUPPLY (PIN VDD)
VDD
supply output voltage referenced to VSS
∆VDD/∆T
supply output voltage temperature
gradient
−
0
−
mV/K
IDD
supply output current capability
−
−
−2
mA
Notes
1. ISS has no influence on AGC characteristics of the TEA106x transmission circuit when VSS is connected to the
SLPE pin of TEA106x.
2. Independent of VRR if greater than 10 V.
3. Without piezo transducer, dependent on VRR.
1997 Sep 29
14
15
240 V
820 nF
Cring
Vline
45 V (RMS)
BRIDGE
4 x BAS11
2.2 kΩ
Rring
CRO
80
nF
RF0 CD0
UBA1702
UBA1702A
RV1 RV2
Fig.4 Test circuit.
RMI RV0
ROB
ROA
RPI
EHI
SDI
SDO
SPI
handbook, full pagewidth
1997 Sep 29
CLA CDA MSA ZPA
RCDA
MSI
RTA
VEE
VSS
VDD
VRR
VBB
SP0
DPI
RRTA
22 µF
CVDD
22 µF
CVRR
VBB
VSPO
4.2 V
MBE750
20 Ω
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
TEST AND APPLICATION INFORMATION
1997 Sep 29
16
b/a
a/b
Rring
BRIDGE
BOD
4 x BAS11
BR211-240
Cring
820 nF 2.2 kΩ
XTAL2
XTAL1
MDT RV0
CE
PCD33xx
RV1 RV2
T1
NSA
VSS
VDD
DP
DPI
RMI RVO RV1 RV2 RFO CDO MSI
VSS
VDD
VRR
VEE
UBA1702
VBB
SP0
ROA
ROB
RPI
EHI
SDI
SDO
SPI
CLA CDA MSA ZPA RTA
CVDD
22 µF
CVRR
22 µF
D1
BAT85
C1
100 µF
LN
MBE746
R9
20 Ω
PD VEE SLPE
TEA106X
VCC
R1
620 Ω
Line interrupter driver and ringer
Fig.5 Simplified basic application of the UBA1702 with the TEA106x.
3.58 MHz
buzzer
3.9 Ω
Rprot M1
BSP254
handbook, full pagewidth
double hook switch
Philips Semiconductors
Product specification
UBA1702; UBA1702A
1997 Sep 29
17
b/a
a/b
BRIDGE
4 x BAS11
Rring
BOD
BR211-240
Cring
820 nF 2.2 kΩ
XTAL2
NSA
T1
CE
MSI
RF0 CD0
PCD33xx
RV1 RV2
MDT RV0
XTAL1
RV1 RV2
UBA1702
RMI RV0
ROA
ROB
RPI
EHI
SDI
SDO
SPI
CLA CDA MSA ZPA RTA
VSS
VDD
DP
DPI
VEE
VSS
VDD
VRR
VBB
SP0
22 µF
CVDD
22 µF
CVRR
D1
BAT85
C15
220
µF
R16
390 Ω
VCC2 LN
C1
100 µF
MBE747
R9
20 Ω
PD VEE SLPE
TEA1064A
VCC1
R1
620 Ω
Line interrupter driver and ringer
Fig.6 Simplified basic application of the UBA1702 with the TEA1064A.
3.58 MHz
buzzer
3.9 Ω
Rprot M1
BSP254
handbook, full pagewidth
double hook switch
Philips Semiconductors
Product specification
UBA1702; UBA1702A
1997 Sep 29
18
b/a
a/b
buzzer
XTAL2
NSA
T1
CE
MSI
RF0 CD0
PCD33xx
RV1 RV2
MDT RV0
XTAL1
RV1 RV2
RMI RV0
ROA
ROB
UBA1702A
VSS
VDD
DP
DPI
VEE
VSS
VDD
VRR
VBB
SP0
22 µF
CVDD
22 µF
CVRR
D1
BAT85
C1
100 µF
LN
MBE748
R9
20 Ω
PD VEE SLPE
TEA106X
VCC
R1
620 Ω
Line interrupter driver and ringer
Fig.7 Simplified basic application of the UBA1702A with the TEA106x.
3.58 MHz
EHI
BRIDGE
BOD
4 x BAS11
BR211-240
RPI
SDI
SDO
SPI
CLA CDA MSA ZPA RTA
Rring
Cring
820 nF 2.2 kΩ
TP1
MPSA92
handbook, full pagewidth
double hook switch
Philips Semiconductors
Product specification
UBA1702; UBA1702A
a/b
speaker-phone
button
D2
3.9 Ω
SPI
VBB
CVRR
22 µF
SDO
cradle
UBA1702
VDD
b/a
RPI
1.8 µF
1.8 µF
2.2 kΩ
D4
VSS
ROA
ROB
buzzer
D5
3.3 V
LN
VCC
QR
TEA106x
CVDD
22 µF
EHI
D3
R1
620 Ω
VRR
SDI
BOD
BR211-240
D1
BAT85
VEE
RMI RV0
RV1
RV2
RF0 CD0
MSI
DTMF VEE
C1
100 µF
100
nF
SLPE
R9
20 Ω
Philips Semiconductors
BRIDGE
4 x BAS11
SP0
Line interrupter driver and ringer
1997 Sep 29
CLA CDA MSA ZPA RTA
Rprot M1
BSP254
DPI
19
CRMI
10 nF
BRIDGE
4 x BAS11
EHD MHD EHT
RV0
RV1 RV2
XTAL1
3.58 MHz
CE
T1
TONE
VDD
PCD33xx
XTAL2
VSS
Loudspeaking
SUP
LSP1
TEA1093 RIN
LSP2
GND
handbook, full pagewidth
Product specification
Fig.8 Simplified proposal for electronic hook switch application of the UBA1702 in combination with a transmission and a hands-free circuit.
UBA1702; UBA1702A
MBE749
MHD: Mechanical Hook switch Detection
EHD: Electronic Hook switch Detection
EHT: Electronic Hook switch Take-over
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
PACKAGE OUTLINES
seating plane
handbook, full
pagewidthdual in-line package; 28 leads (600 mil)
DIP28:
plastic
SOT117-1
ME
D
A2
L
A
A1
c
e
Z
w M
b1
(e 1)
b
MH
15
28
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.1
0.51
4.0
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
2.54
15.24
3.9
3.4
15.80
15.24
17.15
15.90
0.25
1.7
inches
0.20
0.020
0.16
0.066
0.051
0.020
0.014
0.013
0.009
1.41
1.34
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT117-1
051G05
MO-015AH
1997 Sep 29
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
20
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A
X
c
y
HE
v M A
Z
15
28
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
14
e
bp
0
detail X
w M
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.71
0.69
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
inches
0.10
Z
(1)
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT136-1
075E06
MS-013AE
1997 Sep 29
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
21
o
8
0o
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1997 Sep 29
22
Philips Semiconductors
Product specification
Line interrupter driver and ringer
UBA1702; UBA1702A
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale
1997 Sep 29
23
Philips Semiconductors – a worldwide company
Argentina: see South America
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Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
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Fax. +43 160 101 1210
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Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
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Czech Republic: see Austria
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Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
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254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
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Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
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TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
417027/1200/03/pp24
Date of release: 1997 Sep 29
Document order number:
9397 750 02514